Electronic thermal overload relay
By designing the circuit board bracket and housing structure in an electronic thermal overload relay, the problem of easy displacement and loosening of the PCB board in a vibrating environment is solved, and higher structural stability and vibration resistance are achieved.
Patent Information
- Application Number
- CN202422367133.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-26
- Publication Date
- 2025-08-01
- Estimated Expiration
- 2034-09-26
AI Technical Summary
The existing electronic thermal overload relays have poor stability in the PCB board fixing structure in vibrating environments, which are prone to displacement, impact and loose components, resulting in product failure.
The circuit board bracket design is adopted, including planar structure, support structure, limit groove and reinforcement ribs. The PCB board is fixed by self-tapping screws and snaps, and structural ribs and limit structures are installed in the shell to enhance overall stability.
Improve the structural stability of electronic thermal overload relays in vibrating environments, prevent PCB board shift and components loosening, and reduce product failures.
Smart Images
Figure CN223181040U_ABST
Abstract
Description
Technical Field
[0001] The embodiments of the present utility model relate to the technical field of relays, and in particular, to an electronic thermal overload relay. Background Art
[0002] An electronic thermal overload relay is a commonly used relay, which can judge faults by detecting the current amplitude. During normal operation, the negative sequence component and the zero sequence component are absent or very small, and once they appear, it indicates that an asymmetrical fault has occurred. Compared with traditional thermal relays, electronic overload relays have the advantages of fast response speed, high precision, and the ability to achieve multiple protection functions. It usually includes electronic components and related circuits. Using semiconductor non-contact technology, not only can the response speed be adjusted arbitrarily, but also the connection life is long, it can be precisely manufactured, and it can reflect slight current changes. In order to realize the above functions of the relay, the structure of the relay needs to be more stable to avoid component loosening and product failure. Summary of the Utility Model
[0003] The embodiments of the present utility model provide an electronic thermal overload relay, which solves the technical problem that the fixing structure of the PCB board of the electronic thermal overload relay in the prior art is less stable, resulting in easy PCB displacement, impact, and component loosening in a vibration environment, and thus causing product failure.
[0004] The embodiments of the present utility model provide an electronic thermal overload relay, which includes a PCB board and a circuit board bracket; the PCB board is arranged on the circuit board bracket;
[0005] The circuit board bracket includes a planar structure and multiple support structures. The multiple support structures are perpendicular to the planar structure and are semi-surrounded at the edge of the planar structure;
[0006] At least one self-tapping screw groove for fixing the PCB board is arranged on the planar structure;
[0007] Multiple limiting grooves for fixing the PCB board are arranged on the support structure.
[0008] Further, the circuit board bracket further includes multiple reinforcing ribs;
[0009] The multiple reinforcing ribs are perpendicularly arranged on the upper and lower surfaces of the planar structure.
[0010] Further, the circuit board bracket further includes at least three support columns;
[0011] The support columns are arranged on the side of the planar structure away from the PCB board.
[0012] Further, the circuit board support further includes at least two buckles:
[0013] The two buckles are respectively arranged at the edges where the two sides of the planar structure intersect with the support structure.
[0014] Further, the electronic thermal overload relay further includes a housing structure; the housing structure includes an upper cover and a housing body;
[0015] The PCB board and the circuit board support are both arranged inside the housing body, and the upper cover and the top of the housing body are fitted together by buckles; the circuit board support is fixed inside the housing body through the buckles.
[0016] Further, a plurality of structural ribs are arranged at the outer bottom of the housing body;
[0017] A plurality of arc separating plate grooves are reserved on the outer surface of the housing body.
[0018] Further, a plurality of limiting grooves and self-tapping screw grooves for fixing the bus bar are arranged at the inner bottom of the housing body;
[0019] A plurality of openings for the bus bar to extend out are arranged on the outer front surface of the housing body.
[0020] Further, the electronic thermal overload relay further includes an instrument transformer and the bus bar; the instrument transformer and the bus bar are both arranged inside the housing body;
[0021] The instrument transformer is arranged at the lower end of the circuit board support;
[0022] The bus bar is arranged through the hollow coil of the instrument transformer, and the bus bar correspondingly passes through the opening on the surface of the housing body.
[0023] Further, the electronic thermal overload relay further includes a terminal block;
[0024] The terminal block is arranged on the PCB board.
[0025] Further, an I-shaped limiting structure is further arranged inside the housing body, and the limiting structure is used for fixing an indicator light arranged under the outer surface of the housing body.
[0026] An embodiment of the present utility model discloses an electronic thermal overload relay, which includes a PCB board and a circuit board bracket; the PCB board is arranged on the circuit board bracket; the circuit board bracket includes a planar structure and multiple support structures, the multiple support structures are perpendicular to the planar structure and are semi-surrounded and arranged at the edge of the planar structure; at least one self-tapping screw groove for fixing the PCB board is arranged on the planar structure; multiple limiting grooves for fixing the PCB board are arranged on the support structure. By arranging the circuit board bracket and providing support structures and limiting grooves on the circuit board bracket, the PCB board is fixed in multiple aspects, solving the technical problem that the fixing structure of the PCB board of the electronic thermal overload relay in the prior art is relatively poor in stability, resulting in easy PCB displacement, impact, and component loosening in a vibration environment, and further causing product failures, and achieving the technical effect of improving the structural stability of the PCB of the electronic thermal overload relay. Description of the Drawings
[0027] Figure 1 It is a structural diagram of the PCB board and the circuit board bracket of an electronic thermal overload relay provided by an embodiment of the present utility model;
[0028] Figure 2 It is a front view of the PCB board and the circuit board bracket of an electronic thermal overload relay provided by an embodiment of the present utility model;
[0029] Figure 3 It is a structural diagram of the circuit board bracket provided by an embodiment of the present utility model;
[0030] Figure 4 It is a reverse structural diagram of the circuit board bracket provided by an embodiment of the present utility model;
[0031] Figure 5 It is a structural diagram of a certain model of electronic thermal overload relay provided by an embodiment of the present utility model;
[0032] Figure 6 It is an external view of a certain model of electronic thermal overload relay provided by an embodiment of the present utility model;
[0033] Figure 7 It is a schematic diagram of the bottom of the outer side of the shell body provided by an embodiment of the present utility model;
[0034] Figure 8 It is a schematic diagram of the outer surface of the shell body provided by an embodiment of the present utility model;
[0035] Figure 9 It is a schematic diagram of the bottom of the inner side of the shell body provided by an embodiment of the present utility model;
[0036] Figure 10 It is a schematic diagram of the bus bar and the current transformer provided by an embodiment of the present utility model;
[0037] Figure 11 It is a schematic diagram of the hollow coil of the mutual inductor provided by the embodiment of the utility model;
[0038] Figure 12 It is a schematic diagram of the limit structure provided by the embodiment of the present utility model. Detailed implementation manners
[0039] The present utility model will be further described in detail below with reference to the drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the present utility model, rather than limiting the present utility model. Additionally, it should be noted that for the convenience of description, only the parts related to the present utility model rather than all the structures are shown in the drawings.
[0040] It should be noted that the terms "first", "second", etc. in the description and claims of the present utility model and the drawings are used to distinguish different objects, rather than to limit a specific order. Each of the following embodiments of the present utility model can be implemented independently, and the embodiments can also be combined with each other. The embodiments of the present utility model do not make specific limitations on this.
[0041] Figure 1 and Figure 2 They are the structural diagram and front view of the PCB board and circuit board bracket of an electronic thermal overload relay provided by the embodiment of the present utility model. Figure 3 and Figure 4 They are respectively the structural diagrams of the front and back sides of the circuit board bracket provided by the embodiment of the present utility model.
[0042] As Figures 1-3 shown, the electronic thermal overload relay includes a PCB board 10 and a circuit board bracket 20; the PCB board 10 is arranged on the circuit board bracket 20.
[0043] The circuit board bracket 20 includes a planar structure 21 and multiple sections of support structures 22. The multiple sections of support structures 22 are perpendicular to the planar structure 21 and are semi-surroundingly arranged at the edge of the planar structure 21; at least one self-tapping screw groove 23 for fixing the PCB board 10 is arranged on the planar structure 21; and multiple limit grooves 24 for fixing the PCB board 10 are arranged on the support structures 22.
[0044] Specifically, the PCB board 10 is fixed on the circuit board bracket 20 by self-tapping screws 23-1 through the self-tapping screw slots 23, and the PCB board 10 is supported by the multi-segment support structure 22 provided on the circuit board bracket 20. On the one hand, it gives a certain space to the components on the reverse side of the PCB board 10, and on the other hand, it also helps with the heat dissipation of the PCB board 10. The limiting slots 24 on the support structure 22 can assist the self-tapping screws in fixing the PCB board 10, effectively preventing the movement of the PCB board 10 and improving the internal structure stability of the electronic thermal overload relay.
[0045] The utility model fixes the PCB board in multiple ways by setting a circuit board bracket and providing a support structure and limiting slots on the circuit board bracket, solving the technical problem that the fixing structure of the PCB board in the existing electronic thermal overload relay is less stable, which may lead to PCB displacement, impact, and component loosening in a vibration environment, and further causing product failures, and achieving the technical effect of improving the structural stability of the PCB board in the electronic thermal overload relay.
[0046] Optionally, as Figure 3 and Figure 4 shown, the circuit board bracket 20 further includes multiple reinforcing ribs 25; the multiple reinforcing ribs 25 are perpendicularly arranged on the upper and lower surfaces of the planar structure 21.
[0047] Specifically, by arranging multiple mutually perpendicular reinforcing ribs 25 on both the upper and lower surfaces of the planar structure 21, the planar structure 21 still has strong stability, is not easily deformed, and does not affect the space occupied by the PCB board 10 even when the size is ultra-thin.
[0048] Optionally, as Figure 2 and 4 shown, the circuit board bracket 20 further includes at least three support columns 26; the support columns 26 are arranged on the side of the planar structure 21 away from the PCB board 10.
[0049] Specifically, the support columns 26 are used to place the circuit board bracket 20 on the current transformer 50, and a certain gap is left between the planar structure 21 of the circuit board bracket 20 and the current transformer 50 to facilitate the heat dissipation of the current transformer 50.
[0050] Optionally, as Figure 4 shown, the circuit board bracket 20 further includes at least two buckles 27: the two buckles 27 are respectively arranged at the edges where the two sides of the planar structure 21 intersect with the support structure 22.
[0051] Specifically, the buckles 27 are used to fix the circuit board bracket 20 inside the housing 32 of the electronic thermal overload relay, further strengthening the stability of the circuit board bracket 20, thereby making the stability of the PCB board 10 higher.
[0052] Figure 5 and Figure 6 are respectively the structural diagram and the external view of a certain model of electronic thermal overload relay provided by the embodiment of the present utility model.
[0053] Optionally, as shown in Figure 5 and Figure 6 the electronic thermal overload relay further includes a housing structure 30; the housing structure 30 includes an upper cover 31 and a housing body 32; the PCB board 10 and the circuit board bracket 20 are both arranged inside the housing body 32, and the upper cover 31 is fitted with the top of the housing body 32 through a buckle 311; the circuit board bracket 20 is fixed inside the housing body 32 through a buckle 27.
[0054] Specifically, the buckle 311 on the upper cover 31 can be fitted with a locking mechanism 321 at a corresponding position on the housing body 32 to protect the internal components of the electronic thermal overload relay. The buckle 27 on the circuit board bracket 20 also has a corresponding locking mechanism 322 at a corresponding position on the side surface of the housing body 32, which can firmly fix the circuit board bracket 20 inside the housing body 32 to support the PCB board 10.
[0055] Figure 7 and Figure 8 are respectively the schematic diagrams of the bottom outside the housing body and the surface outside the housing body provided by the embodiment of the present utility model.
[0056] Optionally, as shown in Figure 7 and Figure 8 multiple structural ribs 323 are arranged at the bottom outside of the housing body 32; multiple arc separation plate grooves 324 are reserved on the surface outside the housing body 32.
[0057] Specifically, multiple structural ribs 323 that are perpendicular to each other and crisscross horizontally and vertically are arranged at the bottom outside of the housing body 32 to enhance the stability of the housing body 32. Multiple arc separation plate grooves 324 are reserved on the surface outside the housing body 32 for installing arc separation plates when needed to improve the safety of the electronic thermal overload relay.
[0058] Figure 9 is the schematic diagram of the bottom inside the housing body provided by the embodiment of the present utility model.
[0059] Optionally, as shown in Figure 9 multiple limiting grooves 325 and self-tapping screw grooves 326 for fixing the busbar 40 are arranged at the bottom inside the housing body 32; as shown in Figure 5 and Figure 8 multiple openings 327 for the busbar 40 to extend out are arranged on the front surface outside the housing body 32.
[0060] Figure 10 is the schematic diagram of the busbar and the current transformer provided by the embodiment of the present utility model, Figure 11It is a schematic diagram of the hollow coil of the mutual inductor provided by the embodiment of the utility model.
[0061] Optionally, as Figure 5 shown, the electronic thermal overload relay further includes a mutual inductor 50 and a bus bar 40; both the mutual inductor 50 and the bus bar 40 are arranged inside the housing 32; the mutual inductor 50 is arranged at the lower end of the circuit board bracket 20; see Figure 10 and Figure 11 shown, the bus bar 40 is arranged through the hollow coil 51 of the mutual inductor 50, and the bus bar correspondingly passes through the opening 327 on the surface of the housing 32.
[0062] Specifically, the bus bar 40 is fixed on the housing 32 by the twisting of the self-tapping screw 326-1 and the self-tapping screw groove 326, and passes through the hollow coil 51 of the mutual inductor 50 and extends out through the opening 327 on the outer front surface of the housing 32.
[0063] Optionally, as Figure 5 and Figure 6 shown, the electronic thermal overload relay further includes a terminal block 60; the terminal block 60 is arranged on the PCB board 10.
[0064] Specifically, the electronic thermal overload relay can be externally powered, and the voltage of 110V - 220V is reduced to 3.3V through the step-down module. Among them, the external power supply is connected through the terminal block 60, and the terminal block 60 is composed of a male seat and a female seat, and the female seat is welded on the PCB board 10.
[0065] Figure 12 It is a schematic diagram of the limit structure provided by the embodiment of the utility model.
[0066] Optionally, as Figure 12 shown, an I-shaped limit structure 328 is further arranged inside the housing 32, and the limit structure 328 is used to fix the indicator light 70 arranged below the outer surface of the housing 32.
[0067] Specifically, the indicator light 70 includes a light guide column structure and a surface-mounted LED (Light-Emitting Diode) lamp. In order to ensure the stability of the indicator light 70, an I-shaped limit structure 328 that is fitted with the light guide column structure of the indicator light 70 is also arranged below the outer surface of the housing 32, which is used to prevent the indicator light 70 from moving up and down and left and right, and enhance its stability.
[0068] In the description of the embodiments of the present utility model, unless otherwise clearly defined and limited, the terms "installation", "connection", and "coupling" shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.
[0069] Finally, it should be noted that the above are only the preferred embodiments of the present utility model and the technical principles applied. Those skilled in the art will understand that the present utility model is not limited to the specific embodiments described herein. Various obvious changes, re-adjustments, and substitutions can be made by those skilled in the art without departing from the protection scope of the present utility model. Therefore, although the present utility model has been described in more detail through the above embodiments, the present utility model is not limited to the above embodiments. Without departing from the concept of the present utility model, more other equivalent embodiments can be included, and the scope of the present utility model is determined by the scope of the appended claims.
Claims
1. An electronic thermal overload relay, characterized in that, The electronic thermal overload relay includes a PCB board and a circuit board bracket; the PCB board is arranged on the circuit board bracket; The circuit board bracket includes a planar structure and multiple support structures. The multiple support structures are perpendicular to the planar structure and are semi-surrounded and arranged at the edge of the planar structure; At least one self-tapping screw groove for fixing the PCB board is arranged on the planar structure; Multiple limiting grooves for fixing the PCB board are arranged on the support structure.
2. The electronic thermal overload relay according to claim 1, wherein, The circuit board bracket further includes multiple reinforcing ribs; The multiple reinforcing ribs are perpendicularly arranged on the upper and lower surfaces of the planar structure.
3. The electronic thermal overload relay according to claim 1, characterized in that, The circuit board bracket further includes at least three support columns; The support columns are arranged on the side of the planar structure away from the PCB board.
4. The electronic thermal overload relay according to claim 1, characterized in that The circuit board bracket further includes at least two buckles: The two buckles are respectively arranged at the edges where the two sides of the planar structure intersect with the support structure.
5. The electronic thermal overload relay according to claim 4, wherein The electronic thermal overload relay further includes a housing structure; the housing structure includes an upper cover and a housing body; [[ID= 8. The electronic thermal overload relay according to claim 7, characterized in that, 9. The electronic thermal overload relay according to claim 1, characterized in that, 10. The electronic thermal overload relay according to claim 5, wherein,