Radiator and electronic equipment

Abstract

The utility model discloses a radiator and an electronic device, and relates to the technical field of electronic device heat dissipation, the radiator comprises a substrate and heat dissipation tooth sheets, the substrate is provided with a plurality of mounting holes in a penetrating manner, and the substrate is used for being arranged on a case; the number of the heat dissipation tooth pieces is multiple, all the heat dissipation tooth pieces integrally penetrate through the base plate, the first ends of the heat dissipation tooth pieces are arranged on the first side of the base plate and used for being arranged in the case, and the second ends of the heat dissipation tooth pieces are arranged on the second side of the base plate and used for being arranged outside the case. The radiator disclosed by the utility model is formed by penetrating the radiating tooth sheets through the mounting holes of the substrate, heat in the case can be directly conducted from one ends, arranged in the case, of the radiating tooth sheets to one ends, arranged outside the case, of the radiating tooth sheets, and compared with a double-sided form-relieved-tooth radiator in the prior art, thermal resistance between the radiating tooth sheets and the substrate is reduced, and the service life of the radiator is prolonged. And the heat dissipation effect is greatly enhanced.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation of electronic devices, and more specifically, to a radiator and an electronic device. Background Art

[0002] With the continuous increase in the power consumption of components in the electronic chassis, the power density in the chassis is also increasing continuously. Since many chassis need to meet the conditions for outdoor use, the electronic chassis must be kept airtight, which poses a greater challenge to the heat dissipation of the chassis.

[0003] The use of many electronic devices has certain temperature requirements, so it is particularly important to reduce the ambient temperature in the chassis. When the heat dissipation requirement in the chassis is not high, a fan is usually installed in the chassis to dissipate heat in a turbulent flow manner. However, when the ambient temperature in the chassis is relatively high, in addition to using the built-in fan for turbulent flow heat dissipation, a radiator is also required for heat exchange. Among many radiators, the double-sided tooth radiator is a commonly used heat dissipation structure. However, the substrate thermal conduction resistance and diffusion resistance of this radiator are relatively large, which will significantly reduce the heat exchange amount and thus affect the heat dissipation effect.

[0004] Therefore, how to improve the heat dissipation effect of the double-sided tooth radiator has become a technical problem that needs to be solved urgently by those skilled in the art. Summary of the Utility Model

[0005] In view of this, the purpose of the utility model is to provide a radiator to improve the heat dissipation effect of the double-sided tooth radiator.

[0006] Another purpose of the utility model is to provide an electronic device including the above radiator.

[0007] To achieve the above purpose, the utility model provides the following technical solutions:

[0008] A radiator, comprising:

[0009] A substrate;

[0010] Heat dissipation fins, which are multiple, and each of the heat dissipation fins penetrates through the substrate integrally, and the first end of the heat dissipation fin is arranged on the first side of the substrate, and the second end is arranged on the second side of the substrate.

[0011] Optionally, in the above radiator, a plurality of mounting holes are formed in the substrate, and each of the mounting holes is for one of the heat dissipation fins to pass through correspondingly;

[0012] A positioning surface for positioning and cooperating with the substrate is arranged on the heat dissipation fin.

[0013] Optionally, in the above-mentioned radiator, the mounting hole is a stepped hole, and the positioning surface is attached to and connected with the stepped surface of the mounting hole; or,

[0014] the mounting hole is a through hole, and the positioning surface is attached to and connected with the plate surface on the first side of the substrate.

[0015] Optionally, in the above-mentioned radiator, the heat dissipation fins located on the first side of the substrate are defined as the first tooth part, the heat dissipation fins located on the second side of the substrate are defined as the second tooth part, and the second tooth part penetrates through the mounting hole and is connected with the first tooth part;

[0016] Along the connection direction of the first tooth part and the second tooth part, the cross-sectional area of the first tooth part is larger than that of the second tooth part, the second tooth part is attached to the side wall of the mounting hole, and the end surface of the first tooth part facing the second tooth part serves as the positioning surface.

[0017] Optionally, in the above-mentioned radiator, the heat dissipation fins located on the first side of the substrate are defined as the first tooth part, the heat dissipation fins located on the second side of the substrate are defined as the second tooth part, the heat dissipation fins located in the mounting hole and attached to the side wall of the mounting hole are defined as the third tooth part, and the third tooth part is connected between the first tooth part and the second tooth part;

[0018] Along the direction from the first tooth part to the second tooth part, the cross-sectional area of the first tooth part is the first area, the cross-sectional area of the second tooth part is the second area, the cross-sectional area of the third tooth part gradually shrinks from the first area to the second area, and the side wall of the third tooth part serves as the positioning surface.

[0019] Optionally, in the above-mentioned radiator, the first distance is spaced between adjacent two first tooth parts, the second distance is spaced between adjacent two second tooth parts, and the first distance is less than the second distance; and / or,

[0020] Along the connection direction of the first tooth part and the second tooth part, the extension length of the second tooth part is greater than that of the first tooth part.

[0021] Optionally, in the above-mentioned radiator, a plurality of heat dissipation grooves are non-penetratingly formed on the plate surface of the first tooth part and / or the second tooth part.

[0022] Optionally, in the above-mentioned radiator, a sealing mounting groove is provided on one side of the substrate for embedding a sealing member.

[0023] Optionally, in the above-mentioned radiator, a phase change material is embedded inside the heat dissipation fins; or,

[0024] The surface of the heat dissipation fins is coated with a heat dissipation coating.

[0025] An electronic device includes electronic components, a chassis, and the radiator described above. The electronic components are arranged inside the chassis. The substrate is connected to the side wall of the chassis, and the first end of the heat dissipation fins is arranged inside the chassis, and the second end is arranged outside the chassis.

[0026] The radiator provided by the present utility model includes a substrate and heat dissipation fins. A plurality of mounting holes are formed through the substrate, and the substrate is used to be arranged on the chassis; there are a plurality of heat dissipation fins, and each heat dissipation fin penetrates through the substrate integrally. The first end of the heat dissipation fin is arranged on the first side of the substrate and is used to be arranged inside the chassis, and the second end is arranged on the second side of the substrate and is used to be arranged outside the chassis. The radiator provided by the present utility model is formed by passing the heat dissipation fins through the substrate. The heat inside the chassis can be directly conducted from the end of the heat dissipation fin arranged inside the chassis to the end arranged outside the chassis. Compared with the double-sided shovel-shaped radiator in the prior art, the thermal resistance between the heat dissipation fins and the substrate is reduced, and the heat dissipation effect is greatly enhanced.

[0027] The electronic device provided by the present utility model includes the radiator described above, so it also has the above-mentioned beneficial effects. For other structures, reference is made to the prior art and will not be elaborated here. Description of the Drawings

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0029] Figure 1 It is a schematic structural diagram of the radiator disclosed in the embodiment of the present utility model;

[0030] Figure 2 It is a schematic structural diagram of the substrate disclosed in the embodiment of the present utility model;

[0031] Figure 3 It is Figure 2 The sectional view at A-A in

[0032] Figure 4 It is Figure 3 The enlarged view at B in

[0033] Figure 5 It is an axonometric view of the heat dissipation fin disclosed in the embodiment of the present utility model;

[0034] Figure 6Schematic diagram of the installation structure of the radiator and the chassis disclosed in the embodiment of the present utility model;

[0035] Figure 7 Schematic diagram of the structure of the first type of heat dissipation fin disclosed in the embodiment of the present utility model Figure 1 ;

[0036] Figure 8 Schematic diagram of the structure of the first type of heat dissipation fin disclosed in the embodiment of the present utility model Figure 2 ;

[0037] Figure 9 Schematic diagram of the structure of the second type of heat dissipation fin disclosed in the embodiment of the present utility model Figure 1 ;

[0038] Figure 10 Schematic diagram of the structure of the second type of heat dissipation fin disclosed in the embodiment of the present utility model Figure 2 ;

[0039] Figure 11 Schematic diagram of the structure of the third type of heat dissipation fin disclosed in the embodiment of the present utility model Figure 1 ;

[0040] Figure 12 Schematic diagram of the structure of the third type of heat dissipation fin disclosed in the embodiment of the present utility model Figure 2 ;

[0041] Figure 13 Schematic diagram of the structure of the fourth type of heat dissipation fin disclosed in the embodiment of the present utility model;

[0042] Figure 14 Schematic diagram of the installation structure of the fifth type of heat dissipation fin and the substrate disclosed in the embodiment of the present utility model;

[0043] Figure 15 Schematic diagram of the installation structure of the sixth type of heat dissipation fin and the substrate disclosed in the embodiment of the present utility model.

[0044] Among them, 1 is the substrate, 11 is the mounting hole, 111 is the step surface, 12 is the sealed mounting groove, and 13 is the fixing hole;

[0045] 2 is the heat dissipation fin, 21 is the first tooth part, 211 is the positioning surface, 212 is the heat dissipation groove, 22 is the second tooth part, and 23 is the third tooth part;

[0046] 3 is the chassis. Specific implementation manners

[0047] The core of the present utility model lies in disclosing a radiator to improve the heat dissipation effect of the double-sided tooth radiator.

[0048] Another core of the present utility model lies in disclosing an electronic device including the above radiator.

[0049] Hereinafter, embodiments will be described with reference to the accompanying drawings. In addition, the embodiments shown below do not impose any limitation on the utility model content described in the claims. In addition, all the contents of the configurations shown in the following embodiments are not limited to those necessary for the solution of the utility model described in the claims. It should be noted that for ease of description, only parts related to the utility model are shown in the drawings. Without conflict, the embodiments and features in the embodiments of the present utility model can be combined with each other.

[0050] Combined with Figures 1 - 15 , the radiator disclosed in the embodiment of the present utility model includes a substrate 1 and heat dissipation fins 2. The substrate 1 is used to be arranged on the chassis 3; there are multiple heat dissipation fins 2, and each heat dissipation fin 2 penetrates through the substrate 1 integrally. The first end of the heat dissipation fin 2 is arranged on the first side of the substrate 1 and is used to be arranged inside the chassis 3, and the second end is arranged on the second side of the substrate 1 and is used to be arranged outside the chassis 3.

[0051] Specifically, a plurality of mounting holes 11 are formed through the substrate 1, and the heat dissipation fins 2 are arranged in each mounting hole 11 in one-to-one correspondence, and both ends of the heat dissipation fin 2 are exposed outside the mounting hole 11.

[0052] During assembly, insert the heat dissipation fins 2 into the reserved mounting holes 11 on the substrate 1, and then connect the substrate 1 and the heat dissipation fins 2 together by means of brazing, bonding, etc. The installation is convenient. During the specific use process, the radiator is arranged on the chassis 3 through the substrate 1. The two ends of the heat dissipation fins 2 located inside and outside the chassis 3 can conduct heat. It has a large heat exchange area with the environment inside and outside the chassis 3, and can reliably cool the internal environment of the chassis 3. And because the heat dissipation fins 2 on both sides of the substrate 1 are integral fins, its thermal resistance is very low, greatly improving the heat exchange efficiency.

[0053] The radiator disclosed in the embodiment of the present utility model is formed by passing the heat dissipation fins 2 through the substrate 1. The heat inside the chassis 3 can be directly conducted from the end of the heat dissipation fin 2 arranged inside the chassis 3 to the end arranged outside the chassis 3. Compared with the prior art solution where the heat dissipation fins 2 are respectively arranged on both sides of the substrate 1 (double-sided shovel-tooth radiator), the thermal resistance between the heat dissipation fins 2 and the substrate 1 is reduced, greatly enhancing the heat dissipation effect.

[0054] To achieve the positioning and installation of the heat dissipation fin 2 and the substrate 1, a positioning surface 211 for positioning and mating with the substrate 1 is provided on the heat dissipation fin 2. In some embodiments, the mounting hole 11 is a through hole with a uniform cross-section, and the positioning surface 211 is positioned, mated, and connected to the plate surface on the first side of the substrate 1. In other embodiments, the mounting hole 11 is a stepped hole, and the positioning surface 211 is abutted and connected to the stepped surface 111 of the stepped hole. In the above two embodiments, the former is preferred because the production and processing of the mounting hole 11 are convenient.

[0055] In a specific embodiment disclosed by the present utility model, in combination with Figure 5 and Figure 6 , the heat dissipation fin 2 located on the first side of the substrate 1 is defined as the first tooth portion 21, and the heat dissipation fin 2 located on the second side of the substrate 1 is defined as the second tooth portion 22. The second tooth portion 22 passes through the mounting hole 11 and is connected to the first tooth portion 21. At the same time, the second tooth portion 22 is abutted and connected to the side wall of the mounting hole 11. Along the connection direction of the first tooth portion 21 and the second tooth portion 22, the cross-sectional area of the first tooth portion 21 is larger than that of the second tooth portion 22, so that the end surface of the first tooth portion 21 facing the second tooth portion 22 can be used as the positioning surface 211 to be positioned and abutted against the substrate 1 or the stepped surface 111 of the stepped hole. In addition, the abutment of the positioning surface 211 and the stepped surface 111 of the substrate 1 or the stepped hole can also increase the contact area between the heat dissipation fin 2 and the substrate 1, thereby optimizing the heat dissipation effect.

[0056] Define the end surface of the first tooth portion 21 facing the second tooth portion 22 as the first connection surface, and the end surface of the second tooth portion 22 facing the first tooth portion 21 as the second connection surface. Then the area of the first connection surface is larger than that of the second connection surface. When the cross-section of each part of the first tooth portion 21 remains the same as the first connection surface, the cross-section of each part of the second tooth portion 22 remains the same as the second connection surface, and the second connection surface is entirely disposed in a fitting manner on the first connection surface, there are three structures of the heat dissipation fin 2 (for the convenience of description, define the connection direction of two adjacent heat dissipation fins 2 as the thickness direction, the connection direction of the first tooth portion 21 and the second tooth portion 22 as the height direction, and the extending direction of the mounting hole 11 as the length direction): In combination with Figure 7 and Figure 8 , the first structure is that the length of the first tooth portion 21 is greater than the length of the second tooth portion 22; in combination with Figure 9 and Figure 10 , the second structure is that the thickness of the first tooth portion 21 is greater than the thickness of the second tooth portion 22; in combination with Figure 11 and Figure 12 , the third structure is that the length of the first tooth portion 21 is greater than the length of the second tooth portion 22, and the thickness of the first tooth portion 21 is greater than the thickness of the second tooth portion 22. The heat dissipation fins 2 with different structures correspond to different shapes of the mounting hole 11, which will not be elaborated here.

[0057] In combination with Figure 14, a structural solution with a misaligned arrangement of the first connecting surface and the second connecting surface is shown in this figure. In this embodiment, the first connecting surface can also be used as the positioning surface 211 to fit and position with the substrate 1. However, compared with the solution in the above embodiment where the second connecting surface and the first connecting surface are completely fitted and arranged, the contact area between the first tooth part 21 and the second tooth part 22 is reduced, and the heat dissipation effect is poor.

[0058] In a specific embodiment disclosed by the present utility model, the cross-section of the mounting hole 11 is conical as shown in Figure 15 . Define the heat dissipation fin 2 on the first side of the substrate 1 as the first tooth part 21, the heat dissipation fin 2 on the second side of the substrate 1 as the second tooth part 22, and the heat dissipation fin 2 located in the mounting hole 11 and in contact with the side wall of the mounting hole 11 as the third tooth part 23. The third tooth part 23 is connected between the first tooth part 21 and the second tooth part 22. Along the direction from the first tooth part 21 to the second tooth part 22, the cross-sectional area of the first tooth part 21 is the first area, the cross-sectional area of the second tooth part 22 is the second area, and the cross-sectional area of the third tooth part 23 gradually shrinks from the first area to the second area. In this embodiment, the side wall of the third tooth part 23 serves as the positioning surface 211, and a positioning fit is formed between the third tooth part 23 and the conical side wall of the mounting hole 11, with high positioning reliability, and the contact area between the heat dissipation fin 2 and the substrate 1 is larger, and the heat dissipation effect is better.

[0059] Further, in the above embodiment, define the first distance between adjacent two first tooth parts 21 and the second distance between adjacent two second tooth parts 22. Then the first distance can be less than the second distance, which will result in a lower fin density at the second tooth part 22. Correspondingly, the heat transfer area of the second tooth part 22 can be increased by increasing the length dimension of the second tooth part 22, thereby adjusting its heat dissipation efficiency. That is, along the connection direction of the first tooth part 21 and the second tooth part 22, the extension length of the second tooth part 22 can be greater than the extension length of the first tooth part 21.

[0060] Preferably, arrange the second tooth part 22 with a longer extension length outside the chassis 3 to reduce the space occupation inside the chassis 3.

[0061] Combined with Figure 13 , a plurality of heat dissipation grooves 212 are non-penetratingly opened on the plate surface of the first tooth part 21 and / or the second tooth part 22 (the heat dissipation grooves on the second tooth part 22 are not shown). The opening of the heat dissipation grooves 212 can further increase the contact area between the heat dissipation fin 2 and the air, thereby improving the heat dissipation efficiency.

[0062] In addition, to improve the heat dissipation efficiency, a phase change material can be embedded inside the heat dissipation fins 2, or a heat dissipation coating can be applied on the surface of the heat dissipation fins 2. The heat dissipation coating can specifically be a high emissivity coating (such as zirconia or alumina), a metal coating, a ceramic coating (such as aluminum nitride or silicon nitride), a lubricating coating, a phase change material coating, etc. The lubricating coating can reduce the accumulation of dust and dirt on the surface of the heat dissipation fins 2 and maintain its good heat dissipation performance. Applying a layer of phase change material on the surface of the heat dissipation fins 2 can absorb and release heat when the heat load fluctuates, thereby achieving temperature regulation and heat buffering.

[0063] Combined with Figure 2 , a sealed mounting groove 12 is provided on one side of the substrate 1 facing the chassis 3. The sealed mounting groove 12 is used for embedding a seal. During assembly, a seal such as a gasket or a sealing strip is pressed between the substrate 1 and a certain side wall of the chassis 3 to ensure the sealing of the chassis 3.

[0064] In a specific assembly process of the present utility model, the heat dissipation fins 2 are inserted into the mounting holes 11 of the substrate 1. The positioning surface 211 of the heat dissipation fins 2 fits with one side surface of the substrate 1 (or the step surface 111 of the mounting hole 11) and is connected by brazing or bonding to form a seal. After installing a seal in the sealed mounting groove 12 on the substrate 1, screws are passed through the fixing holes 13 on the substrate 1 and the substrate 1 is fixed on the wall surface of the chassis 3.

[0065] The electronic device disclosed in the embodiment of the present utility model includes electronic components, a chassis 3, and the above radiator. The electronic components are arranged inside the chassis 3, the radiator is arranged on the chassis 3, the substrate 1 is connected to the side wall of the chassis 3, and the first end of the heat dissipation fins 2 is arranged inside the chassis 3 and the second end is arranged outside the chassis 3. The heat inside the chassis 3 can directly transfer from inside the chassis 3 to outside the chassis 3 through the heat dissipation fins 2. The radiator only has the thermal conduction resistance and the heat dissipation resistance of the heat dissipation fins 2 themselves. Compared with a double-sided shovel tooth radiator, the heat dissipation resistance and the thermal conduction resistance of the substrate 1 are reduced, and the heat exchange efficiency is improved.

[0066] Due to having the above radiator, it also has the above beneficial effects. Other structures can refer to the prior art and will not be elaborated here.

[0067] Heat dissipation components such as fans can be arranged on or inside the chassis 3 to drive the airflow inside the chassis 3 and enhance the heat dissipation effect of the radiator on the electronic components.

[0068] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present utility model. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present utility model. The specific technical means in some embodiments can be partially or wholly incorporated into another embodiment on the premise that it is not explicitly excluded by another embodiment. Therefore, the present utility model will not be limited to these embodiments shown herein, but rather to the broadest scope consistent with the principles and novel features disclosed herein.

Claims

1. A radiator, characterized in that, Including: A substrate (1); A plurality of heat dissipation fins (2), each of the heat dissipation fins (2) integrally penetrates through the substrate (1), and a first end of the heat dissipation fin (2) is disposed on a first side of the substrate (1), and a second end is disposed on a second side of the substrate (1).

2. The radiator according to claim 1, wherein, A plurality of mounting holes (11) are formed in the substrate (1), and the mounting holes (11) are respectively penetrated by the heat dissipation fins (2) in a one-to-one correspondence; A positioning surface (211) for positioning and cooperating with the substrate (1) is provided on the heat dissipation fin (2).

3. The radiator according to claim 2, wherein The mounting hole (11) is a stepped hole, and the positioning surface (211) is attached to and connected to a stepped surface (111) of the mounting hole (11); or, The mounting hole (11) is a through hole, and the positioning surface (211) is attached to and connected to a plate surface on the first side of the substrate (1).

4. The radiator according to claim 3, wherein The heat dissipation fin (2) located on the first side of the substrate (1) is defined as a first tooth portion (21), and the heat dissipation fin (2) located on the second side of the substrate (1) is defined as a second tooth portion (22), and the second tooth portion (22) penetrates through the mounting hole (11) and is connected to the first tooth portion (21); Along the connection direction of the first tooth portion (21) and the second tooth portion (22), a cross-sectional area of the first tooth portion (21) is larger than a cross-sectional area of the second tooth portion (22), the second tooth portion (22) is attached to a side wall of the mounting hole (11), and an end surface of the first tooth portion (21) facing the second tooth portion (22) serves as the positioning surface (211).

5. The radiator according to claim 2, wherein The heat dissipation fin (2) located on the first side of the substrate (1) is defined as a first tooth portion (21), the heat dissipation fin (2) located on the second side of the substrate (1) is defined as a second tooth portion (22), and the heat dissipation fin (2) located in the mounting hole (11) and attached to the side wall of the mounting hole (11) is defined as a third tooth portion (23), and the third tooth portion (23) is connected between the first tooth portion (21) and the second tooth portion (22); Along the direction from the first tooth portion (21) to the second tooth portion (22), a cross-sectional area of the first tooth portion (21) is a first area, a cross-sectional area of the second tooth portion (22) is a second area, a cross-sectional area of the third tooth portion (23) gradually shrinks from the first area to the second area, and a side wall of the third tooth portion (23) serves as the positioning surface (211).

6. The radiator according to claim 4 or 5, characterized in that, A first distance is spaced between adjacent two of the first tooth portions (21), a second distance is spaced between adjacent two of the second tooth portions (22), and the first distance is less than the second distance; and / or, Along the connection direction of the first tooth portion (21) and the second tooth portion (22), an extension length of the second tooth portion (22) is greater than an extension length of the first tooth portion (21).

7. The radiator according to claim 4 or 5, characterized in that, A plurality of heat dissipation grooves (212) are non-penetratingly formed on a plate surface of the first tooth portion (21) and / or the second tooth portion (22).

8. The radiator according to claim 1, characterized in that, A heat dissipation coating is coated on a surface of the heat dissipation fin (2).

9. The radiator according to claim 1, characterized in that, On one side of the substrate (1), a sealing installation groove (12) is provided, and the sealing installation groove (12) is used for embedding a sealing member.

10. An electronic device, characterized in that, It includes an electronic device, a chassis (3), and a radiator as described in any one of claims 1-9. The electronic device is arranged inside the chassis (3), the substrate (1) is connected to the side wall of the chassis (3), and the first end of the heat dissipation fins (2) is arranged inside the chassis (3), and the second end is arranged outside the chassis (3).

Images