Anti-flashover middle-high voltage ceramic dielectric capacitor

Abstract

The utility model discloses an anti-flashover middle-high voltage ceramic dielectric capacitor, and relates to the technical field of electronic components. An anti-flashover middle-high voltage ceramic dielectric capacitor comprises a capacitor body located between a first pin and a second pin. The upper end of the first pin is connected with one side edge of the capacitor body through a welding piece; the second pin is connected with the other side edge of the capacitor body through a welding piece; and the number of the welding pieces is two, and the two welding pieces are symmetrically distributed on the two sides of the capacitor body. According to the utility model, the capacitor body is erected on the external PCB through the first pin and the second pin, the first pin and the capacitor body as well as the second pin and the capacitor body are respectively fixed by the welding pieces, and the first pin and the second pin are fixed on the external PCB, so that a gap is formed between the capacitor body and the PCB, and even if welding flux is left during welding, the capacitor body can not be damaged. And the residual welding flux is not connected between the PCB and the capacitor body, so that the residual welding flux can be conveniently cleaned, and flashover is further prevented.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic components, and particularly relates to a medium-high voltage ceramic capacitor for preventing flashover. Background Art

[0002] With the rapid development of electronic information technology, the replacement speed of digital electronic products is getting faster and faster. The production and sales volume of consumer electronic products mainly including flat-panel TVs (LCD and PDP), notebook computers, digital cameras, etc. continue to grow, driving the growth of the capacitor industry. According to different manufacturing materials, they can be divided into: ceramic capacitors, polyester capacitors, electrolytic capacitors, tantalum capacitors, and advanced polypropylene capacitors, etc. Among them, ceramic capacitors are widely used due to their advantages such as low cost, high reliability, long life, and small size.

[0003] With the continuous progress of science and technology, the preparation process and performance of ceramic materials have been significantly improved, enabling high-voltage ceramic capacitors to withstand higher working voltages and temperatures, and at the same time having better stability and reliability. With the development of the power system and the popularization of electronic devices, the demand for high-voltage capacitors is increasing continuously. High-voltage ceramic capacitors can provide high-voltage and stable capacitance performance, meeting the requirements of the power system and electronic devices for high voltage, large capacitance, and high stability.

[0004] As a new generation of chip components emerging from the longitudinal deep development of MLCC (multi-layer ceramic capacitors), medium-high voltage MLCC refers to high-performance products with a rated working voltage higher than that of conventional varieties, and is a product that can withstand a relatively high rated voltage produced by adopting special design on the basis of the process technology and equipment of ordinary MLCC.

[0005] The operating voltage of medium-high voltage MLCC is relatively high, and the electric field at the edge of the capacitor end electrode is non-uniform. The electric field is distorted at the tip. When the applied voltage is higher than the initial ionization voltage of the air at this place, the air at this place will be ionized and generate a misty corona, which extends to the opposite end electrode, and finally causes surface flashover breakdown. Capacitor flashover refers to the discharge phenomenon that occurs during the operation of the capacitor, usually caused by the following reasons: overvoltage, capacitor damage, environmental factors, voltage change, etc., and environmental factors include: humidity, temperature, cleanliness of the product surface, etc., which may affect the insulation performance of the capacitor and thus cause flashover. The common installation method of medium-high voltage MLCC is surface mounting, that is, it is installed on the PCB board by welding. During the welding process, too much solder may flow into the gap between the MLCC and the PCB board and cannot be cleaned. Due to the high voltage of the high-voltage MLCC, during actual use, the residual solder is extremely easy to form a discharge channel, causing surface flashover of the high-voltage MLCC, resulting in the breakdown and failure of the high-voltage MLCC, and even burning the entire module. Summary of the Utility Model

[0006] The technical problem to be solved by the present utility model is that the existing medium-high voltage ceramic capacitors for arc prevention are prone to arc discharge, resulting in the breakdown and failure of high-voltage MLCCs. The purpose is to provide a medium-high voltage ceramic capacitor for arc prevention to solve the problem of arc discharge in medium-high voltage ceramic capacitors.

[0007] The present utility model is realized through the following technical solutions:

[0008] The present utility model provides a medium-high voltage ceramic capacitor for arc prevention, including

[0009] a capacitor body located between a first pin and a second pin;

[0010] a first pin, the upper end of which is connected to one side of the capacitor body through a welding piece;

[0011] a second pin, which is connected to the other side of the capacitor body through a welding piece;

[0012] two welding pieces, and the two welding pieces are symmetrically distributed on both sides of the capacitor body.

[0013] As a possible design, the first pin and the second pin have the same structure. The first pin includes a first welding section, a connecting section, and a second welding section;

[0014] The first welding section is connected to the side of the capacitor body through a welding piece, and the first welding section is connected to the connecting section;

[0015] The connecting section is located between the capacitor body and the external PCB board, and both ends of the connecting section are respectively connected to the first welding section and the second welding section;

[0016] The second welding section is connected to the external PCB board.

[0017] As a possible design, the length of the connecting section is 2 - 4 mm.

[0018] As a possible design, the first welding section and the connecting section are on the same straight line, the included angle between the connecting section and the second welding section is 60 - 120°, and the side of the second welding section is in contact with the external PCB board.

[0019] As a possible design, the first welding section, the connecting section, and the second welding section are on the same straight line, the second welding section passes through the external PCB board, and the end of the second welding section is connected to the external PCB board.

[0020] As a possible design, a first electroplated layer is covered on the surfaces of both the first pin and the second pin.

[0021] As a possible design, a second electroplated layer is further covered on the surface of the first electroplated layer.

[0022] As a possible design, the thickness of the first electroplated layer is 2 - 10 μm, and the thickness of the second electroplated layer is 4 - 15 μm.

[0023] As a possible design, a plurality of through holes are provided on both the first pin and the second pin.

[0024] As a possible design, the through holes are arranged obliquely downward.

[0025] Compared with the prior art, the present utility model has the following advantages and beneficial effects:

[0026] The present utility model mounts the capacitor body on an external PCB board through the first pin and the second pin, fixes the first pin and the capacitor body, and the second pin and the capacitor body respectively with welding parts, and then fixes the first pin and the second pin on the external PCB board through welding solder, so that there is a gap between the capacitor body and the PCB board. Even if there is solder residue during welding, the residual solder will not connect between the PCB board and the capacitor body, which can facilitate the cleaning of the residual solder, and such a design can facilitate the spraying of protective paint on all aspects of the ceramic capacitor, further preventing the generation of arc-over. Description of the Drawings

[0027] The drawings described herein are used to provide a further understanding of the embodiments of the present utility model, form a part of this application, and do not limit the embodiments of the present utility model. In the drawings:

[0028] Figure 1 is one of the structural schematic diagrams of a high-voltage ceramic capacitor for preventing arc-over of the present utility model;

[0029] Figure 2 is another structural schematic diagram of a high-voltage ceramic capacitor for preventing arc-over of the present utility model;

[0030] Figure 3 is still another structural schematic diagram of a high-voltage ceramic capacitor for preventing arc-over of the present utility model;

[0031] Figure 4 is a cross-sectional view of the first pin of a high-voltage ceramic capacitor for preventing arc-over of the present utility model;

[0032] Figure 5 is a side cross-sectional view of the first pin of a high-voltage ceramic capacitor for preventing arc-over of the present utility model;

[0033] Figure 6 is one of the front views of the first pin of a high-voltage ceramic capacitor for preventing arc-over of the present utility model;

[0034] Figure 7The second front view of the first pin of a medium and high voltage ceramic capacitor with arc prevention for the present utility model;

[0035] Figure 8 It is a schematic diagram of the connection structure between a capacitor and a PCB board in the prior art.

[0036] Marks in the attached drawings and corresponding component names:

[0037] 1 - Capacitor body; 2 - First pin; 3 - Second pin; 4 - Welding piece; 5 - Opening; 21 - First welding section; 22 - Connection section; 23 - Second welding section; 24 - First plating layer; 25 - Second plating layer. Specific embodiments

[0038] To make the objectives, technical solutions and advantages of the present utility model clearer and more understandable, the present utility model will be further described in detail below in conjunction with embodiments and the attached drawings. The illustrative embodiments and descriptions of the present utility model are only used to explain the present utility model and shall not be construed as a limitation to the present utility model.

[0039] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0040] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present utility model, "a plurality of" means two or more unless otherwise clearly and specifically defined. "Several" means one or more unless otherwise clearly and specifically defined.

[0041] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "front", "rear", "left", "right", etc. is based on the orientation or positional relationship shown in the attached drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the indicated device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be construed as a limitation to the present utility model.

[0042] In the description of the present utility model, it should be noted that unless otherwise clearly specified and defined, the terms "installation", "connection", and "coupling" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0043] Embodiment

[0044] This embodiment provides a mid-voltage ceramic capacitor for preventing arc-over, as Figures 1 - 8 shown, which includes a capacitor body 1, a first lead 2, a second lead 3, and a welding piece 4. The capacitor body 1 is located between the first lead 2 and the second lead 3. It is a mid-voltage MLCC, and welding pieces 4 are connected to both sides thereof. The lead-out end or the electrode of the MLCC end is a palladium-silver alloy; the first lead 2 and the second lead 3 have the same shape and can be made of alloy. The first lead 2 and the second lead 3 are arranged in the same direction or symmetrically. The upper end of the first lead 2 is connected to one side of the capacitor body 1 through the welding piece 4 to fix and support one side of the capacitor body 1; the second lead 3 is located on the other side of the capacitor body 1, and the upper end of the second lead 3 is connected to the other side of the capacitor body 1 through the welding piece 4; the material of the welding piece 4 is preferably tin-lead, which can ensure the tight connection between the capacitor body 1 and the first lead 2 or the second lead 3. There are two welding pieces 4, and the two welding pieces 4 are symmetrically distributed on both sides of the capacitor body 1.

[0045] In this embodiment, compared with the prior art with reference to Figure 8 this embodiment, the first lead 2 and the second lead 3 support the capacitor body 1, so that there is a gap between the capacitor body 1 and the bottom PCB board, thereby ensuring that during welding, the solder will not connect between the PCB board and the capacitor body 1, and further avoiding the generation of arc-over.

[0046] In some embodiments of the present application, the above-mentioned first lead 2 and the second lead 3 have the same structure, both of which are square, cuboid or triangular prism. The first lead 2 includes three sections: a first welding section 21, a connecting section 22, and a second welding section 23. The first welding section 21 is welded to the capacitor body 1 through the welding piece 4, so as to ensure that the capacitor body 1 is fixed on the first lead 2 and the second lead 3; the connecting section 22 is located between the first welding section 21 and the second welding section 23, and in terms of height, it is located between the capacitor body 1 and the PCB board, which can ensure that there is a gap between the capacitor body 1 and the PCB board; the second welding section 23 is connected to the external PCB board, and the PCB board is located below the second welding section 23.

[0047] In this embodiment, the thickness of the first pin 2 and the second pin 3 is 0.1-0.3 mm, which can ensure support for the capacitor body 1 while reducing its own weight and slowing down the self-rotation of the ceramic capacitor, making it easier to use.

[0048] In some embodiments of the present application, the length of the connecting section 22 is 2 to 4 mm, thereby ensuring a gap of 2 to 4 mm between the capacitor body 1 and the PCB board, further ensuring that no arcing occurs, and improving the safety and durability of the ceramic capacitor.

[0049] In some embodiments of the present application, Figures 1 - 2 and Figure 6 As shown, the first welding section 21 and the connecting section 22 are located on the same straight line, which can ensure the support of the capacitor body 1. The angle between the connecting section 22 and the second welding section 23 is 60-120°, preferably 90° (refer to Figure 6 ), the second welding section 23 located on the first pin 2 and the second welding section 23 located on the second pin 3 are arranged opposite to each other, facing each other or in the same direction.

[0050] In this embodiment, by forming an angle between the second welding section 23 and the connecting section 22, not only can the stability of the connection be improved and the welding technical requirements be reduced, but also the fit between the second welding section 23 and the connecting section 22 can be improved, the fixing effect can be better, and the size requirements for the PCB board can be reduced, so that the ceramic dielectric capacitor has better universality and can also resist lateral stress.

[0051] In some embodiments of the present application, Figure 3 and Figure 7 As shown, the first welding section 21, the connecting section 22, and the second welding section 23 are located on the same straight line. The second welding section 23 passes through the external PCB board, and the end of the second welding section 23 is connected to the external PCB board. By using flux to weld between the bottom of the second welding section 23 and the PCB board, the connection strength between the second welding section 23 and the PCB board can be improved, and deformation of the second welding section 23 that affects the position of the capacitor body 1 can be prevented. The spacing between the capacitor body 1 and the PCB board can also be increased, further preventing arcing.

[0052] In some embodiments of the present application, Figure 4 As shown, the surfaces of the first pin 2 and the second pin 3 are both covered with a first electroplating layer 24 , and the material of the first electroplating layer 24 is preferably nickel.

[0053] In some embodiments of the present application, Figure 4 As shown, the surface of the first electroplating layer 24 is further covered with a second electroplating layer 25 , and the material of the second electroplating layer 25 is preferably tin-lead alloy.

[0054] In some embodiments of the present application, the thickness of the first plating layer 24 is 2 to 10 μm, preferably 6 μm; the thickness of the second plating layer 25 is 4 to 15 μm, preferably 10 μm.

[0055] In some embodiments of the present application, a plurality of through holes 5 are formed in the first lead 2 and the second lead 3. The through holes 5 penetrate through the first lead 2 and the second lead 3. The through holes 5 can reduce the self-weight of the first lead 2 and the second lead 3, thereby reducing the cost and improving the applicability.

[0056] In some embodiments of the present application, the through holes 5 are arranged obliquely downward, and the inclined directions of the plurality of through holes 5 can be opposite or different. On the one hand, it can reduce the self-rotation. On the other hand, it can prevent impurities from remaining in the through holes 5. On the other hand, the through holes 5 located on the first welding section 21 and the second welding section 23 can retain solder, making the connection between the first lead 2, the PCB board, and the capacitor body 1 tight. And the through holes 5 on the connection section 22 can provide a flow channel for the sputtered solder during welding, guiding the solder out to avoid solder adhesion.

[0057] The specific embodiments described above further elaborate on the purpose, technical solutions, and beneficial effects of the present invention. It should be understood that the above description is only the specific embodiments of the present invention and is not used to limit the protection scope of the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A medium-voltage ceramic capacitor for preventing arc-over, characterized in that, Comprising: A capacitor body, located between a first pin and a second pin; The first pin, the upper end of which is connected to one side of the capacitor body through a welding piece, and the lower end of which is used to connect to a PCB board so as to form a gap between the PCB board and one side of the capacitor body; The second pin, the upper end of which is connected to the other side of the capacitor body through a welding piece, and the lower end of which is used to connect to a PCB board so as to form a gap between the PCB board and the other side of the capacitor body; Welding pieces, two in number, and the two welding pieces are symmetrically distributed on both sides of the capacitor body.

2. The medium-voltage ceramic capacitor for preventing arc-over according to claim 1, wherein The first pin and the second pin have the same structure, and the first pin includes a first welding section, a connecting section and a second welding section; The first welding section is connected to the side of the capacitor body through a welding piece, and the first welding section is connected to the connecting section; The connecting section is located between the capacitor body and the external PCB board, and both ends of the connecting section are respectively connected to the first welding section and the second welding section; the second welding section is connected to the external PCB board.

3. The medium-voltage ceramic capacitor for preventing arcing according to claim 2, wherein The length of the connecting section is 2 - 4 mm.

4. The medium-voltage ceramic capacitor for preventing arc-over according to claim 2, characterized in that, The first welding section and the connecting section are on the same straight line, the included angle between the connecting section and the second welding section is 60 - 120°, and the side of the second welding section is in contact with the external PCB board.

5. The medium-voltage ceramic capacitor for preventing arc-over according to claim 2, wherein, The first welding section, the connecting section and the second welding section are on the same straight line, the second welding section passes through the external PCB board, and the end of the second welding section is connected to the external PCB board.

6. The medium-voltage ceramic capacitor for preventing arc-over according to claim 1, wherein Both the first pin and the second pin are covered with a first electroplating layer on their surfaces.

7. The medium-voltage ceramic capacitor for preventing arc-over according to claim 6, characterized in that, A second electroplating layer is further covered on the surface of the first electroplating layer.

8. The medium-voltage ceramic capacitor for preventing arc-over according to claim 7, characterized in that, The thickness of the first electroplating layer is 2 - 10 μm, and the thickness of the second electroplating layer is 4 - 15 μm.

9. The medium-voltage ceramic capacitor for preventing arc-over according to claim 1, characterized in that, A plurality of openings are provided on both the first pin and the second pin.

10. The anti-arcing medium- and high-voltage ceramic capacitor according to claim 9, characterized in that, The openings are arranged obliquely downward.

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