Novel wafer angle measuring machine

Abstract

The utility model provides a novel wafer angle measuring machine, which comprises a working table, a ray generator and a detector, the ray generator and the detector are arranged on the working table and are matched for use, a reference platform used for adsorbing a wafer is arranged between the ray generator and the detector, and the reference platform is arranged on a driving part I; the first driving part is in circuit connection with the control device and drives the reference platform to rotate and switch among a feeding position, a sorting position and a measuring position, the first driving part provides high-precision angle coordinates in the scanning and measuring process, and a sorting device used for setting the position of a wafer is arranged on one side of the reference platform. The workbench is provided with a protection device used in cooperation with the arrangement device, and after the reference platform completes feeding, the reference platform rotates to the arrangement position and corresponds to the protection device. According to the utility model, the overall structure is optimized, the detection precision is improved, the feeding operation space is increased through the multi-station rotation switching design, the feeding operation difficulty is reduced, the wafer damage amount is reduced, and the production cost is reduced.

Description

Technical Field

[0001] The utility model relates to a new type of wafer angle measuring machine. Background Art

[0002] In recent years, in the manufacturing process of high-end quartz wafers for crystal oscillators, there has been a trend of transformation from rectangular wafers with a size of less than one inch to wafers in the form of 2-inch to 6-inch wafers. The wafer process shows signs of mass production in 2024. Therefore, there is a market need for equipment for directional angle measurement of quartz wafers.

[0003] However, there is currently no wafer angle measuring machine specifically designed for 2-6 inch quartz wafers. The current situation is that the angle detection of wafers is carried out on existing quartz wafer angle measuring machines for 1-inch and below 1-inch wafers. The existing equipment does not have a sorting device and a protection device, and the loading position and the measuring position are set on the same side, restricting the operation space of operators, making the loading operation difficult, causing operators to easily get fatigued, and easily damaging the wafers due to improper operation. Therefore, the existing technology still needs to be improved and developed. Summary of the Invention

[0004] In view of the deficiencies in the above problems, the utility model provides a new type of wafer angle measuring machine.

[0005] To achieve the above object, the utility model provides a new type of wafer angle measuring machine, which includes a workbench, a ray generator and a detector arranged on the workbench for cooperative use. A reference platform for adsorbing wafers is arranged between the ray generator and the detector. The reference platform is arranged on a driving member 1, and the driving member 1 is electrically connected to a control device and drives the reference platform to rotate and switch between a loading position, a sorting position and a measuring position, and the driving member 1 provides high-precision angle coordinates during the scanning and measurement process. A sorting device for rectifying the position of the wafer is arranged on one side of the reference platform, and a protection device for cooperating with the sorting device is arranged on the workbench. After the reference platform completes loading, the reference platform rotates to the sorting position and corresponds to the protection device.

[0006] Further, the reference platform is connected to the driving member 1 through a connecting disk. A plurality of air pipes are arranged in the connecting disk. One end of each air pipe is connected to the reference platform, and the other end is connected to an external air source. The external air source is electrically connected to the control device.

[0007] Further, a plurality of air nozzles are arranged on the reference platform. Each air pipe is connected to an air nozzle in a one-to-one manner, and an induction device is correspondingly arranged for each air nozzle. The induction device is electrically connected to the control device.

[0008] Furthermore, the connecting plate is arranged above the first driving member and fixedly connected to the rotor of the first driving member. The lower wall surface of the connecting plate is provided with a receiving groove. The rotor of the first driving member has a hollow interior structure and is communicated with the receiving groove. The air pipe passes through the receiving groove and the first driving member and is connected to an external air source.

[0009] Furthermore, the reference platform is fixedly arranged on the upper wall surface of the connecting plate; when the reference platform rotates to the measurement position, both the ray generator and the detector are located on the front side of the wafer.

[0010] Furthermore, the sorting device is arranged on the connecting plate behind the reference platform. The sorting device includes a second driving member, a plurality of groups of adjusting claws and sliders used in cooperation. The second driving member is parallel to the reference platform and electrically connected to the control device. Each slider is slidably arranged above the second driving member; when the sorting device is in the working state, any one group of adjusting claws and sliders is driven by the second driving member to move along the direction parallel to the reference platform, thereby adjusting the position of the wafer.

[0011] Furthermore, the protection device includes a third driving member, a moving seat, and a plurality of soft support bodies. The third driving member is fixedly arranged on the workbench through a fixing frame and is electrically connected to the control device. The moving seat is slidably arranged above the third driving member. The plurality of soft support bodies are arranged on the side wall of the moving seat close to the sorting position; when the reference platform rotates to the sorting position, the moving seat is driven by the third driving member to move along the direction facing the sorting position, so that the soft support bodies are close to the protected wafer.

[0012] Furthermore, the control device includes a plurality of touch screens.

[0013] Furthermore, a protective cover is arranged above the workbench.

[0014] Furthermore, a switchable door is arranged on one side of the protective cover facing the positive direction of the loading station.

[0015] The beneficial effects of the present utility model compared with the prior art are as follows:

[0016] The present utility model optimizes the overall structure, improves the detection accuracy, and the multi-station rotation and switching design increases the operation space for loading, reduces the difficulty of loading operation, reduces the damage amount of wafers, and reduces the production cost;

[0017] The present utility model adopts a multi-airway independent setting, making the reference platform more stable when adsorbing wafers, and cooperating with the induction device, sorting device and protection device in the air nozzle, which can better ensure the safety of wafers during the processes of the loading position, sorting position and measurement position. Description of the Drawings

[0018] Figure 1 is a three-dimensional view of the wafer angle measuring machine (excluding the outer cover) involved in this solution;

[0019] Figure 2 Is a perspective view of the wafer angle measuring machine (including the outer cover) involved in this solution;

[0020] Figure 3 Is a perspective view of the reference platform involved in this solution;

[0021] Figure 4 Is a perspective view of the sorting device involved in this solution;

[0022] Figure 5 Is a perspective view of the connection disk involved in this solution;

[0023] Figure 6 Is Figure 1 The enlarged view at position A in Detailed implementation manners

[0024] As Figure 1 、 Figure 2 shown, a novel wafer angle measuring machine according to an embodiment of the present invention includes a workbench 1, a protective cover 2 is provided above the workbench 1, a door 3 that can be opened and closed is provided on one side of the protective cover 2, four corners of the lower part of the workbench 1 are provided with universal wheels 4, and the universal wheels 4 can be fixed through a braking structure.

[0025] Further, as Figure 1 、 Figure 2 shown, a ray generator 5 and a detector 6 that are used in cooperation are provided on the workbench 1 in this embodiment. A reference platform 7 for adsorbing wafers is provided between the ray generator 5 and the detector 6. The reference platform 7 is arranged on a driving member 1 8, and the driving member 1 8 is electrically connected to the control device and drives the reference platform 7 to rotate and switch between the loading position, the sorting position, and the measuring position, and the driving member 1 8 provides a high-precision angle coordinate during the scanning and measuring process; wherein, the loading position faces the direction of the door 3, which is convenient for the operator to place the wafer on the reference platform without obstacles. A sorting device 9 for adjusting the position of the wafer is provided on one side of the reference platform 7, and a protection device 10 that is used in cooperation with the sorting device 9 is provided on the workbench 1. After the reference platform 7 completes loading, the reference platform 7 rotates to the sorting position and corresponds to the protection device 10. The sorting position is separately arranged from the loading position, which increases the operation space for loading, reduces the operation difficulty of loading, can reduce the damage amount of wafers to a certain extent, and reduces the production cost.

[0026] Further, as Figures 1 to 5As shown in the figure, the reference platform 7 in this embodiment is connected to the first driving member 8 through the connecting plate 11. The connecting plate 11 is arranged above the first driving member 8 and fixedly connected to the rotor of the first driving member 8. The lower wall surface of the connecting plate 11 is provided with a receiving groove 111. The rotor of the first driving member 8 has a hollow internal structure and is communicated with the receiving groove 111. A plurality of air pipes are arranged in the connecting plate 11. One end of each air pipe is connected to the reference platform 7, and the other end passes through the receiving groove 111 and the first driving member 8 and is connected to an external air source. The external air source is electrically connected to the control device. Among them, a plurality of air nozzles 71 are arranged on the reference platform 7. Each air pipe is in one-to-one communication with an air nozzle 71, which can conveniently adjust the air pressure on each air nozzle 71, and also makes the reference platform 7 more stable when adsorbing the wafer. Moreover, each air nozzle 71 is provided with a corresponding sensing device, and the sensing device is electrically connected to the control device. The sensing device feeds back the gas pressure condition on the corresponding air nozzle 71 to the control device, thereby facilitating the judgment of whether the wafer is reliably adsorbed by the reference platform 7.

[0027] Further, as Figures 1 to 5 shown in the figure, the reference platform 7 in this embodiment is fixedly arranged on the upper wall surface of the connecting plate 11. When the reference platform 7 rotates to the measurement position, both the ray generator 5 and the detector 6 are located on the front side of the wafer. The optical path emitted from the ray generator 5 is reflected from the front side of the wafer to the detector 6. Compared with the previous reflection from the adsorption surface of the wafer, the angle detection of wafers of various specifications (circular, square, or other shapes) and sizes can be carried out more widely.

[0028] Further, as Figures 1 to 5 shown in the figure, the sorting device 9 in this embodiment is arranged on the connecting plate 11 behind the reference platform 7. The sorting device 9 includes a second driving member 12, a plurality of groups of adjusting claws 13 and sliders 14 used in cooperation. The second driving member 12 is parallel to the reference platform 7 and electrically connected to the control device. Each slider 14 is slidably arranged above the second driving member 12. When the sorting device 9 is in the working state, any one group of adjusting claws 13 and sliders 14 are driven by the second driving member 12 to move along the direction parallel to the reference platform 7, so that the adjusting claws 13 touch the wafer to adjust its relative position with respect to the reference platform 7.

[0029] Further, as Figures 1 to 6 shown in the figure, the protection device 10 in this embodiment includes a third driving member 15, a moving seat 16, and a plurality of soft support bodies 17. The third driving member 15 is fixedly arranged on the workbench 1 through a fixing frame 18 and is electrically connected to the control device. The moving seat 16 is slidably arranged above the third driving member 15. A plurality of soft support bodies 17 are arranged on the side wall of the moving seat 16 near one end of the sorting position. When the reference platform 7 rotates to the sorting position, the moving seat 16 is driven by the third driving member 15 to move along the direction facing the sorting position, so that the soft support bodies 17 are close to the protected wafer, which can avoid the damage caused by the wafer being toppled due to subsequent position adjustment.

[0030] Furthermore, as Figure 1 shown, the control device in this embodiment includes two touch screens 19 of different sizes. The large touch screen 19 is arranged behind the workbench 1, and its screen faces the positive direction of the loading position. It is used for program setting and parameter adjustment of the structure circuit-connected to the control device, as well as displaying various information results received by the control module in the control device; the small touch screen 19 is arranged directly in front of the workbench 1 and is used for simple measurement operations, facilitating the operator to use.

[0031] When specifically used, for the convenience of understanding the present invention, it will be described in conjunction with the accompanying drawings;

[0032] See Figure 1 . After starting the power supply of the wafer goniometer, the operator places the wafer on the reference platform 7. After the control device receives the signal fed back by the induction device and determines that the wafer is reliably adsorbed, the first driving member 8 drives the reference platform 7 to the sorting position. The control device controls the external air source to adjust the gas pressure on the air nozzle 71, and cooperates with the sorting device 9 and the protection device 10 to complete the wafer adjustment. Then, after the control device receives the signal fed back by the induction device and determines that the sorted wafer is reliably adsorbed, the first driving member 8 drives the reference platform 7 to the measurement position. The first driving member 8 drives the reference platform 7 to complete the measurement scanning action according to the program setting. After the scanning is completed, the first driving member 8 drives the reference platform 7 back to the loading position, and the operator retrieves the wafer.

[0033] The above are only the preferred embodiments of the present invention and are not used to limit the present invention. For those skilled in the art, the present invention can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A novel wafer goniometer, comprising a workbench (1), a ray generator (5) and a detector (6) which are used in cooperation on the workbench (1), and is characterized in that: A reference platform (7) for adsorbing a wafer is provided between the ray generator (5) and the detector (6). The reference platform (7) is arranged on a first driving member (8), and the first driving member (8) is electrically connected to the control device and drives the reference platform (7) to rotate and switch between a loading position, an arranging position, and a measuring position. Moreover, the first driving member (8) provides a high-precision angular coordinate during the scanning measurement process. A sorting device (9) for aligning the position of the wafer is arranged on one side of the reference platform (7), and a protection device (10) cooperating with the sorting device (9) is arranged on the workbench (1). After the reference platform (7) finishes loading, the reference platform (7) rotates to the arranging position and corresponds to the protection device (10).

2. The novel wafer goniometer according to claim 1, characterized in that: The reference platform (7) is connected to the first driving member (8) through a connecting disk (11). Multiple air pipes are arranged inside the connecting disk (11). One end of each air pipe is connected to the reference platform (7), and the other end is connected to an external air source. The external air source is electrically connected to the control device.

3. A novel wafer goniometer according to claim 2, characterized in that: A plurality of air nozzles (71) are arranged on the reference platform (7). Each air pipe is connected to an air nozzle (71) in a one-to-one manner, and an induction device is correspondingly arranged for each air nozzle (71). The induction device is electrically connected to the control device.

4. A novel wafer goniometer according to claim 2 or 3, characterized in that: The connecting disk (11) is arranged above the first driving member (8) and is fixedly connected to the rotor of the first driving member (8). A receiving groove (111) is arranged on the lower wall surface of the connecting disk (11). The rotor of the first driving member (8) has a hollow internal structure and is communicated with the receiving groove (111). The air pipes pass through the receiving groove (111) and the first driving member (8) and are then connected to the external air source.

5. A novel wafer goniometer according to claim 4, characterized in that: The reference platform (7) is fixedly arranged on the upper wall surface of the connecting disk (11). When the reference platform (7) rotates to the measuring position, both the ray generator (5) and the detector (6) are located on the front side of the wafer.

6. The novel wafer goniometer according to claim 5, characterized in that: The sorting device (9) is arranged on the connecting disk (11) behind the reference platform (7). The sorting device (9) includes a second driving member (12), multiple groups of adjusting claws (13) and sliders (14) that cooperate with each other. The second driving member (12) is parallel to the reference platform (7) and is electrically connected to the control device. Each slider (14) is slidably arranged above the second driving member (12). When the sorting device (9) is in a working state, any one group of adjusting claws (13) and sliders (14) are driven by the second driving member (12) to move along a direction parallel to the reference platform (7), thereby adjusting the position of the wafer.

7. A novel wafer goniometer according to claim 1, characterized in that: The protection device (10) includes a third driving member (15), a moving seat (16), and a plurality of soft support bodies (17). The third driving member (15) is fixedly arranged on the workbench (1) through a fixing frame (18) and is electrically connected to the control device. The moving seat (16) is slidably arranged above the third driving member (15). The plurality of soft support bodies (17) are arranged on the side wall of the moving seat (16) close to the arranging position. When the reference platform (7) rotates to the arranging position, the moving seat (16) is driven by the third driving member (15) to move along the direction facing the arranging position, so that the soft support bodies (17) are close to the protected wafer.

8. A novel wafer goniometer according to claim 1, characterized in that: The control device includes a plurality of touch screens (19).

9. A novel wafer goniometer according to claim 1, characterized in that: A protective cover (2) is provided above the workbench (1).

10. A novel wafer angle measuring machine according to claim 9, characterized in that: A door (3) that can be opened and closed is provided on one side of the protective cover (2) facing the positive direction of the loading station.

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