Vapor chamber, cooling device and reflow soldering equipment

Abstract

The embodiment of the utility model provides a uniform temperature plate, a cooling device and reflow soldering equipment, the uniform temperature plate is applied to the cooling device of the reflow soldering equipment, the uniform temperature plate is provided with a plurality of through holes in the thickness direction of the uniform temperature plate, and the through holes are used for air flow to pass through; a low-lying area is arranged on the side of each through hole of the uniform-temperature plate and used for collecting liquid on the periphery of a top opening of each through hole. The low-lying area on the top surface of the vapor chamber can collect the liquid solder resist, so that the problem that the liquid solder resist is easy to drop through the through holes of the vapor chamber is solved.

Description

Technical Field

[0001] The present application relates to the technical field of reflow soldering equipment design, and particularly relates to a heat pipe, a cooling device, and a reflow soldering equipment. Background Art

[0002] Reflow soldering equipment is generally divided into four temperature zones, which are, in sequence: a preheating zone, a constant temperature zone, a reflow zone (also called a soldering zone), and a cooling zone. A printed circuit board (PCB) is conveyed by a conveying device and passes through the preheating zone, the constant temperature zone, the reflow zone, and the cooling zone in sequence. A cooling device is provided in the cooling zone. The cooling device is disposed above the conveying device, and a heat pipe is provided on the lower side of the cooling device. A fan in the cooling device can cause gas to pass through the heat pipe, so as to cool the cooling zone by making the gas flow. The solder on the circuit board conveyed to the cooling zone cools and solidifies in the cooling zone, thereby soldering electronic components to the circuit board.

[0003] Due to process requirements, a soldering flux needs to be used during the soldering process. Condensation will occur on the surface of the cooling device, and part of the soldering flux will accumulate in a liquid form on the heat pipe. Therefore, it is necessary to regularly clean and maintain the heat pipe to prevent the liquid soldering flux from dripping through the pores on the heat pipe onto the surface of the circuit board below, thereby causing the circuit board to be contaminated and scrapped.

[0004] In the related art, the heat pipe has a problem of high cleaning and maintenance frequency. Therefore, those skilled in the art urgently need to solve the problem of how to reduce the cleaning and maintenance frequency of the heat pipe. Summary of the Utility Model

[0005] Embodiments of the present application provide a heat pipe, a cooling device, and a reflow soldering equipment to solve the problem of how to reduce the cleaning and maintenance frequency of the heat pipe.

[0006] To solve the above technical problems, the present application is implemented as follows:

[0007] In a first aspect, embodiments of the present application provide a heat pipe.

[0008] The heat pipe provided by the embodiments of the present application is applied to a cooling device of a reflow soldering equipment. A plurality of through holes are provided in the heat pipe along its own thickness direction, and the through holes are used for allowing air flow to pass through; a low-lying area is provided on the side of each of the through holes of the heat pipe, and the low-lying area is used for collecting liquid on the outer periphery of the top opening of the through hole.

[0009] Optionally, the top surface of the heat pipe is an uneven surface, and each of the through holes penetrates through the raised area of the uneven surface.

[0010] In a second aspect, embodiments of the present application provide a cooling device.

[0011] The cooling device provided by an embodiment of the present application includes: a main body and any one of the heat pipes provided by the embodiments of the present application, and the heat pipe is disposed below the main body.

[0012] Optionally, a groove extending from a first end to an opposite second end is provided on the top surface of the heat pipe, and the area where the groove is located forms the low-lying area.

[0013] Optionally, a protrusion is provided between two adjacent grooves, the protrusion extends from the first end to the second end, and each of the perforations penetrates through the protrusion.

[0014] Optionally, the cross-sectional shape of the top wall of the heat pipe is serrated, and the cross-sectional shape of the bottom wall of the groove is V-shaped.

[0015] Optionally, the cooling device further includes a container, and a material receiving port is provided above the container, and the material receiving port is located below the first end.

[0016] Optionally, in the direction from the second end towards the first end, the height of the bottom wall of the groove gradually decreases.

[0017] Optionally, the main body includes a cooling pipe and a fan, and the fan is configured to drive gas to pass through the perforations and flow along the outer wall of the cooling pipe.

[0018] In a third aspect, an embodiment of the present application provides a reflow soldering device.

[0019] The reflow soldering device provided by an embodiment of the present application includes: any one of the cooling devices provided by the embodiments of the present application; the reflow soldering device is provided with a cooling area, and the cooling device is disposed in the cooling area.

[0020] The above at least one technical solution adopted by the embodiments of the present application can achieve the following beneficial effects:

[0021] In the embodiments of the present application, the liquid solder resist formed by condensation will gather in the low-lying area, and thus, the liquid solder resist is not likely to drip through the perforations. In this way, the cleaning and maintenance frequency of the heat pipe can be reduced.

[0022] Additional aspects and advantages of the present application will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the present application. Description of the Drawings

[0023] To more clearly illustrate the technical solutions in the embodiments of the present application or related technologies, the following will briefly introduce the drawings required for use in the description of the embodiments or related technologies. Obviously, the drawings in the following description are only some embodiments recorded in the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0024] Figure 1 Schematic diagram of a cooling device configured with a heat pipe provided by an embodiment of the present application;

[0025] Figure 2 Schematic diagram of a heat pipe provided by an embodiment of the present application;

[0026] Figure 3 Schematic diagram of a heat pipe provided by an embodiment of the present application;

[0027] Figure 4 Left view of a heat pipe provided by an embodiment of the present application;

[0028] Figure 5 Partial cross-sectional view of a heat pipe provided by an embodiment of the present application;

[0029] Figure 6 Schematic diagram of a cooling device provided by an embodiment of the present application;

[0030] Figure 7 Schematic diagram of a cooling device provided by an embodiment of the present application, showing a situation where components such as the housing of the cooling device are hidden;

[0031] Figure 8 Schematic diagram of a reflow soldering device provided by an embodiment of the present application;

[0032] Figure 9 Schematic diagram of a reflow soldering device provided by an embodiment of the present application, showing a situation where components such as the housing of the reflow soldering device are hidden.

[0033] Explanation of reference numerals:

[0034] 1 - Reflow soldering device; 1a - Cooling zone; 1b - Preheating zone; 1c - Constant temperature zone; 1d - Reflow zone; 10 - Cooling device; 11 - Heat pipe; 11a - First end; 11b - Second end; 111 - Perforation; 112 - Depression area; 113 - Groove; 114 - Protrusion; 12 - Main body; 121 - Pipe; 122 - Fan; 13 - Container; 131 - Material receiving port; 20 - Liquid solder resist. Detailed implementation manners

[0035] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions of this application will be clearly and completely described below in conjunction with specific embodiments of this application and the corresponding drawings. Apparently, the described embodiments are only a part rather than all of the embodiments of this application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in this application without creative efforts shall fall within the scope of protection of this application.

[0036] In the description of this application, it should be noted that unless otherwise clearly specified and limited, the terms "installed", "connected", and "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0037] In addition, although the terms used in this application are selected from well-known and commonly used terms, some of the terms mentioned in the specification of this application may be selected by the applicant according to his or her judgment, and their detailed meanings are described in the relevant parts of this description.

[0038] In addition, it is required to understand this application not only through the actual terms used, but also through the meaning implied by each term.

[0039] The following will describe in detail the technical solutions provided by each embodiment of this application in conjunction with the drawings.

[0040] An embodiment of this application provides a vapor chamber. It should be noted that a vapor chamber generally functions to quickly equalize the temperature during the gas circulation process. Of course, those skilled in the art can also understand the "vapor chamber" based on common general knowledge.

[0041] Referring to Figures 1 to 9 , the vapor chamber 11 provided by the embodiment of this application is applied to the cooling device 10 of the reflow soldering equipment 1. The vapor chamber 11 is provided with a plurality of through holes 111 along its own thickness direction, and the through holes 111 are used for the airflow to pass through. It should be noted that those skilled in the art also refer to the through holes 111 as air holes. A low-lying area 112 is provided on the side of each through hole 111 of the vapor chamber 11, and the low-lying area 112 is used to collect the liquid on the outer periphery of the top opening of the through hole 111.

[0042] Exemplarily, the through holes 111 can be evenly distributed on the vapor chamber 11. For example, the through holes 111 are arranged in a rectangular array on the vapor chamber 11. In addition, the size of the through holes 111 can be flexibly set according to actual needs, and the size parameters of the through holes 111 are not listed here.

[0043] In this way, in the embodiments of the present application, the liquid solder resist 20 formed by condensation will gather in the low-lying area 112, so that the liquid solder resist 20 is not likely to drip through the through holes 111. In this way, the cleaning and maintenance frequency of the heat pipe 11 can be reduced.

[0044] In some embodiments, the top surface of the heat pipe 11 is an uneven surface, and each through hole 111 penetrates the raised area of the uneven surface. In this way, the liquid solder resist 20 condensed on the outer periphery of the through hole 111 can flow towards the low-lying area 112 under the action of gravity, so that the liquid solder resist 20 is not likely to drip through the through hole 111.

[0045] In some embodiments, a groove 113 extending from the first end 11a to the opposite second end 11b is provided on the top surface of the heat pipe 11, and the area where the groove 113 is located forms the low-lying area 112. In this way, the low-lying area 112 can be formed by opening the groove 113. In addition, exemplarily, a broaching machine can be used to form the groove 113 on the surface of the plate by broaching, which can reduce the processing difficulty of forming the low-lying area 112.

[0046] In some embodiments, a raised portion 114 is provided between two adjacent grooves 113. The raised portion 114 extends from the first end 11a to the second end 11b, and each through hole 111 penetrates the raised portion 114. In this way, it is convenient for the liquid solder resist 20 to flow towards the end along the extending direction of the groove 113, and then the liquid solder resist 20 can be collected by providing a collection container at the end, so as to further reduce the cleaning and maintenance frequency of the heat pipe 11.

[0047] Exemplarily, the cross-sectional shape of the top wall of the heat pipe 11 is serrated, and among them, the cross-sectional shape of the bottom wall of the groove 113 is V-shaped. Exemplarily, the cross-sectional shape of the top wall of the heat pipe 11 can also be wavy, etc., which will not be listed one by one here.

[0048] The embodiments of the present application provide a cooling device. Refer to Figure 1 and Figure 6 , the cooling device 10 provided by the embodiments of the present application includes: a main body 12 and any one of the heat pipes 11 provided by the embodiments of the present application, and the heat pipe 11 is provided below the main body 12. It should be noted that the main body 12 can also be referred to as the cooling device main body. The main body 12 includes main devices for cooling the area where it is located.

[0049] Combined with Figure 7, in some embodiments, the main body 12 includes a cooling pipe 121 and a fan 122. The fan 122 is used to drive gas to flow through the outer wall of the cooling pipe 121 and pass through the perforations 111. Exemplarily, the fan 122 can cause the gas to flow from bottom to top. The gas below the heat spreader 11 can pass through the perforations 111 of the heat spreader 11 and flow through the outer wall of the cooling pipe 121. A cooling medium (such as cooling water) can be conveyed in the cooling pipe 121. Thus, the area where the cooling device 10 is located can be cooled by means of heat exchange.

[0050] In addition, the main body 12 may further include a housing, etc. For the specific structure of the main body 12, reference can be made to the related art, and the structure and working principle of the main body 12 will not be introduced in detail here.

[0051] In some embodiments, the cooling device 10 further includes a container 13. When a groove 113 extending from the first end 11a to the opposite second end 11b is provided on the top surface of the heat spreader 11, a material receiving port 131 is provided above the container 13, and the material receiving port 131 is located below the first end 11a. In some embodiments, in the direction from the second end 11b towards the first end 11a, the height of the bottom wall of the groove 113 gradually decreases. In other words, Figure 7 , the right side of the bottom wall of the groove 113 is high and the left side is low; in this way, the liquid solder resist 20 can flow along the groove 113 under the action of gravity in the direction from the second end 11b towards the first end 11a, and then drip into the container 13, so as to further reduce the cleaning and maintenance frequency of the heat spreader 11.

[0052] It should be noted that in other embodiments, it is not necessary to make the height of the bottom wall of the groove 113 gradually decrease in the direction from the second end 11b towards the first end 11a. The liquid solder resist 20 can be prevented from dripping from the second end 11b of the heat spreader 11 by setting a baffle at the second end 11b of the heat spreader 11. Or, a container 13 can also be provided below the second end 11b to catch the liquid solder resist 20 dripping from the second end 11b of the heat spreader 11.

[0053] The part of the heat spreader 11 between the first end 11a and the second end 11b is the middle part. When containers 13 are provided at both the first end 11a and the second end 11b of the heat spreader 11, the liquid solder resist 20 at the middle part can be made to flow towards the first end 11a and the second end 11b respectively by making the groove walls at the middle part of the groove 113 higher than the groove walls at the first end 11a and the second end 11b respectively, so as to avoid the liquid solder resist 20 from accumulating at the middle part, which can further reduce the cleaning and maintenance frequency of the heat spreader 11.

[0054] The embodiments of the present application provide a reflow soldering device. Refer to Figure 8 andFigure 9 In this embodiment of the present application, the reflow soldering equipment 1 includes a cooling device 10 provided by this embodiment of the present application. The reflow soldering equipment 1 is provided with a cooling zone 1a, and the cooling device 10 is arranged in the cooling zone 1a. In addition, the reflow soldering equipment 1 is also provided with a preheating zone 1b, a constant temperature zone 1c, and a reflow zone 1d. The specific structure of the reflow soldering equipment 1 can refer to the related art, and the structure and working principle of the reflow soldering equipment 1 will not be described in detail here.

[0055] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device.

[0056] Although the embodiments of the present application have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the embodiments of the present application. The scope of the embodiments of the present application is defined by the appended claims and their equivalents.

Claims

1. A heat pipe (11) is applied to a cooling device (10) of a reflow soldering equipment (1), and is characterized in that, The heat pipe (11) is provided with a plurality of through holes (111) along its own thickness direction, and the through holes (111) are used for allowing air flow to pass through; a low-lying area (112) is arranged on the side of each of the through holes (111) of the heat pipe (11), and the low-lying area (112) is used for collecting the liquid on the outer periphery of the top opening of the through hole (111).

2. The heat pipe (11) according to claim 1, characterized in that, The top surface of the heat pipe (11) is an uneven surface, and each of the through holes (111) penetrates through the raised area of the uneven surface.

3. A cooling device (10), characterized in that, Comprising: A main body (12) and the heat pipe (11) according to claim 1 or 2, and the heat pipe (11) is arranged below the main body (12).

4. The cooling device (10) according to claim 3, characterized in that, A groove (113) extending from a first end (11a) to an opposite second end (11b) is arranged on the top surface of the heat pipe (11), and the area where the groove (113) is located forms the low-lying area (112).

5. The cooling device (10) according to claim 4, characterized in that, A raised portion (114) is arranged between two adjacent grooves (113), the raised portion (114) extends from the first end (11a) to the second end (11b), and each of the through holes (111) penetrates through the raised portion (114).

6. The cooling device (10) according to claim 5, characterized in that, The cross-sectional shape of the top wall of the heat pipe (11) is serrated, wherein the cross-sectional shape of the bottom wall of the groove (113) is V-shaped.

7. The cooling device (10) according to claim 4, characterized in that, The cooling device (10) further includes a container (13), a material receiving port (131) is arranged above the container (13), and the material receiving port (131) is located below the first end (11a).

8. The cooling device (10) according to claim 7, characterized in that, In the direction from the second end (11b) towards the first end (11a), the height of the bottom wall of the groove (113) gradually decreases.

9. The cooling device (10) according to claim 3, characterized in that, The main body (12) includes a cooling pipe (121) and a fan (122), and the fan (122) is used for driving gas to pass through the through hole (111) and flow through the outer wall of the cooling pipe (121).

10. A reflow soldering device (1), characterized in that Comprising: The cooling device (10) according to any one of claims 3 to 9; the reflow soldering equipment (1) is provided with a cooling area (1a), and the cooling device (10) is arranged in the cooling area (1a).

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