Solder strip grabbing assembly and solder strip carrying device

Abstract

The utility model relates to a solder strip grabbing assembly and a solder strip carrying device. The welding strip grabbing assembly comprises a hook clamp structure and a pressing needle structure, and the hook clamp structure is provided with a first position and a second position; the needle pressing structure is arranged on one side of the hook clamp structure; when the hook clamp structure is located at the first position, at least one part of the needle pressing structure can abut against the hook clamp structure; and when the hook clamp structure is located at the second position, the pressing needle structure can be separated from the hook clamp structure. According to the welding strip grabbing assembly, the reliability of grabbing the welding strip is improved, and the falling risk of the welding strip is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of battery production equipment, and more specifically, the utility model relates to a solder strip gripping assembly and a solder strip handling device. Background Art

[0002] In the conventional series soldering process of BC (Back Contact) battery modules, the solder strip is usually placed on the battery cell by a vacuum adsorption device that adsorbs the solder strip, transports it above the battery cell, and after breaking the vacuum, the solder strip is pressed down and placed on the battery cell. In this way, vacuum leakage is likely to occur when handling a large number of solder strips, resulting in the solder strip falling. Summary of the Utility Model

[0003] An object of the utility model is to provide a new technical solution for a solder strip gripping assembly and a solder strip handling device.

[0004] According to a first aspect of the utility model, there is provided a solder strip gripping assembly, comprising:

[0005] A hook clamping structure having a first position and a second position;

[0006] A pressing needle structure disposed on one side of the hook clamping structure;

[0007] When the hook clamping structure is in the first position, at least a part of the pressing needle structure can be pressed against the hook clamping structure;

[0008] When the hook clamping structure is in the second position, the pressing needle structure can be separated from the hook clamping structure.

[0009] Optionally, the solder strip gripping assembly further comprises a guiding structure, and a limiting groove is provided on the guiding structure. When the hook clamping structure is in the first position, the solder strip it holds can be located in the limiting groove.

[0010] Optionally, the pressing needle structure comprises a pressing plate, a spring and a connecting member, and the pressing plate is connected to the connecting member through the spring, so that at least a part of the pressing plate can be pressed against the hook clamping structure.

[0011] Optionally, the pressing needle structure further comprises an air pipe joint, an adsorption hole is provided in the pressing plate, and the air pipe joint is communicated with the adsorption hole and can be connected to a pneumatic source.

[0012] Optionally, the adsorption hole is set as a waist-shaped hole.

[0013] Optionally, the hook and clamp structure has a supporting portion, and the upper surface of the supporting portion is higher than the lower surface of the pressing plate, so that when the hook and clamp structure is in the first position, at least a part of the lower surface of the pressing plate can be pressed against the upper surface of the supporting portion.

[0014] Optionally, the solder tape gripping assembly further includes a first driving member, and the hook and clamp structure further has a connecting portion;

[0015] The supporting portion is connected to the first driving member through the connecting portion, and the first driving member is used to place the hook and clamp structure in the first position or the second position.

[0016] According to a second aspect of the present invention, there is provided a solder tape handling device, including a solder tape gripping mechanism, the solder tape gripping mechanism including a plurality of solder tape gripping assemblies according to the first aspect and a mounting structure, and a plurality of the solder tape gripping assemblies are arranged in rows and / or columns on the mounting structure, so that each of the hook and clamp structures can have the first position and the second position relative to the mounting structure.

[0017] Optionally, it further includes an auxiliary mechanism. When a solder tape is pressed between the press pin structure and the hook and clamp structure, the auxiliary mechanism can be pressed against the solder tape, and the pressing force is greater than or equal to the pressing force of the press pin structure on the solder tape.

[0018] Optionally, the solder tape handling device further includes a mounting plate, two solder tape gripping mechanisms are provided and are respectively fixed at both ends of the first surface of the mounting plate, and the auxiliary mechanism is fixed between the two solder tape gripping mechanisms.

[0019] Optionally, the structure of the auxiliary mechanism is the same as that of the press pin structure, and the number of the press pin structures included therein is the same as the number of the hook and clamp structures included in the solder tape gripping mechanism.

[0020] Optionally, the solder tape handling device further includes a lifting mechanism, the lifting mechanism is arranged on the mounting plate, and can at least drive the auxiliary mechanism to rise or fall.

[0021] One technical effect of the present invention is that by providing a hook and clamp structure and a press pin structure, when the hook and clamp structure is in the first position, the press pin structure can be pressed against the hook and clamp structure, so that the solder tape can be pressed between the hook and clamp structure and the press pin structure, realizing the gripping of the solder tape, and when the hook is in the second position, the hook and clamp structure is separated from the press pin structure, so that the solder tape can be separated from the solder tape gripping assembly and placed.

[0022] After the above solder tape gripping component grabs the solder tape, during the handling process, one solder surface of the solder tape is pressed against the pressing pin structure, and the other solder surface is entrusted to the hook clamping structure, which improves the reliability of the solder tape gripping and reduces the risk of the solder tape falling off.

[0023] Other features and advantages of the present utility model will become clear through the following detailed description of the exemplary embodiments of the present utility model with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The drawings forming a part of the specification depict embodiments of the present utility model and, together with the specification, are used to explain the principles of the present utility model.

[0025] Figure 1 One of the schematic diagrams of a solder tape handling device provided by the present utility model.

[0026] Figure 2 Figure 1 Partial enlarged view at A in

[0027] Figure 3 Figure 1 Side view of

[0028] Figure 4 One of the schematic diagrams of a solder tape gripping mechanism provided by the present utility model.

[0029] Figure 5 is Figure 4 Side view of

[0030] Figure 6 is Figure 5 B-B cross-sectional view of

[0031] Figure 7 Another schematic diagram of a solder tape gripping mechanism provided by the present utility model.

[0032] Figure 8 Schematic diagram of the structure of a pressing plate provided by the present utility model.

[0033] Figure 9 is Figure 8 Front view of

[0034] Figure 10 is Figure 9 C-C cross-sectional view of

[0035] Figure 11 One of the actions of a solder tape gripping mechanism provided by the present utility model when gripping a solder tape on a solder tape slitting mechanism (the hook clamping structure is at the second position).

[0036] Figure 12 is Figure 11 Partial schematic diagram at M in

[0037] Figure 13 It is the second action of a solder tape gripping mechanism provided by the present utility model to grip the solder tape on the solder tape slitting mechanism (the hook clamping structure is at the second position).

[0038] Figure 14 It is Figure 13 The partial enlarged view at N in

[0039] Figure 15 It is the schematic diagram of the action during the handling process after a solder tape gripping mechanism provided by the present utility model grips the solder tape.

[0040] Figure 16 It is Figure 15 The partial enlarged view at P in

[0041] Figure 17 It is the schematic diagram of a solder tape gripping mechanism provided by the present utility model placing the solder tape on the battery.

[0042] Figure 18 It is Figure 17 The partial enlarged view at Q in

[0043] Figure 19 It is the second schematic diagram of a solder tape handling device provided by the present utility model.

[0044] Figure 20 It is Figure 19 The front view of

[0045] Figure 21 It is Figure 20 The bottom view of

[0046] Figure 22 It is the assembly drawing of a solder tape gripping mechanism and an auxiliary mechanism provided by the present utility model.

[0047] Figure 23 It is the first schematic diagram of an auxiliary mechanism provided by the present utility model.

[0048] Figure 24 It is the second schematic diagram of an auxiliary mechanism provided by the present utility model.

[0049] Figure 25 It is Figure 24 The partial enlarged view at D in

[0050] Figure 26 It is the schematic diagram of a lifting mechanism provided by the present utility model.

[0051] Explanation of reference numerals:

[0052] 100. Welding tape gripping mechanism; 10. Hook clamping structure; 101. Supporting part; 102. Connecting part; 20. Pressing needle structure; 201. Suction hole; 202. Pressing plate; 203. Spring; 204. Connecting piece; 205. Retaining ring; 30. Guiding structure; 301. Limiting groove; 40. Air pipe joint; 50. First driving part; 200. Mounting plate; 300. Auxiliary mechanism; 400. Lifting mechanism; 401. Connecting plate; 402. Card slot; 403. Second driving part; 500. Welding tape; 600. Welding tape cutting mechanism; 700. Battery cell. Detailed implementation mode

[0053] Now, various exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. It should be noted that: unless otherwise specifically stated, the relative arrangements, numerical expressions and values of the components and steps set forth in these embodiments do not limit the scope of the present invention.

[0054] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way a limitation on the present invention or its application or use.

[0055] Technologies and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such technologies and devices should be regarded as part of the specification.

[0056] In all the examples shown and discussed here, any specific value should be construed as merely exemplary and not as a limitation. Therefore, other examples of the exemplary embodiments may have different values.

[0057] It should be noted that: similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0058] As Figures 1 to 18 shown, according to the first aspect of the present invention, a welding tape gripping assembly is provided, including a hook clamping structure 10, and the hook clamping structure 10 has a first position and a second position; a pressing needle structure 20, and the pressing needle structure 20 is arranged on one side of the hook clamping structure 10; when the hook clamping structure 10 is in the first position, at least a part of the pressing needle structure 20 can be pressed against the hook clamping structure 10; when the hook clamping structure 10 is in the second position, the pressing needle structure 20 can be separated from the hook clamping structure 10.

[0059] Specifically, the welding tape gripping assembly provided in the present application is used to grab the welding tape 500 from the welding tape cutting mechanism 600 or other welding tape 500 carrying devices and then transport and place it on the battery cell 700 to perform the string welding process of the BC battery assembly.

[0060] In practical applications, the hook clip structure 10 has a first position and a second position to facilitate the support, handling, and placement of the solder ribbon 500. That is, when the hook clip structure 10 is in the first position, the solder ribbon 500 can be entrusted to the hook clip structure 10. When the hook clip structure 10 is in the first position, since at least a part of the press needle structure 20 can press against the hook clip structure 10, when the solder ribbon 500 is entrusted to the hook clip structure 10, the press needle structure 20 and the hook clip structure 10 can press the solder ribbon 500 tightly between their contact surfaces, realizing the grasping and handling of the solder ribbon 500.

[0061] In the above process, one surface of the solder ribbon 500 is entrusted to the hook clip structure 10, and the other surface is pressed against the hook clip structure 10 by the press needle structure 20, so that the solder ribbon 500 can be firmly pressed between the hook clip structure 10 and the press needle structure 20. During the handling process, the risk of the solder ribbon 500 falling can be avoided, improving the reliability of the handling. The two surfaces of the solder ribbon 500 are clamped, which also avoids problems such as damage to the solder ribbon 500 caused by clamping the two sides of the solder ribbon 500 by jaws in the conventional technology, improving the safety of grasping and handling the solder ribbon 500.

[0062] In addition, after the solder ribbon 500 is transported to the set position, for example, after being transported onto the battery cell 700, the hook clip structure 10 can move to the second position, and then the press needle structure 20 can be separated from the hook clip structure 10. In this way, with the solder ribbon 500 clamped between the two, the separation between the hook clip structure 10 and the press needle structure 20 enables the solder ribbon 500 to be placed on the battery cell 700, completing the entire process of grasping, handling, and placing the solder ribbon 500.

[0063] In the above embodiment, the hook clip structure 10 is in the first position and the second position, which can be the closed state and the open state of the hook clip structure 10, so that its distance relationship with the press needle structure 20 can be adjusted. The specific form can be designed according to actual needs, and the position movement of the hook clip structure 10 can be realized by driving components such as motors and cylinders. This application does not limit this.

[0064] Optionally, as Figure 2 shown, the solder ribbon grasping assembly further includes a guiding structure 30. A limiting groove 301 is provided on the guiding structure 30. When the hook clip structure 10 is in the first position, the entrusted solder ribbon 500 can be located in the limiting groove 301.

[0065] Specifically, in practical applications, the solder strip 500 is a long strip-shaped structure. The setting of the guiding structure 30 enables the solder strip 500 to be located in the limiting groove 301 of the guiding structure 30 when it is between the hook clamping structure 10 and the needle pressing structure 20. During the grasping and handling process, the part of the solder strip 500 that is not pressed between the hook clamping structure 10 and the needle pressing structure 20 can be restricted in the limiting groove 301, preventing it from swaying left and right, thus ensuring that the solder strip 500 will not fall off or change position during handling, and guaranteeing the yield and operation rate of subsequent welding products. Refer to Figures 11 to 18 。

[0066] Optionally, as Figure 2 and Figure 6 shown, the needle pressing structure 20 includes a pressing plate 202, a spring 203, and a connecting member 204. The pressing plate 202 is connected to the connecting member 204 through the spring 203, so that at least a part of the pressing plate 202 can press against the hook clamping structure 10.

[0067] Specifically, in this embodiment, the pressing plate 202 of the needle pressing structure 20 is connected to the connecting member 204 through the spring 203, and the spring 203 can be set with a pre-tightening force. When the hook clamping structure 10 is at the first position, the pressing plate 202 can press against the hook clamping structure 10 under the action of the spring 203 to achieve the purpose of pressing the solder strip 500. Among them, at least a part of the pressing plate 202 presses against the hook clamping structure 10, which means that the contact size between the pressing plate 202 and the hook clamping structure 10 can be designed according to actual needs, and the contact surface between the two is based on pressing the solder strip 500, and it is not necessary to limit the contact surfaces to be the same. [[ID=^{}14]]

[0068] In practical applications, the pressing plate 202 can be designed as a connecting rod and a cylindrical pressing head at one end of the connecting rod. The spring 203 is sleeved on the connecting rod, and the pressing head is assembled on the connecting member 204 through the other end of the connecting rod, and the spring 203 is set with a certain pre-tightening force so that the pressing head can press against the hook clamping structure 10 to achieve the pressing of the solder strip 500.

[0069] Optionally, as Figures 7 to 10 shown, the needle pressing structure 20 further includes an air pipe joint 40. An adsorption hole 201 is provided in the pressing plate 202, and the air pipe joint 40 is communicated with the adsorption hole 201 and can be connected to a pneumatic source.

[0070] Specifically, in this embodiment, by providing adsorption holes 201 in the pressing plate 202, in practical applications, after the air chuck is connected to an external pneumatic source, the pressing plate 202 can achieve an adsorption effect, so that during the process of handling the solder strip 500, the pressing plate 202 can adsorb the solder strip 500 through the adsorption holes 201, further improving the grasping force of the pressing pin structure 20 and the hook clamping structure 10 on the solder strip 500, enhancing the safety and reliability during the handling process of the solder strip 500, and preventing it from falling.

[0071] In the above embodiment, the pressing plate 202 includes a pressing head and a connecting rod connected to the pressing head. By providing a retaining ring 205 and a tracheal joint 40 at the other end of the connecting rod, the movable connection of the pressing plate 202 with the connecting member 204 and the pneumatic connection with the tracheal structure are realized. In practical applications, the adsorption function of the pressing plate 202 can be turned on during the handling process or when placing the solder strip 500 to increase the grasping force on the solder strip 500. Among them, when the adsorption function is turned on when placing the solder strip 500, after the hook clamping structure 10 moves to the second position and separates from the pressing pin structure 20, the position of the solder strip 500 can be continuously ensured not to change, improving the position accuracy of the placement of the solder strip 500.

[0072] Optionally, the adsorption holes 201 are provided as waist-shaped holes.

[0073] Specifically, in practical applications, the solder strip 500 is usually a long strip structure. The adsorption holes 201 are provided as waist-shaped holes, and when adsorbing the solder strip 500, the length direction of the waist-shaped holes is aligned with the length direction of the solder strip 500, increasing the adsorption area of the adsorption holes 201 for the solder strip 500 to improve the adsorption force of the pressing plate 202 on the solder strip 500.

[0074] Optionally, as Figure 2 shown, the hook clamping structure 10 has a supporting portion 101, and the upper surface of the supporting portion 101 is higher than the lower surface of the pressing plate 202, so that when the hook clamping structure 10 is in the first position, at least a part of the lower surface of the pressing plate 202 can be pressed against the upper surface of the supporting portion 101.

[0075] Specifically, in this embodiment, the supporting portion 101 of the hook clamping structure 10 is in contact with the pressing pin structure 20 to achieve the pressing of the solder strip 500. The supporting portion 101 can be provided as a planar structure matching the shape of the solder strip 500, and the size can be appropriately larger than the size of the solder strip 500, so that the solder strip 500 can be completely entrusted on the supporting portion 101 to improve the reliability of entrusting the solder strip 500 and also play a certain protective role for the solder strip 500 during the handling process.

[0076] In practical applications, when the solder strip gripping assembly does not grip the solder strip 500, the upper surface of the supporting portion 101 is higher than the pressing plate 202. When the lower surface of the pressing plate 202 presses on the upper surface of the supporting portion 101 during the process of gripping or transporting the solder strip 500 by the hook clamping structure 10, the solder strip 500 can be tightly pressed, improving the pressing force on the solder strip 500. Reference Figures 11 to 18 。

[0077] Optionally, as Figure 3 、 Figure 19 and Figure 20 shown, the solder strip gripping assembly further includes a first driving member 50, and the hook clamping structure 10 further has a connecting portion 102; the supporting portion 101 is connected to the first driving member 50 through the connecting portion 102, and the first driving member 50 is configured to move the hook clamping structure 10 to the first position or the second position.

[0078] Specifically, in this embodiment, the supporting portion 101 is connected to the first driving member 50 through the connecting portion 102, so that the hook clamping structure 10 can be located at the first position or the second position, realizing the adjustment of the position or state of the hook clamping structure 10. Among them, the first driving member 50 can drive the hook clamping structure 10 to approach or move away from the needle pressing structure 20 in the horizontal direction or the vertical direction, so that the needle pressing structure 20 can press on the supporting portion 101 or separate from the supporting portion 101.

[0079] In practical applications, the position of the needle pressing structure 20 can also be adjusted to achieve its pressing against or separation from the hook clamping structure 10. Among them, the first driving member 50 can adopt driving members such as air cylinders, electric cylinders or motors.

[0080] According to the second aspect of the present invention, as Figures 4 to 7 shown, a solder strip handling device is provided, which includes a solder strip gripping mechanism 100. The solder strip gripping mechanism 100 includes a plurality of solder strip gripping assemblies and an installation structure according to the first aspect. The plurality of solder strip gripping assemblies are arranged in rows and / or columns on the installation structure, so that each hook clamping structure 10 can have the first position and the second position relative to the installation structure.

[0081] Specifically, the solder strip gripping mechanism 100 provided in this application is assembled using the solder strip gripping components provided in the first aspect. Since it can firmly grip the solder strip 500 and place the solder strip 500 accurately, the working efficiency of the solder strip gripping mechanism 100 and the product yield of the finally produced battery module are improved. In practical applications, multiple hook and clamp structures 10 and multiple pressing pin structures 20 are matched and set in multiple groups to simultaneously grip multiple solder strips 500 through multiple solder strip gripping components, improving production efficiency; or multiple solder strip gripping components simultaneously grip the same solder strip 500 to further improve the reliability of the handling of the solder strip 500, and specific matching design is carried out according to actual requirements.

[0082] In one embodiment, multiple groups of solder strip gripping components are matched and set on the installation structure, and the multiple groups of solder strip gripping components are arranged in rows and / or columns on the installation structure, and the hook and clamp structure 10 has a first position and a second position relative to the installation structure to achieve the pressing contact or separation between each hook and clamp structure 10 and the pressing pin structure 20.

[0083] In the above embodiment, the grouped solder strip gripping components can improve the gripping efficiency and firmness of the solder strip 500. Among them, the installation structure can be a plate-like structure, a strip-like structure, or multiple hook and clamp structures 10 and multiple pressing pin structures 20 can be respectively integrated together through a structure similar to an installation beam, and then mutually matched and set on the same installation plate 200 to facilitate adaptation to different production requirements.

[0084] In practical applications, the specific form of the solder strip gripping mechanism 100 can be designed according to actual requirements. As Figures 4 to 5 shown, it is assembled by 12 groups of solder strip gripping components, and can sequentially grip 12 solder strips 500 to form a small solder strip gripping mechanism 100. Further, referring to Figures 11 to 18 , 4 structures assembled by the above 12 groups of solder strip gripping components are jointly assembled on an installation structure to form a larger solder strip gripping mechanism 100 that can respectively form pressing and gripping at four positions of 12 solder strips 500. If more solder strips 500 need to be gripped at one time, it can be achieved by continuing to increase the number of solder strip gripping components or increasing the number of small solder strip gripping mechanisms 100.

[0085] The following takes the Figures 11 to 18 provided solder strip gripping mechanism 100 as an example to illustrate the action relationship between each hook and clamp structure 10 and the corresponding pressing pin structure 20 during the process of gripping, handling, and placing the solder strip 500:

[0086] As Figures 11 to 12As shown in the figure, it is a schematic diagram of the action when the solder strip gripper mechanism 100 is ready to grab the solder strip 500 after the solder strip 500 is cut in the solder strip slitting mechanism 600. The solder strip 500 is located in the guiding groove of the solder strip slitting mechanism 600, and the solder strip gripper mechanism 100 correspondingly descends to the grabbing position. At this time, the hook clamping structure 10 is at the second position, and the upper surface of the supporting part 101 of the hook clamping structure 10 is 1-2 mm lower than the back surface of the solder strip 500. The pressing plate 202 of the pressing needle structure 20 contacts the upper surface of the guiding groove of the solder strip slitting mechanism 600, so that the lower surface of the pressing plate 202 is higher than the upper surface of the supporting part 101. During this process, the pressing needle structure 20 has no contact with the solder strip 500.

[0087] As Figures 13 to 14 shown in the figure, it is one of the schematic diagrams of the action of the solder strip gripper mechanism 100 for grabbing and transporting the solder strip 500. Among them, the solder strip gripper mechanism 100 rises until the upper surface of the supporting part 101 of the hook clamping structure 10 contacts the lower surface of the solder strip 500. At the same time, the hook clamping structure 10 is driven by the first driving part 50 to move to the first position, so that the lower surface of the solder strip 500 is completely entrusted on the supporting part 101.

[0088] As Figures 15 to 16 shown in the figure, it is the second schematic diagram of the action of the solder strip gripper mechanism 100 for grabbing and transporting the solder strip 500. Among them, the solder strip gripper mechanism 100 continues to rise until the solder strip 500 is separated from the solder strip slitting mechanism 600. During this process, due to the action of the spring 203, the lower surface of the pressing plate 202 contacts the upper surface of the solder strip 500 and presses the solder strip 500 against the supporting part 101 of the hook clamping structure 10. Subsequently, the solder strip gripper mechanism 100 moves to the position where the solder strip 500 needs to be placed.

[0089] As Figures 17 to 18 shown in the figure, it is a schematic diagram of the action of the solder strip gripper mechanism 100 for placing the solder strip 500 on the battery cell 700. When the solder strip gripper mechanism 100 moves above the battery cell 700, the hook clamping structure 10 opens, that is, the hook clamping structure 10 moves to the second position, so that the upper surface of the supporting part 101 is separated from the lower surface of the solder strip 500. At the same time, due to the lack of restriction of the hook clamping structure 10, the pressing plate 202 presses the solder strip 500 against the battery cell 700 under the action of the spring 203, realizing the action of placing the solder strip 500. Subsequently, the solder strip gripper mechanism 100 disengages from the battery cell 700 and proceeds to the next cycle of grabbing, transporting and placing processes. At this time, the hook clamp is at the second position, the lower surface of the pressing plate 202 is lower than the upper surface of the supporting part 101, and there is no contact between the two.

[0090] In the above process, the solder ribbon gripping device formed by multiple solder ribbon gripping components can grip multiple solder ribbons 500 at one time, and there are more gripping positions for each solder ribbon 500, which not only improves the gripping efficiency but also ensures the reliability of gripping the solder ribbon 500. Among them, since the solder ribbon 500 is pressed by the pressing plate 202 and the supporting portion 101 during the handling process, the reliability of gripping and handling is further improved. During the placement process, since the pressing plate 202 presses the solder ribbon 500, its position deviation can be avoided, and the reliability of placing the solder ribbon 500 is improved.

[0091] According to the third aspect of the present invention, as Figures 19 to 26 shown, a solder ribbon handling device is provided, which includes an auxiliary mechanism 300 and the solder ribbon gripping mechanism 100 described in the second aspect; when a solder ribbon 500 is pressed between the press pin structure 20 and the hook clamping structure 10, the auxiliary mechanism 300 can be pressed against the solder ribbon 500, and the pressing force is greater than or equal to the pressing force of the press pin structure 20 on the solder ribbon 500.

[0092] Specifically, in this embodiment, the solder ribbon handling device is assembled by one or more solder ribbon gripping mechanisms 100. When a solder ribbon 500 is pressed between the press pin structure 20 and the hook clamping structure 10, the pressing force of the auxiliary mechanism 300 pressing against the solder ribbon 500 is greater than or equal to the pressing force of the press pin structure 20 on the solder ribbon 500. During the process of placing the solder ribbon 500, when the hook clamping structure 10 and the press pin structure 20 are separated, at least the auxiliary mechanism 300 can be pressed on the solder ribbon 500 to fix the position of the solder ribbon 500, facilitating subsequent processes such as further pressing and bonding the solder ribbon 500 with the battery cell 700, and improving the position control of the solder ribbon 500 during the placement process.

[0093] Among them, the auxiliary mechanism 300 can be formed by multiple press pin structures 20 or other similar mechanisms. The present invention does not limit this.

[0094] Optionally, as Figures 19 to 22 shown, the solder ribbon handling device further includes a mounting plate 200. Two solder ribbon gripping mechanisms 100 are provided and are respectively fixed at both ends of the first surface of the mounting plate 200, and the auxiliary mechanism 300 is fixed between the two solder ribbon gripping mechanisms 100.

[0095] Specifically, in this embodiment, two solder tape gripping mechanisms 100 are provided at both ends of the solder tape 500 to achieve the gripping of the solder tape 500. An auxiliary mechanism 300 is arranged in the middle, so that during the placement process, the auxiliary mechanism 300 can fix the position of the solder tape 500 and prevent the solder tape 500 from shifting. This structural design not only ensures the reliability of the solder tape 500 during the gripping process and avoids the risk of dropping, but also ensures the position accuracy of the solder tape 500 during placement, improving the welding quality of subsequent products.

[0096] >In the above embodiment, each solder tape gripping mechanism 100 is assembled by a plurality of press needle mechanisms and a corresponding number of hook clamping structures 10. Each auxiliary mechanism 300 can be implemented by a corresponding number of press needle structures 20, improving the integration of the device and the convenience of unified control. They are assembled together on the mounting plate 200 to facilitate the movement of the overall device.

[0097] Optionally, as Figures 23 to 25 shown, the structure of the auxiliary mechanism 300 is the same as that of the press needle structure 20, and the number of the press needle structures 20 included therein is the same as the number of the hook clamping structures 10 included in the solder tape gripping mechanism 100.

[0098] Specifically, the auxiliary mechanism 300 adopts the same structure as the press needle structure 20 to improve the unified control of the device. As Figures 23 to 25 shown, in one embodiment, the auxiliary mechanism 300 includes a plurality of components arranged in rows and similar to the press needle structure 20. Each component respectively includes a connecting rod, a press head provided at one end of the connecting rod and a retaining ring 205 at the other end, and a spring 203 sleeved on the connecting rod. The plurality of connecting rods pass through a connecting member 204 (a connecting beam) to form an integral structure, and the retaining ring 205 and the press head are located on different sides of the connecting member 204.

[0099] In practical applications, the auxiliary mechanism 300 can also be provided with a guiding structure 30 in the solder tape gripping assembly provided in the first aspect to limit the left - right shaking of the solder tape 500 and improve the position accuracy of the solder tape 500. The structural design of the auxiliary mechanism 300 enables the components of the entire solder tape handling device to be fewer in type and to achieve more functions, simplifies the structure of the device, and improves the working efficiency of the device.

[0100] Optionally, as Figures 19 to 21 and Figure 26 shown, the solder tape handling device further includes a lifting mechanism 400. The lifting mechanism 400 is arranged on the mounting plate 200 and can at least drive the auxiliary mechanism 300 to rise or fall.

[0101] Specifically, in this embodiment, the lifting mechanism 400 can at least drive the auxiliary mechanism 300 to rise or fall, so as to press and position the solder tape 500 or press and bond it to the solar cell 700 during the process of the solder tape gripping mechanism 100 placing the solder tape 500.

[0102] In one embodiment, as Figures 24 to 26 shown, the lifting mechanism 400 includes two second driving members 403 and a connecting plate 401 disposed between the two driving members. A plurality of card slots 402 are provided on the connecting plate 401. The needle pressing mechanism in the auxiliary mechanism 300 is clamped in the card slots 402 through a retaining ring 205 on the connecting rod. In practical applications, the second driving member 403 can drive the connecting plate 401 to rise or fall, so as to realize the rise or fall of the auxiliary mechanism 300.

[0103] In addition, in the above embodiment, a plurality of lifting mechanisms 400 are provided, and a plurality of needle pressing structures 20 in the solder tape gripping mechanism 100 can also be clamped on one lifting mechanism 400, so that the needle pressing structures 20 in the solder tape gripping mechanism 100 and the needle pressing structures 20 in the auxiliary mechanism 300 can rise or fall simultaneously, improving the integration of the device.

[0104] The following takes Figures 19 to 21 the provided solder tape handling device as an example to illustrate the action relationship between the mechanisms during the process of gripping, handling, and placing the solder tape 500:

[0105] Referring to Figures 11 to 12 , it is a schematic diagram of the action when the solder tape gripping mechanism 100 is ready to grip the solder tape 500 after the solder tape 500 is cut in the solder tape cutting mechanism 600. The solder tape 500 is located in the guiding groove of the solder tape cutting mechanism 600, and the solder tape gripping mechanism 100 correspondingly descends to the gripping position. At this time, the hook clamping structure 10 is at the second position, the upper surface of the supporting portion 101 of the hook clamping structure 10 is 1-2 mm lower than the back surface of the solder tape 500, and the pressing plate 202 of the needle pressing structure 20 contacts the upper surface of the guiding groove of the solder tape cutting mechanism 600, so that the lower surface of the pressing plate 202 is higher than the upper surface of the supporting portion 101. During this process, the needle pressing structures 20 of both the solder tape gripping mechanism 100 and the auxiliary mechanism 300 are not in contact with the solder tape 500, and the lifting mechanism 400 is at a low position and not in contact with the retaining ring 205.

[0106] Referring to 13 to Figure 14, which is one of the schematic diagrams of the actions of the solder strip gripping mechanism 100 for gripping and transporting the solder strip 500. Among them, the solder strip gripping mechanism 100 rises until the upper surface of the supporting portion 101 of the hook clamping structure 10 contacts the lower surface of the solder strip 500. At the same time, the hook clamping structure 10 is driven by the first driving member 50 to move to the first position, so that the lower surface of the solder strip 500 is completely entrusted on the supporting portion 101. At this time, the position of the lifting mechanism 400 remains unchanged.

[0107] Refer to 15 to Figure 16 , which is the second of the schematic diagrams of the actions of the solder strip gripping mechanism 100 for gripping and transporting the solder strip 500. Among them, the solder strip gripping mechanism 100 continues to rise until the solder strip 500 is separated from the solder strip cutting mechanism 600. During this process, due to the action of the spring 203, the lower surface of the pressing plate 202 contacts the upper surface of the solder strip 500 and presses the solder strip 500 against the supporting portion 101 of the hook clamping structure 10. Subsequently, the entire solder strip handling device moves above the battery cell 700.

[0108] Refer to 17 to Figure 18 , which is the schematic diagram of the action of the solder strip gripping mechanism 100 placing the solder strip 500 on the battery cell 700. When the solder strip gripping mechanism 100 descends to a certain height, since the pressing needle structure 20 in the auxiliary mechanism 300 is not restricted by the hook clamping structure 10 and its pressing plate 202 is lower than the pressing plate 202 in the solder strip gripping mechanism 100, it can partially press the solder strip 500 on the battery cell 700, thus ensuring the fixed position of the solder strip 500. At this time, the hook clamping structure 10 of the solder strip gripping device does not need to move to the second position and is at a certain distance (2 - 3 mm) from the battery cell 700.

[0109] Furthermore, the lifting mechanism 400 drives each pressing needle structure 20 to lift, so that it is separated from the solder strip 500. At the same time, the hook clamping structure 10 moves to the second position, causing the solder strip 500 to fall onto the surface of the battery cell 700. Then, the lifting mechanism 400 drives each pressing needle structure 20 to descend until the pressing plate 202 of the pressing needle mechanism presses the solder strip 500 against the battery cell 700, and then the entire solder strip handling device descends a certain distance (for example, 1 - 2 mm), thereby ensuring that the solder strip 500 is firmly pressed on the surface of the battery cell 700 (the part of the surface of the battery cell 700 corresponding to the solder strip 500 is coated with glue).

[0110] Subsequently, the entire solder strip handling device rises, disengaging from the battery cell 700, and performs the next cycle of actions. At this time, each hook clamping structure 10 of the solder strip gripping mechanism 100 is located at the second position, and the bottoms of the pressing needle structures 20 in the solder strip gripping mechanism 100 and the pressing needle structures 20 in the auxiliary mechanism 300 are both lower than the upper surface (supporting surface) of the supporting portion 101 of the hook clamping structure 10, and there is no contact between the pressing needle structure 20 and the hook clamping structure 10.

[0111] In the above process, the solder tape gripping device formed by multiple solder tape gripping components can grip multiple solder tapes 500 at one time, and there are more gripping positions for each solder tape 500, which not only improves the gripping efficiency but also ensures the reliability of gripping the solder tape 500. Among them, since the solder tape 500 is pressed by the pressing plate 202 and the supporting portion 101 during the handling process, the reliability of gripping and handling is further improved. During the placement process, since the pressing plate 202 presses the solder tape 500, its position deviation can be avoided, and the reliability of placing the solder tape 500 is improved.

[0112] In the above embodiments, the differences between the various embodiments are mainly described. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a more optimal embodiment. For the sake of brevity of the description, they will not be elaborated here.

[0113] Although some specific embodiments of the present invention have been described in detail by way of examples, those skilled in the art should understand that the above examples are only for illustration and not for limiting the scope of the present invention. Those skilled in the art should understand that the above embodiments can be modified without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.

Claims

1. A solder strip gripping component, characterized in that Comprising: A hook and clamp structure (10), the hook and clamp structure (10) having a first position and a second position; A needle pressing structure (20), the needle pressing structure (20) being disposed on one side of the hook and clamp structure (10); When the hook and clamp structure (10) is in the first position, at least a part of the needle pressing structure (20) can be pressed against the hook and clamp structure (10); When the hook and clamp structure (10) is in the second position, the needle pressing structure (20) can be separated from the hook and clamp structure (10).

2. The solder strip gripping assembly according to claim 1, wherein Further comprising a guiding structure (30), a limiting groove (301) being provided on the guiding structure (30), and when the hook and clamp structure (10) is in the first position, the welding tape (500) supported by it can be located in the limiting groove (301).

3. The solder strip gripping assembly according to claim 1, wherein The needle pressing structure (20) includes a pressing plate (202), a spring (203) and a connecting member (204), the pressing plate (202) being connected to the connecting member (204) through the spring (203), so that at least a part of the pressing plate (202) can be pressed against the hook and clamp structure (10).

4. The solder strip gripping assembly according to claim 3, wherein, The needle pressing structure (20) further includes an air pipe joint (40), an adsorption hole (201) being provided in the pressing plate (202), the air pipe joint (40) communicating with the adsorption hole (201) and being capable of being connected to a pneumatic source.

5. The solder tape gripping assembly according to claim 4, wherein The adsorption hole (201) is provided as an elongated hole.

6. The solder tape gripping assembly according to any one of claims 3 to 5, characterized in that, The hook and clamp structure (10) has a supporting portion (101), the upper surface of the supporting portion (101) being higher than the lower surface of the pressing plate (202), so that when the hook and clamp structure (10) is in the first position, at least a part of the lower surface of the pressing plate (202) can be pressed against the upper surface of the supporting portion (101).

7. The solder strip gripping assembly according to claim 6, characterized in that, Further comprising a first driving member (50), the hook and clamp structure (10) further having a connecting portion (102); The supporting portion (101) is connected to the first driving member (50) through the connecting portion (102), the first driving member (50) being used to place the hook and clamp structure (10) in the first position or the second position.

8. A solder tape handling device, characterized in that, Comprising: A welding tape grasping mechanism (100), the welding tape grasping mechanism (100) including a mounting structure and a plurality of welding tape grasping assemblies according to any one of claims 1-7; A plurality of the welding tape grasping assemblies are arranged in rows and / or columns on the mounting structure, so that each of the hook and clamp structures (10) can have the first position and the second position relative to the mounting structure.

9. The solder tape handling device according to claim 8, characterized in that, Further comprising an auxiliary mechanism (300), when a welding tape (500) is pressed between the needle pressing structure (20) and the hook and clamp structure (10), the auxiliary mechanism (300) can be pressed against the welding tape (500), and the pressing force is greater than or equal to the pressing force of the needle pressing structure (20) on the welding tape (500).

10. The solder tape handling device according to claim 9, characterized in that, It further includes a mounting plate (200). Two solder strip gripping mechanisms (100) are provided and are respectively fixed at both ends of the first surface of the mounting plate (200). The auxiliary mechanism (300) is fixed between the two solder strip gripping mechanisms (100).

11. The solder tape handling device according to claim 10, wherein, The structure of the auxiliary mechanism (300) is the same as that of the press needle structure (20), and the number of the press needle structures (20) included therein is the same as the number of the hook clamping structures (10) included in the solder strip gripping mechanism (100).

12. The solder tape handling device according to claim 11, wherein The solder strip (500) handling device further includes a lifting mechanism (400). The lifting mechanism (400) is arranged on the mounting plate (200) and can drive at least the auxiliary mechanism (300) to rise or fall.

Images