Liquid cooling capacitor pressure relief structure
By setting a pressure relief valve and stopper or avoiding space on the capacitor, the electrolyte spillage problem after the capacitor fails and explodes under the liquid-cooled heat dissipation method is solved, and the safety of electrical equipment is improved.
Patent Information
- Application Number
- CN202422292997.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-18
- Publication Date
- 2025-08-01
- Estimated Expiration
- 2034-09-18
AI Technical Summary
Under the liquid-cooled and heat dissipation method, the electrolyte can easily overflow to the circuit board or other electronic equipment after the capacitor fails and explodes, resulting in a high risk of secondary accidents.
A pressure relief valve is provided on the axial or radial side of the capacitor, and a stop or avoidance space is provided on the axial end or circuit board/liquid cooling plate on the same side to prevent the electrolyte from spilling out.
Effectively prevent the electrolyte from overflowing when the capacitor is released, avoid secondary damage to other devices, and improve safety of use.
Smart Images
Figure CN223180968U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of explosion-proof electrical equipment, and in particular to a liquid-cooled capacitor pressure relief structure. Background Art
[0002] With the continuous rise of new energy technologies, electrical equipment is gradually developing towards high power and high integration. These high-power, highly integrated system equipment places higher demands on heat dissipation standards. As an indispensable component in electrical equipment, capacitors are widely used in circuits for DC blocking, AC passing, coupling, bypassing, filtering, tuning circuits, energy conversion, and control.
[0003] In related technologies, liquid cooling is used to improve the heat dissipation effect of capacitors. It should be noted that even if liquid cooling is used to dissipate heat from capacitors, the problem of capacitor failure and explosion due to excessive temperature still needs to be considered. The sputtered electrolyte after the capacitor fails and explodes can easily overflow to the circuit board, other capacitors or other electronic equipment, causing secondary accidents in electrical equipment. Reducing the risk of secondary accidents caused by the failure and explosion of a single capacitor has become an important safety indicator requirement for capacitor liquid cooling.
[0004] Therefore, a liquid-cooled capacitor pressure relief structure is urgently needed to solve the above problems.
[0005] Application Contents
[0006] The purpose of the present application is to provide a liquid-cooled capacitor pressure relief structure to prevent the electrolyte leaked from the failure and pressure relief of a single capacitor from overflowing onto other devices, thereby improving safety in use.
[0007] To achieve this goal, this application adopts the following technical solutions:
[0008] Liquid-cooled capacitor pressure relief structure, including;
[0009] A capacitor, wherein a pin is provided at one end of the capacitor along the axial direction;
[0010] a circuit board, the pins being fixedly connected to the circuit board; and
[0011] a liquid cooling plate, the liquid cooling plate being bonded to the capacitor;
[0012] A pressure relief valve is provided at the axial end of the capacitor, and a stopper is provided on the circuit board or the liquid cooling plate arranged at the axial end on the same side as the pressure relief valve; or, the pressure relief valve is provided on the radial side of the capacitor, and an avoidance space is provided on the radial side of the capacitor, and along the radial direction of the capacitor, the avoidance space is directly opposite to the pressure relief valve.
[0013] As an optional solution, the capacitor is provided with the pressure relief valve at the axial end of the pin, the circuit board is provided with the stopper, the stopper is arranged around the outer periphery of the pressure relief valve, the circuit board and the stopper are jointly arranged to form a accommodating cavity, and the pressure relief valve is connected to the accommodating cavity.
[0014] As an optional solution, the stopper is provided on the first side surface of the circuit board, and the stopper extends in a direction close to the capacitor.
[0015] As an optional solution, along the radial direction of the capacitor, a first gap exists between the outer peripheral wall of the capacitor and the inner peripheral wall of the stopper.
[0016] As an optional solution, the stop member is arranged on the second side of the circuit board, and the stop member extends in a direction away from the capacitor. A pressure relief hole connected to the pressure relief valve is opened on the circuit board, and the pressure relief valve is connected to the accommodating cavity through the pressure relief hole.
[0017] As an optional solution, the stopper is provided on the liquid cooling plate, and a receiving groove is also provided on the liquid cooling plate. The axial end of the capacitor provided with the pressure relief valve is located in the receiving groove, and the stopper is a pressure relief port opened on the bottom wall of the receiving groove, and the pressure relief port is directly opposite to the pressure relief valve.
[0018] As an optional solution, the pressure relief valve is provided at the end of the capacitor along the axial direction, and the stopper is a potting glue.
[0019] As an optional solution, the liquid-cooled capacitor pressure relief structure further includes a capacitor group, the capacitor group includes a plurality of the capacitors arranged in rows, and the radial side surface of each of the capacitors is provided with the pressure relief valve.
[0020] As an optional solution, the capacitor group includes a first row and a second row, each capacitor in the first row is provided with the pressure relief valve on the radial side away from the second row, and each capacitor in the second row is provided with the pressure relief valve on the radial side away from the first row.
[0021] As an optional solution, the capacitor group includes a third row and a fourth row, and there is an avoidance space between two adjacent capacitors in the third row. The radial side of each capacitor in the third row away from the fourth row is provided with the pressure relief valve, and the pressure relief valve of each capacitor in the fourth row is directly opposite to one of the avoidance spaces in the third row.
[0022] As an alternative, the capacitor bank includes a fifth row and a sixth row. There is the avoidance space between two adjacent capacitors in the fifth row, and there is the avoidance space between two adjacent capacitors in the sixth row. The pressure relief valve of each capacitor in the sixth row is directly opposite to one avoidance space in the fifth row, and the pressure relief valve of each capacitor in the fifth row is directly opposite to one avoidance space in the sixth row.
[0023] As an alternative, a liquid cooling plate is adhesively connected to the outer periphery of the capacitor bank.
[0024] As an alternative, a plurality of liquid cooling plates arranged at intervals are adhesively connected to the outer peripheral side of the capacitor. The pressure relief valve is arranged on the radial side of the capacitor, and the pressure relief valve is located between two adjacent liquid cooling plates.
[0025] As an alternative, a liquid cooling plate is adhesively connected to the outer peripheral side of the capacitor. A plurality of pressure relief valves are arranged at intervals on the radial side of the capacitor, and the liquid cooling plate is located between two adjacent pressure relief valves.
[0026] As an alternative, a receiving groove is further arranged on the liquid cooling plate, and one end of the capacitor along the axis away from the pin is received in the receiving groove.
[0027] The liquid-cooled capacitor pressure relief structure provided by the present application realizes the control of the circuit on the circuit board by the capacitor by arranging pins connected and fixed to the circuit board at one axial end of the capacitor. By using the liquid cooling plate adhesively connected to the capacitor, the temperature of the capacitor can be effectively reduced, ensuring the normal operation of the capacitor. In addition, a pressure relief valve is arranged at the axial end of the capacitor, and a stop is arranged on the circuit board or the liquid cooling plate arranged at the axial end on the same side as the pressure relief valve; or, a pressure relief valve is arranged on the radial side of the capacitor, and an avoidance space is arranged on the radial side of the capacitor. Along the radial direction of the capacitor, the avoidance space is directly opposite to the pressure relief valve. The arrangement of the above-mentioned stop or avoidance space effectively prevents the electrolyte leaked when the capacitor relieves pressure through the pressure relief valve from overflowing to other devices, thus avoiding the problem of secondary damage to other devices when the capacitor relieves pressure, improving the use safety, and meeting the actual safety requirements. BRIEF DESCRIPTION OF THE DRAWINGS
[0028] Figure 1 is a schematic structural diagram of the liquid-cooled capacitor pressure relief structure provided by Embodiment 1 of the present application;
[0029] Figure 2 is a cross-sectional schematic diagram of the liquid-cooled capacitor pressure relief structure provided by Embodiment 1 of the present application;
[0030] Figure 3 is Figure 2 a partial enlarged view of A in
[0031] Figure 4 is the structural schematic diagram of the liquid-cooled capacitor pressure relief structure provided in the second embodiment of the present application;
[0032] Figure 5 is the cross-sectional schematic diagram of the liquid-cooled capacitor pressure relief structure provided in the second embodiment of the present application;
[0033] Figure 6 is Figure 5 the partial enlarged view at position B in
[0034] Figure 7 is the cross-sectional schematic diagram of the liquid-cooled capacitor pressure relief structure provided in the third embodiment of the present application;
[0035] Figure 8 is Figure 7 the partial enlarged view at position C in
[0036] Figure 9 is the structural schematic diagram of the liquid-cooled capacitor pressure relief structure provided in the fourth embodiment of the present application;
[0037] Figure 10 is the cross-sectional schematic diagram of the liquid-cooled capacitor pressure relief structure provided in the fourth embodiment of the present application;
[0038] Figure 11 is Figure 10 the partial enlarged view at position D in
[0039] Figure 12 is the structural schematic of the liquid-cooled capacitor pressure relief structure provided in the fifth embodiment of the present application Figure 1 ;
[0040] Figure 13 is the structural schematic of the liquid-cooled capacitor pressure relief structure provided in the fifth embodiment of the present application Figure 2 ;
[0041] Figure 14 is the structural schematic of the liquid-cooled capacitor pressure relief structure provided in the fifth embodiment of the present application omitting the liquid cooling plate Figure 1 ;
[0042] Figure 15 is the structural schematic of the liquid-cooled capacitor pressure relief structure provided in the fifth embodiment of the present application omitting the liquid cooling plate Figure 2 ;
[0043] Figure 16 is the structural schematic of the liquid-cooled capacitor pressure relief structure provided in the fifth embodiment of the present application Figure 3 ;
[0044] Figure 17 is the structural schematic diagram of the liquid-cooled capacitor pressure relief structure provided in the sixth embodiment of the present application;
[0045] Figure 18It is a schematic structural diagram of the liquid-cooled capacitor pressure relief structure provided in Embodiment 7 of the present application.
[0046] In the figure:
[0047] 1000, capacitor bank; 1100, first row; 1200, second row; 1300, third row; 1400, fourth row; 1500, fifth row; 1600, sixth row; 100, capacitor; 110, pin; 120, pressure relief valve; 130, avoidance space; 140, first gap;
[0048] 200, circuit board; 210, stopper; 220, pressure relief hole; 230, accommodation cavity; 240, first side; 250, second side;
[0049] 300, liquid-cooled plate; 310, inlet pipe; 320, outlet pipe; 330, accommodation groove; 340, pressure relief port. Detailed implementation manners
[0050] To make the technical problems solved by the present application, the technical solutions adopted, and the achieved technical effects clearer, the technical solutions of the present application will be further described below with reference to the accompanying drawings and through specific implementation manners.
[0051] In the description of the present application, unless otherwise clearly specified and limited, the terms "connected", "connected to", and "fixed" shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the internal communication of two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.
[0052] In the present application, unless otherwise clearly specified and limited, the first feature being "above" or "below" the second feature may include the direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but in contact through other features between them. Moreover, the first feature being "above", "above", and "on" the second feature includes that the first feature is directly above and obliquely above the second feature, or simply means that the first feature is at a higher horizontal height than the second feature. The first feature being "below", "below", and "under" the second feature includes that the first feature is directly below and obliquely below the second feature, or simply means that the first feature is at a lower horizontal height than the second feature.
[0053] In the description of this embodiment, the orientation or positional relationships such as "upper", "lower", "left", "right", etc. are based on the orientation or positional relationships shown in the drawings. These are only for the convenience of description and simplifying the operations, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to this application. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.
[0054] Embodiment 1
[0055] As an indispensable and important component in electrical equipment, capacitors are widely used in aspects such as DC blocking and AC passing, coupling, bypassing, filtering, tuning circuits, energy conversion, control, etc. in circuits. In related technologies, to improve the heat dissipation effect of capacitors, liquid cooling is used for capacitors. It should be noted that even when using the liquid cooling method to dissipate heat from capacitors, the problem of the capacitor failing and bursting due to excessive temperature still needs to be considered. The electrolyte sputtered after the capacitor fails and bursts is likely to overflow to the circuit board, other capacitors, or other electronic devices, causing secondary accidents inside the electrical equipment. Reducing the risk of secondary accidents caused by the failure and bursting of a single capacitor has become an important safety index requirement for the liquid cooling method of capacitors.
[0056] To solve the above problems, as Figures 1 - 3 shown, this embodiment provides a liquid-cooled capacitor pressure relief structure. The liquid-cooled capacitor pressure relief structure includes a capacitor 100, a circuit board 200, and a liquid-cooled plate 300. Among them, one end of the capacitor 100 along the axial direction is provided with a lead 110; the lead 110 is fixedly connected to the circuit board 200, the liquid-cooled plate 300 is attached to the capacitor 100, a pressure relief valve 120 is provided at the axial end of the capacitor 100, and a stop member 210 is provided on the circuit board 200 or the liquid-cooled plate 300 provided at the axial end on the same side as the pressure relief valve 120; or, a pressure relief valve 120 is provided on the radial side of the capacitor 100, and an avoidance space 130 is provided on the radial side of the capacitor 100. Along the radial direction of the capacitor 100, the avoidance space 130 is directly opposite to the pressure relief valve 120. Optionally, in this embodiment, a pressure relief valve 120 is provided at the axial end of the capacitor 100, and a stop member 210 is provided on the circuit board 200 or the liquid-cooled plate 300 provided at the axial end on the same side as the pressure relief valve 120.
[0057] The liquid-cooled capacitor pressure relief structure provided in this embodiment realizes the control of the circuit on the circuit board 200 by the capacitor 100 by arranging a pin 110 connected and fixed to the circuit board 200 at one axial end of the capacitor 100. By using the liquid-cooled plate 300 to be attached to the capacitor 100, the temperature of the capacitor 100 can be effectively reduced, ensuring the normal operation of the capacitor 100. In addition, a pressure relief valve 120 is arranged at the axial end of the capacitor 100 along the axis, and a stop member 210 is arranged on the circuit board 200 or the liquid-cooled plate 300 arranged at the axial end on the same side as the pressure relief valve 120. The protective effect of the stop member 210 effectively prevents the electrolyte leaked when the capacitor 100 relieves pressure through the pressure relief valve 120 from overflowing to other devices, thereby avoiding the problem of secondary damage to other devices when the capacitor 100 relieves pressure, improving the use safety, and meeting the actual safety requirements. It should be noted that the other devices can be other capacitors 100, circuit boards 200 or other devices.
[0058] It should be noted that the pressure relief valve 120 on the capacitor 100 can be a weak area provided on the housing of the capacitor 100. The thickness of the weak area of the housing is smaller than the thickness of the rest of the housing. When the internal pressure of the capacitor 100 gradually increases, due to the relatively small thickness of the housing in the weak area, the pressure threshold of the weak area is the smallest, and the weak area ruptures first, thereby realizing the pressure relief of the capacitor 100. The pressure relief valve 120 on the capacitor 100 can also be an opening reserved in advance on the capacitor 100. The specific form of the pressure relief valve 120 is not limited in this embodiment, as long as the pressure relief valve 120 realizes the pressure relief operation of the capacitor when the capacitor 100 needs to relieve pressure.
[0059] Optionally, in this embodiment, as Figure 2 and Figure 3 shown, a pressure relief valve 120 is arranged at the axial end of the capacitor 100 where the pin 110 is arranged, and a stop member 210 is arranged on the circuit board 200. The stop member 210 surrounds the outer periphery of the pressure relief valve 120, and the circuit board 200 and the stop member 210 jointly enclose to form a receiving cavity 230, and the pressure relief valve 120 communicates with the receiving cavity 230. The above setting enables the electrolyte inside the capacitor 100 to flow out into the receiving cavity 230 through the pressure relief valve 120 when the pressure relief valve 120 of the capacitor 100 is opened, thereby preventing the leaked electrolyte from overflowing to other devices. Optionally, in this embodiment, the stop member 210 can be in the form of a stop plate, and the stop plate has the advantages of simple structure and convenient processing.
[0060] Optionally, in this embodiment, as Figure 3 shown, the stop member 210 is arranged on the first side surface 240 of the circuit board 200 and extends in the direction close to the capacitor 100. The above setting can ensure that the electrolyte discharged through the pressure relief valve 120 enters the receiving cavity 230 without the need to perform an opening operation on the circuit board 200, making the structure simple.
[0061] Optionally, as Figure 3 shown, along the radial direction of the capacitor 100, there is a first gap 140 between the outer peripheral wall of the capacitor 100 and the inner peripheral wall of the stopper 210. With the above arrangement, when the capacitor 100 discharges pressure through the pressure relief valve 120, the generated pressure can be discharged from the accommodation cavity 230 through the first gap 140, ensuring the reliability of the pressure relief of the capacitor 100.
[0062] It should be noted that, in this embodiment, the capacitor 100 is cylindrical, the diameter of the capacitor 100 can be 10 mm, the distance that the stopper 210 extends towards the capacitor 100 can be 6 mm, and the inner diameter of the accommodation cavity 230 surrounded by the stopper 210 can be 12 mm, so as to ensure the existence of the first gap 140 between the outer peripheral wall of the capacitor 100 and the inner peripheral wall of the stopper 210. In other embodiments, the specific shape and specifications of the capacitor 100 can also be adjusted according to actual needs, and the specific shape and specifications of the stopper 210 can be adjusted according to actual needs, as long as it is ensured that the stopper 210 can surround the outer periphery of the capacitor 100 and prevent the electrolyte from overflowing to other devices, and this embodiment does not make specific limitations.
[0063] Optionally, in this embodiment, the liquid-cooled capacitor pressure relief structure includes a plurality of capacitors 100 arranged at intervals, and each capacitor 100 corresponds to a stopper 210, so as to ensure corresponding blocking of the electrolyte discharged when each capacitor 100 discharges pressure.
[0064] Optionally, in this embodiment, as Figure 1 and Figure 2 shown, the liquid-cooled plate 300 is attached to one end of the capacitor 100 away from the circuit board 200. The liquid-cooled plate 300 is provided with an inlet pipe 310 and an outlet pipe 320. Both the inlet pipe 310 and the outlet pipe 3 are in communication with the cooling flow channel in the liquid-cooled plate 300. The inlet pipe 310 is in communication with the output end of the circulating cooling device, and the outlet pipe 320 is in communication with the input end of the circulating cooling device. The circulating cooling device is used for circulating cooling and driving the coolant, thereby realizing the effect that the coolant that has not completed cooling flows into the cooling flow channel along the inlet pipe 310 to absorb the heat of the capacitor 100, and the coolant that has absorbed the heat of the capacitor 100 flows back to the circulating cooling device along the outlet pipe 320 for cooling. In addition, since the liquid-cooled plate 300 cools the capacitor 100 at one end along the axial direction of the capacitor 100 away from the pin 110, and the circuit board 200, the capacitor 100, and the liquid-cooled plate 300 are arranged in sequence, the docking stability between the capacitor 100 and the liquid-cooled plate 300 is ensured. In this embodiment and other embodiments, the liquid-cooled plate 300 can also be attached to the radial side surface of the capacitor 100, and the specific liquid-cooled attachment form is not limited.
[0065] Optionally, in this embodiment, asFigure 2 As shown, a plurality of receiving grooves 330 are arranged at intervals on the liquid cooling plate 300. One end of the capacitor 100 along the axial direction away from the pin 110 is received in the receiving groove 330, which not only increases the contact area between the capacitor 100 and the liquid cooling plate 300, improves the cooling effect on the capacitor 100, but also realizes the positioning and fixing of the capacitor 100 and the liquid cooling plate 300.
[0066] In an alternative embodiment, a heat-conducting material is filled between the groove wall of the receiving groove 330 and the capacitor 100, so as to further improve the heat-conducting effect and efficiency between the liquid cooling plate 300 and the capacitor 100, and further improve the cooling effect on the capacitor 100. It should be noted that, in this embodiment, the heat-conducting material can be heat-conducting silicone grease, which has both excellent electrical insulation and excellent heat conductivity. In other embodiments, the heat-conducting material can also be adjusted according to actual needs, and no specific limitation is made in this embodiment.
[0067] Embodiment Two
[0068] The liquid-cooled capacitor pressure relief structure provided in this embodiment is basically the same as that in Embodiment One. The difference between the liquid-cooled capacitor pressure relief structure provided in this embodiment and that in Embodiment One is that the installation position of the stop member 210 on the circuit board 200 is different.
[0069] In this embodiment, as Figures 4 - 6 shown, the stop member 210 is arranged on the second side surface 250 of the circuit board 200, and the stop member 210 extends in a direction away from the capacitor 100. A pressure relief hole 220 communicating with the pressure relief valve 120 is formed on the circuit board 200, and the pressure relief valve 120 communicates with the accommodation cavity 230 through the pressure relief hole 220. With the above arrangement, when the pressure relief valve 120 of the capacitor 100 is opened, the electrolyte inside the capacitor 100 flows out through the pressure relief valve 120, and the flowing electrolyte enters the accommodation cavity 230 through the pressure relief hole 220 on the circuit board 200, thereby preventing the electrolyte in the accommodation cavity 230 from overflowing, and avoiding the overflow of the leaked electrolyte to other devices. It should be noted that, in this embodiment, since the stop member 210 extends in a direction away from the capacitor 100 and surrounds the outer periphery of the pressure relief valve 120, the accommodation cavity 230 is not blocked by the capacitor 100, and the accommodation cavity 230 is in an open form, which is more convenient for the capacitor 100 to relieve pressure through the pressure relief valve 120. Optionally, in this embodiment, the stop member 210 can also be in the form of a stop plate, and the stop plate has the advantages of simple structure and easy processing.
[0070] It should be noted that, in this embodiment, the setting position of the pressure relief valve 120 is the same as that in Embodiment One, and the pressure relief valve 120 is arranged at the axial end of the capacitor 100 where the pin 110 is provided.
[0071] Embodiment Three
[0072] The liquid-cooled capacitor pressure relief structure provided in this embodiment is basically the same as that in Embodiment 1. The difference between the liquid-cooled capacitor pressure relief structure provided in this embodiment and that in Embodiment 1 lies in: the installation positions of the pressure relief valve 120 and the stop member 210 are different.
[0073] In this embodiment, as Figure 7 and Figure 8 shown, a pressure relief valve 120 is provided at one end of the capacitor 100 axially away from the pin 110. A stop member 210 is provided on the liquid-cooled plate 300, and the stop member 210 is a pressure relief port 340 opened on the bottom wall of the accommodating groove 330, and the pressure relief port 340 is directly opposite to the pressure relief valve 120. By arranging the pressure relief valve 120 at one end of the capacitor 100 axially away from the pin 110, the pressure relief valve 120 is far away from the circuit board 200. When the capacitor 100 relieves pressure through the pressure relief valve 120, the problem of short circuit caused by the leaked electrolyte soiling the circuit board 200 is avoided, ensuring safety. In addition, when the capacitor 100 relieves pressure through the pressure relief valve 120, the leaked electrolyte and pressure of the capacitor 100 are discharged through the pressure relief port 340 on the bottom wall of the accommodating groove 330. By designing the stop member 210 in the form of the pressure relief port 340, the structure is simple and convenient for processing and manufacturing.
[0074] As an optional solution, the surface of the liquid-cooled plate 300 is coated with an insulating material. By coating the surface of the liquid-cooled plate 300 with an insulating material, the problem of short circuit of the remaining capacitors 100 caused by the liquid-cooled plate 300 becoming conductive when the electrolyte flows onto the liquid-cooled plate 300 can be avoided. It should be noted that in this embodiment, the surface of the liquid-cooled plate 300 is coated with insulating paint. In other embodiments, an insulating film or insulating glue can also be coated on the surface of the liquid-cooled plate 300, and this embodiment does not make specific limitations.
[0075] Embodiment 4
[0076] The liquid-cooled capacitor pressure relief structure provided in this embodiment is basically the same as that in Embodiment 1. The difference between the liquid-cooled capacitor pressure relief structure provided in this embodiment and that in Embodiment 1 lies in: the specific form of the stop member 210 is different.
[0077] In this embodiment, as Figures 9 - 11As shown, a pressure relief valve 120 is provided at the axial end of the capacitor 100, and the stopper 210 is potting glue. With the above arrangement, when the capacitor 100 relieves pressure through the pressure relief valve 120, under the action of pressure, the potting glue that obstructs the pressure relief valve 120 will be pushed open, ensuring the normal pressure relief operation of the pressure relief valve 120. At the same time, the potting glue at other parts will not be affected, and the potting glue at other parts prevents the leaked electrolyte from overflowing to other devices. By designing the stopper 210 in the form of potting glue, it can prevent the leaked electrolyte from overflowing to other devices, ensuring a good electrical isolation effect. And the potting glue has good heat transfer, can achieve a certain heat dissipation and cooling effect, and can ensure the temperature uniformity of each capacitor 100. Optionally, in this embodiment, the potting glue that obstructs the pressure relief of the pressure relief valve 120 can be set thinner than that at other parts, so as to ensure that the pressure relief valve 120 can smoothly push open the potting glue when relieving pressure. It can also be that there is no potting glue at the part that obstructs the pressure relief of the pressure relief valve 120 to ensure the normal pressure relief of the pressure relief valve 120.
[0078] Specifically, in this embodiment, as Figure 11 shown, the pressure relief valve 120 is located at one end of the capacitor 100 where the lead 110 is provided. Potting glue is provided on the side of the circuit board 200 away from the capacitor 100, and a pressure relief hole 220 communicating with the pressure relief valve 120 is provided on the circuit board 200. With the above arrangement, when the pressure relief valve 120 of the capacitor 100 is opened, the potting glue at the pressure relief hole 220 communicating with the pressure relief valve 120 is pushed open at this time, and the internal electrolyte and pressure of the capacitor 100 are discharged through the pressure relief valve 120 and the pressure relief hole 220.
[0079] Optionally, in this embodiment, as Figures 9 - 11 shown, the entire capacitor 100 can also be potted, so that potting glue is filled between each capacitor 100 and between the capacitor 100 and the circuit board 200 to achieve full potting. While ensuring electrical isolation, it can further improve the heat dissipation efficiency and further ensure the temperature uniformity of the capacitor 100. Optionally, in other embodiments, when the pressure relief valve 120 is located at one end of the capacitor 100 where the lead 110 is provided, potting glue can also be provided only on the side of the circuit board 200 away from the capacitor 100.
[0080] Optionally, in other embodiments, when the pressure relief valve 120 is provided at the end of the capacitor 100 away from the lead 110, a stopper 210 in the form of potting glue is provided on the liquid cooling plate 300. A pressure relief port 340 can be opened on the bottom wall of the accommodation groove 330, and the pressure relief port 340 is directly opposite and communicated with the pressure relief valve 120, and potting glue is sealed on the pressure relief port 340. When the pressure relief valve 120 of the capacitor 100 is opened, the potting glue at the pressure relief port 340 communicating with the pressure relief valve 120 is pushed open at this time, and the internal electrolyte and pressure of the capacitor 100 are discharged through the pressure relief valve 120 and the pressure relief port 340.
[0081] Example 5
[0082] The liquid-cooled capacitor pressure relief structure provided in this embodiment is basically the same as that in Embodiment 1. The difference between the liquid-cooled capacitor pressure relief structure provided in this embodiment and that in Embodiment 1 is as follows:
[0083] As Figure 12 and Figure 13 shown, a pressure relief valve 120 is provided on the radial side of the capacitor 100, and a relief space 130 is provided on the radial side of the capacitor 100. Along the radial direction of the capacitor 100, the relief space 130 is directly opposite to the pressure relief valve 120. By providing the relief space 130, the electrolyte leaked when the capacitor 100 is depressurized is prevented from overflowing to other devices, thereby avoiding the problem of secondary damage to other devices when the capacitor 100 is depressurized, improving the use safety, and meeting the actual safety requirements. It should be noted that the other devices may be other capacitors 100, circuit boards 200 or other devices.
[0084] It should be noted that in other embodiments, a baffle directly opposite to the pressure relief valve 120 may be provided along the radial direction of the capacitor 100, so as to further isolate the leaked electrolyte.
[0085] Optionally, in this embodiment, the liquid-cooled plate 300 is attached to the radial side of the capacitor 100 to achieve cooling of the capacitor 100, as long as it is ensured that the liquid-cooled plate 300 avoids the position of the pressure relief valve 120. Optionally, in this embodiment, the liquid-cooled plate 300 may be a profiling structure, such as a snake shape, to ensure the tightness of the attachment of the liquid-cooled plate 300 to the radial side of the capacitor 100. In other embodiments, the liquid-cooled plate 300 may also be attached to one end of the capacitor 100 away from the circuit board 200.
[0086] It should be noted that in this embodiment, the circuit board 200 is located on the top side of the capacitor 100, and the pressure relief valve 120 is on the radial side of the capacitor 100 close to the bottom side of the capacitor 100, so that the electrolyte leaked from the pressure relief valve 120 flows downward under the action of gravity to the corresponding relief space 130, avoiding soiling the circuit board 200 at the top.
[0087] In this embodiment, as Figures 14 - 16 shown, the liquid-cooled capacitor pressure relief structure further includes a capacitor bank 1000. The capacitor bank 1000 includes a plurality of capacitors 100 arranged in a row, and a pressure relief valve 120 is provided on the radial side of each capacitor 100.
[0088] In an optional embodiment of this embodiment, as Figure 14As shown, the capacitor bank 1000 includes a first row 1100 and a second row 1200. As shown by the arrow direction in the figure, a pressure relief valve 120 is provided on the radial side of each capacitor 100 in the first row 1100 away from the second row 1200, and a pressure relief valve 120 is provided on the radial side of each capacitor 100 in the second row 1200 away from the first row 1100. The arrangement of the capacitors 100 described above causes the pressure relief valves 120 on the first row 1100 and the second row 1200 to be arranged back to back, thereby ensuring that there is a corresponding avoidance space 130 for each capacitor 100 in the first row 1100 and the second row 1200. It should be noted that the first row 1100 and the second row 1200 can be two adjacent rows or the outermost two rows. It should be noted that the number of capacitor banks 1000 can be set according to requirements.
[0089] In an alternative embodiment of the present embodiment, as Figure 15 shown, the capacitor bank 1000 includes a third row 1300 and a fourth row 1400. There is an avoidance space 130 between two adjacent capacitors 100 in the third row 1300. A pressure relief valve 120 is provided on the radial side of each capacitor 100 in the third row 1300 away from the fourth row 1400, and the pressure relief valve 120 of each capacitor 100 in the fourth row 1400 is directly opposite to an avoidance space 130 in the third row 1300. The arrangement of the capacitors 100 described above ensures that there is a corresponding avoidance space 130 for each capacitor 100 in the third row 1300 and the fourth row 1400. It should be noted that the number of capacitor banks 1000 can be set according to requirements.
[0090] In an alternative embodiment of the present embodiment, as Figure 16 shown, the capacitor bank 1000 includes a fifth row 1500 and a sixth row 1600. There is an avoidance space 130 between two adjacent capacitors 100 in the fifth row 1500, and there is an avoidance space 130 between two adjacent capacitors 100 in the sixth row 1600. The pressure relief valve 120 of each capacitor 100 in the sixth row 1600 is directly opposite to an avoidance space 130 in the fifth row 1500, and the pressure relief valve 120 of each capacitor 100 in the fifth row 1500 is directly opposite to an avoidance space 130 in the sixth row 1600. The arrangement of the capacitors 100 described above causes the pressure relief valves 120 on the fifth row 1500 and the sixth row 1600 to be opposite and staggered, thereby ensuring that there is a corresponding avoidance space 130 for each capacitor 100 in the fifth row 1500 and the sixth row 1600. It should be noted that the number of capacitor banks 1000 can be set according to requirements.
[0091] Optionally, in the present embodiment, as Figure 16 shown, a liquid cooling plate 300 is attached to the outer periphery of the capacitor bank 1000 to ensure that the liquid cooling plate 300 is attached to the side of each capacitor 100.
[0092] Example Six
[0093] The liquid-cooled capacitor pressure relief structure provided in this embodiment is basically the same as that in Embodiment Five. The difference between the liquid-cooled capacitor pressure relief structure provided in this embodiment and that in Embodiment Five lies in:
[0094] As Figure 17 shown, a liquid-cooled plate 300 is attached to the outer peripheral side of the capacitor 100, and a plurality of pressure relief valves 120 are arranged at intervals on the radial side surface of the capacitor 100. The liquid-cooled plate 300 is located between two adjacent pressure relief valves 120. By arranging a plurality of pressure relief valves 120 at intervals on the radial side surface of the capacitor 100, the pressure relief effect on the capacitor 100 is improved. In this embodiment, two pressure relief valves 120 are arranged at intervals on the radial side surface of the capacitor 100. In other embodiments, the specific number of the pressure relief valves 120 on the capacitor 100 can be set according to requirements, as long as it is ensured that each pressure relief valve 120 has a corresponding avoidance space 130.
[0095] Example Seven
[0096] The liquid-cooled capacitor pressure relief structure provided in this embodiment is basically the same as that in Embodiment Five. The difference between the liquid-cooled capacitor pressure relief structure provided in this embodiment and that in Embodiment Five lies in:
[0097] As Figure 18 shown, a plurality of liquid-cooled plates 300 arranged at intervals are attached to the outer peripheral side of the capacitor 100, and a pressure relief valve 120 is arranged on the radial side surface of the capacitor 100. The pressure relief valve 120 is located between two adjacent liquid-cooled plates 300. By arranging a plurality of liquid-cooled plates 300 at intervals on the capacitor 100, the cooling and heat dissipation effect on the capacitor 100 is improved. In this embodiment, two liquid-cooled plates 300 arranged at intervals are attached to the outer peripheral side of the capacitor 100. In other embodiments, the specific number of the liquid-cooled plates 300 can be set according to requirements, as long as it is ensured that each pressure relief valve 120 has a corresponding avoidance space 130.
[0098] Obviously, the above-mentioned embodiments of the present application are only examples for clearly explaining the present application, rather than limitations on the implementation manners of the present application. For those of ordinary skill in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation manners here. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present application should be included in the protection scope of the claims of the present application.
Claims
1. Liquid-cooled capacitor pressure relief structure, characterized in that, Comprising; A capacitor (100), one axial end of the capacitor (100) is provided with a pin (110); A circuit board (200), the pin (110) is fixedly connected to the circuit board (200); And A liquid cooling plate (300), the liquid cooling plate (300) is attached to the capacitor (100); A pressure relief valve (120) is provided at an axial end of the capacitor (100), and a stop member (210) is provided on the circuit board (200) or the liquid cooling plate (300) provided at the axial end on the same side as the pressure relief valve (120); or, the pressure relief valve (120) is provided on a radial side of the capacitor (100), and an avoidance space (130) is provided on the radial side of the capacitor (100), and along the radial direction of the capacitor (100), the avoidance space (130) is directly opposite to the pressure relief valve (120).
2. The liquid-cooled capacitor pressure relief structure according to claim 1, wherein The pressure relief valve (120) is provided at an axial end of the capacitor (100) where the pin (110) is provided, the circuit board (200) is provided with the stop member (210), the stop member (210) surrounds the outer periphery of the pressure relief valve (120), and the circuit board (200) and the stop member (210) jointly surround and form a receiving cavity (230), and the pressure relief valve (120) communicates with the receiving cavity (230).
3. The liquid-cooled capacitor pressure relief structure according to claim 2, wherein The stop member (210) is provided on a first side surface (240) of the circuit board (200), and the stop member (210) extends in a direction close to the capacitor (100).
4. The liquid-cooled capacitor pressure relief structure according to claim 3, wherein, Along the radial direction of the capacitor (100), there is a first gap (140) between the outer peripheral wall of the capacitor (100) and the inner peripheral wall of the stop member (210).
5. The liquid-cooled capacitor pressure relief structure according to claim 2, wherein, The stop member (210) is provided on a second side surface (250) of the circuit board (200), the stop member (210) extends in a direction away from the capacitor (100), a pressure relief hole (220) communicating with the pressure relief valve (120) is opened on the circuit board (200), and the pressure relief valve (120) communicates with the receiving cavity (230) through the pressure relief hole (220).
6. The liquid-cooled capacitor pressure relief structure according to claim 1, characterized in that, The stop member (210) is provided on the liquid cooling plate (300), a receiving groove (330) is further provided on the liquid cooling plate (300), an axial end of the capacitor (100) where the pressure relief valve (120) is provided is located in the receiving groove (330), and the stop member (210) is a pressure relief port (340) opened on the bottom wall of the receiving groove (330), and the pressure relief port (340) is directly opposite to the pressure relief valve (120).
7. The liquid-cooled capacitor pressure relief structure according to claim 1, wherein, The pressure relief valve (120) is provided at an axial end of the capacitor (100), and the stop member (210) is potting glue.
8. The liquid-cooled capacitor pressure relief structure according to claim 1, wherein The liquid-cooled capacitor pressure relief structure further includes a capacitor bank (1000), the capacitor bank (1000) includes a plurality of the capacitors (100) arranged in a row, and the pressure relief valve (s) (120) are provided on the radial side surface of each capacitor (100).
9. The liquid-cooled capacitor pressure relief structure according to claim 8, characterized in that, The capacitor bank (1000) includes a first row (1100) and a second row (1200). A pressure relief valve (120) is provided on the radial side of each capacitor (100) in the first row (1100) away from the second row (1200). A pressure relief valve (120) is provided on the radial side of each capacitor (100) in the second row (1200) away from the first row (1100).
10. The liquid-cooled capacitor pressure relief structure according to claim 8, wherein, The capacitor bank (1000) includes a third row (1300) and a fourth row (1400). A clearance space (130) is provided between two adjacent capacitors (100) in the third row (1300). A pressure relief valve (120) is provided on the radial side of each capacitor (100) in the third row (1300) away from the fourth row (1400). The pressure relief valve (120) of each capacitor (100) in the fourth row (1400) is aligned with one clearance space (130) in the third row (1300).
11. The liquid-cooled capacitor pressure relief structure according to claim 8, wherein, The capacitor bank (1000) includes a fifth row (1500) and a sixth row (1600) respectively. A clearance space (130) is provided between two adjacent capacitors (100) in the fifth row (1500). A clearance space (130) is provided between two adjacent capacitors (100) in the sixth row (1600). The pressure relief valve (120) of each capacitor (100) in the sixth row (1600) is aligned with one clearance space (130) in the fifth row (1500). The pressure relief valve (120) of each capacitor (100) in the fifth row (1500) is aligned with one clearance space (on 130) in the sixth row (1600).
12. The liquid-cooled capacitor pressure relief structure according to claim 10 or 11, characterized in that, A liquid cooling plate (300) is attached to the outer periphery of the capacitor bank (1000).
13. The liquid-cooled capacitor pressure relief structure according to claim 1, characterized in that, A plurality of liquid cooling plates (300) arranged at intervals are attached to the outer peripheral side of the capacitor (100). A pressure relief valve (120) is provided on the radial side of the capacitor (100). The pressure relief valve (120) is located between two adjacent liquid cooling plates (300).
14. The liquid-cooled capacitor pressure relief structure according to claim 1, characterized in that, A liquid cooling plate (300) is attached to the outer peripheral side of the capacitor (100). A plurality of pressure relief valves (120) are arranged at intervals on the radial side of the capacitor (100). The liquid cooling plate (300) is located between two adjacent pressure relief valves (120).
15. The liquid-cooled capacitor pressure relief structure according to claim 1, wherein, A receiving groove (330) is further provided on the liquid cooling plate (300). One end of the capacitor (100) axially away from the pin (110) is received in the receiving groove (330).