Silicon carbide wafer annealing tool
By designing a detachable positioning slot and observation port structure of the silicon carbide wafer annealing tool, the reuse and observation problems of existing devices are solved, the placement efficiency and annealing uniformity are improved, and the production cost is reduced.
Patent Information
- Application Number
- CN202422256470.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-14
- Publication Date
- 2025-08-01
- Estimated Expiration
- 2034-09-14
AI Technical Summary
The existing silicon carbide wafer annealing device has problems such as graphite rope embrittlement and unreusable reuse, inability to observe the internal conditions of the wafer, and it is easy to cause overlap, resulting in uneven annealing and damage to the wafer.
A silicon carbide wafer annealing tool is designed, including annealing crucible, positioning mechanism and wafer placement ring, adopting a removable positioning slot and positioning projection structure, allowing multiple use, and checking the number of wafers through the observation port to prevent overlapping.
Reuse of wafers is achieved, placement efficiency is improved, production costs are reduced, wafer damage is avoided, and annealing uniformity is ensured.
Smart Images
Figure CN223181086U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductors, in particular to a silicon carbide wafer annealing tooling. Background Art
[0002] In related technologies, it is pointed out that silicon carbide, as a typical wide-bandgap semiconductor material, has advantages such as high thermal conductivity, high resistivity, high stability, and high carrier saturation drift velocity, and is suitable for making high-temperature, high-frequency, and high-power electronic devices, optoelectronic devices, and surface acoustic wave devices, etc. At present, internal stress will be generated during the growth and wire cutting preparation processes of silicon carbide. The existence of internal stress will cause adverse conditions such as chipping and cracking during subsequent grinding and polishing processes. Therefore, annealing is a necessary process in the silicon carbide processing.
[0003] For the high-temperature annealing treatment of silicon carbide crystals, existing devices use graphite rings and graphite ropes to support and fix wafers. After annealing, the graphite ropes will become brittle and cannot be reused, which is easy to cause waste. In addition, operators cannot observe the internal situation of the wafers, which may lead to the problem of wafer stacking. After stacking, the annealing will be uneven, and marks that cannot be removed in the subsequent process will also be generated on the wafer surface. Summary of the Invention
[0004] The utility model aims to at least solve one of the technical problems existing in the prior art. For this reason, the utility model provides a silicon carbide wafer annealing tooling, which is convenient for carrying wafers, can be reused, and can observe the internal situation of the wafers to avoid the problem of wafer stacking.
[0005] The utility model also provides a silicon carbide wafer annealing tooling, which includes an annealing crucible, a positioning mechanism, and a wafer placement ring; the annealing crucible includes an annealing crucible body and an annealing crucible bottom support. The lower part of the annealing crucible body has an opening. The annealing crucible body covers the annealing crucible bottom support and is threadedly connected to the annealing crucible bottom support; at least three positioning slots with a set depth are arranged on the upper surface of the annealing crucible bottom support, and the center lines of the positioning slots intersect at the center of the upper surface of the annealing crucible bottom support; at least three pairs of positioning notches are defined at intervals from the inside to the outside in each positioning slot, and each pair of the positioning notches is oppositely arranged on the inner side wall of the positioning slot;
[0006] The positioning mechanism is arranged in each positioning slot, and positioning protrusions are symmetrically arranged at the lower part thereof. The positioning mechanism is fixed in the positioning slot through the cooperation of the positioning protrusions and the positioning notches. The positioning mechanisms in each positioning slot jointly define a receiving space;
[0007] A circular carrier for accommodating wafers extends radially inward from the bottom wall of the wafer placement ring.
[0008] In the above technical solution, a suitable positioning bayonet is selected according to actual requirements, and the positioning mechanism is installed in the positioning card slot of the annealing crucible base through the cooperation of the positioning protrusion and the positioning bayonet. Then, wafers of corresponding sizes are placed into corresponding wafer placement rings, and the wafer placement rings are clamped in the accommodation space defined by the positioning mechanism. Finally, the annealing crucible body is covered on the annealing crucible base, and after being threadedly connected together, it is placed into an annealing furnace to anneal the wafers.
[0009] Preferably, the positioning mechanism of the present utility model includes a positioning rod and a positioning block. The positioning rod is installed on the upper surface of the positioning block. The positioning protrusions are symmetrically arranged on both sides of the positioning block, and the height of the positioning block is less than the depth of the positioning card slot. In this embodiment, the height of the positioning block is less than the depth of the positioning card slot, effectively avoiding the scraping of the bottom-layer wafers by the positioning block and reducing the production cost of the enterprise.
[0010] Preferably, the outer diameter of the wafer placement ring of the present utility model is D1, and the distance between the center of the annealing crucible base and the positioning mechanism is L, where D1 / 2 = L. The wafer placement ring is clamped in the accommodation space defined by the positioning mechanism. In this embodiment, the wafer placement ring just fits into the accommodation space, preventing the wafer placement ring from shaking in the accommodation space.
[0011] Preferably, the outer diameter of the wafer placement ring of the present utility model is D1, and the distance between the center of the annealing crucible base and the positioning mechanism is L, where 0.5 cm ≤ D1 / 2 - L ≤ 1 cm. The outer sidewall of the wafer placement ring defines a limiting bayonet for accommodating the positioning mechanism. The number of the limiting bayonets is the same as that of the positioning mechanisms and they correspond one by one. The wafer placement ring is fixed in the accommodation space through the cooperation of the limiting bayonets and the positioning mechanisms. In this embodiment, the outer diameter of the wafer placement ring is slightly larger than the diameter of the circular accommodation space defined by the positioning mechanism. Therefore, a limiting bayonet is defined on the outer sidewall of the wafer placement ring to accommodate the positioning mechanism, so that the wafer placement ring can be placed more stably in the accommodation space.
[0012] Furthermore, the wafer placement ring of the present utility model is provided with an observation port. The observation port penetrates the sidewall of the wafer placement ring and is located above the annular carrier. In this embodiment, it can be checked whether wafers are repeatedly placed in a wafer placement ring through the observation port to prevent the damage of wafers caused by repeated placement.
[0013] Preferably, the positioning rod of the present utility model is of a cylindrical structure, and the cross-sections of the positioning bayonet, the positioning protrusion, and the limiting bayonet are semi-circular structures with equal radii.
[0014] Furthermore, the utility model further includes a reinforcing ring provided with positioning holes. Each positioning hole corresponds to one positioning mechanism, and the reinforcing ring is sleeved on the positioning mechanism through the positioning holes. In this embodiment, the reinforcing ring limits the position of the positioning mechanism, effectively preventing the wafer placement ring from disengaging from the accommodation space.
[0015] Preferably, the lower part of the inner wall of the annealing crucible body of the utility model is an internal thread structure; the side wall of the annealing crucible bottom support is an external thread structure from the upper surface of the annealing crucible down to a set depth, and the diameter of the part with the external thread structure is smaller than the diameter of the bottom of the annealing crucible bottom support. The annealing crucible body and the annealing crucible bottom support are connected together through the internal thread structure and the external thread structure.
[0016] Preferably, the crucible bottom support is of a cylindrical structure; there are three positioning slots, and the central lines of the three positioning slots form an angle of 120° with each other; there are three pairs of positioning notches, which respectively correspond to the wafer placement rings for carrying 4-inch, 6-inch, and 8-inch wafers from the inside to the outside.
[0017] Compared with the prior art, the annealing tooling of the utility model can be reused. The utility model stacks multiple wafer placement rings longitudinally, improving the wafer placement efficiency. Moreover, the wafer placement rings of the utility model have multiple specifications and can carry wafers of multiple sizes, with high utilization rate. An observation port is also provided on the wafer placement ring of the utility model, which can detect whether there is wafer stacking in the wafer placement ring, reducing the probability of wafer damage and thus reducing the production cost of the enterprise.
[0018] The additional aspects and advantages of the utility model will be partly given in the following description, partly will become obvious from the following description, or will be understood through the practice of the utility model. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 is a schematic structural diagram of the positioning slot of the silicon carbide wafer annealing tooling according to an embodiment of the utility model;
[0020] Figure 2 is a schematic structural diagram of the positioning slot of the silicon carbide wafer annealing tooling according to an embodiment of the utility model;
[0021] Figure 3 is a schematic structural diagram of the positioning mechanism of the silicon carbide wafer annealing tooling according to an embodiment of the utility model; [[ID=**28]]
[0022] Figure 4 is a schematic structural diagram of the wafer placement ring of the silicon carbide wafer annealing tooling according to an embodiment of the utility model;
[0023] Figure 5Schematic diagram of the silicon carbide wafer annealing tooling after assembling the wafer placement ring according to an embodiment of the present utility model;
[0024] Figure 6 Schematic diagram of the silicon carbide wafer annealing tooling after assembling the reinforcing ring according to an embodiment of the present utility model;
[0025] Figure 7 Schematic diagram of the position of the silicon carbide wafer annealing tooling in the annealing crucible according to an embodiment of the present utility model;
[0026] Reference numerals:
[0027] 100: Crucible bottom support; 11: Positioning slot; 111: Positioning bayonet; 12: External thread structure;
[0028] Description of the drawings 200: Positioning mechanism; 20: Positioning rod; 21: Positioning block; 22: Positioning protrusion;
[0029] 300: Wafer placement ring; 301: Annular carrier; 302: Limiting bayonet; 303: Observation port;
[0030] 400: Reinforcing ring;
[0031] 500: Annealing crucible;
[0032] 600: Handle. Detailed implementation manners
[0033] The embodiments of the present utility model will be described in detail below. The examples of the embodiments are shown in the drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are intended to explain the present utility model, and should not be construed as limiting the present utility model.
[0034] The following disclosure provides many different embodiments or examples for implementing different structures of the present utility model. To simplify the disclosure of the present utility model, the components and settings of specific examples are described below. Of course, they are only examples and are not intended to limit the present utility model. In addition, the present utility model may repeat reference numerals and / or letters in different examples. This repetition is for the purpose of simplification and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the present utility model provides examples of various specific processes and materials, but those of ordinary skill in the art can be aware of the applicability of other processes and / or the use of other materials.
[0035] The following reference is made to Figures 1-7Describes a silicon carbide wafer annealing tooling according to an embodiment of the present invention, including an annealing crucible, a positioning mechanism 200 and a wafer placement ring 300. The annealing crucible includes an annealing crucible body 500 and an annealing crucible bottom support 100. Refer to Figure 1 , Figure 2 and Figure 7 . As shown, the lower part of the annealing crucible body 500 has an opening. The annealing crucible body 500 covers the annealing crucible bottom support 100 and is threadedly connected to the annealing crucible bottom support 100. Specifically, the annealing crucible body 500 is a hollow cylindrical structure with an opening at the lower part, and the lower inner wall of the annealing crucible body 500 is an internal thread structure. The side wall of the annealing crucible bottom support 100 from its upper surface downwards for 20 cm is an external thread structure 12, and the diameter of the part with the external thread structure 12 is smaller than the bottom diameter of the annealing crucible bottom support 100. It can be understood that the side wall of the annealing crucible bottom support 100 from its upper surface downwards for 15 cm, 20 cm or 25 cm can also be the external thread structure 12, and the annealing crucible body 500 and the annealing crucible bottom support 100 are connected together through the internal thread structure and the external thread structure 12. The upper surface of the annealing crucible bottom support 100 is provided with three positioning slots 11 with a depth of 10 cm, and the center lines of the positioning slots 11 intersect at the center of the upper surface of the annealing crucible bottom support 100. Refer to Figure 3 . As shown, the positioning mechanism 200 is arranged in each positioning slot 11, and positioning protrusions 22 are symmetrically arranged at its lower part. The positioning mechanism 200 is fixed in the positioning slot 11 through the cooperation of the positioning protrusions 22 and the positioning notches 111. The positioning mechanisms 200 in each positioning slot 11 jointly define a circular accommodating space. The annealing crucible body 500 and the annealing crucible bottom support 100 are connected together through the internal thread structure and the external thread structure 12. Refer to Figure 7 .
[0036] Refer to Figure 3 . As shown, in some embodiments, the positioning mechanism 200 of the present invention includes a positioning rod 20 and a positioning block 21. The positioning rod 20 is installed on the upper surface of the positioning block 21, and the positioning protrusions 22 are symmetrically arranged on both sides of the positioning block 21. The height of the positioning block 21 is slightly smaller than the depth of the positioning slot 11. It can be understood that the difference between the height of the positioning block 21 and the depth of the positioning slot 11 is 0.5 cm or 1 cm to prevent the positioning block 21 from being too high and scratching the bottommost wafer.
[0037] Refer to Figure 4As shown, in some embodiments, an annular carrier 301 for accommodating a wafer extends radially inward from the bottom wall of the wafer placement ring 300. The outer diameter of the wafer placement ring 300 is D1, and its inner diameter is D2. It can be understood that the inner diameter of the wafer placement ring 300 refers to the inner diameter of the annular carrier 301. The distance from the center of the annealing crucible bottom support 100 to the positioning mechanism 200 is L, and L = D1 / 2. The wafer placement ring 300 is just stuck in the accommodation space defined by the three positioning mechanisms 200 to prevent the wafer placement ring 300 from shaking between the positioning mechanisms 200. The wafer placement ring 300 in this embodiment has three specifications, which are used to carry 4-inch, 6-inch, and 8-inch wafers respectively.
[0038] Specifically, the central line angles of the three positioning slots 11 are 120° with each other. The inner side wall surface of each positioning slot 11 is spaced apart from the inside to the outside to define three pairs of positioning notches 111. Each pair of positioning notches 111 is oppositely arranged on the inner side wall of the positioning slot 11; the three pairs of positioning notches 111 respectively correspond to the wafer placement rings 300 for carrying 4-inch, 6-inch, and 8-inch wafers.
[0039] Reference Figure 4 As shown, in some embodiments, in order to further fix the wafer placement ring 300, 1 / 2 of the outer diameter D1 of the wafer placement ring 300 of the present utility model is slightly larger than L, and the difference between the two can be controlled between 0.5 cm and 1 cm. For example, in this embodiment, the three positioning mechanisms 200 are respectively placed at the 8-inch positioning notches 111 in the three positioning slots 11. The wafer placement ring 300 used in this embodiment is for carrying an 8-inch wafer (with a diameter of 20.32 cm). The outer diameter D1 of this wafer placement ring 300 is 21.5 cm, and its inner diameter D2 is 20 cm. Then the distance L between the center of the crucible bottom support 100 and the positioning mechanism 200 is 10 cm. Since 1 / 2 of the outer diameter D1 of the wafer placement ring 300 is slightly larger than L, a limiting notch 302 for accommodating the positioning mechanism 200 is defined on the outer side wall of the wafer placement ring 300. The number of the limiting notches 302 is the same as the number of the positioning mechanisms 200 and they correspond one by one. In other words, each limiting notch 302 corresponds to a positioning mechanism 200. The wafer placement ring 300 is fixed in the accommodation space through the cooperation of the limiting notch 302 and the positioning mechanism 200. Specifically, the limiting notches 302 of the wafer placement ring 300 in this embodiment are respectively aligned with the corresponding positioning mechanisms 200, and after alignment, they can be stacked downward to the upper surface of the uppermost wafer placement ring 300.
[0040] Reference Figure 4 As shown, in some embodiments, the wafer placement ring 300 of the present utility model is provided with an observation port. The observation port penetrates the side wall of the wafer placement ring 300 and is located above the annular carrier 301. The observation port is convenient for observing the situation of the wafers in the wafer placement ring 300 to observe whether each wafer placement ring 300 only places one wafer, effectively preventing the wafers from being stacked.
[0041] Reference Figure 3 As shown, in some embodiments, the positioning rod 20 of the present utility model is a cylindrical structure, and the cross-sections of the positioning bayonet 111, the positioning protrusion 22, and the limiting bayonet 302 are all semi-circular structures with equal radii, which are convenient for processing and manufacturing. Of course, the positioning rod 20 can also be a triangular structure or a square structure, and the cross-sections of the positioning bayonet 111, the positioning protrusion 22, and the limiting bayonet 302 are triangular structures or square structures corresponding to the positioning rod 20.
[0042] Reference Figure 6 As shown, in some embodiments, the present utility model further includes a reinforcing ring 400. Positioning holes are provided on the reinforcing ring 400, and each positioning hole corresponds to a positioning mechanism 200. The reinforcing ring 400 is sleeved on the positioning mechanism 200 through the positioning holes. The use of the reinforcing ring 400 in this embodiment is mainly to prevent the positioning mechanism 200 from shaking.
[0043] This embodiment takes an 8-inch wafer as an example:
[0044] (1) Fix the three positioning mechanisms 200 on the 8-inch positioning bayonets 111 in the three positioning slots 11 respectively;
[0045] (2) Place the 8-inch wafer on the annular carrier 301 of the wafer placement ring 300 for placing the 8-inch wafer;
[0046] (3) Place the positioning rod 20 of the positioning mechanism 200 in the limiting bayonet 302 outside the wafer placement ring 300, and then press it down onto the crucible bottom support 100;
[0047] (4) Repeat steps (2) and (3) until all the wafers are placed;
[0048] (5) Align the positioning holes on the reinforcing ring 400 with the corresponding positioning rods 20 respectively. Through the positioning holes, sleeved the reinforcing ring 400 on the positioning rods 20 and press it on the topmost wafer placement ring 300 to fix the positions of the three positioning rods 20 and prevent the wafer placement ring 300 from slipping out of the circular accommodating space formed by the positioning rods 20 due to shaking.
[0049] (6) Cover the annealing crucible body 500 on the annealing crucible bottom support 100, and fixedly connect the annealing crucible body 500 and the annealing crucible bottom support 100 together through the internal thread structure and the external thread structure 12. Reference Figure 7 As shown, and then send the whole into the annealing furnace to anneal the wafer.
[0050] Reference Figure 7As shown, in some embodiments, in order to facilitate the movement of the annealing tooling of this embodiment, a handle 600 is fixedly installed on the upper part of the annealing crucible body 500, so as to facilitate the staff to handle the annealing tooling. Except for the handle 600, the annealing tooling of this embodiment is made of high-temperature-resistant graphite material to extend the service life of the annealing tooling.
[0051] The annealing tooling of the present utility model can be reused, effectively reducing the production cost, and at the same time improving the placement efficiency of the annealed wafers. The present utility model can be compatible with wafers of various sizes and has a wide application range.
[0052] Other components of the silicon carbide wafer annealing tooling according to the embodiments of the present utility model, such as the positioning rod 20 and the positioning block 21, etc., and the operations are known to those of ordinary skill in the art and will not be described in detail here.
[0053] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present utility model.
[0054] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present utility model, "a plurality" means two or more, unless otherwise specifically defined.
[0055] In the present utility model, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection, an electrical connection, or a communication connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the internal communication of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.
[0056] In the present utility model, unless otherwise clearly defined and limited, the first feature being "on" or "under" the second feature may mean that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may mean that the first feature is directly above or obliquely above the second feature, or merely indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature being "under", "below" and "beneath" the second feature may mean that the first feature is directly below or obliquely below the second feature, or merely indicates that the horizontal height of the first feature is less than that of the second feature.
[0057] In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples", etc. means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.
[0058] Although the embodiments of the present utility model have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present utility model, and the scope of the present utility model is defined by the claims and their equivalents.
Claims
1. A silicon carbide wafer annealing tooling, characterized in that, including an annealing crucible, which includes an annealing crucible body and an annealing crucible bottom support. The lower part of the annealing crucible body has an opening. The annealing crucible body covers the annealing crucible bottom support and is threadedly connected to the annealing crucible bottom support. At least three positioning card slots with a set depth are arranged on the upper surface of the annealing crucible bottom support, and the center lines of the positioning card slots intersect at the center of the upper surface of the annealing crucible bottom support. At least three pairs of positioning notches are defined at intervals from the inside to the outside in each positioning card slot, and each pair of positioning notches is oppositely arranged on the inner side wall of the positioning card slot; a positioning mechanism, which is arranged in each positioning card slot. Positioning protrusions are symmetrically arranged at the lower part of the positioning mechanism. The positioning mechanism is fixed in the positioning card slot through the cooperation of the positioning protrusions and the positioning notches. The positioning mechanisms in each positioning card slot jointly define an accommodation space; a wafer placement ring, and a ring-shaped carrier for accommodating wafers radially extends inwards from the bottom wall of the wafer placement ring.
2. The annealing tooling for silicon carbide wafers according to claim 1, characterized in that, The positioning mechanism includes a positioning rod and a positioning block. The positioning rod is installed on the upper surface of the positioning block. The positioning protrusions are symmetrically arranged on both sides of the positioning block, and the height of the positioning block is less than the depth of the positioning card slot.
3. A silicon carbide wafer annealing tooling according to claim 2, characterized in that, The outer diameter of the wafer placement ring is D1, and the distance between the center of the annealing crucible bottom support and the positioning mechanism is L, and D1 / 2 = L. The wafer placement ring is square-fitted in the accommodation space defined by the positioning mechanism.
4. A silicon carbide wafer annealing tooling according to claim 2, characterized in that, The outer diameter of the wafer placement ring is D1, and the distance between the center of the annealing crucible bottom support and the positioning mechanism is L, and 0.5 cm ≤ D1 / 2 - L ≤ 1 cm. A limiting notch for accommodating the positioning mechanism is defined on the outer side wall of the wafer placement ring. The number of the limiting notches is the same as the number of the positioning mechanisms and they correspond one by one. The wafer placement ring is fixed in the accommodation space through the cooperation of the limiting notches and the positioning mechanism.
5. A silicon carbide wafer annealing tooling according to any one of claims 1-4, characterized in that, The wafer placement ring is provided with an observation port, which penetrates the side wall of the wafer placement ring, and the observation port is located above the ring-shaped carrier.
6. The annealing tooling for silicon carbide wafers according to claim 4, characterized in that, The positioning rod is of a cylindrical structure, and the cross-sections of the positioning notch, the positioning protrusion and the limiting notch are semi-cylindrical structures with equal radii.
7. A silicon carbide wafer annealing tooling according to any one of claims 1-4, characterized in that, It further includes a reinforcing ring, and positioning holes are arranged on the reinforcing ring. Each positioning hole corresponds to one positioning mechanism, and the reinforcing ring is sleeved on the positioning mechanism through the positioning holes.
8. A silicon carbide wafer annealing tooling according to any one of claims 1-4, characterized in that, The lower part of the inner wall of the annealing crucible body is of an internal thread structure; the side wall of the annealing crucible bottom support is of an external thread structure from the upper surface of the annealing crucible to a set depth, and the diameter of the part with the external thread structure is smaller than the diameter of the bottom of the annealing crucible bottom support. The annealing crucible body and the annealing crucible bottom support are connected together through the internal thread structure and the external thread structure.
9. The annealing tooling for silicon carbide wafers according to claim 8, wherein, the crucible bottom support is of a cylindrical structure; there are three positioning card slots, and the central lines of the three positioning card slots form an angle of 120° with each other; there are three pairs of positioning notches, which respectively correspond to the wafer placement rings for carrying 4-inch, 6-inch and 8-inch wafers from the inside to the outside.