Packaging reflow soldering full-automatic feeding device

Abstract

The utility model discloses a packaging reflow soldering full-automatic feeding device which comprises a board placing machine, a first reflow soldering machine, a transfer board collecting machine, a conveying device, a transfer board feeding machine, a second reflow soldering machine and a board collecting machine which are sequentially arranged. The processed circuit board is transferred to the conveying belt through the transfer board collecting machine, is conveyed to the transfer board feeding machine through the conveying device and then is processed through the second reflow soldering machine, and the processed circuit board is collected by the board collecting machine; all devices adopted in the packaging reflow soldering full-automatic feeding and discharging system adopt human-computer interaction. According to the automatic board collecting and releasing device, the board releasing machine, the first reflow soldering machine, the transfer board collecting machine, the conveying device, the transfer board feeding machine, the second reflow soldering machine and the board collecting machine are arranged to form a complete automatic board collecting and releasing process, automatic feeding and discharging are achieved, manual operation is reduced, and the production and processing efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic manufacturing production lines, in particular to a fully automatic feeding device for packaging reflow soldering. Background Art

[0002] The utility model provides a fully automatic feeding device for packaging reflow soldering, which realizes a complete process in which a product is automatically placed on a board, passes through a reflow soldering machine, passes through a transfer conveyor and other links, passes through a reflow soldering machine for a second time, and finally is automatically received into a clip, thereby realizing a complete process of automatically placing and receiving boards. Utility Model Content

[0003] Purpose of the utility model: to provide a complete process for automatically retracting and extending a plate.

[0004] To achieve the above purpose, the present invention provides the following technical solutions:

[0005] A fully automatic feeding device for packaging reflow soldering comprises a board placing machine, a first reflow soldering machine, a transfer board collecting machine, a conveying device, a transfer board loading machine, a second reflow soldering machine and a board collecting machine which are arranged in sequence. The board placing machine transports the circuit board to the first reflow soldering machine for processing. The processed circuit board is transferred to the conveyor belt via the transfer board collecting machine. After being transported by the conveying device to the transfer board loading machine, it is processed by the second reflow soldering machine. The processed circuit board is collected by the board collecting machine. Each device used in the fully automatic loading and unloading system for packaging reflow soldering adopts human-computer interaction.

[0006] Furthermore, the plate placing machine includes:

[0007] A loading bin is provided at the upper part of the main body of the plate placing machine;

[0008] A lower silo, which is arranged at the lower part of the upper silo;

[0009] The pushing mechanism is used for loading or unloading the circuit board.

[0010] Furthermore, the transfer board receiving machine includes:

[0011] A transfer board receiving machine conveyor belt, which is arranged on an operating table inside the main body of the transfer board receiving machine and is used to transport the circuit boards processed by the first reflow soldering machine to the transfer board receiving machine;

[0012] The transfer plate receiving machine guide baffles are provided with four guide baffles, and the position of the guide baffles is fixed on the surface of the conveyor belt and is infinitely close to the surface of the conveyor belt;

[0013] The docking and transporting mechanism is used to transfer the circuit boards on the conveyor belt to the conveying device.

[0014] Furthermore, the conveying device includes:

[0015] A profile rack which is erected on the ground through floor bolts;

[0016] A conveyor belt which is arranged on the profile rack;

[0017] A speed-regulating motor which adopts a servo motor and is used for precise positioning and precisely adjusting the speed of the conveyor belt.

[0018] Furthermore, the transfer upper board machine includes:

[0019] A board placing mechanism which is used for transferring the boards from the conveying device to the second reflow soldering machine after they are transported to the transfer upper board machine;

[0020] An ion fan which is arranged on the top of the main body of the transfer upper board machine and is used for heat dissipation and exhaust.

[0021] Furthermore, the board receiving machine includes:

[0022] A conveyor belt which is arranged on the operating table inside the main body of the board receiving machine and is used for transporting the circuit boards processed by the second reflow soldering machine into the main body of the board receiving machine;

[0023] Four guiding baffles which are fixedly positioned on the surface of the conveyor belt and are infinitely close to the surface of the conveyor belt;

[0024] A magazine loading bin which is arranged at the upper end inside the main body of the board receiving machine and is used for transferring and stacking the processed circuit boards for storage;

[0025] A magazine unloading bin which is arranged below the magazine loading bin.

[0026] Furthermore, the board placing machine, the transfer board receiving machine, the transfer upper board machine and the board receiving machine are all controlled by an industrial control computer and are operated through control buttons, and the touch screen displays the operation and running conditions.

[0027] Compared with the prior art, the beneficial effects of the present utility model are:

[0028] This application forms a complete automatic board loading and unloading process by setting a board placing machine, a first reflow soldering machine, a transfer board receiving machine, a conveying device, a transfer upper board machine, a second reflow soldering machine and a board receiving machine, realizes automatic feeding and discharging, reduces manual operation, and improves the production and processing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a top view structural schematic diagram of the present utility model;

[0030] Figure 2 Structural schematic diagram of the plate placing machine in the present utility model;

[0031] Figure 3 Structural schematic diagram of the intermediate receiving and plate collecting machine in the present utility model;

[0032] Figure 4 Structural schematic diagram of the conveying device in the present utility model;

[0033] Figure 5 Structural schematic diagram of the intermediate plate loading machine in the present utility model;

[0034] Figure 6 Structural schematic diagram of the plate collecting machine in the present utility model.

[0035] In the figure: 1. Plate placing machine; 101. Feeding bin; 102. Discharging bin; 103. Pushing mechanism; 2. First reflow soldering machine; 3. Intermediate receiving and plate collecting machine; 301. Intermediate receiving and plate collecting machine conveyor belt; 302. Intermediate receiving and plate collecting machine guiding baffle; 303. Docking handling mechanism; 4. Conveying device; 401. Profile frame; 402. Conveyor belt; 403. Speed regulating motor; 5. Intermediate plate loading machine; 501. Plate placing mechanism; 502. Ion fan; 6. Second reflow soldering machine; 7. Plate collecting machine; 701. Conveyor belt; 702. Guiding baffle; 703. Magazine feeding bin; 704. Magazine discharging bin; 8. Industrial control computer; 9. Control button; 10. Touch display screen; 11. Warning lamp. Specific embodiments

[0036] In the following description, a large number of specific details are given to provide a more thorough understanding of the present utility model. However, it is obvious to those skilled in the art that the present utility model can be implemented without one or more of these details. In other examples, in order to avoid confusion with the present utility model, some well-known technical features in the art are not described.

[0037] Therefore, the applicant designs a fully automatic feeding device for encapsulation reflow soldering as shown in Figures 1-6 , which includes a plate placing machine 1, a first reflow soldering machine 2, an intermediate receiving and plate collecting machine 73, a conveying device 4, an intermediate plate loading machine 5, a second reflow soldering machine 6, and a plate collecting machine 7 arranged in sequence. The plate placing machine 1 transports the circuit board to the first reflow soldering machine 2 for processing. The processed circuit board is transferred to the conveyor belt 402 through intermediate receiving and plate collecting, and then transported to the intermediate plate loading machine 5 by the conveying device 4 and further processed by the second reflow soldering machine 6. The processed circuit board is collected by the plate collecting machine 7; all devices used in the fully automatic loading and unloading system for encapsulation reflow soldering adopt human-computer interaction.

[0038] As shown in Figure 2As shown in the figure, further optionally in this embodiment, the board placing machine 1 includes: a loading bin 101, which is arranged at the upper part inside the main body of the board placing machine 1; a discharging bin 102, which is arranged at the lower part of the loading bin 101; and a pushing mechanism 103, which is used for loading or unloading the circuit board.

[0039] As Figure 3 shown in the figure, further optionally in this embodiment, the transfer board receiving machine 3 includes: a transfer board receiving machine conveyor belt 301, which is arranged on the operating table inside the main body of the transfer board receiving machine 3 and is used for transporting the circuit board processed by the first reflow soldering machine 2 to the transfer board receiving machine 3; four transfer board receiving machine guiding baffles 302, whose positions are fixed on the surface of the transfer board receiving machine conveyor belt 301 and are infinitely close to the surface of the transfer board receiving machine conveyor belt 301; a docking handling mechanism 303, which is used for transferring and transporting the circuit board on the transfer board receiving machine conveyor belt 301 to the conveying device 4; and the transfer board receiving machine 3 completes the transfer and receiving, keeping the incoming and outgoing directions of the circuit board consistent.

[0040] As Figure 4 shown in the figure, further optionally in this embodiment, the conveying device 4 includes: a profile frame 401, which is erected on the ground through a floor anchor; a conveyor belt 402, which is arranged on the profile frame 401; and a speed regulating motor 403, which uses a servo motor and is used for precise positioning and precise adjustment of the speed of the conveyor belt 402; and the conveying device 4 completes the stable transportation of the circuit board, keeping the principle of first in first out.

[0041] As Figure 5 shown in the figure, further optionally in this embodiment, the transfer board loading machine 5 includes: a board loading mechanism, which is used for transferring the circuit board transported to the transfer board loading machine 5 by the conveying device 4 to the second reflow soldering machine 6 by the board loading mechanism; and an ion fan 502, which is arranged on the top of the main body of the transfer board loading machine 5 and is used for heat dissipation and exhaust.

[0042] As Figure 6As shown in the figure, further optionally in this embodiment, the board collector 7 includes: a conveyor belt 701 disposed on the operating table inside the main body of the board collector 7 for transporting the circuit boards processed by the second reflow soldering machine 6 into the main body of the board collector 7; four guiding baffles 702 fixedly positioned on the surface of the conveyor belt 701 and infinitely close to the surface of the conveyor belt 701; a magazine loading bin 703 disposed at the upper end inside the main body of the board collector 7 for transferring and stacking the processed circuit boards; a magazine unloading bin 704 disposed below the magazine loading bin 703. The board collector 7 receives the boards into the magazine loading bin 703 according to the first-in, first-out principle.

[0043] Further optionally in this embodiment, the board feeder 1, the intermediate board collector 3, the intermediate board loader 5, and the board collector 7 are all controlled by an industrial control computer 8 and operated through control buttons 9. The touch screen displays the operation and running status. In case of a fault, a warning light 11 flashes for warning. All the moving structures in the fully automatic loading and unloading system of the encapsulation reflow soldering machine are controlled by servo motors to achieve precise positioning.

[0044] Further optionally in this embodiment, the system can be connected to external devices, can be equipped with a barcode scanner, etc., and can be docked with an IT or MES system at the same time.

[0045] Working principle: During the working process, first, the board feeder 1 transports the circuit boards into the first reflow soldering machine 2 for processing. The processed circuit boards are transferred to the conveying device 4 for transportation by the intermediate board collector 3, and then transferred to the second reflow soldering machine 6 for secondary processing by the intermediate board loader 5. After being processed, they are transferred to the magazine loading bin 703 of the board collector 7 for stacking and storage, thus completing the operation.

[0046] For those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or basic characteristics of the present invention. Therefore, in any aspect, the embodiments should be regarded as exemplary and non-limiting. The scope of the present invention is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present invention. Any reference signs in the claims should not be regarded as limiting the claims involved.

Claims

1. An automatic feeding device for encapsulation reflow soldering, characterized in that, It includes a board placing machine, a first reflow soldering machine, a transfer board receiving machine, a conveying device, a transfer board loading machine, a second reflow soldering machine and a board receiving machine arranged in sequence. The board placing machine transports the circuit board to the first reflow soldering machine for processing. The processed circuit board is transferred to the conveyor belt through the transfer board receiving machine, and then transported to the transfer board loading machine by the conveying device and further processed by the second reflow soldering machine. The processed circuit board is collected by the board receiving machine; all devices used in the fully automatic loading and unloading system for encapsulation reflow soldering adopt human-computer interaction.

2. The fully automatic feeding device for encapsulation reflow soldering according to claim 1, characterized in that, The board placing machine includes: A loading bin, which is arranged at the upper part inside the main body of the board placing machine; A discharging bin, which is arranged below the loading bin; A pushing mechanism, which is used for loading or unloading the circuit board.

3. The fully automatic feeding device for encapsulation reflow soldering according to claim 1, characterized in that, The transfer board receiving machine includes: A transfer board receiving machine conveyor belt, which is arranged on the operating table inside the main body of the transfer board receiving machine and is used for transporting the circuit board processed by the first reflow soldering machine to the transfer board receiving machine; Four transfer board receiving machine guiding baffles, whose positions are fixed on the surface of the conveyor belt and are infinitely close to the surface of the conveyor belt; A docking handling mechanism, which is used for transferring the circuit board on the conveyor belt to the conveying device.

4. The fully automatic feeding device for encapsulation reflow soldering according to claim 1, wherein, The conveying device includes: A profile frame, which is erected on the ground through floor bolts; A conveyor belt, which is arranged on the profile frame; A speed regulating motor, which adopts a servo motor and is used for precise positioning and precisely adjusting the speed of the conveyor belt.

5. A fully automatic feeding device for encapsulation reflow soldering according to claim 1, characterized in that, The transfer board loading machine includes: A board placing mechanism, which is used for transferring the circuit board transported to the transfer board loading machine by the conveying device to the second reflow soldering machine through the board placing mechanism; An ion fan, which is arranged on the top of the main body of the transfer board loading machine and is used for heat dissipation and exhaust.

6. The fully automatic feeding device for encapsulation reflow soldering according to claim 1, characterized in that, The board receiving machine includes: A conveyor belt, which is arranged on the operating table inside the main body of the board receiving machine and is used for transporting the circuit board processed by the second reflow soldering machine to the inside of the main body of the board receiving machine; Four guiding baffles, whose positions are fixed on the surface of the conveyor belt and are infinitely close to the surface of the conveyor belt; A magazine feeding bin, which is arranged at the upper end inside the main body of the board receiving machine and is used for transferring and stacking the processed circuit boards for storage; A magazine discharging bin, which is arranged below the magazine feeding bin.

7. The fully automatic feeding device for encapsulation reflow soldering according to claim 1, wherein, The board placing machine, the transfer board receiving machine, the transfer board loading machine and the board receiving machine are all controlled by an industrial computer and are operated through control buttons. The touch screen displays the operation and running status.

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