Portable temperature adjusting device

Abstract

The utility model provides a portable temperature adjusting device which comprises a main body and a fan, a semiconductor temperature adjusting piece, a temperature conducting piece and an air outlet part which are arranged on the main body, the temperature conducting piece is connected to one of the hot end and the cold end of the semiconductor temperature adjusting piece in a heat conduction mode, and the temperature conducting piece can be used for making contact with the skin so as to transfer cold energy or heat energy to cool or warm the skin. The air outlet part is connected to the other one of the hot end and the cold end of the semiconductor temperature adjusting piece in a heat conduction mode, and air generated by the fan can be blown out through the air outlet part. The semiconductor temperature adjusting part is connected with the air outlet part, when the semiconductor temperature adjusting part is used for refrigeration, the air outlet part can serve as a heat dissipation element, heat can be taken away when air is blown out through the air outlet part, heat dissipation of the semiconductor temperature adjusting part is achieved while air blowing is achieved, and therefore the heat dissipation element does not need to be additionally arranged, and element configuration is simplified.

Description

Technical Field

[0001] The present application relates to the technical field of daily necessities, and in particular to a portable temperature control device. Background Art

[0002] As a small fan, a handheld fan is easy to carry and move, suitable for different occasions, and brings convenience to people's lives. A handheld fan generally includes a gripping component and a fan arranged on the gripping component. However, the wind power of the fan is limited, and temperature adjustment by the fan alone can no longer meet the users' increasingly high temperature adjustment needs. Therefore, some people have proposed adding a cooling element to the handheld fan, using the cooling element and the fan to cool the human body at the same time to meet people's increasingly high temperature adjustment needs. However, the cooling element generates a certain amount of heat during the cooling process, and this heat needs to be dissipated by the heat dissipation component. Adding an additional heat dissipation component to the handheld fan will occupy internal space or increase the overall volume of the handheld fan, which restricts the realization of other functions of the handheld fan and the development of miniaturization.

[0003] Based on this, it is necessary to improve the existing handheld fan to solve the above problems. Summary of the Invention

[0004] In view of this, the present application provides a portable temperature control device that can effectively solve the above problems.

[0005] The present application provides a portable temperature control device, which is characterized in that it includes a main body and a fan, a semiconductor temperature control component, a temperature conductor, and an air outlet portion arranged on the main body, the temperature conductor is thermally connected to one of the hot end and the cold end of the semiconductor temperature control component, the temperature conductor can be used for contact with the skin, the air outlet portion is thermally connected to the other of the hot end and the cold end of the semiconductor temperature control component, and the wind generated by the fan can be blown out through the air outlet portion.

[0006] In one embodiment, the temperature conducting component is arranged on the main body and is arranged on the same side of the main body as the air outlet portion. The air outlet portion is provided with a conductive arm, which extends into the main body and is thermally connected to the semiconductor temperature regulating component. The semiconductor temperature regulating component is located between the conductive arm and the temperature conducting component.

[0007] In one embodiment, an installation cavity is formed in the main body, the semiconductor temperature regulating component and the fan are located in the installation cavity, a mounting frame is provided in the installation cavity, and the fan is installed on the mounting frame.

[0008] In one embodiment, the air outlet and the heat conducting member are located on two adjacent sides of the main body.

[0009] In one embodiment, the air outlet part includes a grid structure and a conduction arm connected to the grid structure. The grid holes of the grid structure form the air outlet. The conduction arm extends into the installation cavity, and the semiconductor temperature control element is arranged between the temperature conduction element and the conduction arm and is thermally conductively connected to the conduction arm.

[0010] In one embodiment, a convex wall is provided on the side wall of the installation frame close to the temperature conduction element. The convex wall encloses to form the placement position, and the side of the convex wall corresponding to the conduction arm is of an open structure. The semiconductor temperature control element is placed in the placement position.

[0011] In one embodiment, the installation frame is provided with an air inlet opening and an air outlet opening corresponding to the blower. The air inlet opening is arranged facing the temperature conduction element, and the air outlet opening is arranged facing the air outlet part and is communicated with the air outlet of the air outlet part.

[0012] In one embodiment, two blowers are provided, and the semiconductor temperature control element is located between the two blowers; and / or, two temperature conduction elements, two semiconductor temperature control elements and two conduction arms are respectively provided. The two conduction arms are respectively thermally conductively connected to the two semiconductor temperature control elements, the two temperature conduction elements are respectively thermally conductively connected to the two semiconductor temperature control elements, and the two temperature conduction elements are respectively arranged on opposite sides of the main body.

[0013] In one embodiment, the main body includes a housing, a first cover and a second cover. The housing has a first port and a second port located on its opposite sides. The first cover covers the first port, the second cover covers the second port. The temperature conduction element is arranged in the housing, the air outlet part is arranged at the second cover. The first cover is provided with an air inlet, and the air inlet is communicated with the air inlet opening. An air inlet space is formed between the housing and the installation frame, and the air inlet space communicates the air inlet and the air inlet opening; and / or, the temperature conduction element is provided with an air inlet structure communicated with the air inlet opening.

[0014] In one embodiment, the portable temperature control device includes a circuit board and a power supply. The circuit board and the power supply are installed in the installation frame. A partition is provided in the installation frame to separate the circuit board, the power supply from the blower. The blower, the power supply and the semiconductor temperature control element are respectively electrically connected to the circuit board.

[0015] In one embodiment, the housing includes a first housing part and a second housing part connected in butt joint. One end of the first housing part and the second housing part encloses the first port, and the other end encloses the second port. Two temperature conduction elements are provided, and the two temperature conduction elements are respectively arranged on the first housing part and the second housing part.

[0016] In summary, the present application provides a portable temperature regulating device, which includes a main body, a blower, a semiconductor temperature regulating component, a heat conducting component, and an air outlet part provided on the main body. The heat conducting component is thermally connected to one of the hot end and the cold end of the semiconductor temperature regulating component. The heat conducting component can be used to contact the skin to transfer cold energy or heat energy to the skin for cooling or warming. The air outlet part is thermally connected to the other of the hot end and the cold end of the semiconductor temperature regulating component. The air generated by the blower can be blown out through the air outlet part. By connecting the semiconductor temperature regulating component to the air outlet part in the present application, when the semiconductor temperature regulating component is used for refrigeration, the air outlet part can be used as a heat dissipation element, and the heat can be taken away simultaneously when the air passes through the air outlet part, so as to dissipate heat from the semiconductor temperature regulating component while blowing air, thus eliminating the need for an additional heat dissipation element and simplifying the component configuration. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 FIG. is a perspective schematic view of the portable temperature regulating device of the present application.

[0018] Figure 2 is Figure 1 an exploded schematic view of the main body part of the portable temperature regulating device in FIG..

[0019] Figure 3 is Figure 1 an internal structure schematic view of the main body part in FIG. after removing the first housing part.

[0020] Figure 4 is Figure 1 a preliminary exploded schematic view of the main body part in FIG..

[0021] Figure 5 is Figure 4 a further exploded schematic view of the main body part in FIG..

[0022] Figure 6 is Figure 1 a perspective schematic view of the first cover part in FIG..

[0023] Figure 7 is an exploded schematic view of another embodiment of the portable temperature regulating device of the present application.

[0024] Reference numerals:

[0025] 10 - Portable temperature - regulating device; 12 - Main body; 14 - Fan; 16 - Semiconductor temperature - regulating component; a - Hot end; b - Cold end; 18 - Heat - conducting component; 20 - Air - outlet part; 22 - Housing; 24 - First cover; 24a - First part; 24b - Second part; 26 - Second cover; 28 - First port; 30 - Second port; 32 - First housing part; 34 - Second housing part; 36 - First mounting opening; 38 - First cover body; 38a - First cover part; 38b - Second cover part; 40 - Mounting frame; 42 - Grid structure; 44 - Conductive arm; 46 - Second mounting opening; 48 - Air - outlet; 50 - First frame body; 52 - Second frame body; 54 - Partition; 56 - Accommodating position; 60 - Air - inlet opening; 62 - Air - outlet opening; 64 - Air - inlet; 66 - Air - inlet space; 68 - Placement position; 70 - First contact part; 71 - Second contact part; 72 - Circuit board; 74 - Power supply; 76 - Button; 78 - Charging interface; 80 - Lanyard. Detailed implementation manners

[0026] Before describing the embodiments in detail, it should be understood that the present application is not limited to the detailed structures or element arrangements described in the following text or drawings of the present application. The present application can be implemented in other ways. Moreover, it should be understood that the wording and terms used herein are only for descriptive purposes and should not be construed restrictively. The similar wording such as "including", "comprising", "having" used herein means including the matters listed thereafter, their equivalents and other additional matters. In particular, when describing "a certain element", the present application does not limit the number of such elements to one, and multiple elements can also be included.

[0027] Please refer to Figures 1 to 6 As shown, the present application provides a portable temperature - regulating device 10. The portable temperature - regulating device 10 includes a main body 12, as well as a fan 14, a semiconductor temperature - regulating component 16, a heat - conducting component 18, and an air - outlet part 20 provided on the main body 12. The heat - conducting component 18 is thermally conductively connected to one of the hot end a and the cold end b of the semiconductor temperature - regulating component 16. The heat - conducting component 18 can be used to contact the skin to transfer cold energy or heat energy to the skin for cooling or warming. The air - outlet part 20 is thermally conductively connected to the other of the hot end a and the cold end b of the semiconductor temperature - regulating component 16. The air generated by the fan 14 can be blown out through the air - outlet part 20. By connecting the semiconductor temperature - regulating component 16 to the air - outlet part 20 in the present application, when the semiconductor temperature - regulating component 16 is used for refrigeration, the air - outlet part 20 can be used as a heat - dissipating element. When the air passes through the air - outlet part 20 and is blown out, heat can be taken away at the same time, realizing heat dissipation of the semiconductor temperature - regulating component 16 while blowing air, so that there is no need to additionally provide a heat - dissipating element, and the element configuration is simplified.

[0028] Among them, the heat conduction member 18 can serve as a handheld component of the portable temperature control device 10 for the user to hold, so that the user's skin contacts the heat conduction member 18, thereby realizing the temperature control of the human body. The portable temperature control device 10 of the present application can be used for heating or cooling. In the heating mode, the fan 14 does not operate, and the semiconductor temperature control member 16 works. The end of the semiconductor temperature control member 16 connected to the heat conduction member 18 is set as the hot end a, and the end connected to the air outlet part 20 is set as the cold end b. The heat generated by the semiconductor temperature control member 16 is conducted to the heat conduction member 18 to increase its temperature, and the heat conduction member 18 then conducts the heat to the human body to warm the user, so that the portable temperature control device 10 forms an effect similar to a hand warmer. In the cooling mode, the fan 14 and the semiconductor temperature control member 16 work simultaneously. The wind generated by the fan 14 blows out from the air outlet part 20 to cool the user. The end of the semiconductor temperature control member 16 connected to the heat conduction member 18 is set as the cold end b, and the end connected to the air outlet part 20 is set as the hot end a. The cold generated by the semiconductor temperature control member 16 is conducted to the heat conduction member 18 to decrease its temperature, and the heat conduction member 18 then conducts the cold to the human body to cool the user, so that the portable temperature control device 10 forms a cooling effect of cold compress plus blowing. The heat of the hot end a is conducted to the air outlet part 20, and the heat can be taken away when the wind blows out from the air outlet part 20, realizing the heat dissipation effect of the semiconductor temperature control member 16. Since the performance of the fan 14 can blow a large amount of air, the heat released by the semiconductor temperature control member 16 will be diluted by a large enough amount of air and will not turn the cool air into hot air, realizing the heat dissipation of the semiconductor temperature control member 16 while blowing.

[0029] Specifically, the main body 12 is in an overall cuboid shape. The main body 12 includes a housing 22, a first cover member 24 and a second cover member 26. The housing 22 is an annular structure with openings at both ends. The housing 22 has opposite first ports 28 and second ports 30. The first cover member 24 covers the first port 28, and the second cover member 26 covers the second port 30. The heat conduction member 18 is arranged on the housing 22, and the air outlet part 20 is arranged on the second cover member 26. The heat conduction member 18 and the air outlet part 20 are both made of metal material, for example, or other materials with good heat conduction effect. The heat conduction member 18 is designed as a plate-like structure adapted to the shape of the housing 22.

[0030] Please refer to Figure 7 , as another implementation manner, the heat conduction member 18 can also be arranged on the second cover member 26, on the same side of the main body 12 as the air outlet part 20. The heat conduction member 18 is designed as a plate-like structure adapted to the shape of the second cover member 26. A semiconductor temperature control member 16 is arranged between the air outlet part 20 and the heat conduction member 18 and is thermally conductively connected to it.

[0031] Further, the housing 22 includes a first housing member 32 and a second housing member 34 that are butt - connected. Both ends of the first housing member 32 and the second housing member 34 are bent in an arc shape. The first housing member 32 and the second housing member 34 are, for example, snap - connected. After the first housing member 32 and the second housing member 34 are butted, a ring - shaped structure is formed, such that one end of the first housing member 32 and the second housing member 34 encloses a first port 28, and the other end encloses a second port 30. Two heat - conducting members 18 are provided, and the two heat - conducting members 18 are respectively arranged on the first housing member 32 and the second housing member 34. For example, a first mounting opening 36 is provided in the central region of the first housing member 32 and the second housing member 34. The two heat - conducting members 18 are respectively fixed in the corresponding first mounting openings 36 by snap - fitting or other means. The first mounting opening 36 is, for example, the hand - holding area of the first housing member 32 and the second housing member 34. When the user holds the portable temperature - regulating device 10, the fingers hold the two opposite heat - conducting members 18.

[0032] In the illustrated embodiment, the first cover member 24 includes a first cover body 38 and a mounting frame 40 connected to the first cover body 38. The mounting frame 40 and the housing 22 are fixed, for example, by screws. Among them, the first cover body 38 covers the first port 28. The first cover body 38, the first housing member 32, the second housing member 34, and the second cover member 26 together enclose an installation cavity, and the installation cavity is formed inside the main body 12. The mounting frame 40 is located in the installation cavity, and the blower 14 and the semiconductor temperature - regulating member 16 are both installed on the mounting frame 40. In other embodiments, the mounting frame 40 can also be provided as an independent component separately in the installation cavity and does not form a part of the first cover member 24.

[0033] Preferably, two semiconductor temperature - regulating members 16 are provided, and the two semiconductor temperature - regulating members 16 are respectively arranged on opposite sides of the mounting frame 40. The heat - conducting members 18 are arranged on the side wall of the main body 12 corresponding to the semiconductor temperature - regulating members 16, that is, the two heat - conducting members 18 are respectively arranged on the first housing member 32 and the second housing member 34. The air - outlet part 20 is located on one side of the mounting frame 40, and the side where the air - outlet part 20 is located is adjacent to the side where the semiconductor temperature - regulating member 16 is located.

[0034] Among them, the air outlet part 20 includes a grid structure 42 and a conduction arm 44 connected to the grid structure 42. The grid structure 42 is installed on the second cover 26. For example, a second installation port 46 is provided on the second cover 26, and the grid structure 42 can be fixedly embedded in the second installation port 46 by means of snap fasteners or the like. In other embodiments, the grid structure 42 can also be directly installed on the mounting frame 40, and a relief hole for avoiding the grid structure 42 is provided on the second cover 26. The grid structure 42 is, for example, a plurality of intersecting ribs, and grid holes are formed between the plurality of ribs. The grid holes of the grid structure 42 form an air outlet 48 corresponding to the blower 14. The semiconductor temperature control member 16 is connected between the heat conduction member 18 and the conduction arm 44. In this embodiment, two conduction arms 44 are provided. The two conduction arms 44 are respectively connected to opposite sides of the grid structure 42. During installation, the two conduction arms 44 are respectively located on opposite sides of the mounting frame 40, that is, the conduction arms 44 are located between the mounting frame 40 and the heat conduction member 18.

[0035] Preferably, when the heat conduction member 18 is arranged on the second cover 26, the air outlet part 20 is provided with one conduction arm 44. The conduction arm 44 extends into the main body 12 and corresponds to the heat conduction member 18. Moreover, the conduction arm 44 is thermally conductively connected to the semiconductor temperature control member 16. The semiconductor temperature control member 16 is located between the conduction arm 44 and the heat conduction member 18, and the cold generated by the semiconductor temperature control member 16 is conducted to the second cover 26.

[0036] Furthermore, the mounting frame 40 includes a first frame body 50, a second frame body 52 connected in butt joint, and a partition member 54 provided between the first frame body 50 and the second frame body 52. The partition member 54 divides the space between the first frame body 50 and the second frame body 52 into a receiving position 56 and a mounting position (not shown in the figure). Among them, the receiving position 56 is formed between the partition member 54 and the first frame body 50, and the mounting position is formed between the partition member 54 and the second frame body 52. The blower 14 is located in the receiving position 56 and is fixedly installed on the partition member 54. The first frame body 50, the second frame body 52, and the partition member 54 are fixed by screws, for example. The blower 14 is, for example, a centrifugal blower. The first frame body 50 is provided with an air inlet opening 60 corresponding to the blower 14. An air outlet opening 62 corresponding to the blower 14 is formed between the first frame body 50 and the partition member 54 or the second frame body 52. The air inlet opening 60 is arranged toward the heat conduction member 18, and the air outlet opening 62 is arranged toward the air outlet part 20 and is communicated with the air outlet 48. For example, the air outlet opening 62 is formed between the first frame body 50 and the partition member 54 or the second frame body 52 at the end away from the first cover 38. Preferably, the air inlet direction of the air inlet opening 60 is perpendicular to the air outlet direction of the air outlet opening 62.

[0037] In the illustrated embodiment, two fans 14 are provided. The two fans 14 are spaced apart and arranged within the mounting frame 40. The semiconductor temperature regulating member 16 is located in the area between the corresponding two fans 14 of the mounting frame 40 to avoid the air inlet opening 60, so as to prevent the semiconductor temperature regulating member 16 from affecting the air intake of the fans 14.

[0038] In the illustrated embodiment, an air inlet 64 is further provided on the first cover 38. The air inlet 64 is, for example, arranged on the edge of the first cover 38 near the temperature guiding member 18 and the fans 14. The air inlet 64 is communicated with the air inlet opening 60, and the air intake direction of the air inlet 64 is perpendicular to the air intake direction of the air inlet opening 60. An air intake space 66 is formed between the main body 12 and the mounting frame 40. Specifically, there is a certain spacing distance between the first frame body 50 and the first housing member 32, so that the air intake space 66 is formed between the first frame body 50 and the first housing member 32. The air intake space 66 is communicated with the air inlet 64 and the air inlet opening 60, and the air inlet 64 is arranged at the position of the first cover 38 corresponding to the air intake space 66. When the fans 14 operate, air enters the air intake space 66 through the air inlet 64, then enters the fans 14 from the air intake space 66 through the air inlet opening 60, and then is blown out through the air outlet 48 via the air outlet opening 62. The fans 14 are centrifugal fans. By providing the air intake space 66, the air flow can intake air axially and discharge air radially.

[0039] Furthermore, an air intake structure communicated with the air inlet opening 60 can also be provided on the temperature guiding member 18. The air intake structure is an air intake net or an avoidance hole, so that air can enter the air intake space 66 through the air intake structure and then enter the fans 14 from the air intake space 66 through the air inlet opening 60.

[0040] In this embodiment, two fans 14 are provided, and the components and structures cooperating with the fans 14 are correspondingly provided in two. For example, two air inlet openings 60 are provided, or the area and position corresponding to the two fans 14 can be covered. For example, the air outlet 48 can cover the air outlet areas of the two fans 14. Preferably, a spacing portion is further provided between the two fans 14 in the mounting frame 40, so that the two fans 14 are separated from each other to avoid interference between them.

[0041] From another perspective, the first cover member 24 includes a first part 24a and a second part 24b connected by butt joint. The first cover 38 includes a first cover portion 38a and a second cover portion 38b. The separating member 54 is assembled between the first part 24a and the second part 24b. The first cover portion 38a and the first frame body 50 are, for example, an integrally formed structure, and the two together constitute the first part 24a. The second cover portion 38b and the second frame body 52 are, for example, an integrally formed structure, and the two together constitute the second part 24b.

[0042] In the illustrated embodiment, a placement position 68 is provided on the side of the mounting bracket 40 close to the heat conduction member 18, that is, placement positions 68 are respectively provided on the opposite sides of the mounting bracket 40. Specifically, placement positions 68 are respectively provided on the sides of the first frame body 50 and the second frame body 52 facing away from each other. The placement position 68 is, for example, a groove structure with an open end, and the groove structure can be formed by surrounding convex walls. During installation, the conduction arm 44 extends and inserts into the bottom inside the placement position 68 through the open end of the groove structure. Two semiconductor temperature control members 16 are provided, and the two semiconductor temperature control members 16 are placed in the corresponding placement positions 68. Moreover, the semiconductor temperature control member 16 is located between the heat conduction member 18 and the conduction arm 44, and one end (one of the hot end a and the cold end b) of the semiconductor temperature control member 16 is connected to the heat conduction member 18, and the other end (the other of the hot end a and the cold end) is connected to the conduction arm 44. Optionally, a first contact portion 70 is provided on the side of the heat conduction member 18 facing the semiconductor temperature control member 16, and the first contact portion 70 is used to contact the hot end a or the cold end b. A second contact portion 71 is provided on the side of the conduction arm 44 facing the semiconductor temperature control member 16, and the second contact portion 71 is used to contact the hot end a or the cold end b.

[0043] In the illustrated embodiment, the portable temperature control device 10 includes a circuit board 72 and a power supply 74. The blower 14, the power supply 74, and the semiconductor temperature control member 16 are respectively electrically connected to the circuit board 72. The circuit board 72 and the power supply 74 can be installed in the installation position formed between the partition member 54 and the second frame body 52. Preferably, one end of the partition member 54 away from the first cover body 38 bends towards one end of the second frame body 52 away from the first cover body 38 and is connected to the end of the second frame body 52 to enclose the installation position formed between the partition member 54 and the second frame body 52, which can avoid the mutual influence between the power supply 74 and the semiconductor temperature control member 16 and prevent the influence on the air outlet.

[0044] Preferably, a key 76 and a charging interface 78 electrically connected to the circuit board 72 are further provided on the main body 12. The key 76 is, for example, provided on the second cover member 26 and is spaced from the air outlet portion 20. The key 76 can be used to control the switch of the portable temperature control device 10, the air volume adjustment of the blower 14, and the switching of the cooling and heating modes, etc. The charging interface 78 is, for example, provided on the second cover portion 38b and can be connected to an external power supply to charge the power supply 74. A hanging rope 80 is further connected to the main body 12. The two ends of the hanging rope 80 are, for example, respectively connected to the two ends in the length direction of the main body 12. The hanging rope 80 can be used for hanging, carrying by hand, or wearing, so as to facilitate the user to carry the portable temperature control device 10.

[0045] In summary, the present application provides a portable temperature regulating device, which includes a main body, a blower, a semiconductor temperature regulating component, a heat conducting component, and an air outlet part arranged on the main body. The heat conducting component is thermally connected to one of the hot end and the cold end of the semiconductor temperature regulating component, and the heat conducting component can be used to contact the skin to transfer cold energy or heat energy to the skin for cooling or warming. The air outlet part is thermally connected to the other of the hot end and the cold end of the semiconductor temperature regulating component, and the air generated by the blower can be blown out through the air outlet part. By connecting the semiconductor temperature regulating component to the air outlet part, when the semiconductor temperature regulating component is used for refrigeration, the air outlet part can be used as a heat dissipation element, and the heat can be taken away simultaneously when the air passes through the air outlet part, so as to dissipate heat from the semiconductor temperature regulating component while blowing air, thus eliminating the need for an additional heat dissipation element and simplifying the component configuration.

[0046] The concepts described herein can be implemented in other forms without departing from their spirit and characteristics. The specific embodiments disclosed should be considered illustrative rather than restrictive. Therefore, the scope of the present application is determined by the appended claims rather than by these previous descriptions. Any changes within the literal meaning and equivalent scope of the claims should fall within the scope of these claims.

Claims

1. A portable temperature regulating device, characterized in that, It includes a main body, as well as a blower, a semiconductor temperature regulator, a heat conducting member, and an air outlet portion provided on the main body. The heat conducting member is thermally connected to one of the hot end and the cold end of the semiconductor temperature regulator. The heat conducting member can be used to contact the skin. The air outlet portion is thermally connected to the other of the hot end and the cold end of the semiconductor temperature regulator. The air generated by the blower can be blown out through the air outlet portion.

2. The portable temperature regulating device according to claim 1, wherein The heat conducting member is provided on the main body and on the same side of the main body as the air outlet portion. The air outlet portion is provided with a conduction arm. The conduction arm extends into the main body and is thermally connected to the semiconductor temperature regulator. The semiconductor temperature regulator is located between the conduction arm and the heat conducting member.

3. The portable temperature regulating device according to claim 1, wherein An installation cavity is formed in the main body. The semiconductor temperature regulator and the blower are located in the installation cavity. An installation frame is provided in the installation cavity. The blower is installed on the installation frame.

4. The portable temperature regulating device according to claim 3, characterized in that The air outlet portion and the heat conducting member are located on adjacent side surfaces of the main body.

5. The portable temperature control device according to claim 3, wherein The air outlet portion includes a grid structure and a conduction arm connected to the grid structure. The grid holes of the grid structure form air outlets. The conduction arm extends into the installation cavity. The semiconductor temperature regulator is provided between the heat conducting member and the conduction arm and is thermally connected to the conduction arm.

6. The portable temperature regulating device according to claim 5, wherein, A convex wall is provided on the side wall of the installation frame close to the heat conducting member. The convex wall surrounds to form a placement position. And an opening structure is provided on the side of the convex wall corresponding to the conduction arm. The semiconductor temperature regulator is placed in the placement position.

7. The portable temperature adjusting device according to claim 5, characterized in that The installation frame is provided with an air inlet opening and an air outlet opening corresponding to the blower. The air inlet opening is arranged facing the heat conducting member. The air outlet opening is arranged facing the air outlet portion and is communicated with the air outlet of the air outlet portion.

8. The portable temperature regulating device according to claim 5, wherein There are two blowers, and the semiconductor temperature regulator is located between the two blowers; and / or, there are two heat conducting members, two semiconductor temperature regulators, and two conduction arms respectively. The two conduction arms are respectively thermally connected to the two semiconductor temperature regulators. The two heat conducting members are respectively thermally connected to the two semiconductor temperature regulators. The two heat conducting members are respectively provided on opposite sides of the main body.

9. The portable temperature regulating device according to claim 7, wherein The main body includes a housing, a first cover member, and a second cover member. The housing has a first port and a second port located on its opposite sides. The first cover member covers the first port. The second cover member covers the second port. The heat conducting member is provided on the housing. The air outlet portion is provided at the second cover member. The first cover member is provided with an air inlet, and the air inlet is communicated with the air inlet opening. An air inlet space is formed between the housing and the installation frame, and the air inlet space communicates the air inlet and the air inlet opening; and / or, the heat conducting member is provided with an air inlet structure communicated with the air inlet opening.

10. The portable temperature regulating device according to any one of claims 3-9, characterized in that, The portable temperature regulator includes a circuit board and a power supply. The circuit board and the power supply are installed in the installation frame. A partition member is provided in the installation frame. The partition member separates the circuit board, the power supply from the blower. The blower, the power supply, and the semiconductor temperature regulator are respectively electrically connected to the circuit board.

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