Infrared sensor and detection assembly

Abstract

The utility model discloses an infrared sensor and a detection assembly, and relates to the technical field of semiconductors, the infrared sensor comprises a heat insulation housing, an induction chip, a signal acquisition chip and a conductive support; the heat insulation shell is provided with a cavity and a photosensitive hole communicated with the cavity; the sensing chip is arranged in the cavity, the sensing chip faces the photosensitive hole, and the sensing chip is used for outputting a sensing signal when sensing an infrared signal; the signal acquisition chip is arranged in the cavity and used for being electrically connected to the circuit board, and the signal acquisition chip is used for acquiring an induction signal output by the induction chip and outputting the induction signal to the circuit board; the conductive support is arranged in the cavity and electrically connected with the sensing chip and the signal acquisition chip, and the sensing chip, the conductive support and the signal acquisition chip are arranged in a stacked mode in the first direction. According to the utility model, the heat interference of the circuit board on the sensing chip can be reduced, the influence of heating on the performance of the chip is reduced, the signal fluctuation is reduced, and the infrared detection performance of the infrared sensor is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, and particularly relates to an infrared sensor and a detection component. Background Art

[0002] The existing infrared sensor includes a metal housing, and an induction chip and a signal acquisition chip arranged in the housing. In actual application, the infrared sensor is plugged into the circuit board of the product. Thus, other components on the circuit board generate heat, and the generated heat is conducted to the metal housing of the infrared sensor, and then conducted to the induction chip and the signal acquisition chip through the metal housing. However, the induction chip will generate signal fluctuations under the influence and interference of the heat of the circuit board, and the chip performance will decline, thereby affecting the detection performance of the infrared sensor. Summary of the Utility Model

[0003] The main purpose of the utility model is to provide an infrared sensor and a detection component, aiming to reduce the heat interference of the circuit board on the induction chip, reduce the influence of heat on the chip performance, reduce signal fluctuations, and improve the infrared detection performance of the infrared sensor.

[0004] To achieve the above purpose, the infrared sensor proposed by the utility model includes:

[0005] A heat insulation housing, having a cavity and a photosensitive hole communicated with the cavity;

[0006] An induction chip, arranged in the cavity, the induction chip is arranged towards the photosensitive hole, and the induction chip is used for outputting an induction signal when an infrared signal is sensed;

[0007] A signal acquisition chip, arranged in the cavity, used for being electrically connected to the circuit board, and the signal acquisition chip is used for acquiring the induction signal output by the induction chip and outputting it to the circuit board;

[0008] A conductive bracket, arranged in the cavity, the conductive bracket is electrically connected to the induction chip and the signal acquisition chip respectively, and the induction chip, the conductive bracket and the signal acquisition chip are stacked along a first direction.

[0009] In one embodiment, the conductive bracket has a first end and a second end opposite to each other along the first direction, the first end is electrically connected to the induction chip, and the second end is electrically connected to the signal acquisition chip.

[0010] In one embodiment, the contact surface between the conductive bracket and the induction chip is a plane;

[0011] And / or, the contact surface between the conductive bracket and the signal acquisition chip is a plane.

[0012] In one embodiment, the conductive bracket includes a first conductive part and a second conductive part. The first conductive part and the second conductive part are spaced apart along a second direction. The first conductive part, the induction chip, the second conductive part, and the signal acquisition chip enclose a heat insulation space. The first direction intersects with the second direction.

[0013] In one embodiment, the signal acquisition chip includes a chip body, a first conductive member, and a second conductive member. The first conductive member is disposed on the chip body and faces and is electrically connected to the conductive bracket. The heat insulation housing further has a connection hole communicating with the cavity. The second conductive member is disposed on the chip body and extends out from the connection hole for electrically connecting to a circuit board.

[0014] In one embodiment, the chip body has opposite first and second sides along a third direction. A plurality of the second conductive members are provided. The plurality of second conductive members are respectively disposed on the first side and the second side and are spaced apart along the second direction. A plurality of the connection holes are provided. The plurality of second conductive members extend out from the plurality of connection holes one by one. The first direction, the second direction, and the third direction intersect pairwise.

[0015] In one embodiment, the heat insulation housing includes a heat insulation bottom plate and a housing body connected to and enclosing the heat insulation bottom plate to form the cavity. The heat insulation bottom plate is provided with the connection hole.

[0016] In one embodiment, the heat insulation bottom plate is provided with a limiting groove. The bottom of the chip body is disposed in the limiting groove, and the top of the chip body extends out of the limiting groove. The first conductive member and the second conductive member are respectively disposed on the top of the chip body.

[0017] In one embodiment, the infrared sensor further includes a light filtering member. The light filtering member is disposed at the light sensing hole for filtering light other than infrared light.

[0018] The present utility model further provides a detection assembly, including a circuit board; and / or, the infrared sensor as described above.

[0019] The technical solution of the present utility model is achieved by providing a heat-insulating housing, an induction chip, a signal acquisition chip, and a conductive bracket; the heat-insulating housing has a cavity and a photosensitive hole communicating with the cavity, the induction chip is disposed in the cavity and faces the photosensitive hole, the signal acquisition chip is disposed in the cavity for electrical connection to a circuit board, the conductive bracket is disposed in the cavity and is electrically connected to the induction chip and the signal acquisition chip respectively; in practical applications, the signal acquisition chip collects the induction signal output by the induction chip through the conductive bracket and outputs the collected induction signal to the circuit board to achieve signal transmission, and the induction chip, the conductive bracket, and the signal acquisition chip are stacked along a first direction. It can be understood that the circuit board is located outside the heat-insulating housing, and the induction chip and the circuit board are spaced apart by the heat-insulating housing, the conductive bracket, and the signal acquisition chip. The heat conducted from the circuit board to the induction chip is isolated by the heat-insulating housing, the conductive bracket, and the signal acquisition chip, thereby reducing the interference effect of the heat generated by the circuit board on the induction chip, avoiding the induction chip from being heated for a long time, reducing signal fluctuations, and improving the infrared detection performance of the infrared sensor. In addition, the structure of the present utility model is simple, convenient for installation, and can test the induction chip and the signal acquisition chip to determine whether the chips are normal before reassembly, thereby improving the production yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The accompanying drawings are incorporated herein and form a part of this specification, showing embodiments consistent with the present utility model and, together with the specification, are used to explain the principles of the present utility model.

[0021] To more clearly illustrate the technical solutions in the embodiments of the present utility model or in the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, for those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0022] Figure 1 is a schematic structural diagram of the infrared sensor provided by the present utility model;

[0023] Figure 2 is Figure 1 the front view of

[0024] Figure 3 is Figure 1 the rear view of

[0025] Figure 4 is Figure 1 the partial view of

[0026] Figure 5 is Figure 1 the exploded view of

[0027] Explanation of the reference numerals in the drawings:

[0028] 100, Infrared sensor; 1, Heat-insulating housing; 11, Heat-insulating bottom plate; 111, Light-sensing hole; 112, Connection hole; 113, Limit groove; 12, Housing body; 13, Cavity; 2, Induction chip; 3, Signal acquisition chip; 31, Chip body; 311, First side; 312, Second side; 32, First conductive part; 33, Second conductive part; 4, Conductive bracket; 41, First end; 42, Second end; 43, First conductive portion; 44, Second conductive portion; 5, Heat-insulating space; 6, Light-filtering element.

[0029] The realization, functional features and advantages of the present utility model will be further described with reference to the embodiments and the accompanying drawings. Detailed implementation manners

[0030] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0031] Existing infrared sensors include a metal housing and an induction chip and a signal acquisition chip disposed in the housing. In actual applications, the infrared sensor is plugged into the circuit board of the product. Thus, other components on the circuit board generate heat, and the generated heat is conducted to the metal housing of the infrared sensor, and then conducted to the induction chip and the signal acquisition chip through the metal housing. The induction chip will generate signal fluctuations under the influence and interference of the heat of the circuit board, and the chip performance will decline, thereby affecting the detection performance of the infrared sensor.

[0032] Therefore, the present utility model provides an infrared sensor 100, aiming to reduce the heat interference of the circuit board on the induction chip 2, reduce the influence of heat on the chip performance, reduce signal fluctuations, and improve the infrared detection performance of the infrared sensor 100.

[0033] Refer to Figures 1 to 5 , in an embodiment of the present utility model, the infrared sensor 100 includes:

[0034] A heat-insulating housing 1 having a cavity 13 and a light-sensing hole 111 communicating with the cavity 13;

[0035] An induction chip 2 disposed in the cavity 13, the induction chip 2 facing the light-sensing hole 111, and the induction chip 2 is configured to output an induction signal when an infrared signal is sensed;

[0036] The signal acquisition chip 3 is disposed within the cavity 13 and is used to be electrically connected to the circuit board. The signal acquisition chip 3 is used to acquire the induction signal output by the induction chip 2 and output it to the circuit board;

[0037] The conductive bracket 4 is disposed within the cavity 13. The conductive bracket 4 is electrically connected to the induction chip 2 and the signal acquisition chip 3 respectively. The induction chip 2, the conductive bracket 4, and the signal acquisition chip 3 are stacked along the first direction.

[0038] In this embodiment, the shape and size of the heat-insulating housing 1 can be set according to the installation requirements of the induction chip 2, the signal acquisition chip 3, and the conductive bracket 4. The heat-insulating housing 1 is of a cylindrical structure. The heat-insulating housing 1 has a cavity 13 and a photosensitive hole 111 communicating with the cavity 13. The photosensitive hole 111 is provided at the top of the heat-insulating housing 1. The material of the heat-insulating housing 1 is a heat-insulating material. The heat generated by the circuit board is isolated outside the heat-insulating housing 1 as much as possible through the heat-insulating housing 1, reducing the influence of heat on the electrical components within the heat-insulating housing 1.

[0039] The induction chip 2 is a ceramic induction chip. The ceramic induction chip is disposed within the cavity 13 and is arranged facing the photosensitive hole 111. In this way, the visible light and infrared signals in the external environment can be irradiated onto the ceramic induction chip 2 through the photosensitive hole 111. The ceramic induction chip 2 generates an induction signal and outputs it to the signal acquisition chip 3.

[0040] The signal acquisition chip 3 can be implemented by using an SOP8 chip. The SOP8 chip has characteristics such as small volume, low power consumption, excellent performance, and easy integration. It can reduce the volume of the infrared sensor 100 and lower its power consumption. The SOP8 chip is installed within the cavity 13 to reduce the influence of factors in the external environment on it and extend the service life of the SOP8 chip. The input end of the signal acquisition chip 3 is electrically connected to the output end of the induction chip 2. The output end of the signal acquisition chip 3 is used to be electrically connected to the circuit board of the product. That is, the output end of the signal acquisition chip 3 can be electrically connected to the circuit board, enabling the signal acquisition chip 3 to acquire the induction signal output by the induction chip 2 and output the acquired induction signal to the circuit board to achieve signal transmission.

[0041] The conductive support 4 is disposed in the cavity 13. The conductive support 4 is electrically connected to the induction chip 2 and the signal acquisition chip 3 respectively. That is, the conductive support 4 serves as an electrical connection medium between the induction chip 2 and the signal acquisition chip 3, which can effectively shorten the length of the electrical connection line between the induction chip 2 and the signal acquisition chip 3 and reduce the volume of the infrared sensor 100. Moreover, the induction chip 2, the conductive support 4, and the signal acquisition chip 3 are stacked along the first direction, and the first direction is the height direction of the signal acquisition chip 3. The heat conducted from the circuit board to the induction chip 2 is isolated by the heat insulation housing 1, the signal acquisition chip 3, and the conductive support 4 in sequence, thereby reducing the interference effect of the heat generated by the circuit board on the induction chip 2, avoiding the long-term heating of the induction chip 2, reducing the influence of heating on the chip performance, reducing the signal fluctuation of the induction chip 2, ensuring that the induction chip 2 can normally sense the infrared signal, and improving the infrared detection performance of the infrared sensor 100.

[0042] The technical solution of the present utility model is to provide a heat insulation housing 1, an induction chip 2, a signal acquisition chip 3, and a conductive support 4. The heat insulation housing 1 has a cavity 13 and a photosensitive hole 111 communicating with the cavity 13. The induction chip 2 is disposed in the cavity 13 and faces the photosensitive hole 111. The signal acquisition chip 3 is disposed in the cavity 13 and is used for electrical connection to the circuit board. The conductive support 4 is disposed in the cavity 13 and is electrically connected to the induction chip 2 and the signal acquisition chip 3 respectively. In actual application, the signal acquisition chip 3 acquires the induction signal output by the induction chip 2 through the conductive support 4 and outputs the acquired induction signal to the circuit board to achieve signal transmission. Moreover, the induction chip 2, the conductive support 4, and the signal acquisition chip 3 are stacked along the first direction. It can be understood that the circuit board is located outside the heat insulation housing 1, and the induction chip 2 and the circuit board are spaced apart from each other by the heat insulation housing 1, the conductive support 4, and the signal acquisition chip 3. The heat conducted from the circuit board to the induction chip 2 is isolated by the heat insulation housing 1, the conductive support 4, and the signal acquisition chip 3, thereby reducing the interference effect of the heat generated by the circuit board on the induction chip 2, avoiding the long-term heating of the induction chip 2, reducing signal fluctuation, and improving the infrared detection performance of the infrared sensor 100. In addition, the structure of the present utility model is simple, convenient for installation, and can test the induction chip 2 and the signal acquisition chip 3 to determine whether the chips are normal and then assemble them, thereby improving the production yield.

[0043] Refer to Figure 4 In an embodiment of the present utility model, the conductive support 4 has opposite first end 41 and second end 42 along the first direction. The first end 41 is electrically connected to the induction chip 2, and the second end 42 is electrically connected to the signal acquisition chip 3.

[0044] In this embodiment, the conductive bracket 4 has opposite first end 41 and second end 42 along the first direction, and the first direction is the height direction of the signal acquisition chip 3. The first end 41 faces and is electrically connected to the induction chip 2, and the second end 42 faces and is electrically connected to the signal acquisition chip 3, thus completing the electrical connection between the conductive bracket 4, the induction chip 2 and the signal acquisition chip 3, which is convenient and fast.

[0045] Optionally, the electrical connection manner between the first end 41 and the induction chip 2 is generally not limited. For example, the first end 41 is provided with a first copper sheet, and the induction chip 2 is provided with a second copper sheet. When the first copper sheet contacts the second copper sheet, the electrical connection between the first end 41 and the induction chip 2 can be realized. It can be inferred from this that the electrical connection manner between the second end 42 and the signal acquisition chip 3 is similar, and will not be repeated here.

[0046] Refer to Figure 4 , in an embodiment of the present utility model, the contact surface between the conductive bracket 4 and the induction chip 2 is a plane;

[0047] And / or, the contact surface between the conductive bracket 4 and the signal acquisition chip 3 is a plane.

[0048] In this embodiment, the contact surface between the conductive bracket 4 and the induction chip 2 is a plane, and the plane can increase the contact area between the conductive bracket 4 and the induction chip 2, improving the installation stability of the induction chip 2. Similarly, in another embodiment, the contact surface between the conductive bracket 4 and the signal acquisition chip 3 is a plane, which can further enhance the installation stability of the induction chip 2.

[0049] There are many implementation forms of the conductive bracket 4. Refer to Figure 4 , in an embodiment of the present utility model, the conductive bracket 4 includes a first conductive part 43 and a second conductive part 44. The first conductive part 43 and the second conductive part 44 are arranged at intervals along the second direction. The first conductive part 43, the induction chip 2, the second conductive part 44 and the signal acquisition chip 3 enclose a heat insulation space 5, and the first direction intersects with the second direction.

[0050] In this embodiment, the conductive support 4 includes a first conductive part 43 and a second conductive part 44. The first conductive part 43 and the second conductive part 44 are arranged at intervals on the signal acquisition chip 3 along the second direction, and the second direction is the length direction of the signal acquisition chip 3. The two opposite ends of the first conductive part 43 along the first direction are respectively electrically connected to the induction chip 2 and the signal acquisition chip 3, and the two opposite ends of the second conductive part 44 along the first direction are also respectively electrically connected to the induction chip 2 and the signal acquisition chip 3. That is to say, the first conductive part 43 and the second conductive part 44 are arranged in parallel along the first direction. The first conductive part 43, the induction chip 2, the second conductive part 44 and the signal acquisition chip 3 are sequentially connected to enclose a heat insulation space 5. In this way, the heat conducted by the circuit board to the signal acquisition chip 3 can be conducted to the heat insulation housing 1 through the heat insulation space 5, and then conducted to the external environment through the heat insulation housing 1, avoiding direct conduction of heat to the induction chip 2 and reducing the influence of heat on the induction chip 2.

[0051] Referring to Figure 5 , in an embodiment of the present utility model, the signal acquisition chip 3 includes a chip body 31, a first conductive member 32 and a second conductive member 33. The first conductive member 32 is arranged on the chip body 31, and the first conductive member 32 faces and is electrically connected to the conductive support 4; the heat insulation housing 1 further has a connection hole 112 communicated with the cavity 13. The second conductive member 33 is arranged on the chip body 31 and extends out from the connection hole 112 for electrically connecting to the circuit board.

[0052] It can be understood that the existing infrared sensors are generally through-hole sensors. When assembling through-hole sensors, manual insertion is required, and the through-hole sensors are installed on the circuit board by soldering. After soldering, the redundant pins are manually cut off. This assembly method is complex and inconvenient to operate.

[0053] In view of the above situation, in this embodiment, the signal acquisition chip 3 includes a chip body 31, a first conductive member 32, and a second conductive member 33. Among them, the chip body 31 is installed in the cavity 13 to reduce the influence of factors in the external environment on it and extend the service life of the chip body 31. The first conductive member 32 can be implemented by a pad. One end of the pad is fixedly connected and electrically connected to the chip body 31, and the other end of the pad faces and is electrically connected to the conductive bracket 4, that is, the pad electrically connects the chip body 31 and the conductive bracket 4. The second conductive member 33 can be implemented by a pin. One end of the pin is fixedly connected and electrically connected to the chip body 31, and the other end of the pin extends out of the heat insulation housing 1 through the connection hole 112. Then, in practical applications, the pin can be directly electrically connected to the circuit board of the product outside the heat insulation housing 11, so as to realize the connection between the signal acquisition chip 3 and the circuit board, enabling the chip body 31 to collect the induction signal output by the induction chip 2 and output the collected induction signal to the circuit board, thereby realizing the transmission of the signal. Through the above connection method, the structure of the infrared sensor 100 can be simplified and the assembly is facilitated.

[0054] To ensure the stability of signal transmission, referring to Figure 5 , in an embodiment of the present utility model, the chip body 31 has opposite first side 311 and second side 312 along a third direction; a plurality of the second conductive members 33 are provided, and the plurality of the second conductive members 33 are respectively arranged on the first side 311 and the second side 312 and are spaced apart along a second direction; a plurality of the connection holes 112 are provided, and the plurality of the second conductive members 33 extend out of the plurality of the connection holes 112 one by one, and the first direction, the second direction, and the third direction intersect pairwise.

[0055] In this embodiment, the chip body 31 has opposite first side 311 and second side 312 along a third direction, and the third direction is the width direction of the signal acquisition chip 3. A plurality of the second conductive members 33 are provided, and the plurality of the second conductive members 33 are respectively arranged on the first side 311 and the second side 312 and are spaced apart along a second direction, and the second direction is the length direction of the signal acquisition chip 3. Specifically, referring to Figure 1, there are eight second conductive members 33, four of which are disposed on the first side 311 and are spaced along the second direction on the first side 311, and the other four second conductive members 33 are disposed on the second side 312 and are also spaced along the second direction on the second side 312. Correspondingly, there are eight connection holes 112, and the positions of the eight connection holes 112 are correspondingly set with the positions of the eight second conductive members 33. The eight second conductive members 33 extend out of the eight connection holes 112 one by one for electrical connection with the circuit board. Through the above settings, even if one or two second conductive members 33 are damaged or the connection is unstable, the other normal second conductive members 33 can maintain the connection between the infrared sensor 100 and the circuit board, thereby ensuring the normal transmission of signals.

[0056] There are also many implementation forms of the heat insulation housing 1. Refer to Figure 5 , in an embodiment of the present invention, the heat insulation housing 1 includes a heat insulation bottom plate 11 and a housing body 12 connected to the heat insulation bottom plate 11 to enclose the cavity 13, and the heat insulation bottom plate 11 is provided with the connection holes 112.

[0057] In this embodiment, by setting the heat insulation housing 1 into a split structure of the heat insulation bottom plate 11 and the housing body 12, it is convenient to arrange the induction chip 2, the signal acquisition chip 3 and the conductive bracket 4 in the heat insulation housing 1, improving the assembly convenience of the infrared sensor 100; moreover, by opening the connection holes 112 on the heat insulation bottom plate 11, when the heat insulation bottom plate 11 is placed on the circuit board, the second conductive member 33 can be directly electrically connected to the circuit board through the connection holes 112, improving the connection convenience of the two, and at the same time shortening the connection distance between the second conductive member 33 and the circuit board, so that the second conductive member 33 can be designed smaller, reducing the volume of the infrared sensor 100. Optionally, the connection between the heat insulation bottom plate 11 and the housing body 12 can be a fixed connection, such as welding, etc., or a detachable connection, such as magnetic attraction connection, plug connection, snap connection, etc. If the heat insulation bottom plate 11 and the housing body 12 are fixedly connected, the fixed method can improve the structural stability of the heat insulation housing 1; if the heat insulation bottom plate 11 and the housing body 12 are detachably connected, when at least one of the induction chip 2, the signal acquisition chip 3, and the conductive bracket 4 is damaged, the heat insulation housing 1 can be disassembled to realize the repair or replacement of the damaged component, improving the repair or replacement convenience.

[0058] According to the above content, to strengthen the installation of the chip body 31, refer to Figure 5 , in an embodiment of the present invention, the heat insulation bottom plate 11 is provided with a limiting groove 113, the bottom of the chip body 31 is disposed in the limiting groove 113, the top of the chip body 31 extends out of the limiting groove 113, and the first conductive member 32 and the second conductive member 33 are respectively disposed on the top of the chip body 31.

[0059] In this embodiment, a limiting groove 113 is provided on one side of the heat-insulating bottom plate 11 located inside the cavity 13. The bottom of the chip body 31 is adaptively installed in the limiting groove 113 to fix the chip body 31. The top of the chip body 31 extends out of the limiting groove 113, facilitating the arrangement of the first conductive member 32 and the second conductive member 33. Among them, the first conductive member 32 is arranged on the top surface of the top of the chip body 31, facilitating electrical connection to the induction chip 2; the second conductive member 33 is arranged on the side surface of the top of the chip body 31, which can shorten the height distance between the second conductive member 33 and the connection hole 112, reducing the length and volume of the second conductive member 33.

[0060] Refer to Figure 5 , in an embodiment of the present invention, the infrared sensor 100 further includes a light filtering member 6, and the light filtering member 6 is arranged at the light sensing hole 111 for filtering light other than infrared light.

[0061] In this embodiment, the light filtering member 6 can be implemented by a light filtering film, and the light filtering film is installed at the light sensing hole 111. The light filtering film is used to filter light other than infrared light, so that the induction chip 2 can quickly and accurately sense the infrared signal and output an induction signal to the signal acquisition chip 3, which is output to the circuit board by the signal acquisition chip 3, thereby improving the efficiency of signal transmission.

[0062] The present invention also proposes a detection assembly, which includes a circuit board; and / or, an infrared sensor 100. The specific structure of the infrared sensor 100 refers to the above embodiment. Since this detection assembly adopts all the technical solutions of the above embodiments, it at least has all the beneficial effects brought by the technical solutions of the above embodiments, and will not be elaborated here one by one.

[0063] The above are only the preferred embodiments of the present invention, and do not limit the patent scope of the present invention. Any equivalent structural transformation made under the inventive concept of the present invention by using the content of the specification and drawings of the present invention, or directly / indirectly applied in other related technical fields, is included in the patent protection scope of the present invention.

Claims

1. An infrared sensor, characterized in that, Comprising: A heat-insulating housing having a cavity and a photosensitive hole communicating with the cavity; An induction chip disposed in the cavity, the induction chip facing the photosensitive hole, and the induction chip being configured to output an induction signal when an infrared signal is sensed; A signal acquisition chip disposed in the cavity, configured to be electrically connected to a circuit board, and the signal acquisition chip is configured to acquire the induction signal output by the induction chip and output it to the circuit board; A conductive bracket disposed in the cavity, the conductive bracket being electrically connected to the induction chip and the signal acquisition chip respectively, and the induction chip, the conductive bracket, and the signal acquisition chip are stacked in a first direction.

2. The infrared sensor according to claim 1, characterized in that The conductive bracket has a first end and a second end opposite to each other in the first direction, the first end is electrically connected to the induction chip, and the second end is electrically connected to the signal acquisition chip.

3. The infrared sensor according to claim 1, characterized in that, The contact surface of the conductive bracket with the induction chip is a plane; And / or, the contact surface of the conductive bracket with the signal acquisition chip is a plane.

4. The infrared sensor according to claim 1, wherein The conductive bracket includes a first conductive part and a second conductive part, the first conductive part and the second conductive part are spaced apart in a second direction, and the first conductive part, the induction chip, the second conductive part, and the signal acquisition chip enclose a heat-insulating space, and the first direction intersects with the second direction.

5. The infrared sensor according to claim 1, wherein The signal acquisition chip includes a chip body, a first conductive member, and a second conductive member, the first conductive member is disposed on the chip body, and the first conductive member faces and is electrically connected to the conductive bracket; the heat-insulating housing further has a connection hole communicating with the cavity, and the second conductive member is disposed on the chip body and extends out of the connection hole for electrically connecting to the circuit board.

6. The infrared sensor according to claim 5, wherein, The chip body has a first side and a second side opposite to each other in a third direction; there are a plurality of the second conductive members, and the plurality of second conductive members are respectively disposed on the first side and the second side and are spaced apart in the second direction; there are a plurality of the connection holes, and the plurality of second conductive members extend out of the plurality of connection holes one by one, and the first direction, the second direction, and the third direction intersect pairwise.

7. The infrared sensor according to claim 5, wherein The heat-insulating housing includes a heat-insulating bottom plate and a housing body connected to the heat-insulating bottom plate to enclose the cavity, and the heat-insulating bottom plate is provided with the connection hole.

8. The infrared sensor according to claim 7, wherein, The heat-insulating bottom plate is provided with a limiting groove, the bottom of the chip body is disposed in the limiting groove, the top of the chip body extends out of the limiting groove, and the first conductive member and the second conductive member are respectively disposed on the top of the chip body.

9. The infrared sensor according to claim 1, characterized in that, The infrared sensor further includes a light filtering member, the light filtering member is disposed in the photosensitive hole for filtering light other than infrared light.

10. A detection component, characterized in that, Including a circuit board; and / or, the infrared sensor according to any one of claims 1 to 9.

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