Vapor chamber used for being matched with silicon carbide boat

Abstract

The utility model relates to a uniform temperature plate for matching a silicon carbide boat, which comprises a main plate with the thickness of H and the side length of L, and the ratio of H to L is 1: (14-16), and H is more than or equal to 10mm and less than or equal to 16mm; at least one through hole is symmetrically formed in the main board, the area of the hole in the main board is s, the total area of the main board is S, and s: S = 1: (3-5); at least two slits extending to the edge of the main board are further formed in the main board in a central symmetry mode, the width of each slit is 2-3 mm, and the slits penetrate through the thickness of the main board; the upper surface of the main board is further provided with a supporting part used for supporting the silicon carbide boat. The unique structural design of the vapor chamber facilitates stress release, and the overall structure is more stable and durable.

Description

Technical Field

[0001] This application relates to the field of new energy technologies, and particularly to a temperature equalizing plate that can be used in a diffusion furnace for manufacturing solar panels and is used to match a silicon carbide wafer boat. Background Art

[0002] In the annealing process during semiconductor manufacturing, an annealing furnace is used. Its principle is to use a resistance coil to surround a quartz tube. After being energized, the coil heats the quartz tube to generate a constant temperature area. When the temperature reaches the temperature required by the process, the silicon wafer is sent into the constant temperature area inside the quartz tube through a silicon carbide wafer boat placed on a robotic arm for annealing to meet the process requirements. Therefore, it is very important to keep the temperature of the silicon carbide wafer boat uniform and stable. In the prior art, the temperature equalizing plate used to carry the silicon carbide wafer boat often cracks due to thermal stress at high temperatures, thus having a very serious adverse impact on the entire annealing process and affecting the normal production process. Summary of the Invention

[0003] Aiming at the deficiencies of the prior art, this application proposes a temperature equalizing plate for matching a silicon carbide wafer boat that can not only eliminate thermal stress but also ensure the load-bearing capacity.

[0004] A temperature equalizing plate for matching a silicon carbide wafer boat in this application includes a main board with a thickness of H and a side length of L, and satisfies H:L = 1:(14~16), 10mm ≤ H ≤ 16mm;

[0005] At least one through hole is symmetrically opened on the main board. The opening area of the main board is s, and the total area of the main board is S, and satisfies s:S = 1:(3~5);

[0006] At least two slits extending to the edge of the main board are symmetrically opened at the center of the main board. The width of the slit is 2~3mm, and the slit penetrates through the thickness of the main board;

[0007] A support part for supporting the silicon carbide wafer boat is further provided on the upper surface of the main board.

[0008] Further, the through hole of the temperature equalizing plate in this application includes a large round hole located at the geometric center of the main board.

[0009] Further, the through hole of the temperature equalizing plate in this application further includes four rectangular holes evenly distributed around the large round hole.

[0010] Further, the through hole of the temperature equalizing plate in this application further includes eight small round holes evenly distributed around the large round hole.

[0011] Further, the slit of the temperature equalizing plate in this application extends along the edge of the rectangular hole to the edge of the main board.

[0012] Further, at the edge where the main board of the heat pipe in this application is connected to the slit, there is a concave-convex edge, and at the edge of the main board that is not connected to the slit, there is a notch.

[0013] Further, the support part of the heat pipe in this application is at least four symmetrically distributed pins.

[0014] Further, the support part of the heat pipe in this application is a "hui"-shaped convex platform arranged along the four peripheries of the heat pipe.

[0015] Advantages of this application:

[0016] For the heat pipe used to match the silicon carbide crystal boat in this application, on the one hand, through a reasonable length-to-thickness ratio and the ratio of the opening area, the overall structure of the heat pipe is more concise while ensuring the bearing capacity. On the other hand, by symmetrically opening slits extending to the edge of the main board on the heat pipe, thermal stress is eliminated.

[0017] In addition, the structure of a large round hole at the geometric center, four rectangular holes evenly distributed around the large round hole, and eight small round holes evenly distributed around the large round hole, combined with the concave-convex edge and notch design around the heat pipe, is also conducive to stress release, making the overall structure of the heat pipe used to match the silicon carbide crystal boat more stable. The heat pipe described in this application can bear a load of 60 kg at a high temperature of 800 °C, fully meeting the usage requirements. Description of the drawings

[0018] Figure 1 is a schematic structural diagram of the heat pipe used to match the silicon carbide crystal boat in this application;

[0019] Figure 2 is a side view of the structure of the heat pipe used to match the silicon carbide crystal boat in this application;

[0020] Wherein: 1, main board; 2, through hole; 3, slit; 4, pin; 5, concave-convex edge; 6, notch;

[0021] 201, large round hole; 202, rectangular hole; 203, small round hole. Specific embodiments

[0022] To make the purpose, technical solutions, and advantages of the specific embodiments of this application clearer, the technical solutions in the specific embodiments of this application will be clearly and completely described below. Those not specified in the specific embodiments are carried out according to conventional conditions or conditions recommended by the manufacturer.

[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this technology belongs. The terms used in the specification herein are for the purpose of describing specific embodiments only and are not intended to limit this application. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0024] A temperature equalizing plate for matching a silicon carbide boat includes a main board with a thickness of H and a side length of L, and satisfies H:L = 1:(14~16), 10mm ≤ H ≤ 16mm;

[0025] At least one through hole is symmetrically formed on the main board. The opening area of the main board is s, and the total area of the main board is S, and satisfies s:S = 1:(3~5);

[0026] At least two slits extending to the edge of the main board are symmetrically formed at the center of the main board. The width of the slit is 2~3mm, and the slit is formed through the thickness of the main board;

[0027] A support part for supporting the silicon carbide boat is further provided on the upper surface of the main board.

[0028] In some other embodiments, the through holes of the temperature equalizing plate include a large round hole located at the geometric center of the main board.

[0029] In some other embodiments, the through holes of the temperature equalizing plate further include four rectangular holes uniformly distributed around the large round hole.

[0030] In some other embodiments, the through holes of the temperature equalizing plate further include eight small round holes uniformly distributed around the large round hole.

[0031] In some other embodiments, the slits of the temperature equalizing plate extend along the edge of the rectangular hole to the edge of the main board.

[0032] In some other embodiments, a concave-convex edge is further provided at the edge of the main board of the temperature equalizing plate communicating with the slit, and a notch is provided at the edge of the main board not communicating with the slit.

[0033] In some other embodiments, the support part of the temperature equalizing plate is at least four symmetrically distributed pins.

[0034] In some other embodiments, the support part of the temperature equalizing plate is a "hui"-shaped boss arranged along the four edges of the temperature equalizing plate. Example 1:

[0035] As Figure 1 and Figure 2As shown, a heat pipe for matching a silicon carbide boat of the present application includes a main board 1 with a thickness of H and a side length of L, and satisfies H:L = 1:(14~16), 10mm ≤ H ≤ 16mm;

[0036] At least one through hole 2 is symmetrically formed on the main board 1. The opening area of the main board 1 is s, and the total area of the main board 1 is S, and s:S = 1:(3~5) is satisfied; in Embodiment 1, the through holes 2 of the heat pipe include a large round hole 201 located at the geometric center of the main board 1, four rectangular holes 202 uniformly distributed around the large round hole 201, and eight small round holes 203 uniformly distributed around the large round hole 201.

[0037] At least two slits 3 extending to the edge of the main board 1 are symmetrically formed at the center of the main board 1. The width of the slit 3 is 2~3mm, and the slit 3 penetrates through the thickness of the main board 1; the slit 3 extends along the edge of the rectangular hole 202 to the edge of the main board 1.

[0038] A support portion for supporting the silicon carbide boat is further provided on the upper surface of the main board 1. In Embodiment 1, the support portion is eight symmetrically distributed pins 4.

[0039] A concave-convex edge 5 is further provided at the edge of the main board 1 communicating with the slit 3, and a notch 6 is provided at the edge of the main board 1 not communicating with the slit 3.

[0040] The above-described embodiments are part of the embodiments of the present application, rather than all embodiments. The detailed description of the embodiments of the present application is not intended to limit the scope of the present application claimed, but merely represents selected embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts shall fall within the scope of protection of the present application.

Claims

1. A temperature equalizing plate for matching a silicon carbide susceptor, characterized in that, It includes a main board with a thickness of H and a side length of L, and satisfies H:L = 1:(14~16), 10mm ≤ H ≤ 16mm; At least one through hole is symmetrically opened on the main board. The opening area of the main board is s, and the total area of the main board is S, and satisfies s:S = 1:(3~5); At least two slits extending to the edge of the main board are symmetrically opened at the center of the main board. The width of the slit is 2~3mm, and the slit runs through the thickness of the main board; A support part for supporting a silicon carbide crystal boat is also provided on the upper surface of the main board.

2. The isothermal plate for matching a silicon carbide boat according to claim 1, characterized in that: The through hole includes a large round hole located at the geometric center of the main board.

3. The isothermal plate for matching a silicon carbide susceptor according to claim 2, wherein: The through hole also includes four rectangular holes evenly distributed around the large round hole.

4. The isothermal plate for matching the silicon carbide boat according to claim 3, characterized in that: The through hole also includes eight small round holes evenly distributed around the large round hole.

5. The isothermal plate for matching a silicon carbide susceptor according to claim 4, wherein: The slit extends along the edge of the rectangular hole to the edge of the main board.

6. The isothermal plate for matching the silicon carbide boat according to claim 5, wherein: An uneven edge is also provided at the edge of the main board where the slit is connected, and a notch is provided at the edge of the main board where the slit is not connected.

7. The heat spreader for matching a silicon carbide susceptor according to any one of claims 1 to 6, characterized in that: The support part is at least four symmetrically distributed pins.

8. The temperature equalizing plate for matching a silicon carbide susceptor according to any one of claims 1 to 6, characterized in that: The support part is a "return" shaped boss arranged along the periphery of the heat spreader.

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