Chip carrying and implanting mechanism

Abstract

A chip carrying and implanting mechanism comprises a grabbing assembly, a carrying driving assembly and an XY double-axis driving assembly, and the XY double-axis driving assembly comprises an X-axis base, a Y-axis base, a first driving part and a second driving part; the carrying driving assembly comprises a mounting frame, a driving motor, a guide plate, a cam and an X-axis guide rail, the mounting frame is arranged on the Y-axis base in a sliding mode and is in driving connection with the second driving piece, the driving motor and the guide plate are fixed to the two sides of the mounting frame, the cam is located in the mounting frame and is in driving connection with the driving motor, and the X-axis guide rail is fixed to the lower portion of the mounting frame; the guide plate is provided with a guide through groove penetrating through the two opposite side faces of the guide plate. The grabbing assembly comprises a Z-axis guide rail connected with the eccentric part through a connecting rod penetrating through the guide through groove, a transmission block arranged on the X-axis guide rail in a sliding mode and used for penetrating through the Z-axis guide rail in a sliding mode, and a suction head fixed to the bottom end of the Z-axis guide rail and used for sucking the chip. The Z-axis guide rail is driven by the cam to move along the guide through groove so that the suction head can move in the X-axis direction and the vertical direction at the same time.

Description

Technical Field

[0001] The utility model relates to the technical field of smart card processing, in particular to a chip transporting and implanting mechanism. Background Art

[0002] When processing smart cards, it is necessary to first mill a groove on the card, and then embed the chip into the groove and package it to obtain the finished product. The industry mainly uses IC card milling and packaging machines for integrated processing of smart cards. The chip is transported to the designated position on the card with the milled groove, and then the next packaging operation is carried out. Among them, the chip transportation operation is an important step in the processing of smart cards. The precise assembly of the chip and the groove on the card determines whether the chip and the card can be effectively assembled, which in turn affects the yield rate of the smart card. At present, in the chip transportation structure on the traditional IC card milling and packaging machine, the horizontal movement of the chip is achieved by combining a servo motor with a guide rail, and the vertical movement of the chip is achieved by a cylinder drive. There is also a servo system to achieve the vertical movement of the chip. However, the vertical drive methods of the above two chips both have the problem of insufficient stability, and the chip transportation efficiency is poor, which in turn affects the production efficiency of smart cards. Utility Model Content

[0003] Based on this, it is necessary to provide a chip transport and implantation mechanism with strong structural stability and high transport efficiency to address the above-mentioned shortcomings.

[0004] A chip transport and implantation mechanism, for being arranged beside a card conveyor belt of an IC card slot milling and packaging machine, comprises a gripping assembly for sucking a chip to be transported, a transport drive assembly for driving the gripping assembly to move to grab the chip, and an XY dual-axis drive assembly for driving the transport drive assembly to move horizontally, wherein the XY dual-axis drive assembly comprises an X-axis base extending along the X-axis direction, a Y-axis base slidably disposed on the X-axis base, a first drive member fixed to the X-axis base and driving the Y-axis base to slide along the X-axis direction, and a second drive member fixed to the Y-axis base and driving the gripping assembly to slide on the Y-axis base along the Y-axis direction;

[0005] The transport drive assembly includes a mounting frame slidably arranged on the Y-axis base and drivenly connected to the second drive member, a drive motor located on one side of the mounting frame and fixedly connected to the upper part of the mounting frame, a guide plate located on the other side of the mounting frame and fixedly connected to the upper part of the mounting frame, a cam located in the mounting frame and drivenly connected to the output shaft of the drive motor, and an X-axis guide rail fixed to the lower part of the mounting frame and extending along the X-axis direction, the cam having an eccentric portion and coaxially rotating with the output shaft of the drive motor, and a guide groove with an N-shaped or U-shaped structure is provided on the guide plate, and the guide groove passes through two opposite side surfaces of the guide plate;

[0006] The gripping assembly includes a Z-axis guide rail extending in the vertical direction, a transmission block slidably disposed on the X-axis guide rail and for slidably passing through the Z-axis guide rail, a suction head fixed to the bottom end of the Z-axis guide rail and for sucking the chip to be transported, and a connecting rod passing through the guiding through groove and fixedly connected to the upper part of the Z-axis guide rail and the eccentric part respectively. The suction head is communicated with an external air pressure device; the Z-axis guide rail moves along the guiding through groove under the drive of the cam, so that the suction head moves along the X-axis direction and the vertical direction simultaneously.

[0007] In one embodiment, a proximity switch is provided at the edge of the guiding through groove on the side of the guiding plate adjacent to the Z-axis guide rail, and the proximity switch is electrically connected to the driving motor.

[0008] In one embodiment, the transmission block includes a first slider, a limiting block, and a second slider. A first sliding groove that is in concave-convex fit with the X-axis guide rail is formed on the first slider. The side of the first slider facing away from the X-axis guide rail is fixedly connected to the limiting block, and a through hole penetrating the upper surface and the lower surface of the limiting block is formed on the limiting block. The second slider is received in the through hole and fixedly connected to the limiting block. A second sliding groove is formed on the second slider, and the Z-axis guide rail passes through the second sliding groove and is in sliding fit with the second slider.

[0009] In one embodiment, the gripping assembly further includes a positioning frame fixed to the bottom end of the Z-axis guide rail, a suction head mounting block located below the positioning frame, at least one heat insulation column connecting the positioning frame and the suction head mounting block, and a heat insulation plate fixed to the positioning frame and at least semi-surrounding the suction head mounting block. A plurality of weight-reducing holes are formed on the heat insulation plate. The suction head is fixed to the suction head mounting block and is communicated with an external air pressure device through an air pipe passing through the positioning frame.

[0010] In one embodiment, the gripping assembly further includes a shock absorption structure. The shock absorption structure includes a third slider slidably engaged with the Z-axis guide rail, a shock absorption rod extending in the vertical direction between the third slider and the positioning frame, and a shock absorption spring. One end of the shock absorption rod is fixedly connected to the third slider, and the other end of the shock absorption rod is fixedly connected to the positioning frame. The shock absorption spring is sleeved on the shock absorption rod and abuts against the lower surface of the third slider and the upper surface of the positioning frame respectively.

[0011] In one embodiment, the first driving member includes a first servo motor fixed to the X-axis base, a first lead screw drivingly connected to the output shaft of the first servo motor and extending in the X-axis direction, a first nut sleeved on the first lead screw and in threaded fit with the first lead screw, and a first support frame fixedly connected to the first nut. The Y-axis base is fixed to the top or bottom of the first support frame.

[0012] In one embodiment, two X-axis slide rails fixedly connected to the X-axis base and extending in the X-axis direction are oppositely arranged on both sides of the first lead screw, and X-axis sliders slidably engaged with the two X-axis slide rails are respectively provided on the first support frame.

[0013] In one embodiment, the second driving member includes a second servo motor fixed on the Y-axis base, a second lead screw drivingly connected to the output shaft of the second servo motor and extending in the Y-axis direction, a second nut sleeved on the second lead screw and threadedly engaged with the second lead screw, and a second support frame fixedly connected to the second nut. The mounting frame is fixedly connected to the side of the second support frame facing away from the Y-axis base.

[0014] In one embodiment, two Y-axis slide rails fixedly connected to the Y-axis base and extending in the Y-axis direction are oppositely arranged on both sides of the second lead screw, and Y-axis sliders slidably engaged with the two Y-axis slide rails are respectively provided on the second support frame.

[0015] In one embodiment, the output shaft of the second servo motor is drivingly connected to the second lead screw through a conveyor belt.

[0016] When implementing the chip transfer and implantation mechanism of the present utility model, the driving motor drives the cam to rotate. The connecting rod connects the Z-axis guide rail and the eccentric part of the cam. By using the guiding through groove to guide and limit the connecting rod, the Z-axis guide rail moves simultaneously in the X-axis direction and the vertical direction. At the same time, in cooperation with the XY double-axis driving assembly to adjust the position of the suction head in the horizontal direction, the suction head can accurately grasp the chip and transport the chip to the groove of the card on the card conveyor belt. Compared with the driving method of the servo motor and the guide rail, the movement of the suction head in the X-axis direction in this solution is realized by the joint action of the first driving member and the driving motor. The movement speed of the suction head is faster, improving the chip handling efficiency and further improving the production efficiency of smart cards. Moreover, compared with the driving method of the servo motor and the guide rail, the chip transfer and implantation mechanism of this solution has a simpler structure and better stability, ensuring the reliability of the chip handling operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic structural diagram of the chip transfer and implantation mechanism cooperating with the card conveyor belt and the chip loading device in an embodiment of the present utility model;

[0018] Figure 2 It is a schematic structural diagram of the chip transfer and implantation mechanism from one perspective in an embodiment of the present utility model;

[0019] Figure 3 It is a schematic structural diagram of the chip transfer and implantation mechanism from another perspective in an embodiment of the present utility model;

[0020] Figure 4Schematic diagram of the cooperation between the handling drive assembly and the gripping assembly in an embodiment of the present utility model;

[0021] Figure 5 For Figure 4 Schematic diagram of the structure of the handling drive assembly after removing the guide plate in the illustrated embodiment. Detailed implementation manners

[0022] To make the above objects, features and advantages of the present utility model more obvious and understandable, the following will describe the detailed implementation manners of the present utility model with reference to the accompanying drawings. Many specific details are set forth in the following description in order to fully understand the present utility model. However, the present utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present utility model. Therefore, the present utility model is not limited by the specific embodiments disclosed below.

[0023] Please refer to Figure 1-2 and Figure 4-5 , the present utility model discloses a chip transfer and implantation mechanism 10 with strong structural stability and high handling efficiency. The chip transfer and implantation mechanism 10 is used to be arranged beside the card conveyor belt 20 of an IC card milling groove encapsulation machine, so as to individually grasp the chips on the chip loading device 30 beside the chip transfer and implantation mechanism 10 and place the chips in the grooves of the corresponding cards on the card conveyor belt 20 to achieve the assembly of the chips and the cards. Specifically, the chip transfer and implantation mechanism 10 of this embodiment includes a gripping assembly 100 for sucking the chips to be transferred, a handling drive assembly 200 for driving the gripping assembly 100 to move to grasp the chips, and an XY two-axis drive assembly 300 for driving the handling drive assembly 200 to move in the horizontal direction. The XY two-axis drive assembly 300 includes an X-axis base 310 extending in the X-axis direction, a Y-axis base 320 slidably arranged on the X-axis base 310, a first driving member 330 fixed on the X-axis base 310 and driving the Y-axis base 320 to slide in the X-axis direction, and a second driving member 340 fixed on the Y-axis base 320 and driving the gripping assembly 100 to slide in the Y-axis direction on the Y-axis base 320. In this embodiment, it is agreed that the X-axis direction is the direction from the chip transfer and implantation mechanism 10 towards the card conveyor belt 20; the Y-axis direction is the conveying direction of the card conveyor belt 20; the vertical direction is the height direction of the chip transfer and implantation mechanism 10, that is, the lifting direction of the chips during the movement process.

[0024] The handling drive assembly 200 includes a mounting bracket 210 slidably disposed on the Y-axis base 320 and drivingly connected to the second driving member 340, a driving motor 220 located on one side of the mounting bracket 210 and fixedly connected to the upper part of the mounting bracket 210, a guide plate 230 located on the other side of the mounting bracket 210 and fixedly connected to the upper part of the mounting bracket 210, a cam 240 located inside the mounting bracket 210 and drivingly connected to the output shaft of the driving motor 220, and an X-axis guide rail 250 fixed to the lower part of the mounting bracket 210 and extending in the X-axis direction. The driving motor 220 can be a three-phase motor or a servo motor. That is to say, in this embodiment, the mounting bracket 210 and the guide plate 230 jointly enclose a cavity, and the X-axis guide rail 250 is located outside the cavity. The cam 240 has an eccentric portion 241, and the cam 240 rotates coaxially with the output shaft of the driving motor 220. Thus, when the cam 240 rotates coaxially with the output shaft of the driving motor 220, the eccentric portion 241 on the cam 240 will perform an eccentric motion around the rotation center of the cam 240. The guide plate 230 is provided with a guide through groove 231 having an n-shaped or U-shaped structure. The guide through groove 231 penetrates through two opposite side surfaces of the guide plate 230, and the guide through groove 231 is used to cooperate with the cam 240 to define the movement path of the gripping assembly 100. The gripping assembly 100 includes a Z-axis guide rail 110 extending in the vertical direction, a transmission block 120 slidably disposed on the X-axis guide rail 250 and used for slidably passing through the Z-axis guide rail 110, a suction head 130 fixed to the bottom end of the Z-axis guide rail 110 and used for sucking the chip to be transported, and a connecting rod 140 passing through the guide through groove 231 and fixedly connected to the upper part of the Z-axis guide rail 110 and the eccentric portion 241 respectively. The suction head 130 is communicated with an external air pressure device; the Z-axis guide rail 110 moves along the guide through groove 231 under the drive of the cam 240, so that the suction head 130 moves along the X-axis direction and the vertical direction at the same time. That is to say, in this embodiment, the first driving member 330 is used to realize the primary driving and guiding of the suction head 130 along the X-axis direction, and the second driving member 340 is used to realize the driving and guiding of the suction head 130 along the Y-axis direction; at the same time, under the drive of the eccentric portion 241 on the cam 240 and the common constraint of the guide through groove 231, when the driving motor 220 works, the transmission block 120 and the X-axis guide rail 250 cooperate with each other to realize the secondary guiding and limiting of the suction head 130 along the X-axis direction, and the transmission block 120 and the Z-axis guide rail 110 cooperate with each other to realize the guiding and limiting of the suction head 130 along the vertical direction. Thus, the movement of the suction head 130 along the vertical direction and the X-axis direction can be realized by one driving motor 220 at the same time, achieving multi-purpose use of one machine. The first driving motor 220 only needs to assist in adjusting the movement of the suction head 130 along the X-axis direction, which is beneficial to reducing the energy consumption of the entire chip handling and implanting mechanism 10 and improving the chip handling efficiency.

[0025] Please further combine Figure 1-3, in this embodiment, the first driving member 330 includes a first servo motor 331 fixed on the X-axis base 310, a first lead screw 332 drivingly connected to the output shaft of the first servo motor 331 and extending along the X-axis direction, a first nut 333 sleeved on the first lead screw 332 and threadedly engaged with the first lead screw 332, and a first support frame 334 fixedly connected to the first nut 333. The Y-axis base 320 is fixed to the top or bottom of the first support frame 334. Thus, when the first servo motor 331 operates, the output shaft of the first servo motor 331 drives the first lead screw 332 to rotate synchronously. Since the first lead screw 332 is threadedly connected to the first nut 333 and the first support frame 334 is fixedly connected to the first nut 333, the first support frame 334 is further limited by the mutual restraint with the X-axis base 310. Therefore, during the rotation of the first lead screw 332, the first nut 333 drives the first support frame 334 to move along the axial direction of the first lead screw 332, thereby realizing the primary drive of the Y-axis base 320 and even the entire gripping assembly 100 along the X-axis direction. Further, two X-axis slide rails 335 fixedly connected to the X-axis base 310 and extending along the X-axis direction are oppositely arranged on both sides of the first lead screw 332, and X-axis sliders 336 slidably engaged with the two X-axis slide rails 335 are respectively provided on the first support frame 334. Thus, while guiding the Y-axis base 320 and defining the moving path of the Y-axis base 320, the mating area between the Y-axis base 320 and the X-axis base 310 is increased, and the smoothness of the movement of the Y-axis base 320 along the X-axis direction is improved. In other embodiments, the first driving member 330 can also be replaced with a linear motor for driving the Y-axis base 320 to move along the X-axis direction.

[0026] The second driving member 340 includes a second servo motor 341 fixed on the Y-axis base 320, a second screw rod 342 that is driven and connected to the output shaft of the second servo motor 341 and extends along the Y-axis direction, a second nut 343 that is sleeved on the second screw rod 342 and threadedly engaged with the second screw rod 342, and a second support frame 344 fixedly connected to the second nut 343. The mounting frame 210 is fixedly connected to a side of the second support frame 344 that faces away from the Y-axis base 320. Thus, when the second servo motor 341 is operating, the output shaft of the second servo motor 341 drives the second screw rod 342 to rotate synchronously. Since the second screw rod 342 is threadedly connected to the second nut 343, and the second support frame 344 is fixedly connected to the second nut 343, the second support frame 344 is further limited by mutual constraints with the Y-axis base 320. As a result, during the rotation of the second screw rod 342, the second nut 343 drives the second support frame 344 to move axially along the second screw rod 342, thereby achieving the drive of the entire grasping assembly 100 along the Y-axis direction. Furthermore, two Y-axis slide rails 345 fixedly connected to the Y-axis base 320 and extending along the Y-axis direction are oppositely arranged on both sides of the second screw rod 342. The second support frame 344 is provided with a Y-axis slider 346 that corresponds to and slidably engages with the two Y-axis slide rails 345. In this way, while guiding and limiting the movement path of the mounting frame 210, the mating area between the mounting frame 210 and the Y-axis base 320 is increased, thereby improving the stability of the mounting frame 210 moving along the Y-axis. In order to reduce the size of the chip transport and implantation mechanism 10 along the Y-axis, in this embodiment, the second servo motor 341 is arranged side by side with the Y-axis base 320. Furthermore, the output shaft of the second servo motor 341 is connected to the second screw rod 342 via a conveyor belt drive. Specifically, the output shaft of the second servo motor 341 is fixed to a driving pulley 347, and the second screw rod 342 is fixed to one end adjacent to the driving pulley 347. The driving pulley 347 and the driven pulley 348 are driven by a conveyor belt 349 to transmit the power output by the second servo motor 341 to the second screw rod 342. In other embodiments, the second driving member 340 can also be replaced with a linear motor for driving the mounting frame 210 to move along the Y-axis.

[0027] Please combine Figure 4-5, the cam 240 can be an eccentric circular structure, a multi-prismatic eccentric structure or an irregular eccentric structure. Preferably, in this embodiment, the cam 240 is a triangular prism structure, and the rotation center of the cam 240 (i.e., the output shaft of the cam 240 and the drive motor 220) is eccentrically arranged on the triangular prism structure. On one side of the guide plate 230 adjacent to the Z-axis guide rail 110, a proximity switch 260 is provided at the edge of the guide through groove 231. The proximity switch 260 is electrically connected to the drive motor 220. The proximity switch 260 is used to detect the position of the Z-axis guide rail 110. When the Z-axis guide rail 110 moves into the detection area of the proximity switch 260, the potential of the proximity switch 260 changes, so as to drive the drive motor 220 to rotate in the reverse direction or pause, thereby accurately controlling the position of the suction head 130.

[0028] In this embodiment, the transmission block 120 includes a first slider 121, a limit block 122 and a second slider 123. A first chute 124 that is concavo-convexly matched with the X-axis guide rail 250 is formed on the first slider 121. The surface of the first slider 121 facing away from the X-axis guide rail 250 is fixedly connected to the limit block 122, and a through hole 125 that penetrates the upper surface and the lower surface of the limit block 122 is formed on the limit block 122. The second slider 123 is received in the through hole 125 and fixedly connected to the limit block 122. A second chute 126 is formed on the second slider 123. The Z-axis guide rail 110 passes through the second chute 126 and is slidably matched with the second slider 123. The first slider 121 is screwed to the limit block 122, and the second slider 123 is screwed to the limit block 122. Of course, the first slider 121, the limit block 122 and the second slider 123 can also be integrally formed. Preferably, the inner contour shape of the first chute 124 is adapted to the outer contour shape of the X-axis guide rail 250, and the inner contour shape of the second chute 126 is adapted to the outer contour shape of the Z-axis guide rail 110, so as to reduce the shaking during the movement of the suction head 130 and improve the smoothness of the movement of the suction head 130.

[0029] In one embodiment, the gripping assembly 100 further includes a positioning frame 150 fixed to the bottom end of the Z-axis guide rail 110, a suction head mounting block 160 located below the positioning frame 150, at least one heat insulation column 170 connecting the positioning frame 150 and the suction head mounting block 160, and a heat insulation plate 180 fixed to the positioning frame 150 and at least semi-surrounding the suction head mounting block 160. A plurality of weight-reducing holes 181 are formed in the heat insulation plate 180. The suction head 130 is fixed to the suction head mounting block 160 and is communicated with an external air pressure device through an air pipe passing through the positioning frame 150. The suction head mounting block 160 is used to position the suction head 130 to avoid the problem that it is difficult to align the suction head 130 with the chip due to the shaking of the suction head 130 under the action of air pressure. Preferably, a jack is formed in the suction head mounting block 160, the suction head 130 passes through the jack, and the outer surface of the suction head 130 fits with the inner surface of the jack. In this embodiment, the inner contour shape of the jack is adapted to the outer contour shape of the suction head 130, and an adhesive layer is attached to the outer surface of the suction head 130. The adhesive layer is used to seal the gap between the inner wall of the jack and the outer surface of the suction head 130, so that the suction head 130 is in a tight fit with the inner wall of the jack, avoiding the shaking of the suction head 130 relative to the suction head mounting block 160 and improving the stability of the installation of the suction head 130. Since the temperature of each component rises after mutual friction during the high-speed operation of the equipment, the temperature of the Z-axis guide rail 110 will also rise accordingly. By extending the distance between the positioning frame 150 and the suction head mounting block 160 through the heat insulation column 170, the heat transfer to the suction head 130 can be reduced, and further the heat transfer to the chip can be reduced to weaken the influence of the equipment temperature on the chip. By providing the heat insulation plate 180 on the positioning frame 150 and forming the weight-reducing holes 181 in the heat insulation plate 180, the heat insulation plate 180 is used to protect the suction head 130 and the suction head mounting block 160 on the one hand, and on the other hand, the heat transferred to the positioning frame 150 and the suction head 130 can be quickly exported; the weight-reducing holes 181 are used to reduce the weight of the bottom end of the gripping assembly 100 on the one hand, and on the other hand, are also used to quickly export the heat at the suction head 130 to further weaken the influence of the equipment temperature on the chip.

[0030] In addition, the gripping assembly 100 further includes a shock absorption structure 190. The shock absorption structure 190 includes a third slider 191 slidably engaged with the Z-axis guide rail 110, a shock absorption rod 192 extending in the vertical direction between the third slider 191 and the positioning frame 150, and a shock absorption spring 193. One end of the shock absorption rod 192 is fixedly connected to the third slider 191, the other end of the shock absorption rod 192 is fixedly connected to the positioning frame 150, and the shock absorption spring 193 is sleeved on the shock absorption rod 192 and abuts against the lower surface of the third slider 191 and the upper surface of the positioning frame 150 respectively. By providing the shock absorption structure 190, when the chip transfer and implantation mechanism 10 is subjected to an external impact, the shock absorption spring 193 can buffer part of the impact to avoid the chip being damaged by the suction head 130 under the external impact, thereby reducing the defective rate of the product during the operation process.

[0031] The above chip transfer and implantation mechanism 10 drives the cam 240 to rotate through the drive motor 220. The connecting rod 140 connects the Z-axis guide rail 110 and the eccentric part 241 of the cam 240. By using the guiding slot 231 to guide and limit the connecting rod 140, the Z-axis guide rail 110 moves along the X-axis direction and the vertical direction simultaneously. At the same time, in cooperation with the XY biaxial drive assembly 300, the position of the suction head 130 in the horizontal direction is adjusted, so that the suction head 130 can accurately grasp the chip and transport the chip to the groove of the card on the card conveyor belt 20. Compared with the drive mode of the servo motor and the guide rail, the movement of the suction head 130 along the X-axis direction in this solution is realized by the joint action of the first drive member 330 and the drive motor 220. The movement speed of the suction head 130 is faster, which improves the chip handling efficiency and further improves the production efficiency of smart cards. Moreover, compared with the drive mode of the servo motor and the guide rail, the chip transfer and implantation mechanism 10 in this solution has a simpler structure and better stability, ensuring the reliability of the chip handling operation.

[0032] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.

[0033] The above-described embodiments only represent several implementation manners of the present invention. The description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the utility model patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can still be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the utility model patent shall be subject to the appended claims.

Claims

1. A chip transfer and implantation mechanism is used to be arranged beside the card conveyor belt of an IC card milling slot encapsulation machine. It includes a gripping component for sucking the chip to be transferred, a handling drive component for driving the gripping component to move to grab the chip, and an XY two-axis drive component for driving the handling drive component to move in the horizontal direction. The XY two-axis drive component includes an X-axis base extending in the X-axis direction, a Y-axis base slidably arranged on the X-axis base, a first drive member fixed on the X-axis base and driving the Y-axis base to slide in the X-axis direction, and a second drive member fixed on the Y-axis base and driving the gripping component to slide in the Y-axis direction on the Y-axis base. It is characterized in that the handling drive component includes a mounting frame slidably arranged on the Y-axis base and drivingly connected to the second drive member, a drive motor located on one side of the mounting frame and fixedly connected to the upper part of the mounting frame, a guide plate located on the other side of the mounting frame and fixedly connected to the upper part of the mounting frame, a cam located inside the mounting frame and drivingly connected to the output shaft of the drive motor, an X-axis guide rail fixed to the lower part of the mounting frame and extending in the X-axis direction. The cam has an eccentric part, and the cam rotates coaxially with the output shaft of the drive motor. The guide plate is provided with a guide through groove in an n-shaped or U-shaped structure, and the guide through groove penetrates through two opposite side surfaces of the guide plate; the gripping component includes a Z-axis guide rail extending in the vertical direction, a transmission block slidably arranged on the X-axis guide rail and used for slidably passing through the Z-axis guide rail, a suction head fixed to the bottom end of the Z-axis guide rail and used for sucking the chip to be transferred, and a connecting rod passing through the guide through groove and fixedly connected to the upper part of the Z-axis guide rail and the eccentric part respectively. The suction head is communicated with an external air pressure device; the Z-axis guide rail moves along the guide through groove under the drive of the cam, so that the suction head moves in the X-axis direction and the vertical direction at the same time.

2. The chip transfer and implantation mechanism according to claim 1, characterized in that, A proximity switch is arranged on one side of the guide plate adjacent to the Z-axis guide rail at the edge of the guide through groove, and the proximity switch is electrically connected to the drive motor.

3. The chip transfer and implantation mechanism according to claim 1, wherein The transmission block includes a first slider, a limit block and a second slider. The first slider is provided with a first chute that is concavo-convexly matched with the X-axis guide rail. The side of the first slider facing away from the X-axis guide rail is fixedly connected to the limit block, and the limit block is provided with a through hole penetrating through the upper surface and the lower surface of the limit block. The second slider is received in the through hole and fixedly connected to the limit block. The second slider is provided with a second chute, and the Z-axis guide rail passes through the second chute and is slidably matched with the second slider.

4. The chip transfer and implantation mechanism according to claim 1, wherein, The gripping component further includes a positioning frame fixed to the bottom end of the Z-axis guide rail, a suction head mounting block located below the positioning frame, at least one heat insulation column connecting the positioning frame and the suction head mounting block, and a heat insulation plate fixed to the positioning frame and at least semi-surrounding the suction head mounting block. The heat insulation plate is provided with a plurality of weight-reducing holes. The suction head is fixed to the suction head mounting block and is communicated with an external air pressure device through a trachea passing through the positioning frame.

5. The chip transfer and implantation mechanism according to claim 4, wherein The gripping assembly further includes a shock-absorbing structure, which includes a third slider slidably engaged with the Z-axis guide rail, a shock-absorbing rod extending in the vertical direction between the third slider and the positioning frame, and a shock-absorbing spring. One end of the shock-absorbing rod is fixedly connected to the third slider, and the other end of the shock-absorbing rod is fixedly connected to the positioning frame. The shock-absorbing spring is sleeved on the shock-absorbing rod and abuts against the lower surface of the third slider and the upper surface of the positioning frame respectively.

6. The chip transfer and implantation mechanism according to claim 1, characterized in that The first driving member includes a first servo motor fixed on the X-axis base, a first lead screw drivingly connected to the output shaft of the first servo motor and extending in the X-axis direction, a first nut sleeved on the first lead screw and threadedly engaged with the first lead screw, and a first support frame fixedly connected to the first nut. The Y-axis base is fixed to the top or bottom of the first support frame.

7. The chip transfer and implantation mechanism according to claim 6, characterized in that, On both sides of the first lead screw, there are two X-axis slide rails fixedly connected to the X-axis base and extending in the X-axis direction. The first support frame is provided with X-axis sliders respectively slidably engaged with the two X-axis slide rails.

8. The chip transfer and implantation mechanism according to claim 1, characterized in that, The second driving member includes a second servo motor fixed on the Y-axis base, a second lead screw drivingly connected to the output shaft of the second servo motor and extending in the Y-axis direction, a second nut sleeved on the second lead screw and threadedly engaged with the second lead screw, and a second support frame fixedly connected to the second nut. The mounting frame is fixedly connected to the side of the second support frame facing away from the Y-axis base.

9. The chip transfer and implantation mechanism according to claim 8, wherein, On both sides of the second lead screw, there are two Y-axis slide rails fixedly connected to the Y-axis base and extending in the Y-axis direction. The second support frame is provided with Y-axis sliders respectively slidably engaged with the two Y-axis slide rails.

10. The chip transfer and implantation mechanism according to claim 8, characterized in that, The output shaft of the second servo motor is drivingly connected to the second lead screw through a conveyor belt.

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