Conductive heat dissipation type power supply device

Abstract

A conduction heat dissipation type power supply device comprises a power supply unit and a heat dissipation unit, the power supply unit comprises a power supply shell and a power supply module arranged in the power supply shell, and the heat dissipation unit comprises a heat conductor structure arranged in the power supply shell and a heat conduction layer connected with the heat conductor structure. The power supply module is connected with the heat conduction layer. Therefore, the heat dissipation effect of the electronic component in the power supply module can be improved.

Description

Technical Field

[0001] The utility model relates to a power supply device, in particular to a conduction heat dissipation type power supply device. Background Art

[0002] Today, with the rapid development of technology, electronic devices are widely used by people. All kinds of electronic devices have a main operation circuit board, on which there are important central processing units, memories, processing circuits, etc. Therefore, the working load, value and importance of the operation circuit board are higher than those of other electronic devices in the electronic device.

[0003] In addition, with the development trend of higher and higher computer operation frequencies, the operation efficiency and level of computer components are proportional to the power consumption, and the required power also increases accordingly. Most of the current water cooling structures on the market are mainly designed for the central processing unit (CPU) and the display (GPU). When the computer is operating, the central processing unit is responsible for data operation, and the display adapter is responsible for image operation, both of which will generate a large amount of heat. Therefore, computer manufacturers generally install fans or water cooling radiators to dissipate heat from the central processing unit or the display adapter. However, there is no water cooling structure for power supplies on the market yet.

[0004] In the early days, the internal electronic components of the power supply were not arranged compactly, and the power supplies used in computers were about 300 watts or less, generating less heat and being easily dissipated, so there was no need to set up additional heat dissipation structures. However, the output power of existing high-power power supplies has reached 1000 watts, and the overall volume has not increased much, resulting in a compact layout of internal electronic components and high heat generation. If the heat dissipation inside the power supply is poor, it will cause heat accumulation and affect the lifespan of electronic components.

[0005] Please refer to Figure 1 , Chinese Taiwan Patent TW I757654 B, a conductive and heat-conductive structure 1 for a high-power power supply, including a magnetic core housing 11, an inductor coil 12 disposed in the magnetic core housing 11, an inductor copper wire 13 connected to the inductor coil 12, a power component 14 connected to the inductor copper wire 13, a heat transfer and conduction component 15 connected to the power component 14, and a heat dissipation member 16 connected to the heat transfer and conduction component 15. The heat generated by the power component 14 can be exported outward through the heat dissipation member 16, or can be guided to the inductor coil 12 and the magnetic core housing 11 through the inductor copper wire 13.

[0006] Although the known technology has disclosed using copper conductors to export heat, there are still the following disadvantages in actual use:

[0007] 1. Poor heat dissipation efficiency:

[0008] Currently, power supplies are mostly cooled by air. This involves installing several heat dissipation holes on the casing or a cooling fan to force air into the power supply. However, with the compact arrangement of electronic components, heat is difficult to dissipate through air, resulting in poor heat dissipation in existing power supplies.

[0009] 2. Poor heat dissipation of power components:

[0010] Although conventional technology discloses the use of copper metal to dissipate heat from power components, conventional technology conducts heat to the inductor coil and the core housing, and then dissipates heat from the power components through a cooling system outside the housing. The heat conduction path is too long, resulting in poor heat dissipation effect of the power components.

[0011] 3. The coil assembly cannot dissipate heat:

[0012] The coils currently installed in power supplies, including common-mode chokes / filters (EMI chokes) and power factor correction inductors (PFC inductors), generate heat as the power supply output power increases. These coils not only need to dissipate heat but are also suited to absorbing it.

[0013] Therefore, how to improve the heat dissipation effect of electronic components in a power supply and to set up heat dissipation structures for power components and coil components are goals that relevant technical personnel urgently need to work hard on. Utility Model Content

[0014] In view of this, an object of the present invention is to provide a conductive cooling power supply device, which includes a power supply unit and a heat dissipation unit.

[0015] The power supply unit includes a power supply shell and a power supply module arranged in the power supply shell.

[0016] The heat dissipation unit comprises a heat conductor structure arranged in the power supply housing and a heat conduction layer connected to the heat conductor structure, and the power supply module is connected to the heat conduction layer.

[0017] In one embodiment, the heat dissipation unit further includes a flow channel base connected to the heat conductor structure, a liquid flow channel defined by the flow channel base and the heat conductor structure, a liquid inlet structure arranged on the flow channel base, and a liquid outlet structure arranged on the flow channel base. The structure of the liquid flow channel is generally curved and extended between the heat conductor structure and the flow channel base.

[0018] In one embodiment, the power supply unit further includes a liquid input opening and a liquid output opening arranged on the power supply housing. The power supply housing has a front plate, and the liquid input opening and the liquid output opening are arranged on the front plate. The liquid inlet structure is exposed to the outside through the liquid input opening, and the liquid outlet structure is exposed to the outside through the liquid output opening.

[0019] In one embodiment, the conductive heat dissipation power supply device further includes a fixing unit. The fixing unit includes at least a first fixing body. The first fixing body is disposed in the heat conductor structure, the flow channel base, and the power supply housing.

[0020] In one embodiment, the conductive heat dissipation power supply device further includes a fixing unit, which includes a second fixing base disposed on the heat conductor structure and a second fixing body disposed on the power module, and the second fixing body is connected to the second fixing base.

[0021] In one embodiment, the conductive heat dissipation power supply device further includes a fixing unit. The fixing unit includes a third fixing body. The third fixing body is disposed in the flow channel base and the heat conductor structure.

[0022] In one embodiment, the heat dissipation unit further includes a liquid stop ring disposed between the flow channel base and the heat conductor structure, and the liquid stop ring surrounds the liquid flow channel.

[0023] In one embodiment, the power module has a main power circuit board, an upper surface arranged on the main power circuit board, at least one first electronic component arranged on the upper surface, and at least one board opening arranged on the main power circuit board and passing through the main power circuit board, the first electronic component is passed through the board opening and contacts the thermal conductive layer.

[0024] In one embodiment, the power module has a main power circuit board, a lower surface of the main power circuit board, and at least one second electronic component disposed on the lower surface, wherein the second electronic component is connected to the heat conducting layer.

[0025] In one embodiment, the heat conductor structure is made of brass.

[0026] The beneficial effect of the present invention is that the heat-conducting layer is tightly attached to the main power circuit board and the heat conductor structure, and can directly conduct the heat in the power module; the first electronic component is directly in contact with the heat-conducting layer through the opening of the plate, and can directly conduct the heat of the first electronic component; the second electronic component is arranged on the lower surface of the main power circuit board and is directly tightly attached to the heat-conducting layer, and can directly conduct the heat of the second electronic component. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1Schematic three-dimensional view of Taiwan, China Patent TW I757654 B;

[0028] Figure 2 Schematic three-dimensional view of a first embodiment of the conduction heat dissipation type power supply device of the present utility model;

[0029] Figure 3 Schematic exploded three-dimensional view of the first embodiment;

[0030] Figure 4 Schematic side sectional view of the first embodiment;

[0031] Figure 5 Schematic three-dimensional view of a heat dissipation unit in the first embodiment;

[0032] Figure 6 Another schematic three-dimensional view of the heat dissipation unit in the first embodiment;

[0033] Figure 7 Schematic exploded three-dimensional view of the heat dissipation unit in the first embodiment;

[0034] Figure 8 Schematic three-dimensional view of a power supply unit in the first embodiment;

[0035] Figure 9 Another schematic three-dimensional view of the power supply unit in the first embodiment;

[0036] Figure 10 Schematic side view of the setting of a first electronic component in the first embodiment;

[0037] Figure 11 Another schematic side view of the setting of a first electronic component in the first embodiment;

[0038] Figure 12 Schematic side sectional view of a second embodiment of the conduction heat dissipation type power supply device of the present utility model.

[0039] Explanation of symbols in the drawings:

[0040] 1 Conductive and heat-conductive structure;

[0041] 11 Core housing;

[0042] 12 Inductive coil;

[0043] 13 Inductive copper wire;

[0044] 14 Power component;

[0045] 15 Heat transfer and conduction component;

[0046] 16 Heat sink;

[0047] 3 Power supply unit;

[0048] 31 Power supply housing;

[0049] 311 Front panel;

[0050] 312 Rear panel;

[0051] 313 Side panel; [[ID=1,6]]

[0052] 314 Bottom panel;

[0053] 315 Top panel;

[0054] 32 Power supply module;

[0055] ]>321 Main power circuit board;

[0056] 322 Side power circuit board;

[0057] 323 Output component;

[0058] 324 Upper surface;

[0059] 325 First electronic component;

[0060] 326 Board opening;

[0061] 327 Lower surface;

[0062] 328 Second electronic component;

[0063] 33 Liquid input opening;

[0064] 34 Liquid output opening;

[0065] 4 Heat dissipation unit;

[0066] 41 Flow channel base;

[0067] 42 Liquid flow channel;

[0068] 43 Heat conducting body structure;

[0069] 44 Heat conducting layer;

[0070] 45 Liquid inlet structure;

[0071] 451 Liquid inlet sealing cap;

[0072] 46 Liquid outlet structure;

[0073] 461 Liquid outlet sealing cap;

[0074] 47 Liquid stop ring;

[0075] 48 Support structure;

[0076] 5 fixed units;

[0077] 51 first fixed body;

[0078] 52 second fixed seat;

[0079] 53 second fixed body;

[0080] 54 The third fixed body. DETAILED DESCRIPTION

[0081] The features and technical contents of the related patent applications of the present invention will be clearly presented in the following detailed description of two embodiments with reference to the drawings.

[0082] See also Figure 2 、 Figure 3 and Figure 4 , which is a first embodiment of a conductive cooling power supply device of the present invention, the conductive cooling power supply device includes a power supply unit 3 , a cooling unit 4 and a fixing unit 5 .

[0083] The power supply unit 3 includes a power supply housing 31 , a power supply module 32 disposed in the power supply housing 31 , a liquid input opening 33 disposed in the power supply housing 31 , and a liquid output opening 34 disposed in the power supply housing 31 .

[0084] Please refer to Figure 5 、 Figure 6 and Figure 7 The heat dissipation unit 4 includes a flow channel base 41 arranged in the power supply housing 31, a liquid flow channel 42 formed on the flow channel base 41, a heat conductor structure 43 connected to the flow channel base 41, a heat conductive layer 44 connected to the heat conductor structure 43, a liquid inlet structure 45 arranged on the flow channel base 41, a liquid outlet structure 46 arranged on the flow channel base 41, a liquid stop ring 47 arranged between the flow channel base 41 and the heat conductor structure 43, and a support structure 48 arranged on the flow channel base 41.

[0085] The fixing unit 5 includes at least a first fixing body 51 , a second fixing base 52 disposed on the heat conducting structure 43 , a second fixing body 53 disposed on the power module 32 , and a third fixing body 54 .

[0086] In this first embodiment, the top view of the liquid flow channel 42 is a water channel in the shape of a U-shaped groove. In actual implementation, the structure of the liquid flow channel 42 can also be set to other shapes, and this should not be taken as a limitation. In some embodiments, a liquid inlet sealing cover 451 is provided on the liquid inlet structure 45, and a liquid outlet sealing cover 461 is provided on the liquid outlet structure 46 to prevent the flow channel base 41 and the heat conducting body structure 43 of the liquid flow channel 42 from rusting.

[0087] The liquid inlet structure 45 is exposed to the outside through the liquid input opening 33, and the liquid outlet structure 46 is exposed to the outside through the liquid output opening 34. The liquid inlet structure 45 and the liquid outlet structure 46 are connected to a water cooling device. In some embodiments, the heat dissipation unit 4 is connected to a water cooling device in a computer to drive the coolant to enter the liquid flow channel 42 from the liquid inlet structure 45, and the coolant in the liquid flow channel 42 flows back to the water cooling device from the liquid outlet structure 46. In some embodiments, the water cooling structures of the central processing unit (CPU), the display (GPU), the radiator structure, the pump module, and the heat dissipation unit 4 are connected in series, and the coolant flows through the above-mentioned structures.

[0088] The power module 32 is connected to the heat conducting layer 44, the heat conducting layer 44 is connected to the heat conducting body structure 43, the heat conducting body structure 43 is connected to the coolant, and the heat conducting layer 44 and the heat conducting body structure 43 conduct the heat of the power module 32 to the coolant in the liquid flow channel 42 to achieve the effect of direct heat dissipation. The material of the heat conducting body structure 43 is brass, and the heat conducting layer 44 is a commercially available heat conducting adhesive. In actual implementation, other heat conducting materials can also be used for the heat conducting body structure 43 and the heat conducting layer 44, and this should not be taken as a limitation.

[0089] The liquid stop ring 47 surrounds the liquid flow channel 42. In this first embodiment, the liquid stop ring 47 is an O-ring to prevent the connection between the flow channel base 41 and the heat conducting body structure 43 from leaking water.

[0090] The support structure 48 covers the surface of the flow channel base 41. In this first embodiment, the bottom surface of the flow channel base 41 has an irregular shape. In some embodiments, the shape of the bottom surface of the flow channel base 41 matches the shape of the liquid flow channel 42, and the support structure 48 covers the bottom surface of the flow channel base 41 to strengthen the structure of the bottom surface of the flow channel base 41.

[0091] The power supply housing 31 has a front plate 311, a rear plate 312 opposite to the front plate 311, two side plates 313 connected to the front plate 311 and the rear plate 312, a bottom plate 314 connected to the front plate 311 and the rear plate 312, and a top plate 315 connected to the front plate 311 and the rear plate 312.

[0092] The AC power input socket is located on the rear panel 312, and several DC power output sockets are located on one side panel 313. The liquid input opening 33 and the liquid output opening 34 are located on the front panel 311. In actual implementation, the liquid input opening 33, the liquid output opening 34, and the several DC power output sockets may also be located at other locations on the power supply housing 31, and the present invention is not limited to this.

[0093] In the first embodiment, the first fixing body 51, the second fixing body 53, and the third fixing body 54 are screws, the bottom of the second fixing base 52 is a screw structure, and the top of the second fixing base 52 is a screw hole structure. In actual implementation, the heat dissipation unit 4 can also use other fixing structures and should not be limited to this.

[0094] The first fixing body 51 is disposed within the heat conductor structure 43, the flow channel base 41, and the power supply housing 31. The first fixing body 51 is used to fix the heat dissipation unit 4 to the bottom surface of the power supply housing 31. In some embodiments, the first fixing body 51 passes through the heat conductor structure 43 and the flow channel base 41 and is then screwed onto the power supply housing 31.

[0095] The second fixing body 53 is connected to the second fixing base 52. The second fixing body 53 and the second fixing base 52 are used to fix the power module 32 to the heat conductor structure 43. In some embodiments, the second fixing base 52 is screwed onto the heat conductor structure 43. The second fixing body 53 passes through the main power circuit board 321 of the power module 32 and is then screwed onto the second fixing base 52.

[0096] The third fixing body 54 is disposed between the flow channel base 41 and the heat conductor structure 43. The third fixing body 54 is used to fix the heat conductor structure 43 to the flow channel base 41. In some embodiments, the third fixing body 54 passes through the flow channel base 41 and is screwed onto the heat conductor structure 43.

[0097] See also Figure 8 and Figure 9 The power module 32 includes a main power circuit board 321, a side power circuit board 322 disposed on the main power circuit board 321, an output component 323 connected to the side power circuit board 322, a top surface 324 disposed on the main power circuit board 321, a plurality of first electronic components 325 disposed on the top surface 324, a plurality of plate openings 326 disposed on the main power circuit board 321, a bottom surface 327 disposed on the main power circuit board 321, and a plurality of second electronic components 328 disposed on the bottom surface 327. In actual implementation, the number of the first electronic component 325, the plate opening 326, and the second electronic component 328 can be one, and the present invention is not limited to this.

[0098] The main power supply circuit board 321 and the side power supply circuit board 322 are printed circuit boards with electronic components (PCBA), which can convert commercial power into direct current for computer use. The output component 323 is a board with several bases to provide connections for computer components such as the motherboard, disk drive, display adapter, etc. The upper surface 324 and the lower surface 327 are opposite surfaces of the main power supply circuit board 321. The first electronic components 325 are two common mode chokes / filters (EMI choke) and a power factor correction inductor (PFC inductor), but not limited thereto. The several second electronic components 328 are several active bridge rectifier control chips, power amplifier chips (PFC MOSFET), Schottky diode chips (SICDIODE), synchronous rectifier field effect diode chips (SR MOSFET), resonant conversion field effect diode chips (LLC MOSFET), etc., but not limited thereto.

[0099] The first electronic components 325 pass through the openings 326 in the board and are in contact with the heat conducting layer 44. Please refer to Figure 4 and Figure 10 for a side view of the first electronic components 325 of a common mode choke / filter (EMI choke). The first electronic components 325 are entirely located above the main power supply circuit board 321 and pass through the openings 326 in the board. The heat conducting layer 44 located below the main power supply circuit board 321 can be in contact with the first electronic components 325, and the heat conducting layer 44 can directly take away the heat on the first electronic components 325.

[0100] Please refer to Figure 4 and Figure 11 for a side view of the first electronic components 325 of a power factor correction inductor (PFC inductor). The first electronic components 325 are entirely located above the main power supply circuit board 321. The bottom of the first electronic components 325 passes through the openings 326 in the board and protrudes outwards. The heat conducting layer 44 located below the main power supply circuit board 321 can be in contact with the first electronic components 325, and the heat conducting layer 44 can directly take away the heat on the first electronic components 325.

[0101] Referring back to Figure 2 and Figure 9 the several second electronic components 328 are arranged on the lower surface 327, and the surfaces of the several second electronic components 328 are all in contact with the heat conducting layer 44. The heat conducting layer 44 can directly take away the heat on the several second electronic components 328.

[0102] Please refer to Figure 12, which is a second embodiment of a conduction heat dissipation power supply device of the present utility model. This second embodiment is substantially the same as the first embodiment, and the same parts will not be described in detail here. The difference is that the heat dissipation unit 4 does not have a flow channel base 41, a liquid flow channel 42, a liquid inlet structure 45, a liquid outlet structure 46, and a liquid stop ring 47.

[0103] The heat conducting body structure 43 is disposed within the power supply housing 31. The heat conducting body structure 43 is disposed at the bottom of the power supply housing 31 and directly forms the bottom shell of the power supply housing 31. In actual implementation, the power supply housing 31 may also be provided with a bottom shell to enclose the heat conducting body structure 43, but this should not be taken as a limitation. In some embodiments, the heat conducting body structure 43 is fixed to the power supply housing 31. In some embodiments, the heat conducting body structure 43 is fixed to the power module 32.

[0104] In this second embodiment, several bumps are provided at the bottom of the heat conducting body structure 43 to increase the heat dissipation area, which belongs to a passive heat dissipation module. In some embodiments, a fin structure may be provided at the bottom of the heat conducting body structure 43. In some embodiments, a fan may also be added to the bottom of the heat conducting body structure 43 to form an active heat dissipation module.

[0105] The main power circuit board 321 is accommodated in the power supply housing 31. The first electronic component 325 passes through the board opening 326 to contact the heat conducting layer 44. The second electronic component 328 is located at the bottom of the main power circuit board 321 and contacts the heat conducting layer 44. After the heat conduction of the first electronic component 325 and the second electronic component 328 to the heat conducting layer 44, it is then conducted to the heat conducting body structure 43 for heat dissipation.

[0106] From the above description, it can be seen that a conduction heat dissipation power supply device of the present utility model indeed has the following effects:

[0107] I. Good heat dissipation effect:

[0108] The liquid inlet structure 45 supplies the coolant to flow into the liquid flow channel 42, and the liquid outlet structure 46 supplies the coolant in the liquid flow channel 42 to flow out. The power module 32 is connected to the heat conducting layer 44, the heat conducting layer 44 is connected to the heat conducting body structure 43, the heat conducting body structure 43 is connected to the coolant. The heat conducting layer 44 and the heat conducting body structure 43 conduct the heat of the power module 32 to the coolant in the liquid flow channel 42. Even if the electronic components on the power module 32 are arranged compactly, it will not affect the heat dissipation effect of the water cooling, and the heat dissipation unit 4 has better heat dissipation efficiency.

[0109] II. Improve the heat dissipation effect of power components:

[0110] In the present utility model, the second electronic components 328 of several power components are arranged on the lower surface 327 of the main power circuit board 321, so that the second electronic components 328 can be in direct contact with the heat conduction layer 44. The heat generated by the several second electronic components 328 can be directly conducted to the cooling liquid in the liquid flow channel 42, thereby improving the heat dissipation effect of the several second electronic components 328.

[0111] III. Improving the heat dissipation effect of the coil assembly:

[0112] Several board openings 326 are provided on the main power circuit board 321. Although the first electronic components 325 of the several coil assemblies are arranged on the upper surface 324 of the main power circuit board 321, the bottoms of the several first electronic components 325 also pass through the several board openings 326 and are in direct contact with the heat conduction layer 44. The heat generated by the several first electronic components 325 can be directly conducted to the cooling liquid in the liquid flow channel 42, thereby improving the heat dissipation effect of the several first electronic components 325.

[0113] In summary, the heat conduction layer 44 is in close contact with the main power circuit board 321 and the heat conduction body structure 43, and can directly export the heat in the power module 32 to the cooling liquid. The first electronic component 325 is in direct contact with the heat conduction layer 44 through the board opening 326, and can directly export the heat of the first electronic component 325. The second electronic component 328 is arranged on the lower surface 327 of the main power circuit board 321 and is in direct contact with the heat conduction layer 44, and can directly export the heat of the second electronic component 328. The heat dissipation unit 4 does provide a better heat dissipation effect for the power module 32, so the purpose of the present utility model can indeed be achieved.

[0114] The above is only two embodiments of the present utility model, and the scope of implementation of the present utility model cannot be limited thereby. That is, all simple equivalent changes and modifications made according to the scope of the patent application of the present utility model and the content of the utility model description still fall within the scope covered by the patent of the present utility model.

Claims

1. A conduction heat dissipation type power supply device, characterized in that Comprising: A power supply unit, including a power supply housing and a power supply module disposed within the power supply housing; and A heat dissipation unit, including a heat conducting body structure disposed within the power supply housing and a heat conducting layer connected to the heat conducting body structure, the power supply module being connected to the heat conducting layer.

2. The conduction heat dissipation type power supply device according to claim 1, wherein The heat dissipation unit further includes a flow channel base connected to the heat conducting body structure, a liquid flow channel defined by the cooperation of the flow channel base and the heat conducting body structure, a liquid inlet structure disposed on the flow channel base, and a liquid outlet structure disposed on the flow channel base. The structure of the liquid flow channel is curved and distributed between the heat conducting body structure and the flow channel base.

3. The conductive cooling power supply device according to claim 2, wherein: The power supply unit further includes a liquid input opening disposed on the power supply housing and a liquid output opening disposed on the power supply housing. The power supply housing has a front plate, and the liquid input opening and the liquid output opening are disposed on the front plate. The liquid inlet structure is exposed to the outside through the liquid input opening, and the liquid outlet structure is exposed to the outside through the liquid output opening.

4. The conductive heat dissipation power supply device according to claim 2, wherein: Further comprising a fixing unit, the fixing unit including at least one first fixing body, the first fixing body being disposed in the heat conducting body structure, the flow channel base, and the power supply housing.

5. The conduction heat dissipation type power supply device according to claim 2, wherein, Further comprising a fixing unit, the fixing unit including a second fixing base disposed on the heat conducting body structure and a second fixing body disposed on the power supply module, the second fixing body being connected to the second fixing base.

6. The conduction heat dissipation type power supply device according to claim 2, characterized in that, Further comprising a fixing unit, the fixing unit including a third fixing body, the third fixing body being disposed in the flow channel base and the heat conducting body structure.

7. The conduction heat dissipation type power supply device according to claim 2, wherein The heat dissipation unit further includes a liquid stop ring disposed between the flow channel base and the heat conducting body structure, the liquid stop ring surrounding the liquid flow channel.

8. The conduction heat dissipation type power supply device according to claim 1, characterized in that, The power supply module has a main power circuit board, a first electronic component disposed on the upper surface of the main power circuit board, at least one first electronic component disposed on the upper surface, and at least one board opening penetrating through the main power circuit board. The first electronic component passes through the board opening and contacts the heat conducting layer.

9. The conductive cooling power supply device according to claim 1, wherein: The power supply module has a main power circuit board, a second electronic component disposed on the lower surface of the main power circuit board, and at least one second electronic component disposed on the lower surface. The second electronic component is connected to the heat conducting layer.

10. The conductive cooling power supply device according to claim 1, wherein: The material of the heat conducting body structure is brass.

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