Substrate slice cleaning device

Abstract

The utility model discloses a substrate slice cleaning device which comprises a water tank used for containing cleaning liquid, a clamp assembly, a rotary driving piece, a lifting driving assembly and a support, the rotary driving piece is connected with the clamp assembly so as to drive the clamp assembly to rotate, the lifting driving assembly is installed on the support, and the lifting driving assembly is connected with the water tank. And the lifting driving assembly is connected with the rotary driving part, so that the clamp assembly is suspended in the water tank, and the clamp assembly is driven to do lifting motion. The substrate cleaning device is driven by the rotary driving part to rotate, so that the cleaning liquid can uniformly flow on the surface of the substrate, and dirt attached to the surface can be removed. In addition, according to the embodiment, the lifting frequency is adjusted through the lifting driving assembly to control the soaking time, soaking and cleaning with different requirements are met, and the cleaning flexibility is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer cleaning, in particular to a wafer cleaning device. Background Art

[0002] In the fields of semiconductor manufacturing, microelectronic device processing, and precision optical element cleaning, traditional cleaning techniques mainly rely on a single rotational motion to clean wafers. Although this cleaning method can basically meet the requirements of surface cleanliness, a single rotational motion often has difficulty meeting the rinsing requirements at different times. Content of the Utility Model

[0003] The technical problem to be solved by the utility model is that a single rotational motion often has difficulty meeting the rinsing requirements at different times.

[0004] To solve the above technical problem, the utility model provides a wafer cleaning device, which includes a water tank for containing cleaning liquid, a fixture assembly, a rotation driving member, a lifting driving assembly, and a bracket. The rotation driving member is connected to the fixture assembly to drive the fixture assembly to perform a rotational motion. The lifting driving assembly is installed on the bracket, and the lifting driving assembly is connected to the rotation driving member so that the fixture assembly is suspended in the water tank and drives the fixture assembly to perform a lifting motion.

[0005] In some embodiments, the lifting driving assembly includes a first driving member, a slider, and a guide rail. The guide rail and the first driving member are installed on the bracket. The guide rail is arranged along the height direction parallel to the water tank. The rotation driving member is connected to the slider, and the slider is slidably installed on the guide rail. The first driving member is used to drive the slider to slide along the length direction of the guide rail.

[0006] In some embodiments, the lifting driving assembly further includes a gear member and a rack member. The output shaft of the first driving member is connected to the gear member. The rack member is installed on the slider. The gear member meshes with the rack member, and the rotation driving member is connected to the rack member.

[0007] In some embodiments, the rack member includes a rack portion and a mounting portion. The rack portion is connected to the mounting portion, and the rack portion and the mounting portion are perpendicularly arranged. A rack meshing with the gear member is provided on the rack portion, and the rotation driving member is installed on the mounting portion.

[0008] In some embodiments, the bracket includes a first mounting plate and a second mounting plate. The first mounting plate is connected to the second mounting plate, and the first mounting plate and the second mounting plate are perpendicularly arranged. The guide rail is arranged on the first mounting plate, and the first driving member is installed on the second mounting plate.

[0009] In some embodiments, a notch is formed on the side of the first mounting plate facing the notch of the water tank.

[0010] In some embodiments, the fixture assembly includes a first fixture and a second fixture. The first fixture is connected to the rotary drive member, and the first fixture is cooperatively connected to the second fixture to fix the substrate wafer.

[0011] In some embodiments, the first fixture has a connecting shaft connected to the first drive member.

[0012] In some embodiments, a plurality of first fixing members are further included. The first fixture and the second fixture are connected by the first fixing members. The first fixture is provided with a first through hole adapted to the substrate wafer, and the second fixture is provided with a second through hole corresponding to the first through hole for the cleaning liquid to flow through and clean the substrate wafer.

[0013] In some embodiments, a groove is recessed on one side of the first fixture facing the second fixture, and the width of the groove is greater than the width of the first through hole.

[0014] Compared with the prior art, the beneficial effects of the substrate wafer cleaning device according to the embodiment of the present invention are as follows:

[0015] The water tank in the embodiment of the present invention is used to load the cleaning liquid to ensure that the substrate wafer is completely immersed in the cleaning liquid. The fixture assembly is used to fix and support the substrate wafer to ensure that the substrate wafer remains stable during the cleaning process, and the rotary drive member is used to drive its rotation, so that the cleaning liquid can generate uniform flow on the surface of the substrate wafer, which helps to remove the dirt attached to the surface. In addition, in this embodiment, the soaking time is controlled by adjusting the lifting frequency of the lifting drive assembly to meet the soaking cleaning requirements of different needs, increasing the flexibility of cleaning. Description of the Drawings

[0016] Figure 1 is a first-angle schematic view of the substrate wafer cleaning device provided by the embodiment of the present invention;

[0017] Figure 2 is a second-angle schematic view of the substrate wafer cleaning device provided by the embodiment of the present invention;

[0018] Figure 3 is a schematic structural view of the tooth condition provided by the embodiment of the present invention;

[0019] Figure 4 is a schematic structural view of the fixture assembly provided by the embodiment of the present invention;

[0020] Figure 5It is a schematic structural diagram of the first fixture and the connecting shaft provided by the embodiment of the present utility model;

[0021] In the figure, 1 is a water tank; 2 is a fixture assembly; 21 is a first fixture, 211 is a first through hole, 212 is a groove; 22 is a second fixture, 221 is a second through hole; 23 is a connecting shaft; 3 is a rotation driving member; 4 is a lifting driving assembly, 41 is a first driving member, 42 is a slider, 43 is a guide rail, 44 is a gear member, 45 is a rack member, 451 is a rack portion, 452 is a mounting portion; 5 is a bracket, 51 is a first mounting plate, 511 is a notch, 52 is a second mounting plate; 6 is a first fixing member. Detailed implementation manners

[0022] The following combines the drawings and embodiments to further describe in detail the specific implementation manners of the present utility model. The following embodiments are used to illustrate the present utility model, but are not used to limit the scope of the present utility model.

[0023] As Figure 1 and Figure 2 shown, the present utility model provides a cleaning device for a substrate wafer, including a water tank 1 for containing a cleaning liquid, a fixture assembly 2, a rotation driving member 3, a lifting driving assembly 4 and a bracket 5. The rotation driving member 3 is connected to the fixture assembly 2 to drive the fixture assembly 2 to perform a rotation motion. The lifting driving assembly 4 is installed on the bracket 5, and the lifting driving assembly 4 is connected to the rotation driving member 3 so that the fixture assembly 2 is suspended in the water tank 1 and drives the fixture assembly 2 to perform a lifting motion.

[0024] The water tank 1 of this embodiment is used to contain the cleaning liquid to ensure that the substrate wafer is completely immersed in the cleaning liquid. The fixture assembly 2 is used to fix and support the substrate wafer to ensure that the substrate wafer remains stable during the cleaning process, and the rotation driving member 3 is used to drive its rotation, which can make the cleaning liquid flow uniformly on the surface of the substrate wafer, helping to remove the dirt attached to the surface. In addition, in this embodiment, the soaking time is controlled by adjusting the lifting frequency of the lifting driving assembly 4 to meet the soaking cleaning requirements of different needs, increasing the flexibility of cleaning.

[0025] In some embodiments, the lifting drive assembly 4 includes a first drive member 41, a slider 42, and a guide rail 43. The guide rail 43 and the first drive member 41 are mounted on the bracket 5. The guide rail 43 is arranged along the height direction parallel to the water tank 1, providing an up-and-down movement path for the slider 42. The rotary drive member 3 is connected to the slider 42, and the slider 42 is slidably mounted on the guide rail 43. When the slider 42 slides under the action of the first drive member 41, the rotary drive member 3 and the fixture assembly 2 fixed thereto also move up and down accordingly. The first drive member 41, as the power source, is responsible for providing the driving force to drive the slider 42 to slide along the length direction of the guide rail 43. The first drive member 41 in this embodiment can be an electric motor, a pneumatic cylinder, or other forms of drive devices, and the up-and-down movement speed and distance can be adjusted according to the requirements of the control system.

[0026] Based on the above structure, in this embodiment, by adjusting the first drive member 41, the up-and-down sliding distance of the slider 42 along the guide rail 43 can be accurately controlled, and further, the immersion depth of the fixture assembly 2 and the lining film in the cleaning liquid can be controlled, so as to meet the immersion time setting under different cleaning requirements.

[0027] In some embodiments, the lifting drive assembly 4 further includes a gear member 44 and a rack member 45. The output shaft of the first drive member 41 is connected to the gear member 44 to transmit the rotational motion to the gear member 44. The rack member 45 is mounted on the slider 42. The gear member 44 meshes with the rack member 45 to receive the rotational driving force from the gear member 44 and convert the rotational motion generated by the first drive member 41 into the linear motion required to drive the slider 42 to move up and down. The rotary drive member 3 is connected to the rack member 45. In this embodiment, by using gear transmission as the transmission method, the high precision and stability in the power transmission process can be ensured, the errors and vibrations in the transmission process can be reduced, and the up-and-down movement of the slider 42 can be made smoother and more controllable.

[0028] Refer to together Figure 3 , the rack member 45 includes a rack portion 451 and a mounting portion 452. The rack portion 451 is connected to the mounting portion 452, and the rack portion 451 is perpendicular to the mounting portion 452. The rack portion 451 is connected to the slider 42. A rack meshing with the gear member 44 is provided on the rack portion 451. The rotary drive member 3 is mounted on the mounting portion 452. In this embodiment, by vertically arranging the rack portion 451 and the mounting portion 452, the structure of the rack member 45 is simplified. While avoiding interference with other structures, a stable mounting platform is provided for the rotary drive member 3.

[0029] In some embodiments, the bracket 5 includes a first mounting plate 51 and a second mounting plate 52. The first mounting plate 51 is connected to the second mounting plate 52, providing a support frame for the entire cleaning device. The first mounting plate 51 and the second mounting plate 52 are perpendicularly arranged, which not only avoids mutual interference but also maximally utilizes the available space, ensuring a reasonable installation position for the driving member. The guide rail 43 is arranged on the first mounting plate 51, and the first driving member 41 is mounted on the second mounting plate 52.

[0030] In some embodiments, a notch 511 is formed on the side of the first mounting plate 51 facing the notch of the water tank 1, so as to exactly avoid the water tank 1 during installation, ensuring that there is no interference or collision between the bracket 5 and the water tank 1, so that the installation can be carried out smoothly and the installation difficulty caused by structural conflicts can be avoided.

[0031] Refer to Figure 4 and Figure 5 , the fixture assembly 2 includes a first fixture 21 and a second fixture 22. The first fixture 21 is connected to the rotary driving member 3, so that the first fixture 21 can follow the rotational movement of the driving member and drive the backing sheet to rotate together. The first fixture 21 and the second fixture 22 are cooperatively connected to fix the backing sheet.

[0032] It can be understood that the second fixture 22 of this embodiment is cooperatively connected with the first fixture 21 to jointly complete the fixation of the backing sheet. The second fixture 22 can cooperate with the first fixture 21 through snap fasteners, screws, magnetic attraction, etc. to ensure that the backing sheet remains stable during rotation and lifting, avoiding slippage or damage.

[0033] In some embodiments, the first fixture 21 has a connecting shaft 23 connected to the first driving member 41. The connecting shaft 23 plays a bridging role to transmit the rotational power generated by the first driving member 41 to the first fixture 21. When the first driving member 41 rotates, through the connecting shaft 23, this rotational movement will be transmitted to the first fixture 21, and then drive the entire fixture assembly 2 and the clamped backing sheet to rotate together.

[0034] In some embodiments, it further includes a plurality of first fixing members 6. The first clamp 21 and the second clamp 22 are connected by the first fixing members 6. The fixing members in this embodiment can be screws, pins or other fasteners, which pass through the second clamp 22 and are connected to the first clamp 21 to ensure that the first clamp 21 and the second clamp 22 can be closely fitted to stably clamp the substrate wafer and prevent it from moving or falling off during the cleaning process. In addition, the first clamp 21 is provided with a first through hole 211 adapted to the substrate wafer, which can tightly wrap a part of the substrate wafer to reduce vibration and displacement during cleaning. The second clamp 22 is provided with a second through hole 221 corresponding to the first through hole 211. The two through holes are aligned to form a continuous channel, allowing the cleaning liquid to freely flow between the first clamp 21 and the second clamp 22 and around the substrate wafer, so that the cleaning liquid can flow through to clean the substrate wafer, improving the cleaning efficiency and ensuring that the cleaning liquid can reach all surfaces and gaps of the substrate wafer to effectively remove contaminants.

[0035] In some embodiments, a groove 212 is formed by recessing one side of the first clamp 21 facing the second clamp 22 for mounting the substrate wafer. In addition, the width of the groove 212 is greater than the width of the first through hole 211 to limit the substrate wafer to prevent it from slipping, while allowing the cleaning liquid to pass through to clean the substrate wafer.

[0036] In summary, the embodiment of the present utility model provides a substrate wafer cleaning device. Its water tank 1 is used to load the cleaning liquid to ensure that the substrate wafer is completely immersed in the cleaning liquid. The clamp assembly 2 is used to fix and support the substrate wafer to ensure that the substrate wafer remains stable during the cleaning process, and the rotation driving member 3 is used to drive its rotation, which can make the cleaning liquid generate uniform flow on the surface of the substrate wafer, helping to remove the dirt attached to the surface. In addition, in this embodiment, the soaking time is controlled by adjusting the lifting frequency of the lifting driving assembly 4 to meet the soaking cleaning requirements of different needs and increase the flexibility of cleaning.

[0037] The above are only the preferred embodiments of the present utility model. It should be noted that for those of ordinary skill in the art, without departing from the technical principle of the present utility model, several improvements and replacements can be made, and these improvements and replacements should also be regarded as the protection scope of the present utility model.

Claims

1. A substrate cleaning device, characterized in that, It includes a water tank for containing cleaning liquid, a fixture assembly, a rotary drive, a lifting drive assembly and a bracket. The rotary drive is connected to the fixture assembly to drive the fixture assembly to perform a rotary motion. The lifting drive assembly is installed on the bracket, and the lifting drive assembly is connected to the rotary drive so that the fixture assembly is suspended in the water tank and drives the fixture assembly to perform a lifting motion.

2. The cleaning device for a substrate wafer according to claim 1, wherein, The lifting drive assembly includes a first drive, a slider and a guide rail. The guide rail and the first drive are installed on the bracket. The guide rail is arranged along the height direction parallel to the water tank. The rotary drive is connected to the slider, and the slider is slidably installed on the guide rail. The first drive is used to drive the slider to slide along the length direction of the guide rail.

3. The cleaning device for the substrate wafer according to claim 2, characterized in that, The lifting drive assembly further includes a gear member and a toothed member. The output shaft of the first drive is connected to the gear member. The toothed member is installed on the slider. The gear member meshes with the toothed member, and the rotary drive is connected to the toothed member.

4. The cleaning device for a substrate wafer according to claim 3, wherein, The toothed member includes a rack portion and a mounting portion. The rack portion is connected to the mounting portion, and the rack portion is perpendicular to the mounting portion. A rack meshing with the gear member is provided on the rack portion. The rotary drive is installed on the mounting portion.

5. The cleaning device for a substrate wafer according to claim 2, characterized in that, The bracket includes a first mounting plate and a second mounting plate. The first mounting plate is connected to the second mounting plate, and the first mounting plate is perpendicular to the second mounting plate. The guide rail is arranged on the first mounting plate, and the first drive is installed on the second mounting plate.

6. The cleaning device for a substrate wafer according to claim 5, characterized in that A notch is formed on the side of the first mounting plate facing the notch of the water tank.

7. The cleaning device for a substrate wafer according to claim 2, wherein, The fixture assembly includes a first fixture and a second fixture. The first fixture is connected to the rotary drive. The first fixture and the second fixture are cooperatively connected to fix the substrate film.

8. The cleaning device for a substrate wafer according to claim 7, wherein, The first fixture has a connecting shaft connected to the first drive.

9. The cleaning device for a substrate wafer according to claim 7, wherein, It further includes a plurality of first fixing members. The first fixture and the second fixture are connected by the first fixing members. The first fixture is provided with a first through hole adapted to the substrate film, and the second fixture is provided with a second through hole corresponding to the first through hole for the cleaning liquid to flow through to clean the substrate film.

10. The cleaning device for the substrate wafer according to claim 9, characterized in that, A groove is recessed on one side of the first fixture facing the second fixture. The width of the groove is greater than the width of the first through hole.

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