Ultraviolet curing device

Abstract

The disclosed UV curing apparatus comprises: a UV chamber; a UV irradiation member located outside the UV chamber; a stage located within the UV chamber; the first gas injection part is positioned on one side of the UV chamber; and a second gas injection part connected to the stage, in which the second gas injection part may include a floating gas supply member connected to the stage to supply a mixed gas to the stage, and a mixed gas generation part connected to the floating gas supply member.

Description

Technical Field

[0001] The present disclosure relates to an ultraviolet (UV) curing apparatus. Background Art

[0002] As a device for displaying an image, a display device includes an organic light emitting diode (OLED), a liquid crystal display (LCD), an electrophoretic display (ED), a surface-conduction electron-emitter display (SED), a vacuum fluorescent display panel (VFD), a quantum dot light emitting diode (QLED), a Micro LED display, and the like.

[0003] Such a display device can be formed by stacking a plurality of layers on a substrate, and in order to bond the display panel to the cover glass, a transparent adhesive resin (OCR, Optically Clear Resin) can be coated on the display panel in an inkjet manner. The transparent adhesive resin thus coated requires a process of curing with UV light.

[0004] However, there are the following problems: UV light absorbs oxygen in the air to generate ozone, and oxygen in the air inhibits the reaction caused by UV light, thereby reducing the curing quality. In addition, there is also the following problem: when the transparent adhesive resin comes into contact with oxygen, it is oxidized due to the oxidation reaction, and thus the optical function may deteriorate. For this, the following method is being used: transporting the substrate into the chamber, and converting the inside of the chamber into a nitrogen environment to reduce the oxygen concentration inside the chamber, and then performing the UV curing process. Summary of the Utility Model

[0005] An embodiment is for providing a UV curing apparatus capable of controlling O2 ppm during UV curing and a UV curing method using the apparatus.

[0006] A UV curing device according to an embodiment includes: a UV chamber; a UV irradiation member located outside the UV chamber; a stage located inside the UV chamber; a first gas injection unit located on one side of the UV chamber; and a second gas injection unit connected to the stage, wherein the second gas injection unit includes a floating gas supply member connected to the stage to supply a mixed gas to the stage and a mixed gas generation unit connected to the floating gas supply member.

[0007] The floating gas supply member is supplied with a non-reactive gas, and the mixed gas generation unit may include an oxygen-containing gas supply member connected to the floating gas supply member to supply an oxygen-containing gas to the floating gas supply member.

[0008] The mixed gas generation unit may further include: a gas composition control unit connected to the oxygen-containing gas supply member to control the flow rate of the oxygen-containing gas moving from the oxygen-containing gas supply member to the floating gas supply member.

[0009] The mixed gas generation unit may further include: a first non-reactive gas reservoir connected to the floating gas supply member to supply a non-reactive gas; and a first oxygen-containing gas reservoir connected to the oxygen-containing gas supply member to supply an oxygen-containing gas.

[0010] The first gas injection unit may include a first non-reactive gas injection member and a first oxygen-containing gas injection member.

[0011] It may further include: a first exhaust member located on one side of the UV chamber.

[0012] It may further include: a first concentration measurement member located in the UV chamber to measure the gas concentration inside the UV chamber.

[0013] The mixed gas generation unit may include: a mixing chamber connected to the floating gas supply member to supply a mixed gas.

[0014] The mixed gas generation unit may further include: a second non-reactive gas injection member and a second oxygen-containing gas injection member connected to the mixing chamber.

[0015] The first gas injection unit may be connected to the mixing chamber to supply the mixed gas in the mixing chamber to the UV chamber.

[0016] The mixed gas generation unit may further include: a circulation member connected to the UV chamber and the mixing chamber to move the gas in the UV chamber to the mixing chamber.

[0017] The mixed gas generation unit may further include: a mixing member located inside the mixing chamber.

[0018] The mixed gas generation unit may further include: a second exhaust member located on one side of the mixing chamber.

[0019] The mixed gas generation unit may further include: a second concentration measurement member located in the mixing chamber to measure the gas concentration inside the mixing chamber.

[0020] The mixed gas generation unit may further include: a second non-reactive gas reservoir connected to the second non-reactive gas injection member to supply non-reactive gas; and a second oxygen-containing gas reservoir connected to the second oxygen-containing gas injection member to supply oxygen-containing gas.

[0021] The mixed gas generation unit may further include: a flow control unit connected to the second oxygen-containing gas injection member to control the flow rate of the oxygen-containing gas moving from the second oxygen-containing gas injection member to the mixing chamber.

[0022] It includes: a substrate support member located inside the UV chamber and arranged to support the edge of the substrate transported into the UV chamber, wherein the substrate support member can move up and down.

[0023] It further includes: a shielding part located at the UV chamber, through which the substrate can be transported in or out.

[0024] It further includes: a UV transmission member located at the UV chamber, through which the light emitted by the UV irradiation member can be transmitted into the UV chamber.

[0025] The stage can eject a gas mixture of non-reactive gas and oxygen-containing gas in the direction of the substrate arranged on the upper part.

[0026] An embodiment can provide a UV curing apparatus and a UV curing method capable of maintaining the gas environment inside the UV chamber during the UV curing process. According to the embodiment, during the UV curing process, the substrate is floated by ejecting gas from the stage, and the O2 ppm of the ejected gas is controlled, so that contact in the active region of the substrate that may occur due to using a device for floating the substrate can be prevented, and at the same time, the O2 ppm inside the UV chamber can be maintained. Description of the Drawings

[0027] Figure 1 is a cross-sectional view schematically showing a UV curing apparatus according to an embodiment.

[0028] Figure 2 is showing Figure 1 the gas flow in the UV curing apparatus of

[0029] Figure 3It is a flowchart showing a UV curing method using a UV curing device according to an embodiment.

[0030] Figure 4 It is a cross-sectional view schematically showing a UV curing device according to another embodiment.

[0031] Figure 5 It shows Figure 4 the gas flow in the UV curing device.

[0032] Figure 6 It is a flowchart showing a UV curing method using a UV curing device according to another embodiment.

[0033] Description of reference numerals

[0034] 100: UV chamber

[0035] 110: Stage

[0036] 130: Shielding part

[0037] 150: Substrate support member

[0038] 170: First concentration measurement member

[0039] 210: UV irradiation member

[0040] 230: UV transmission member

[0041] [[ID=4S1]]300: First gas injection part

[0042] 310: First non-reactive gas injection member

[0043] 330: First oxygen-containing gas injection member

[0044] 410: Floating gas supply member

[0045] 430: Mixed gas generation part

[0046] 431: Oxygen-containing gas supply member

[0047] 433: First non-reactive gas reservoir

[0048] 435: First oxygen-containing gas reservoir

[0049] 437: Gas composition control part

[0050] 450: First gas injection part

[0051] 470: Floating gas supply member

[0052] 510: First exhaust member

[0053] 600: Mixed Gas Generation Unit

[0054] 610: Mixing Chamber

[0055] 611: Mixing Component

[0056] 615: Second Concentration Measuring Component

[0057] 631: Second Non-Reactive Gas Injection Component

[0058] 633: Second Oxygen-Containing Gas Injection Component

[0059] 635: Second Non-Reactive Gas Reservoir

[0060] 637: Second Oxygen-Containing Gas Reservoir

[0061] 639: Flow Control Unit

[0062] 650: Circulation Component

[0063] 670: Second Exhaust Component Detailed Embodiments

[0064] Hereinafter, various embodiments of the present invention will be described in detail with reference to the accompanying drawings, so that those of ordinary skill in the technical field to which the present invention pertains can easily implement it. The present invention can be implemented in various different forms and is not limited to the embodiments described herein.

[0065] To clearly illustrate the present invention, parts irrelevant to the description are omitted, and throughout the specification, the same reference numerals are given to the same or similar components.

[0066] In addition, the dimensions and thicknesses of the components shown in the drawings are arbitrarily shown for ease of explanation, so the present invention is not necessarily limited to the shown dimensions and thicknesses. In the drawings, the thicknesses are enlarged to clearly show each layer and region. In addition, in the drawings, the thicknesses of some layers and regions are exaggerated for ease of explanation.

[0067] In addition, when a part such as a layer, film, region, plate, etc. is referred to as being "above" or "on" another part, it includes not only the case of being "directly above" the other part, but also the case where there is another part in between. On the contrary, when a part is referred to as being "directly above" another part, it means that there is no other part in between. In addition, being "above" or "on" the reference part is located above or below the reference part, and does not necessarily mean being "above" or "on" in the direction opposite to gravity.

[0068] In addition, throughout the specification, when referring to a certain part "including" a certain component, unless there is a particularly contrary record, it means that other components can also be included, rather than excluding other components.

[0069] In addition, throughout the specification, when referring to "on a plane", it means when viewing the target part from above, and when referring to "in a cross-section", it means when viewing the cross-section after vertically cutting the target part from the side.

[0070] In addition, when referring to two components overlapping, unless otherwise mentioned, it means that the two components overlap in the vertical direction (for example, in the direction perpendicular to the upper surface of the substrate).

[0071] Figure 1 is a cross-sectional view schematically showing a UV curing apparatus according to an embodiment, and [[ID=ll]] Figure 2 shows Figure 1 the gas flow in the UV curing apparatus.

[0072] Referring to Figure 1 and Figure 2 According to the present embodiment, the UV curing apparatus 10 may include a UV chamber 100, a stage 110, a UV irradiation unit 200, a first gas injection unit 300, a second gas injection unit 400, a substrate support member 150, and a first exhaust member 510.

[0073] The UV chamber 100, as a device for curing a thin film layer formed on the substrate 1000, can arrange the position of the substrate 1000 in its internal space. The substrate 1000 can be a display device such as an organic light emitting diode (OLED), a liquid crystal display (LCD), an electrophoretic display (ED), a surface-conduction electron-emitter display (SED), a vacuum fluorescent display panel (VFD), or a Micro LED display device. The thin film layer formed on the substrate 1000 is usually implemented by a resin, but is not limited thereto, and can be formed of a raw material that can be cured by ultraviolet rays, such as a UV resin. The UV chamber 100 can form a space inside, and one side can have an opening. As an example, a shielding part 130 can be arranged at the UV chamber 100 to selectively open and close, and through the shielding part 130, the substrate 1000 can be transported in or out.

[0074] Inside the UV chamber 100, a stage 110 can be arranged below the position of the substrate 1000. The stage 110 can receive gas from the second gas injection part 400 and can retain the gas inside. During the UV curing process, the stage 110 can eject the gas retained inside or supplied from the outside upward. The stage 110 can float the substrate 1000 by ejecting gas toward the lower surface of the substrate 1000.

[0075] The UV chamber 100 can have a first concentration measurement member 170 for detecting the gas composition inside. As an example, the first concentration measurement member 170 can be a gas sensor that measures the O2 ppm inside the UV chamber 100.

[0076] The UV irradiation part 200 can irradiate ultraviolet rays onto the substrate 1000. The UV irradiation part 200 can include a UV irradiation member 210 and a UV transmission member 230. The UV irradiation member 210 can emit ultraviolet rays. The UV irradiation member 210 can be located outside the UV chamber 100 and can be arranged above the substrate 1000. As an example, the UV irradiation member 210 can be a UV lamp located above the UV chamber 100. The UV transmission member 230 can transmit the ultraviolet rays irradiated by the UV irradiation member 210 into the interior of the UV chamber 100. The UV transmission member 230 can be a plate made of a transparent material with a high ultraviolet ray transmittance.

[0077] The first gas injection unit 300 may be disposed at the UV chamber 100 to supply gas to the inside of the UV chamber 100. The first gas injection unit 300 may include a first non-reactive gas injection member 310, a first oxygen-containing gas injection member 330, a first non-reactive gas reservoir 350, a first oxygen-containing gas reservoir 370, and a gas flow control unit 390.

[0078] The first non-reactive gas injection member 310 may inject non-reactive gas into the inside of the UV chamber 100. The first non-reactive gas injection member 310 may have a tube shape connecting the inside and the outside of the UV chamber 100. The non-reactive gas may include inert gases such as argon (Ar), nitrogen (N2), and combinations thereof, but is not limited thereto.

[0079] The first oxygen-containing gas injection member 330 may inject a gas containing oxygen (oxygen-containing gas) into the inside of the UV chamber 100. The first oxygen-containing gas injection member 330 may have a tube shape connecting the inside and the outside of the UV chamber 100. As an example, the gas supplied by the first oxygen-containing gas injection member 330 to the UV chamber 100 may be compressed dry air (CDA).

[0080] The first non-reactive gas reservoir 350 may be located outside the UV chamber 100. The first non-reactive gas reservoir 350 may be connected to the first non-reactive gas injection member 310 to supply the non-reactive gas injected into the UV chamber 100. The first non-reactive gas reservoir 350 may receive and store non-reactive gas from the outside.

[0081] The first oxygen-containing gas reservoir 370 may be located outside the UV chamber 100. The first oxygen-containing gas reservoir 370 may receive and store a gas containing oxygen from the outside. The first oxygen-containing gas reservoir 370 may be connected to the first oxygen-containing gas injection member 330 to supply the oxygen-containing gas injected into the UV chamber 100.

[0082] The gas flow control unit 390 may control the flow rate of the gas injected into the UV chamber 100. As an example, the gas flow control unit 390 may be connected to the first non-reactive gas injection member 310 and the first oxygen-containing gas injection member 330 to control the flow rates of the non-reactive gas and the oxygen-containing gas injected into the UV chamber 100. As another example, the gas flow control unit 390 may be connected to the first oxygen-containing gas injection member 330 to control the flow rate of the oxygen-containing gas injected into the UV chamber 100. The gas flow control unit 390 may be connected to the first concentration measurement member 17".

[0083] The second gas injection unit 400 may be connected to the stage 110 to supply the gas ejected from the stage 110 to float the substrate 1000 to the stage 110. The second gas injection unit 400 may include a floating gas supply member 410 and a mixed gas generation unit 430.

[0084] The floating gas supply member 410 may be connected to the stage 110. As an example, the floating gas supply member 410 may have a tube shape connecting the stage 110 and the outside of the UV chamber 100. The floating gas supply member 410 may supply a mixed gas containing a non-reactive gas and an oxygen-containing gas to the stage 110.

[0085] The mixed gas generation unit 430 may supply a non-reactive gas and an oxygen-containing gas to the floating gas supply member 410. The non-reactive gas and the oxygen-containing gas supplied to the floating gas supply member 410 may be mixed within the floating gas supply member 410. The mixed gas generation unit 430 may include an oxygen-containing gas supply member 431, a second non-reactive gas reservoir 433, a second oxygen-containing gas reservoir 435, and a gas composition control unit 437.

[0086] The oxygen-containing gas supply member 431 may be connected to the floating gas supply member 410. As an example, the oxygen-containing gas supply member 431 may have a tube shape extending from the floating gas supply member 410. The oxygen-containing gas supply member 431 may supply an oxygen-containing gas such as CDA to the floating gas supply member 410. In Figure 1 and Figure 2 the oxygen-containing gas supply member 431 is shown connected to the floating gas supply member 410 inside the UV chamber 100, but is not limited thereto, and the oxygen-containing gas supply member 431 may also be connected to the floating gas supply member 410 outside the UV chamber 100.

[0087] The second non-reactive gas reservoir 433 may be located outside the UV chamber 100. The second non-reactive gas reservoir 433 may be connected to the floating gas supply member 410 to supply a non-reactive gas. The second non-reactive gas reservoir 433 may receive a non-reactive gas from the outside for storage. As an example, the second non-reactive gas reservoir 433 may be the same as the first non-reactive gas reservoir 350. That is, the first non-reactive gas injection member 310 and the second non-reactive gas reservoir 433 may receive a non-reactive gas from one non-reactive gas reservoir.

[0088] The second oxygen-containing gas reservoir 435 may be located outside the UV chamber 100. The second oxygen-containing gas reservoir 435 may be connected to the oxygen-containing gas supply member 431 to supply the oxygen-containing gas. The oxygen-containing gas supply member 431 may receive the oxygen-containing gas from the outside for storage. As an example, the second oxygen-containing gas reservoir 435 may be the same as the first oxygen-containing gas reservoir 370. That is, the first oxygen-containing gas injection member 330 and the oxygen-containing gas supply member 431 may receive the oxygen-containing gas from one oxygen-containing gas reservoir.

[0089] The gas composition control unit 437 may control the composition of the gas injected into the stage 110. As an example, the gas composition control unit 437 may be connected to the oxygen-containing gas supply member 431 to control the flow rate of the oxygen-containing gas injected into the floating gas supply member 410. The gas composition control unit 437 may be connected to the first concentration measurement member 170.

[0090] The first exhaust member 510 may be located at the UV chamber 100. As an example, the first exhaust member 510 may have a tube shape connecting the inside and the outside of the UV chamber 100. Through the first exhaust member 510, the gas inside the UV chamber 100 can be exhausted to the outside. If the air pressure inside the UV chamber 100 rises above a certain level, the gas inside can flow out through the first exhaust member 510.

[0091] Hereinafter, with reference to Figure 1 and Figure 2 and also with reference to Figure 3 a UV curing method using a UV curing apparatus according to an embodiment will be described.

[0092] Figure 3 is a flowchart showing a UV curing method using a UV curing apparatus according to an embodiment.

[0093] Referring to Figure 3 in the UV curing method using a UV curing apparatus according to the present embodiment, first, in step S110, the substrate 1000 may be transported into the UV chamber 100.

[0094] Specifically, by opening the shielding part 130 arranged at the UV chamber 100, the substrate 1000 may be transported into the UV chamber 100 through the shielding part 130. The moved substrate 1000 may be located above the stage 110 inside the UV chamber 100. The substrate 1000 may be supported by the substrate support member 150. The substrate support member 150 may support the substrate 1000 by contacting a region of the substrate 1000 that is not the active region (i.e., the corner region of the substrate 1000). Therefore, the substrate 1000 may be arranged in a floating state without the active region contacting other components such as the support stage.

[0095] Then, in step S120, the first non-reactive gas injection member 310 and the first oxygen-containing gas injection member 330 can be opened to inject non-reactive gas and oxygen-containing gas into the interior of the UV chamber 100. At this time, in order not to cause the air pressure inside the UV chamber 100 to rise excessively, the first exhaust member 510 can be opened. In order to control the resin printing quality on the substrate 1000, the non-reactive gas and O2 ppm can be controlled during the curing process. If non-reactive gas and oxygen-containing gas are continuously injected into the interior of the UV chamber 100 at a certain flow rate, the O2 ppm will continuously change, and thus the target O2 ppm may be reached. The first concentration measurement member 170 can monitor whether the gas inside the UV chamber 100 reaches the target O2 ppm. The flow rates of the non-reactive gas and the oxygen-containing gas injected through the first non-reactive gas injection member 310 and the first oxygen-containing gas injection member 330 can be controlled by reflecting the monitoring.

[0096] In step S130, when the gas inside the UV chamber 100 reaches the target O2 ppm, the first non-reactive gas injection member 310, the first oxygen-containing gas injection member 330, and the first exhaust member 510 can be closed.

[0097] Then, in step S140, gas can be started to be ejected from the stage ۱۱۰. The gas ejected from the floating gas supply member 410 to the stage 110 can be supplied. The non-reactive gas can be supplied from the second non-reactive gas reservoir 433 to the floating gas supply member 410, and the oxygen-containing gas can be supplied from the second oxygen-containing gas reservoir 435 to the floating gas supply member 410. The oxygen-containing gas can start from the second oxygen-containing gas reservoir 435 and move to the floating gas supply member 410 via the oxygen-containing gas supply member 431. The flow rate of the oxygen-containing gas injected from the oxygen-containing gas supply member 431 to the floating gas supply member 410 can be controlled by the gas composition control unit 437. The non-reactive gas and the oxygen-containing gas can move to the stage 110 while being mixed with each other in the floating gas supply member 410. The mixed gas can reach the target value of O2 ppm and can be ejected from the stage 110 upward.

[0098] Then, in step S150, the substrate support member 150 can be lowered. As the substrate support member 150 is lowered, the substrate 1000 supported by the substrate support member 150 can also be lowered together. When the substrate 1000 is lowered, it starts to be subjected to the upward pressure caused by the gas ejected from the stage 110, and when it reaches a certain height, it can be floated in the air by ejecting gas. Therefore, even without other floating tools in contact with the active area, the substrate 1000 can be floated in the air at a certain interval from the stage 110.

[0099] Then, in step S160, a UV curing process can be performed on the substrate 1000. As an example, the substrate 1000 can have a structure in which a protective layer is stacked on a glass panel and a resin layer is stacked on the protective layer. The resin layer can be a UV-curable resin layer having the property of being cured by ultraviolet rays. The UV irradiation member 210 can be operated to emit ultraviolet rays. The emitted ultraviolet rays can pass through the UV transmissive member 230 and enter the interior of the UV chamber 100, thereby curing the resin layer on the substrate 1000.

[0100] In step S170, when the UV curing process is completed, the substrate support member 150 is raised, so that the substrate 1000 can be raised. During this process, gas can be continuously ejected upward in the table 110.

[0101] In step S180, when the substrate 1000 rises back to its original position, the gas ejection from the table 110 can be stopped. As an example, by closing the second gas injection unit 400 to block the gas supplied to the substrate 1000, the gas ejection of the substrate 1000 can be stopped.

[0102] Then, in step S190, the first oxygen-containing gas injection member 330 can be opened. The oxygen-containing gas flows from the first oxygen-containing gas injection member 330 into the interior of the UV chamber 100, and while the gas inside the UV chamber 100 is exhausted through the first exhaust member 510, the gas inside the UV chamber 100 can be restored to the initial state with a higher O2 ppm.

[0103] Then, in step S200, the substrate 1000 can be transported out of the UV chamber 100.

[0104] Hereinafter, reference will be made to Figure 4 and Figure 5 to describe a UV curing apparatus according to another embodiment.

[0105] Figure 4 is a cross-sectional view schematically showing a UV curing apparatus according to another embodiment, and Figure 5 is a diagram showing Figure 4 the gas flow in the UV curing apparatus of Figure 1 and Figure 2 The UV curing apparatus according to the present embodiment is similar to the embodiment of the UV curing apparatus 10 described with reference to

[0106] Reference is made to Figure 4 and Figure 5 According to the present embodiment, the UV curing apparatus 20 can include a UV chamber 100, a table 110, a first gas injection unit 450, a floating gas supply member 470, and a mixed gas generation unit 600.

[0107] The mixed gas generation unit 600 can generate a mixed gas to be supplied to the UV chamber 100 and the stage 110. The mixed gas generation unit 600 can include a mixing chamber 610, a second non-reactive gas injection member 631, a second oxygen-containing gas injection member 633, a circulation member 650, and a second exhaust member 670.

[0108] The mixing chamber 610 can store the gases flowing in from the second non-reactive gas injection member 631 and the second oxygen-containing gas injection member 633, and mix them. The mixing chamber 610 can be provided with a mixing member 611 that aids in the rapid mixing of the inflowing gases.

[0109] The mixing chamber 610 can have a second concentration measurement member 615 for detecting the gas composition inside. As an example, the second concentration measurement member 615 can be a gas sensor that measures the O2 ppm inside the mixing chamber 610.

[0110] The second non-reactive gas injection member 631 can inject a non-reactive gas into the interior of the mixing chamber 610. The second non-reactive gas injection member 631 can have a tube shape connecting the interior and exterior of the mixing chamber 610. The second non-reactive gas injection member 631 can be connected to a second non-reactive gas reservoir 635. The second non-reactive gas reservoir 635 can supply the non-reactive gas injected into the mixing chamber 610 through the second non-reactive gas injection member 631. The second non-reactive gas reservoir 635 can receive the non-reactive gas from the outside for storage.

[0111] The second oxygen-containing gas injection member 633 can inject an oxygen-containing gas into the interior of the mixing chamber 610. The second oxygen-containing gas injection member 633 can have a tube shape connecting the interior and exterior of the mixing chamber 610. The second oxygen-containing gas injection member 633 can be connected to a second oxygen-containing gas reservoir 637. The second oxygen-containing gas reservoir 637 can supply the oxygen-containing gas injected into the mixing chamber 610 through the second oxygen-containing gas injection member 633. The second oxygen-containing gas reservoir 637 can receive the oxygen-containing gas from the outside for storage.

[0112] The flow control unit 639 can control the composition of the gas injected into the mixing chamber 610. As an example, the flow control unit 639 can be connected to the second oxygen-containing gas injection member 633 to control the flow rate of the oxygen-containing gas injected into the mixing chamber 610. The flow control unit 639 can be connected to the second concentration measurement member 615. In Figure 4 this case, the second non-reactive gas injection member 631, the second oxygen-containing gas injection member 633, the second non-reactive gas reservoir 635, the second oxygen-containing gas reservoir 637, and the flow control unit 639 can be collectively denoted by the reference numeral 630.

[0113] The circulation member 650 can be connected to the UV chamber 100 and the mixing chamber 610. The gas inside the UV chamber 100 can move towards the mixing chamber 610 through the circulation member 650.

[0114] The second exhaust member 670 can be arranged at the mixing chamber 610 to exhaust the gas inside the mixing chamber 610. As an example, the second exhaust member 670 can have a pipe shape connecting the inside and the outside of the mixing chamber 610. When the air pressure inside the mixing chamber 610 rises above a certain level, the gas inside can flow out through the second exhaust member 670.

[0115] The first gas injection part 450 can be connected to the UV chamber 100 and the mixing chamber 610. The gas in the mixing chamber 610 can move towards the UV chamber 100 through the first gas injection part 450.

[0116] The floating gas supply member 470 can be connected to the stage 110 and the mixing chamber 610. As an example, the floating gas supply member 470 can have a pipe shape. The gas in the mixing chamber 610 can move towards the stage 110 through the floating gas supply member 470.

[0117] Figure 6 is a flowchart showing a UV curing method using a UV curing apparatus according to another embodiment. The UV curing method using a UV curing apparatus according to the present embodiment is similar to the embodiment described with reference to Figure 3 The specific description of the same components will be omitted.

[0118] Referring to Figure 6 , in the UV curing method using a UV curing apparatus according to the present embodiment, first, in step S310, a non-reactive gas and an oxygen-containing gas can be injected into the mixing chamber 610. In order to inject gas into the mixing chamber 610, the second non-reactive gas injection member 631 and the second oxygen-containing gas injection member 633 can be opened. Before and after this, in order to prevent the air pressure inside the mixing chamber 610 from rising excessively, the second exhaust member 670 can be opened. If the non-reactive gas and the oxygen-containing gas are continuously injected into the mixing chamber 610 at a certain flow rate, the O2 ppm will continuously change, and thus the target O2 ppm may be reached. The second concentration measurement member 615 can monitor whether the gas inside the mixing chamber 610 reaches the target O2 ppm. The flow rate of the oxygen-containing gas injected through the second oxygen-containing gas injection member 633 can be controlled by reflecting the monitoring. At this time, in step S320, the mixing member 611 can be operated to accelerate the mixing of the non-reactive gas and the oxygen-containing gas.

[0119] Step S330, when the gas inside the mixing chamber 610 reaches the target O2 ppm, the substrate 1000 can be transported into the UV chamber. To transport the substrate 1000, the shielding part 130 can be opened, and other tools such as a robot device can be used.

[0120] Step S340, when the substrate 1000 is placed at a specific position by the substrate support member 150, the first gas injection part 450 can be opened to inject the gas in the mixing chamber 610 into the UV chamber 100. Before and after this, to prevent the air pressure inside the UV chamber 100 from rising excessively, the first exhaust member 510 can be opened. Additionally, the circulation member 650 can be opened. When the gas in the mixing chamber 610 moves towards the UV chamber 100 through the first gas injection part 450, the air pressure inside the UV chamber 100 rises. Therefore, a part of the gas inside the UV chamber 100 can be exhausted to the outside through the first exhaust member 510, and a part can move towards the mixing chamber 610 through the circulation member 650. Since non-reactive gas and oxygen-containing gas are continuously injected into the mixing chamber 610 from the second non-reactive gas injection member 631 and the second oxygen-containing gas injection member 633, the O2 ppm in the mixing chamber 610 can be maintained within a certain range even when the gas in the UV chamber 100 moves towards the mixing chamber 610 through the circulation member 650. When the gas in the UV chamber 100 moves towards the mixing chamber 610 through the circulation member 650, the gas inside the UV chamber 100 can reach the target O2 ppm more quickly.

[0121] Step S35 , when the gas inside the UV chamber 100 reaches the target O2 ppm, the first gas injection part 45 can be closed.

[0122] Then, in step S360, the floating gas supply member 470 can be opened. The gas in the mixing chamber 610 can move towards the stage 110 through the floating gas supply member 470 and thus be ejected above the stage 110.

[0123] Then, in step S370, the substrate support member 150 can be lowered.

[0124] Step S380, when the substrate 1000 is lifted to a certain height by the gas ejected from the stage 110, a UV curing process can be performed.

[0125] Step S390, when the UV curing process is completed, the substrate support member 150 can be raised to lift the substrate 1000.

[0126] Step S400, when the substrate 1000 rises back to its original position, the floating gas supply member 470 can be closed to stop ejecting gas from the stage 110.

[0127] Then, in step S410, the substrate 1000 can be transported out of the UV chamber 100.

[0128] The embodiments of the present invention have been described in detail above, but the scope of the rights of the present invention is not limited thereto, and various modifications and improvements made by those skilled in the art using the basic concepts of the present invention defined in the appended claims also fall within the scope of the rights of the present invention.

Claims

1. An ultraviolet curing device, characterized in that, Comprising: An ultraviolet chamber; An ultraviolet irradiation member, located outside the ultraviolet chamber; A stage, located inside the ultraviolet chamber; A first gas injection part, located on one side of the ultraviolet chamber; And A second gas injection part, connected to the stage, wherein the second gas injection part includes a floating gas supply member connected to the stage to supply a mixed gas to the stage and a mixed gas generation part connected to the floating gas supply member.

2. The ultraviolet curing device according to claim 1, characterized in that The floating gas supply member is supplied with a non-reactive gas, and The mixed gas generation part includes an oxygen-containing gas supply member connected to the floating gas supply member to supply an oxygen-containing gas to the floating gas supply member.

3. The ultraviolet curing device according to claim 2, characterized in that The mixed gas generation part further includes: A gas composition control part, connected to the oxygen-containing gas supply member to control the flow rate of the oxygen-containing gas moving from the oxygen-containing gas supply member to the floating gas supply member.

4. The ultraviolet curing device according to claim 2, characterized in that The mixed gas generation part further includes: A first non-reactive gas reservoir, connected to the floating gas supply member to supply a non-reactive gas; and A first oxygen-containing gas reservoir, connected to the oxygen-containing gas supply member to supply an oxygen-containing gas.

5. The ultraviolet curing device according to claim 1, characterized in that The first gas injection part includes a first non-reactive gas injection member and a first oxygen-containing gas injection member.

6. The ultraviolet curing device according to claim 1, characterized in that, It further includes: A first exhaust member, located on one side of the ultraviolet chamber.

7. The ultraviolet curing device according to claim 1, characterized in that, It further includes: A first concentration measurement member, located in the ultraviolet chamber to measure the gas concentration inside the ultraviolet chamber.

8. The ultraviolet curing device according to claim 1, characterized in that The mixed gas generation part includes: A mixing chamber, connected to the floating gas supply member to supply a mixed gas.

9. The ultraviolet curing device according to claim 8, characterized in that The mixed gas generation part further includes: A second non-reactive gas injection member and a second oxygen-containing gas injection member, connected to the mixing chamber.

10. The ultraviolet curing device according to claim 8, characterized in that The first gas injection part is connected to the mixing chamber to supply the mixed gas in the mixing chamber to the ultraviolet chamber.

11. The ultraviolet curing device according to claim 8, characterized in that The mixed gas generation part further includes: A circulation member, connected to the ultraviolet chamber and the mixing chamber to move the gas in the ultraviolet chamber to the mixing chamber.

12. The ultraviolet curing device according to claim 8, characterized in that The mixed gas generation part further includes: A mixing member, located inside the mixing chamber.

13. The ultraviolet curing device according to claim 8, characterized in that The mixed gas generation part further includes: A second exhaust member, located on one side of the mixing chamber.

14. The ultraviolet curing device according to claim 8, characterized in that The mixed gas generation part further includes: A second concentration measurement member is located at the mixing chamber to measure the gas concentration inside the mixing chamber.

15. The ultraviolet curing device according to claim 9, wherein the mixed gas generation unit further includes: a second non-reactive gas reservoir connected to the second non-reactive gas injection member to supply non-reactive gas; and a second oxygen-containing gas reservoir connected to the second oxygen-containing gas injection member to supply oxygen-containing gas.

16. The ultraviolet curing device according to claim 9, wherein the mixed gas generation unit further includes: a flow control unit connected to the second oxygen-containing gas injection member to control the flow rate of the oxygen-containing gas moving from the second oxygen-containing gas injection member to the mixing chamber.

17. The ultraviolet curing device according to claim 1, characterized in that including: a substrate support member located inside the ultraviolet chamber and arranged to support the edge of the substrate carried into the inside of the ultraviolet chamber, wherein the substrate support member moves up and down.

18. The ultraviolet curing device according to claim 1, characterized in that, further includes: a shielding part located at the ultraviolet chamber, wherein the substrate is carried in or out through the shielding part.

19. The ultraviolet curing device according to claim 1, characterized in that, further includes: an ultraviolet transmission member located at the ultraviolet chamber, wherein the light emitted by the ultraviolet irradiation member is transmitted through the ultraviolet transmission member to the inside of the ultraviolet chamber.

20. The ultraviolet curing device according to claim 1, wherein the stage ejects a mixed gas of non-reactive gas and oxygen-containing gas in the direction of the substrate arranged on the upper part.

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