Liquid cooling radiator
By optimizing the liquid supply assembly and fin module design of the liquid-cooled radiator, a closed liquid-cooled chamber is formed, which solves the problem of insufficient heat dissipation uniformity and stability of the liquid-cooled radiator, and achieves efficient cooling and temperature control, improving the operating stability and life of the equipment.
Patent Information
- Application Number
- CN202422364722.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-27
- Publication Date
- 2025-08-01
- Estimated Expiration
- 2034-09-27
AI Technical Summary
The existing liquid-cooled radiators have problems of insufficient uniformity and stability during the heat dissipation process, resulting in low heat dissipation efficiency and a risk of leakage.
The liquid supply assembly including the first pipe, the second pipe and the high-efficiency liquid supply pump is adopted, and combined with the fin module and the heat dissipation fan, a closed liquid-cooled cavity is formed, the liquid flow path is optimized, and the heat transfer plate and the connecting cover are tightly combined to ensure smooth circulation and stable connection of the coolant.
It realizes efficient circulation and smoothness of the coolant, improves heat dissipation efficiency, reduces energy consumption, ensures the reliability and safety of the system, and can maintain stable control of the heat source temperature under high-intensity working conditions, extending the service life of the equipment.
Smart Images
Figure CN223180632U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of heat dissipation, in particular to a liquid cooling radiator. Background Art
[0002] As an efficient computer hardware heat dissipation solution, the core principle of a liquid cooling radiator is to utilize the high specific heat capacity of water to effectively absorb and carry away the heat generated by high heat density electronic components such as CPUs and GPUs during operation. Compared with the traditional air cooling method, the liquid cooling radiator can provide more stable and efficient heat dissipation performance, especially suitable for scenarios of high-performance computing, gaming entertainment, and long-term high-load operation. During the working process, driven by a water pump, the high-temperature coolant flows through the cold plate, exchanges heat with the air through the fins on the cold plate, releases the heat, and is carried away by the air flow accelerated by the fan. Finally, the cooled coolant returns to the cold head again to complete a cycle. This process continues, effectively maintaining the stable operating temperature of computer hardware. In the process of using existing radiators, due to structural design reasons, it is easy to have insufficient uniformity and stability during heat dissipation. Therefore, new improvements need to be made to the existing radiator structure. Summary of the Utility Model
[0003] To solve the above problems, the utility model ensures the smooth circulation of the coolant in the system through the first pipeline, the second pipeline, and an efficient liquid supply pump, and realizes a liquid cooling radiator that can quickly transfer and dissipate heat.
[0004] The technical solution adopted by the utility model is: a liquid cooling radiator, including a heat exchange module, a liquid supply component, and a heat source connection component; the liquid supply component is provided with a first pipeline, a second pipeline, and a liquid supply pump, the first pipeline is connected to the heat exchange module and the heat source connection component through the liquid supply pump, and the second pipeline is used to connect the heat exchange module and the heat source connection component; the heat source connection component includes a heat transfer plate and a connection cover, one side of the connection cover is buckled on the heat transfer plate to form a liquid cooling cavity, the end of the heat transfer plate facing the liquid cooling cavity is provided with heat dissipation fins, the connection cover is provided with a first interface and a second interface, the first interface is used to connect the first pipeline, and the second interface is used to connect the second pipeline for the liquid to flow in the liquid cooling cavity.
[0005] A further improvement to the above solution is that the heat exchange module includes a fin module and a cooling fan, a liquid flow channel is arranged in the fin module, both ends of the liquid flow channel are respectively connected to the first pipeline and the second pipeline for liquid cooling, and the cooling fan is used to dissipate heat from the fin module.
[0006] A further improvement to the above solution is that the fin module includes a fin frame, flow flat tubes, and fin elements. A plurality of the flow flat tubes are provided, and the plurality of flow flat tubes are arranged on the fin frame. The fin elements are arranged between two adjacent flow flat tubes. The cooling fan is arranged at one end of the fin frame to dissipate heat from the flow flat tubes and the fin elements.
[0007] A further improvement to the above solution is that the fin frame is provided with a liquid inlet cavity, a return cavity, and a liquid outlet cavity. The liquid inlet cavity and the liquid outlet cavity are connected to the return cavity through the flow flat tubes to form a liquid flow channel.
[0008] A further improvement to the above solution is that one end of the liquid supply pump is connected to the first interface through the first pipeline and the other end is connected to the liquid outlet cavity. The liquid inlet cavity is connected to the second interface through the second pipeline.
[0009] A further improvement to the above solution is that the liquid supply pump includes an upper cover, a pump body, and a lower cover. The pump body is used to connect the first pipeline, and the upper cover and the lower cover are respectively connected to the upper and lower sides of the pump body.
[0010] A further improvement to the above solution is that the heat source connection assembly is provided with a cold and hot medium and a TEC module. Connection elements are arranged on both sides of the connection cover. The connection cover is connected to the cold and hot medium through the connection elements. One side of the TEC module is connected to the heat transfer plate and the other side is connected to the cold and hot medium.
[0011] A further improvement to the above solution is that a sealing platform is arranged on the outer periphery of the liquid cooling cavity of the heat transfer plate. The connection cover is provided with a sealing groove, and a sealing ring is arranged in the sealing groove. The sealing ring cooperates with the sealing platform to seal the liquid cooling cavity.
[0012] A further improvement to the above solution is that a sealing member is arranged in the liquid cooling cavity. The sealing member covers the surfaces and both sides of the heat dissipation fins to form a flow groove on the heat dissipation fins. The first interface and the second interface are respectively connected to both sides of the flow groove.
[0013] A further improvement to the above solution is that a plurality of the heat dissipation fins are provided, and a flow groove is arranged between the plurality of heat dissipation fins. The flow groove is used for the liquid to pass through to take away the heat.
[0014] The beneficial effects of the present utility model are:
[0015] Compared with the existing liquid-cooled radiators, the liquid supply assembly of the present utility model includes a first pipe, a second pipe and an efficient liquid supply pump, ensuring the smooth circulation of the coolant within the system and realizing the rapid transfer and dissipation of heat. This design not only improves the heat dissipation efficiency but also reduces energy consumption because the optimized liquid flow path can carry away the heat generated by the heat source faster. The close combination of the heat transfer plate and the connection cover forms a closed liquid-cooled cavity, providing a stable environment for the efficient transfer of heat. The heat dissipation fins arranged on the heat transfer plate further increase the heat exchange area and effectively enhance the heat dissipation capacity, enabling the stable control of the heat source temperature even under high-intensity working conditions. The design of the first interface and the second interface on the connection cover makes the connection of the first pipe and the second pipe both convenient and firm, ensuring the smooth circulation of the coolant within the liquid-cooled cavity, avoiding the risk of leakage, and improving the overall reliability and safety of the system. Through the efficient heat conduction mechanism, optimized liquid circulation path and stable system connection design, the present utility model realizes the efficient cooling and temperature control of the heat source, provides an ideal heat dissipation solution for various high-performance devices, and significantly improves the operation stability and service life of the devices. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 is a three-dimensional schematic diagram of the liquid-cooled radiator of the present utility model;
[0017] Figure 2 is Figure 1 a three-dimensional schematic diagram of the liquid-cooled radiator from another perspective in
[0018] Figure 3 is Figure 1 an exploded schematic diagram of the liquid-cooled radiator in
[0019] Figure 4 is Figure 1 an internal structural schematic diagram of the heat exchange module of the liquid-cooled radiator in
[0020] Figure 5 is Figure 1 an exploded schematic diagram of the heat source connection assembly of the liquid-cooled radiator in
[0021] Figure 6 is Figure 1 an exploded schematic diagram of the heat source connection assembly of the liquid-cooled radiator from another perspective in
[0022] Description of the reference numerals in the drawings: heat exchange module 1, fin module 11, fin frame 111, liquid inlet cavity 1111, return cavity 1112, liquid outlet cavity 1113, flow flat tube 112, fin element 113, cooling fan 12, liquid supply assembly 2, first pipe 21, second pipe 22, liquid supply pump 23, upper cover 231, pump body 232, lower cover 233, heat source connection assembly 3, heat transfer plate 31, heat dissipation fins 311, flow groove 3111, sealing platform 312, connection cover 32, first interface 321, second interface 322, connection element 323, sealing groove 324, cold and hot medium 33, liquid cooling cavity 34, seal 341. Detailed implementation manners
[0023] To facilitate the understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings. The preferred embodiments of the present invention are shown in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the understanding of the disclosure of the present invention more thorough and comprehensive.
[0024] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time.
[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which the present invention belongs. The terms used in the description of the present invention in this specification are only for the purpose of describing specific embodiments and are not intended to limit the present invention. As Figures 1 to 6As shown, in one embodiment of the present invention, a liquid-cooled radiator is provided, comprising a heat exchange module 1, a liquid supply component 2 and a heat source connection component 3; the liquid supply component 2 is provided with a first pipe 21, a second pipe 22 and a liquid supply pump 23, the first pipe 21 is connected to the heat exchange module 1 and the heat source connection component 3 through the liquid supply pump 23, and the second pipe 22 is used to connect the heat exchange module 1 to the heat source connection component 3; the heat source connection component 3 comprises a heat transfer plate 31 and a connecting cover 32, one side of the connecting cover 32 is buckled on the heat transfer plate 31 to form a liquid cooling cavity 34, and the end of the heat transfer plate 31 facing the liquid cooling cavity 34 is provided with a heat dissipation fin 311, and the connecting cover 32 is provided with a first interface 321 and a second interface 322, the first interface 321 is used to connect the first pipe 21, and the second interface 322 is used to connect the second pipe 22, so that liquid flows in the liquid cooling cavity 34. The liquid supply assembly 2 of this embodiment includes a first pipe 21, a second pipe 22 and an efficient liquid supply pump 23, which ensures the smooth circulation of the coolant in the system and realizes the rapid transfer and dissipation of heat. This design not only improves the heat dissipation efficiency, but also reduces energy consumption, because the optimized liquid flow path can more quickly carry away the heat generated by the heat source. The close combination of the heat transfer plate 31 and the connecting cover 32 forms a closed liquid cooling chamber 34, which provides a stable environment for the efficient transfer of heat. The heat dissipation fins 311 arranged on the heat transfer plate 31 further increase the heat exchange area, effectively improving the heat dissipation capacity, so that even under high-intensity working conditions, the temperature of the heat source can be kept stably controlled. The design of the first interface 321 and the second interface 322 on the connecting cover 32 makes the connection between the first pipe 21 and the second pipe 22 both convenient and stable, ensuring the smooth circulation of the coolant in the liquid cooling chamber 34, avoiding the risk of leakage, and improving the overall reliability and safety of the system. This embodiment achieves efficient cooling and temperature control of the heat source through an efficient heat conduction mechanism, an optimized liquid circulation path, and a stable system connection design, providing an ideal heat dissipation solution for various high-performance devices and significantly improving the operating stability and service life of the equipment.
[0026] The heat exchange module 1 includes a fin module 11 and a cooling fan 12. A liquid flow channel is provided inside the fin module 11. The two ends of the liquid flow channel are respectively connected to a first pipe 21 and a second pipe 22 for liquid cooling. The cooling fan 12 is used to dissipate heat from the fin module 11. In this embodiment, the liquid flow channel carefully designed inside the fin module 11 ensures the efficient circulation of the coolant. The coolant is input through the first pipe 21 and discharged through the second pipe 22. This process effectively utilizes the high specific heat capacity of the liquid to achieve the efficient absorption and transfer of heat from the heat source. At the same time, the equipped cooling fan 12 conducts directional air cooling on the fin module 11, further accelerating the dissipation of heat, forming a dual heat dissipation mechanism of liquid cooling and air cooling. This structural design not only greatly improves the heat dissipation rate but also optimizes the utilization of the heat dissipation space, ensuring the stability and reliability of the system under high-load operation.
[0027] Refer to Figure 4As shown in the figure, the fin module 11 includes a fin frame 111, a flow flat tube 112, and fin elements 113. A plurality of the flow flat tubes 112 are provided, and the plurality of flow flat tubes 112 are arranged on the fin frame 111. The fin elements 113 are arranged between two adjacent flow flat tubes 112. The cooling fan 12 is arranged at one end of the fin frame 111 to dissipate heat from the flow flat tubes 112 and the fin elements 113. Specifically, the fin frame 111 is provided with a liquid inlet cavity 1111, a return cavity 1112, and a liquid outlet cavity 1113. The liquid inlet cavity 1111 and the liquid outlet cavity 1113 are connected to the return cavity 1112 through the flow flat tubes 112 to form a liquid flow channel. One end of the liquid supply pump 23 is connected to the first interface 321 through the first pipe 21, and the other end is connected to the liquid outlet cavity 1113. The liquid inlet cavity 1111 is connected to the second interface 322 through the second pipe 22. In this embodiment, through the designed fin frame 111, the liquid inlet cavity 1111, the return cavity 1112, and the liquid outlet cavity 1113 are integrated, and an efficient liquid flow channel constructed by a plurality of flow flat tubes 112 effectively promotes the circulation of the coolant inside the radiator. The fin elements 113 are ingeniously arranged between adjacent flat tubes, greatly increasing the heat exchange area, enabling heat to be quickly transferred from the heat source to the coolant. The strategic arrangement of the cooling fan 12 further accelerates the air convection on the surfaces of the fin module 11 and the flow flat tubes 112, strengthens the heat exchange process, and ensures that heat is taken away in time and dissipated into the surrounding environment. The precise connection of the liquid supply pump 23 with the first and second interfaces 322 not only simplifies the installation process but also ensures the stable supply and return of the coolant in the system, maintaining the continuous and efficient operation of the cooling system. In summary, the application of the fin module 11 design in the liquid-cooled radiator achieves efficient heat dissipation and optimized thermal management, providing a solid guarantee for the stable operation of high-performance electronic devices. In different embodiments, reversing the flow of the liquid inlet cavity 1111 and the liquid outlet cavity 1113 can also achieve the same technical effect without affecting the operation of heat exchange.
[0028] The liquid supply pump 23 includes an upper cover 231, a pump body 232, and a lower cover 233. The pump body 232 is used to connect the first pipe 21. The upper cover 231 and the lower cover 233 are respectively connected to the upper and lower sides of the pump body 232. In this embodiment, the combined structure of the upper cover 231, the pump body 232, and the lower cover 233 not only enhances the overall stability and sealing performance of the pump body 232 but also optimizes the hydrodynamic performance. Specifically, the pump body 232 is precisely designed to be connected to the first pipe 21, ensuring the efficient and stable transmission of the coolant, effectively reducing the energy loss and the risk of fluid leakage. The upper cover 231 and the lower cover 233 are respectively fastened to the upper and lower sides of the pump body 232 to form a closed environment, preventing external impurities from invading, and at the same time reducing the vibration and noise during the operation of the pump body 232, improving the reliability and service life of the system.
[0029] Referring to Figures 5 to 6 As shown, the heat source connection component 3 is provided with a cold and hot medium 33 and a TEC module 35. Connecting elements 323 are provided on both sides of the connecting cover 32. The connecting cover 32 is connected to the cold and hot medium 33 through the connecting elements 323. One side of the TEC module 35 is connected to the heat transfer plate 31 and the other side is connected to the cold and hot medium 33. In this embodiment, the cold and hot medium 33 serves as a stable support structure, effectively bearing the weights of the heat transfer plate 31 and the connecting cover 32, ensuring the stability and durability of the overall structure. The connecting elements 323 provided on both sides of the connecting cover 32 achieve a tight and reliable connection with the cold and hot medium 33, not only simplifying the assembly process but also enhancing the sealing of the heat conduction path and reducing heat dissipation. TEC is a thermoelectric cooler, a semiconductor or solid-state device that uses the Peltier effect for heating and cooling. This device passes a direct current through an electric couple composed of two semiconductor materials, generating a phenomenon of heat absorption at one end and heat release at the other end, thereby achieving the effect of refrigeration or heating. Specifically, the heat-releasing surface of the TEC module 35 is in contact with the heat transfer plate 31, and the heat-absorbing surface is in contact with the cold and hot medium 33.
[0030] The heat transfer plate 31 is provided with a sealing platform 312 on the outer periphery of the liquid cooling cavity 34. The connecting cover 32 is provided with a sealing groove 324, and a sealing ring 325 is arranged in the sealing groove 324. The sealing ring 325 cooperates with the sealing platform 312 to seal the liquid cooling cavity 34. In this embodiment, first, the tight sealing of the liquid cooling cavity 34 is ensured, effectively preventing the leakage of the coolant during high-speed circulation, maintaining the stable operation of the system and the cleanliness of the surrounding environment. Secondly, the introduction of the sealing ring 325 enhances the elasticity and adaptability of the sealing interface. Even under temperature fluctuations or slight vibrations, it can maintain a stable sealing state, extending the service life of the radiator. In addition, this design also optimizes the overall structural compactness of the radiator, reduces unnecessary space occupation, and improves the heat conduction efficiency.
[0031] A sealing member 341 is arranged in the liquid cooling cavity 34. The sealing member 341 covers the surfaces and both sides of the heat dissipation fins 311 to form flow channels 3111 on the heat dissipation fins 311. The first interface 321 and the second interface 322 are respectively connected to both sides of the flow channels 3111. In this embodiment, the sealing member 341 not only comprehensively covers the surfaces and both sides of the heat dissipation fins 311, effectively isolating the coolant from the external environment and ensuring the sealing and safety of the system. More importantly, its design ingeniously shapes smooth flow channels 3111 on the heat dissipation fins 311. This structure greatly optimizes the flow path of the coolant, making heat transfer more efficient. The first interface 321 and the second interface 322 are accurately docked with both sides of the flow channels 3111, ensuring that the coolant can circulate smoothly and flow through the heat dissipation fins 311 without obstruction, realizing the rapid absorption and release of heat.
[0032] A plurality of heat dissipation fins 311 are provided, and a flow channel 3111 is provided between the plurality of heat dissipation fins 311. The flow channel 3111 is used for liquid to pass through to take away heat. In this embodiment, the plurality of heat dissipation fins 311 greatly increase the heat dissipation area, enabling heat to be more quickly distributed and dissipated into the surrounding environment, effectively improving the heat dissipation efficiency. Secondly, the provision of the flow channel 3111 allows the coolant to flow smoothly, and this design directly promotes the heat exchange process, that is, heat is conducted from a heat source (such as a CPU or GPU) through the radiator base to the heat dissipation fins 311, and then is quickly absorbed and taken away by the flowing coolant, realizing efficient heat transfer. In addition, the optimized layout of the flow channel 3111 can also reduce the water flow resistance, increase the flow speed of the coolant, and further enhance the heat dissipation performance.
[0033] The above embodiments only represent several implementation manners of the present utility model, and the description thereof is relatively specific and detailed, but it should not be construed as a limitation on the scope of the patent of the present utility model. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present utility model, several deformations and improvements can still be made, and these all belong to the protection scope of the present utility model. Therefore, the protection scope of the patent of the present utility model shall be subject to the appended claims.
Claims
1. A liquid-cooled radiator, characterized in that: It includes a heat exchange module, a liquid supply component, and a heat source connection component; the liquid supply component is provided with a first pipeline, a second pipeline, and a liquid supply pump. The first pipeline is connected to the heat exchange module and the heat source connection component through the liquid supply pump. The second pipeline is used to connect the heat exchange module and the heat source connection component; the heat source connection component includes a heat transfer plate and a connection cover. One side of the connection cover is buckled on the heat transfer plate to form a liquid cooling cavity. One end of the heat transfer plate facing the liquid cooling cavity is provided with heat dissipation fins. The connection cover is provided with a first interface and a second interface. The first interface is used to connect the first pipeline, and the second interface is used to connect the second pipeline for the liquid to flow in the liquid cooling cavity.
2. The liquid-cooled radiator according to claim 1, wherein: The heat exchange module includes a fin module and a cooling fan. A liquid flow channel is arranged in the fin module. Both ends of the liquid flow channel are respectively connected to the first pipeline and the second pipeline for liquid cooling. The cooling fan is used to dissipate heat from the fin module.
3. The liquid-cooled radiator according to claim 2, wherein: The fin module includes a fin frame, flow flat tubes, and fin elements. A plurality of the flow flat tubes are arranged on the fin frame. The fin elements are arranged between two adjacent flow flat tubes. The cooling fan is arranged at one end of the fin frame to dissipate heat from the flow flat tubes and the fin elements.
4. The liquid cooling radiator according to claim 3, wherein: The fin frame is provided with a liquid inlet cavity, a return cavity, and a liquid outlet cavity. The liquid inlet cavity and the liquid outlet cavity are connected to the return cavity through the flow flat tubes to form a liquid flow channel.
5. The liquid cooling radiator according to claim 4, characterized in that: One end of the liquid supply pump is connected to the first interface through the first pipeline, and the other end is connected to the liquid outlet cavity. The liquid inlet cavity is connected to the second interface through the second pipeline.
6. The liquid cooling radiator according to claim 1, wherein: The liquid supply pump includes an upper cover, a pump body, and a lower cover. The pump body is used to connect the first pipeline. The upper cover and the lower cover are respectively connected to the upper and lower sides of the pump body.
7. The liquid-cooled radiator according to claim 1, wherein: The heat source connection component is provided with a cold and hot medium and a TEC module. Connection elements are arranged on both sides of the connection cover. The connection cover is connected to the cold and hot medium through the connection elements. One side of the TEC module is connected to the heat transfer plate, and the other side is connected to the cold and hot medium.
8. The liquid-cooled radiator according to claim 1, wherein: A sealing platform is arranged on the outer periphery of the heat transfer plate located in the liquid cooling cavity. The connection cover is provided with a sealing groove. A sealing ring is arranged in the sealing groove. The sealing ring cooperates with the sealing platform to seal the liquid cooling cavity.
9. The liquid-cooled radiator according to claim 1, wherein: A sealing member is arranged in the liquid cooling cavity. The sealing member covers the surface and both sides of the heat dissipation fins to form a flow groove on the heat dissipation fins. The first interface and the second interface are respectively connected to both sides of the flow groove.
10. The liquid-cooled radiator according to claim 1, wherein: A plurality of the heat dissipation fins are arranged. A flow groove is arranged between the plurality of heat dissipation fins. The flow groove is used for the liquid to pass through to take away the heat.