Novel solid-state laminated polymer capacitor

Abstract

The utility model discloses a novel solid-state laminated polymer capacitor, which comprises a first shell, a conducting medium and a second shell, and is characterized in that the conducting medium is arranged in a cavity formed by the first shell and the second shell; the conducting medium comprises a voltage through electrode, a laminated structure and a grounding structure, the voltage through electrode and the grounding structure are fixed to the front face and the back face of the laminated structure respectively, a working pin is led out of the voltage through electrode towards the outside of the second shell, and a grounding pin is led out of the grounding structure towards the outside of the second shell. The laminated structure is arranged between the voltage through electrode and the grounding structure to form a stable sandwich structure, and a small amount of residual inductance of the voltage through electrode can play a role in suppressing a pulse signal in a power supply, so that the voltage has inertia during change, the influence of parasitic inductance can be reduced, and the reliability of the power supply is improved. The grounding electrode first pin and the grounding electrode second pin are grounded at the same time and are in a parallel connection state, so that the influence of parasitic inductance on the capacitor is further reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of capacitors, in particular to a novel solid-state laminated polymer capacitor. Background Art

[0002] A laminated capacitor is a capacitor with a highly conductive polymer material as the electrolyte. Its structure is more complex than that of an ordinary capacitor. However, since it can accommodate more charges under the same size, it has a higher capacitance value. Therefore, laminated capacitors are widely used in various electrical devices.

[0003] There is parasitic inductance, that is, equivalent series inductance (ESL) in a capacitor. A higher equivalent series inductance (ESL) will reduce the high-frequency characteristics of the capacitor and affect the resonance behavior of the circuit. To reduce the equivalent series inductance (ESL), it is usually necessary to connect multiple capacitors in parallel in the bypass to share the current, so as to reduce the overall inductance value by reducing the burden on a single capacitor. However, this assembly method is relatively complex and requires more capacitors, resulting in a higher cost.

[0004] The internal structure of a traditional laminated capacitor is a multi-layer stacked structure. The lead terminals of the capacitor are 1 anode pin and 1 cathode pin. For example, Chinese Utility Model Patent No. 201821387048.2 discloses a vertical laminated capacitor, which includes a laminated capacitor unit, an insulating package body, and a conductive lead-out part. The laminated capacitor unit includes a cathode terminal, an insulating isolation part, and an anode terminal. A plurality of laminated capacitor units are stacked into a laminated capacitor body, and the laminated capacitor units are stacked along the extension direction of the shortest side of the laminated capacitor body. The cathode terminals are connected to form the cathode of the laminated capacitor body, and the anode terminals are connected to form the anode of the laminated capacitor body. The package body packages the laminated capacitor body, and the cathode and anode of the laminated capacitor body are respectively led out through the lead-out part. The laminated capacitor with this structure has a relatively large equivalent series inductance (ESL), which is likely to have an adverse impact on the circuit performance. Summary of the Utility Model

[0005] Based on this, it is necessary to provide a novel solid-state laminated polymer capacitor with a low equivalent series inductance (ESL) for the above technical problems.

[0006] In order to solve the above technical problems, the utility model adopts the following technical solutions:

[0007] A novel solid-state laminated polymer capacitor, which comprises: a first outer shell, a conductive medium, and a second outer shell, wherein the conductive medium is placed inside a cavity formed by the first outer shell and the second outer shell; the conductive medium includes a voltage-through electrode, a laminated structure, and a grounding structure, the voltage-through electrode and the grounding structure are respectively fixed on the front and back sides of the laminated structure, the voltage-through electrode leads out working pins to the outside of the second outer shell, and the grounding structure leads out grounding pins to the outside of the second outer shell.

[0008] Further, the grounding structure is a grounding electrode, and the grounding electrode includes a grounding electrode substrate, and grounding pins led out from two corresponding sides of the grounding electrode substrate towards the direction of the second outer shell.

[0009] Further, the grounding pins include a first grounding electrode pin and a second grounding electrode pin.

[0010] Further, the voltage-through electrode includes a first through-electrode substrate and a second through-electrode substrate, the first through-electrode substrate and the second through-electrode substrate are arranged from top to bottom along the vertical direction on the front side of the laminated structure, and the working pins include a first through-electrode pin and a second through-electrode pin.

[0011] Further, the upper end of the first through-electrode substrate leads out the first through-electrode pin towards the direction of the second outer shell, and the lower end of the second through-electrode substrate leads out the second through-electrode pin towards the direction of the second outer shell.

[0012] Further, after the first through-electrode pin and the second through-electrode pin penetrate through the second outer shell, they are bent towards the inside of the capacitor to form an L-shaped pin structure.

[0013] Further, the first through-electrode pin is an anode pin, and the second through-electrode pin is a cathode pin.

[0014] Further, after the first grounding electrode pin and the second grounding electrode pin penetrate through the second outer shell, they are bent towards the inside of the capacitor to form an L-shaped pin structure.

[0015] Further, the virtual connection line of the first through-electrode pin and the second through-electrode pin is perpendicular to the virtual connection line of the first grounding electrode pin and the second grounding electrode pin.

[0016] Further, the laminated structure is formed by stacking a plurality of capacitor layers, and the plurality of capacitor layers are bonded by an adhesive layer.

[0017] Compared with the prior art, the present utility model has the following beneficial effects:

[0018] The novel solid-state laminated polymer capacitor provided by the present utility model forms a stable sandwich structure by arranging the laminated structure between the voltage through electrode and the grounding structure. The small residual inductance of the voltage through electrode can play a role in suppressing the pulsating signal in the power supply, making the voltage have inertia when changing, thereby reducing the influence of parasitic inductance. The grounding structure is adjacent to the second outer shell, and the grounding pin led out therefrom is at a short distance from the external welding part. The first grounding electrode pin and the second grounding electrode pin are grounded simultaneously and in a parallel state, further reducing the influence of parasitic inductance on the capacitor and improving the filtering effect of the capacitor. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 is a schematic structural diagram of the novel solid-state laminated polymer capacitor provided by the present utility model;

[0020] Figure 2 is a first exploded view of the novel solid-state laminated polymer capacitor provided by the present utility model;

[0021] Figure 3 is a second exploded view of the novel solid-state laminated polymer capacitor provided by the present utility model;

[0022] Figure 4 is an exploded view of the conductive medium of the novel solid-state laminated polymer capacitor provided by the present utility model;

[0023] Figure 5 is a schematic structural diagram of the voltage through electrode of the novel solid-state laminated polymer capacitor provided by the present utility model;

[0024] Figure 6 is a schematic structural diagram of the grounding electrode of the novel solid-state laminated polymer capacitor provided by the present utility model.

[0025] The reference numerals in the figures are explained as follows:

[0026] The first outer shell 1, the second outer shell 2, the conductive medium 3, the voltage through electrode 31, the capacitor layer 32, the grounding electrode 33, the adhesive layer 34, the first through electrode pin 311, the second through electrode pin 312, the first through electrode substrate 313, the second through electrode substrate 314, the grounding electrode substrate 331, the first grounding electrode pin 332, the second grounding electrode pin 333. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0027] To enable those skilled in the art to better understand the solution of the present utility model, the following will clearly and completely describe the technical solutions in the embodiments of the present utility model in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0028] In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be construed as a limitation to the present utility model.

[0029] In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first", "second", "third" may explicitly or implicitly include at least one of such features. In the description of the present utility model, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0030] As described in the background art, the equivalent series inductance (ESL) of the prior art solid-state laminated capacitor is likely to have an adverse effect on the circuit performance.

[0031] To solve this technical problem, the present utility model provides a novel solid-state laminated polymer capacitor, which includes: a first housing 1, a conductive medium 3, and a second housing 2. The conductive medium 3 is placed inside the cavity formed by the first housing 1 and the second housing 2. The conductive medium 3 includes a voltage through electrode 31, a laminated structure, and a grounding structure. The voltage through electrode 31 and the grounding structure are respectively fixed on the front and back sides of the laminated structure. The voltage through electrode 31 leads out a working pin to the outside of the second housing 2, and the grounding structure leads out a grounding pin to the outside of the second housing 2.

[0032] The new solid-state laminated polymer capacitor provided by the present utility model forms a stable conductive medium between the voltage-through electrode, the laminated structure and the grounding structure. The small amount of residual inductance of the voltage-through electrode can suppress the pulsating signal in the power supply, so that the voltage has inertia when it changes, thereby reducing the influence of parasitic inductance; adding a grounding electrode and leading out grounding pins from the two sides corresponding to the grounding electrode, reducing the voltage mutation at both ends of the capacitor by connecting the grounding pins in parallel and shortening the termination distance, reducing the equivalent series inductance ESL, and improving the filtering effect of the capacitor.

[0033] In order to enable those skilled in the art to better understand the solution of the present invention, the technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings.

[0034] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features and technical solutions therein can be combined with each other.

[0035] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0036] Example 1

[0037] like Figures 1 to 6 As shown, this embodiment proposes a new solid-state multilayer polymer capacitor, which includes a shell and a conductive medium 3. The shell encapsulates the conductive medium 3 body therein, and the conductive medium 3 extends a pin structure to the outside of the shell, and the pin structure is used to be soldered to an external circuit board.

[0038] Furthermore, the shell includes a first shell 1 and a second shell 2, the first shell 1 and the second shell 2 form a closed cavity and accommodate the conductive medium 3 body in the closed cavity, and the conductive medium 3 leads to the outside of the second shell 2 through a pin structure, and the pin structure includes a working pin and a ground pin.

[0039] Further, such as Figure 4As shown, the conductive medium 3 includes a voltage through electrode 31, a stacked structure, and a grounding structure. The voltage through electrode 31 and the grounding structure are respectively disposed on the front and back sides of the stacked structure. Specifically, the front side of the stacked structure is fixed to the voltage through electrode frame 1, and the specific fixing method can be conventional methods such as welding or riveting; the back side of the stacked structure is fixed to the grounding structure, and the specific fixing method can be conventional methods such as pasting with conductive adhesive or conductive paste. Specifically, the voltage through electrode 31 is adjacent to the first housing 1, and the grounding structure is adjacent to the second housing 2. The voltage through electrode 31 and the grounding structure sandwich the stacked structure in the middle, and the structure is stable and firm. By adding the grounding structure, the voltage mutation at both ends of the capacitor is reduced, and the stable operation of the circuit is maintained.

[0040] Furthermore, the stacked structure is formed by stacking a plurality of capacitor layers 32. The number of capacitor layers 32 is determined according to the capacity and model of the capacitor. The capacitor layers 32 are bonded by a bonding layer 34. Specifically, the bonding layer 34 is a welding layer, a conductive adhesive, a conductive paste, or other conventional bonding materials used in capacitors. Furthermore, the capacitor layer 32 is a conductive polymer capacitor layer.

[0041] Furthermore, as Figure 5 shown, the voltage through electrode 31 includes a through electrode first substrate 313 and a through electrode second substrate 314. The through electrode first substrate 313 and the through electrode second substrate 314 are arranged from top to bottom along the vertical direction of the front side of the stacked structure, and the through electrode first substrate 313 and the through electrode second substrate 314 are respectively fixed to the stacked structure by conventional methods such as welding or riveting. Furthermore, the through electrode first substrate 313 leads out a working pin to the outside of the second housing 2. Specifically, the upper end of the through electrode first substrate 313 leads out a through electrode first pin 311 along the direction of the second housing 2, and the lower end of the through electrode second substrate 314 leads out a through electrode second pin 312 along the direction of the second housing 2. Specifically, after the through electrode first pin 311 and the through electrode second pin 312 penetrate through the second housing 2, they are bent towards the inside of the capacitor to form an L-shaped pin structure. Furthermore, the through electrode first pin 311 is an anode pin, and the through electrode second pin 312 is a cathode pin. The stacked structure is in the middle of the voltage through electrode 31 and the grounding structure, forming a stable sandwich structure. The small residual inductance of the voltage through electrode 31 can play a role in suppressing the pulsating signal in the power supply, making the voltage have inertia when changing.

[0042] Furthermore, as Figure 6As shown, the grounding structure is a grounding electrode 33, which includes a grounding electrode substrate 331 and grounding pins extending outward from the grounding electrode substrate 331 to the outside of the second housing 2. The grounding pins include a first grounding electrode pin 332 and a second grounding electrode pin 333. Specifically, the first grounding electrode pin 332 and the second grounding electrode pin 333 are led out from the two corresponding sides of the grounding electrode substrate 331 towards the second housing 2. Further, after the first grounding electrode pin 332 and the second grounding electrode pin 333 penetrate through the second housing 2, they are bent towards the inside of the capacitor to form an L-shaped pin structure.

[0043] Further, the virtual connection line of the first through electrode pin 311 and the second through electrode pin 312 is perpendicular to the virtual connection line of the first grounding electrode pin 332 and the second grounding electrode pin 333. Since the distance between the welding parts of the first grounding electrode pin 332 and the second grounding electrode pin 333 and the external circuit board is short, and both ends of the first grounding electrode pin 332 and the second grounding electrode pin 333 are grounded and in a parallel state, the parasitic inductance can be effectively reduced.

[0044] The manufacturing method of the novel solid-state laminated polymer capacitor proposed in this embodiment is as follows: Determine the number of layers of the capacitor layer 32 according to the capacitance and model of the capacitor, and stack and fix each layer of the capacitor layer 32 with the adhesive layer 34 to form a laminated structure. Fix the voltage through electrode 31 on the front of the laminated structure by welding or riveting, and fix the grounding electrode 33 on the back of the laminated structure with conductive glue or conductive paste. The voltage through electrode 31, the laminated structure, and the grounding electrode 33 form a stable conductive medium 3 structure. The first through electrode pin 311 and the second through electrode pin 312 are led out from the voltage through electrode 31 towards the grounding electrode 33. The first grounding electrode pin 332 and the second grounding electrode pin 333 are led out from the grounding electrode 33 in the opposite direction of the laminated structure. Place the conductive medium 3 into the encapsulation mold, inject the resin encapsulation material to form a first housing 1 and a second housing 2 with good sealing performance. The first housing 1 and the second housing 2 encapsulate the conductive medium 3 inside the housing. The first through electrode pin 311, the second through electrode pin 312, the first pin 332, and the second grounding electrode pin 333 all extend to the outside of the second housing 2 and are bent towards the inside of the capacitor. During use, the pin structures are simultaneously welded to the external circuit board.

[0045] Obviously, the embodiments described above are only a part of the embodiments of the present utility model, rather than all of them. The preferred embodiments of the present utility model are shown in the drawings, but they do not limit the scope of the patent of the present utility model. The present utility model can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosed content of the present utility model more thorough and comprehensive. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing specific embodiments, or perform equivalent replacements on some of the technical features. Any equivalent structure that makes use of the content of the specification and drawings of the present utility model, directly or indirectly applied in other related technical fields, is equally within the scope of the patent protection of the present utility model.

Claims

1. A novel solid-state laminated polymer capacitor, characterized in that, It includes: A first outer shell (1), a conductive medium (3), and a second outer shell (2), wherein the conductive medium (3) is placed inside the cavity formed by the first outer shell (1) and the second outer shell (2); the conductive medium (3) includes a voltage through electrode (31), a stacked structure, and a grounding structure. The voltage through electrode (31) and the grounding structure are respectively fixed on the front and back sides of the stacked structure. The voltage through electrode (31) leads out working pins to the outside of the second outer shell (2), and the grounding structure leads out grounding pins to the outside of the second outer shell (2).

2. The novel solid-state laminated polymer capacitor according to claim 1, wherein The grounding structure is a grounding electrode (33), and the grounding electrode (33) includes a grounding electrode substrate (331) and grounding pins led out from the two corresponding sides of the grounding electrode substrate (331) towards the second outer shell (2).

3. The novel solid-state laminated polymer capacitor according to claim 2, wherein, The grounding pins include a first grounding electrode pin (332) and a second grounding electrode pin (333).

4. The novel solid-state laminated polymer capacitor according to claim 3, characterized in that, The voltage through electrode (31) includes a first through electrode substrate (313) and a second through electrode substrate (314). The first through electrode substrate (313) and the second through electrode substrate (314) are arranged vertically from top to bottom on the front side of the stacked structure. The working pins include a first through electrode pin (311) and a second through electrode pin (312).

5. The novel solid-state laminated polymer capacitor according to claim 4, characterized in that, The upper end of the first through electrode substrate (313) leads out the first through electrode pin (311) towards the second outer shell (2), and the lower end of the second through electrode substrate (314) leads out the second through electrode pin (312) towards the second outer shell (2).

6. The novel solid-state laminated polymer capacitor according to claim 4, characterized in that, After the first through electrode pin (311) and the second through electrode pin (312) penetrate through the second outer shell (2), they are bent towards the inside of the capacitor to form an L-shaped pin structure.

7. The novel solid-state laminated polymer capacitor according to claim 4, wherein The first through electrode pin (311) is an anode pin, and the second through electrode pin (312) is a cathode pin.

8. The novel solid-state laminated polymer capacitor according to claim 2, wherein After the first grounding electrode pin (332) and the second grounding electrode pin (333) penetrate through the second outer shell (2), they are bent towards the inside of the capacitor to form an L-shaped pin structure.

9. The novel solid-state laminated polymer capacitor according to claim 5, wherein, The virtual connection line of the first through electrode pin (311) and the second through electrode pin (312) is perpendicular to the virtual connection line of the first grounding electrode pin (332) and the second grounding electrode pin (333).

10. The novel solid-state laminated polymer capacitor according to claim 1, characterized in that, The stacked structure is formed by stacking a plurality of capacitor layers (32), and the plurality of capacitor layers (32) are bonded by an adhesive layer (34).

Images