Top-mounted high-precision temperature control device

Abstract

The utility model provides a top-mounted high-precision temperature control device. The top-mounted high-precision temperature control device comprises a water inlet, a water outlet, a hoisting plate, an outer shell, a frame, a water coil, a fan, a first-stage heating module, a second-stage heating module, a flow equalizing static pressure box body and a high-efficiency filter, the outer shell is mounted on the frame to form a cavity; the outer shell is further provided with an air inlet and an air outlet. The hoisting plate is mounted on the frame, and a hoisting hole is formed in the hoisting plate; according to the utility model, through the installation hoisting plate, the device can be installed above the semiconductor detection equipment during use, so that the device is small in occupied area and can be well butted with the semiconductor detection equipment, and high-precision constant-temperature clean air is provided for the semiconductor detection equipment. Air is cooled through the water coil pipe, sufficient heat exchange of the air is guaranteed, a cooling source is low in noise and vibration, and high requirements of semiconductor detection equipment are met.

Description

Technical Field

[0001] The utility model relates to the technical field of clean and constant temperature control in the semiconductor industry, and particularly relates to a top-mounted high-precision temperature control device. Background Art

[0002] In the etching process of semiconductor production and manufacturing, an accurate working temperature needs to be provided, and the process has strict requirements for cleanliness and electrical insulation. However, the existing temperature control devices for the semiconductor industry on the market are mainly in the form of floor-mounted, and provide constant temperature and clean air to semiconductor detection equipment through air duct connection, occupying a large area. Moreover, the existing temperature control devices for the semiconductor industry on the market mainly use a chiller as a cooling source, and the chiller has relatively large noise and vibration, which will affect semiconductor detection equipment. Summary of the Invention

[0003] In view of the above problems, the utility model provides a top-mounted high-precision temperature control device.

[0004] To achieve the above object, the utility model adopts the following technical solutions:

[0005] A top-mounted high-precision temperature control device includes a water inlet, a water outlet, a lifting plate, a housing, a frame, a water coil, a fan, a primary heating module, a secondary heating module, and a uniform flow static pressure box.

[0006] The housing is installed on the frame to form a cavity; the housing also has an air inlet and an air outlet; the lifting plate is installed on the frame.

[0007] The water inlet and the water outlet are installed on the housing; the water coil, the fan, the primary heating module, the secondary heating module, and the uniform flow static pressure box are installed inside the housing.

[0008] The primary heating module includes an inlet and an outlet; the inlet of the primary heating module is communicated with the water inlet on the housing, the outlet of the primary heating module is communicated with the water inlet of the water coil, and the water outlet of the water coil is communicated with the water outlet on the housing; the front end of the water coil is communicated with the air inlet, and the rear end of the water coil is installed with the secondary heating module.

[0009] The fan includes an air inlet end and an air outlet end, the fan is arranged at the rear end of the secondary heating module, the air inlet end inputs the gas heated by the secondary heating module, and the air outlet end is communicated with the uniform flow static pressure box.

[0010] Further, the frame is a hexahedron bracket composed of multiple connecting rods. A partition is installed inside the frame. The partition divides the cavity into an upper chamber and a lower chamber. The partition is provided with a fan mounting hole, and the fan is mounted on the partition. The air inlet end of the fan is located in the upper chamber, and the air outlet end of the fan faces the lower chamber. The water coil, the primary heating module, and the secondary heating module are installed in the upper chamber, the uniform flow static pressure box is arranged in the lower chamber, the air inlet is located on the side surface of the outer shell of the upper chamber, and the air outlet is located on the lower surface of the outer shell.

[0011] Further, a duct is also provided in the upper chamber. The secondary heating module is installed in the duct. One end of the duct communicates with the water coil, and the other end of the duct communicates with the air inlet end of the fan.

[0012] Further, the water coil includes an outer box body and an inner coil. The inner coil is fixed inside the outer box body. The outer box body is fixed on the frame. The front end of the outer box body is connected to the air inlet. The side surface at the rear end of the outer box body is an opening, and the rear end of the outer box body is connected to the duct.

[0013] Further, the duct is composed of duct plates. The duct plates include side plates and mounting plates. The mounting plates are vertically fixed at the lower ends of the side plates. The mounting plates are provided with through holes. The mounting plates are installed and fixed on the partition. The upper ends of the side plates are hermetically abutted against the inner cavity wall of the outer shell.

[0014] Further, a high-efficiency filter is also provided. The high-efficiency filter is installed in the outer shell and is arranged between the uniform flow static pressure box and the air outlet.

[0015] Further, a maintenance window is also provided on the outer shell. The maintenance window is detachably installed with a maintenance board by screws.

[0016] Further, grille plates are provided at the air inlet and the air outlet. The grille plates are provided with a plurality of ventilation holes.

[0017] Further, a fixing plate is also provided on the outer side surface at the lower end of the frame. The fixing plate is horizontally arranged and is provided with mounting holes.

[0018] Compared with the prior art, the beneficial effects of the present utility model are as follows: (1) By designing a top-mounted high-precision temperature control device, plant water enters the first-stage heating module through the pipeline water inlet, heats the water temperature to the set temperature, and the heated water exchanges heat with the outside air through the water coil. The air after heat exchange is heated to the final temperature through the second-stage heating module. The air at the final temperature enters the uniform flow static pressure box through the suction of the fan, and the water after heat exchange is discharged through the pipeline water outlet. The air in the uniform flow static pressure box passes through the high-efficiency filter, and the air finally entering the semiconductor detection equipment is constant-temperature clean air. By installing a lifting plate and setting a fixing plate, the device can be installed and placed above the semiconductor detection equipment during use, ensuring that the present utility model has a small floor area and is well docked with the semiconductor detection equipment, providing high-precision constant-temperature clean air for the semiconductor detection equipment. (2) By using plant water as the coolant, it is convenient to use, and the air is cooled by the water coil, ensuring sufficient air heat exchange. The cooling source has low noise and low vibration, meeting the high requirements of semiconductor detection equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 FIG. is a three-dimensional structural schematic diagram of a top-mounted high-precision temperature control device of the present utility model;

[0020] Figure 2 FIG. is an internal structural schematic diagram of a top-mounted high-precision temperature control device of the present utility model. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0021] To further understand the purpose, structure, features and functions of the present utility model, the following is a detailed description in conjunction with the embodiments.

[0022] Please refer to Figure 1 and Figure 2 A top-mounted high-precision temperature control device according to an embodiment of the present utility model includes a water inlet 1, a water outlet 2, a lifting plate 3, an outer housing 4, a frame 5, a water coil 6, a fan 7, a first-stage heating module 8, a second-stage heating module 9, a uniform flow static pressure box 10, and a high-efficiency filter 11;

[0023] The outer housing 4 is installed on the frame 5 to form a cavity, ensuring the strength of the present utility model, reducing damage, and ensuring the service life. The outer housing 4 also has an air inlet 41 and an air outlet. The lifting plate 3 is installed on the frame 5, and the lifting plate 3 is provided with a lifting hole 31. Through this lifting plate 3, it is convenient to install the equipment above the semiconductor detection equipment, providing high-precision constant-temperature clean air for the semiconductor detection equipment. Ensure that the present utility model has a small floor area and is well docked with the semiconductor detection equipment.

[0024] The water inlet 1 and the water outlet 2 are installed on the outer housing 4; it is convenient to connect to the external plant utilities water, and the usage cost is low. The water coil 6, the fan 7, the primary heating module 8, the secondary heating module 9, the uniform flow static pressure box 10, and the high-efficiency filter 11 are installed inside the outer housing 4; the primary heating module 8 and the secondary heating module 9 are also electrically connected to the control system, and the control system is used to adjust and set the heating temperature for convenient use.

[0025] The primary heating module 8 includes an inlet 81 and an outlet 82; the inlet 81 of the primary heating module 8 is connected to the water inlet 1 on the outer housing, the outlet 82 of the primary heating module is connected to the inlet of the water coil 6, and the outlet of the water coil 6 is connected to the water outlet 2 on the outer housing; the front end of the water coil 6 is connected to the air inlet 41, and the secondary heating module 9 is installed at the rear end of the water coil 6; during use, the external plant utilities water enters the primary heating module 8 through the water inlet 1 on the outer housing 4 first, and the water temperature is heated to the temperature set by the primary heating module 1; the heated plant utilities water flows to the water coil 6 and exchanges heat with the external air. The plant utilities water after heat exchange flows out through the water outlet 2 installed on the outer housing 4 (the water flowing out of the water outlet 2 enters the plant utilities water tower and can be recycled). By using the plant utilities water as the coolant, it is convenient to use. The air is cooled by the water coil 6 to ensure sufficient air heat exchange. The water coil is used as the cooling source, and the cooling source has low noise and low vibration, meeting the high requirements of semiconductor detection equipment.

[0026] The fan 7 includes an air inlet end and an air outlet end. The fan 7 is arranged at the rear end of the secondary heating module 9. The air inlet end inputs the gas heated by the secondary heating module 9, and the air outlet end is connected to the uniform flow static pressure box 10. The high-efficiency filter 11 is installed below the uniform flow static pressure box 10, and the air outlet surface of the high-efficiency filter 11 is close to the air outlet. The high-efficiency filter 11 is arranged between the uniform flow static pressure box and the air outlet to ensure that the air after heat exchange of the water coil 6 is heated to the set temperature by the secondary heating module 9 and enters the uniform flow static pressure box 10 through the suction of the fan 7. The highly accurate temperature air after control is output from the high-efficiency filter to ensure that highly accurate constant temperature clean air enters the semiconductor detection equipment.

[0027] During use, the plant utilities water enters the primary heating module 8 through the pipeline water inlet 1, the water temperature is heated, the heated water exchanges heat with the external air through the water coil 6, the air after heat exchange is heated to the final temperature by the secondary heating module 9, then enters the uniform flow static pressure box 10 through the suction of the fan 7, is filtered by the high-efficiency filter 11 and then output, and the water after heat exchange is discharged through the pipeline water outlet 2.

[0028] The frame 5 is a hexahedron bracket composed of multiple connecting rods 51. The frame 5 is installed on the outer housing 4 by screw connection. The structure of the frame 5 is beautiful and convenient for installing the outer housing 4. A partition 52 is installed inside the frame 5. The partition 52 divides the cavity into an upper chamber and a lower chamber. The partition 52 is provided with a fan installation hole. The fan 7 is installed on the partition 52. The air inlet end of the fan 7 is located in the upper chamber, and the air outlet end of the fan 7 faces the lower chamber. The water coil 6, the primary heating module 8, and the secondary heating module 9 are installed in the upper chamber. The uniform flow static pressure box 10 and the high-efficiency filter 11 are arranged one above the other in the lower chamber. The air inlet 41 is located on the side of the outer housing 4 of the upper chamber, and the air outlet is located on the lower surface of the outer housing 4. Ensure that air enters the upper chamber through the air inlet 41, undergoes heat exchange with the outside air through the water coil 6 in the upper chamber, and the air after heat exchange is heated to the final temperature by the secondary heating module 9. The air at the final temperature is inhaled into the lower chamber through the fan 7, enters the uniform flow static pressure box 10, and finally is purified and filtered by the high-efficiency filter 11 and discharged from the air outlet below, ensuring that the air finally entering the semiconductor detection device is constant-temperature and clean air. By separating into upper and lower chambers by the partition 52, ensure that the air entering the lower chamber is all air processed through heat exchange and the secondary heating module 9, ensuring the provision of high-precision constant-temperature air and avoiding the influence of unprocessed air on the air temperature.

[0029] A duct 12 is further provided in the upper chamber. The secondary heating module 9 is installed in the duct 12. One end of the duct 12 communicates with the water coil 6, and the other end of the duct 12 communicates with the air inlet end of the fan 7. Ensure that the air after heat exchange through the water coil 6 can enter the duct 12 and is heated to the preset temperature by the secondary heating module 9 provided in the duct 12, ensuring that the present invention can provide high-precision constant-temperature air.

[0030] The water coil 6 includes an outer box body 61 and an inner coil. The inner coil is fixed inside the outer box body 61. The outer box body 61 is fixed on the frame 5. The front end of the outer box body 61 is connected to the air inlet 41. The side of the rear end of the outer box body 61 is an opening. The rear end of the outer box body 61 is connected to the duct 12. Ensure that after the outside air enters, it can flow through the inner coil 6 regularly and undergoes heat exchange through the inner coil to ensure sufficient heat exchange.

[0031] The air duct 12 is composed of air duct plates. The air duct plates include side plates 121 and mounting plates 122. The mounting plate 122 is vertically fixed to the lower end of the side plate 121. Through holes 123 are provided on the mounting plate 122. The mounting plate 122 is mounted and fixed on the partition plate 52. The air duct plates can be detachably mounted using the through holes 123 by bolts or screws, which is convenient for disassembly and installation, beneficial for maintenance, and convenient for replacing damaged air duct plates. The upper end of the side plate 121 is hermetically abutted against the inner cavity wall of the outer housing 4, ensuring the air duct 12 is sealed and preventing air leakage. Through the design of the air duct 12, it is ensured that air can smoothly enter the fan 7, ensuring the smooth operation of the present utility model.

[0032] An inspection window 42 is further provided on the outer housing 4. The inspection window 42 is detachably mounted with an inspection plate by screws, facilitating the inspection and maintenance of the device.

[0033] Grille plates are provided at the air inlet 41 and the air outlet. Multiple ventilation holes are provided on the grille plates, ensuring that air can smoothly pass through. The grille plates can achieve uniform flow, and the grille plate at the air inlet can play a role in primary filtration, reducing the entry of large particle impurities into the device with air, reducing the purification resistance of the high-efficiency filter, avoiding damage to the high-efficiency filter, and extending the service life.

[0034] On the outer side surface of the lower end of the frame 5, a fixing plate 13 is further provided. The fixing plate 13 is horizontally arranged, and mounting holes 131 are provided on the fixing plate 13, facilitating the installation and docking of the device with semiconductor detection equipment through the mounting holes 131, ensuring high-precision constant-temperature clean air enters the semiconductor detection equipment.

[0035] The present utility model has been described by the above related embodiments. However, the above embodiments are only examples for implementing the present utility model. It must be pointed out that the disclosed embodiments do not limit the scope of the present utility model. On the contrary, modifications and refinements made without departing from the spirit and scope of the present utility model fall within the scope of the patent protection of the present utility model.

Claims

1. A top-mounted high-precision temperature control device, characterized in that: It includes a water inlet, a water outlet, a housing, a frame, a water coil, a fan, a primary heating module, a secondary heating module, and a flow equalizing static pressure box body; The housing is installed on the frame to form a cavity; the housing also has an air inlet and an air outlet; The water inlet and the water outlet are installed on the housing; the water coil, the fan, the primary heating module, the secondary heating module, and the flow equalizing static pressure box body are installed inside the housing; The primary heating module includes an inlet and an outlet; the inlet of the primary heating module is connected to the water inlet on the housing, the outlet of the primary heating module is connected to the inlet of the water coil, and the outlet of the water coil is connected to the water outlet on the housing; the front end of the water coil is connected to the air inlet, and the secondary heating module is installed at the rear end of the water coil; The fan includes an air inlet end and an air outlet end, the fan is arranged at the rear end of the secondary heating module, the air inlet end inputs the gas heated by the secondary heating module, and the air outlet end is connected to the flow equalizing static pressure box body.

2. The top-mounted high-precision temperature control device according to claim 1, wherein: The frame is a hexahedron bracket composed of multiple connecting rods. A partition is installed inside the frame. The partition divides the cavity into an upper chamber and a lower chamber. The partition is provided with a fan mounting hole. The fan is installed on the partition. The air inlet end of the fan is located in the upper chamber, and the air outlet end of the fan faces the lower chamber. The water coil, the primary heating module, and the secondary heating module are installed in the upper chamber. The flow equalizing static pressure box body is arranged in the lower chamber. The air inlet is located on the side surface of the housing of the upper chamber, and the air outlet is located on the lower surface of the housing.

3. The top-mounted high-precision temperature control device according to claim 2, wherein: A duct is also provided in the upper chamber. The secondary heating module is installed in the duct. One end of the duct is connected to the water coil, and the other end of the duct is connected to the air inlet end of the fan.

4. The top-mounted high-precision temperature control device according to claim 3, characterized in that: The water coil includes an outer box body and an inner coil. The inner coil is fixed inside the outer box body. The outer box body is fixed on the frame. The front end of the outer box body is connected to the air inlet. The side surface at the rear end of the outer box body is open. The rear end of the outer box body is connected to the duct.

5. The top-mounted high-precision temperature control device according to claim 3, wherein: The duct is composed of duct plates. The duct plates include side plates and mounting plates. The mounting plates are vertically fixed at the lower ends of the side plates. The mounting plates are provided with through holes. The mounting plates are installed and fixed on the partition. The upper ends of the side plates are hermetically abutted against the inner cavity wall of the housing.

6. The top-mounted high-precision temperature control device according to claim 1, characterized in that: A high-efficiency filter is also provided. The high-efficiency filter is installed inside the housing. The high-efficiency filter is arranged between the flow equalizing static pressure box body and the air outlet.

7. The top-mounted high-precision temperature control device according to claim 1, characterized in that: A maintenance window is also provided on the housing. The maintenance window is detachably installed with a maintenance board by screws.

8. The top-mounted high-precision temperature control device according to claim 1, characterized in that: Grille plates are provided at the air inlet and the air outlet. The grille plates are provided with a plurality of ventilation holes.

9. The top-mounted high-precision temperature control device according to claim 1, characterized in that: A fixing plate is also provided on the outer side surface at the lower end of the frame. The fixing plate is horizontally arranged. The fixing plate is provided with mounting holes.

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