Porcelain dish band piece cleaning and discharging integrated equipment

Abstract

The utility model relates to porcelain dish band piece cleaning and discharging integrated equipment which comprises a machine frame, a ceramic dish band piece cleaning device, a ceramic dish band piece discharging device and a ceramic dish band piece discharging device. The material rack is provided with a material placing area which is communicated with the transshipment area and is used for placing the ceramic plates with pieces and / or the empty ceramic plates; the cleaning mechanism is arranged in the cleaning area; the sheet discharging mechanism is arranged in the sheet discharging area; and the transshipment manipulator is arranged in the transshipment area. On one hand, on the basis that the wafers are kept in the state of being adhered to the porcelain plate, stripping and unloading of the wafers are carried out through cooperation of the second positioning component, the scraper knife and the transmission track, the wafers are effectively prevented from deviating, accurate butt joint of the wafers and the transmission track is guaranteed, and the unloading success rate is greatly improved; on the other hand, loading, cleaning, unloading and recycling of the porcelain plates are integrated, time and labor are saved in operation, efficiency is effectively improved, the occupied area of equipment is reduced, and the space utilization rate is increased advantageously; in addition, the structure is simple and reliable, and implementation cost is low.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor processing, and particularly relates to a cleaning and unloading integrated device for ceramic plates with wafers. Background Art

[0002] A wafer is a silicon wafer used in the production of semiconductor chips and integrated circuits. Since its shape is circular, it is also called a silicon wafer. By fabricating various circuit structures on the surface of the wafer, it can be made into an electronic component with specific electrical functions. In the production and processing process of wafers, it usually needs to go through process steps such as slicing, grinding, polishing, and cleaning. Currently, in the processes of grinding, polishing, etc., a ceramic plate is required as the carrier or substrate of the wafer, that is, the wafer is attached to the surface of the ceramic plate for processing operations. The ceramic plate has a very high surface flatness and can provide a reference plane for the grinding and polishing of the wafer.

[0003] In the prior art, after attaching the wafer to the surface of the ceramic plate and performing the grinding and polishing processes, the ceramic plate needs to be cleaned to remove residues, impurities, etc. on the surfaces of the ceramic plate and the wafer. After the cleaning process is completed, the wafer needs to be removed from the ceramic plate, that is, the unloading process is performed.

[0004] However, in the actual production process, the prior art has the following defects:

[0005] 1. The cleaning process and the unloading process are two separate processes. That is, the ceramic plates with wafers are batch-cleaned on a cleaning machine and then temporarily stored on a carrier vehicle, and then transported to an unloader by the carrier vehicle for unloading. The operation is cumbersome, time-consuming and laborious, and the processing efficiency is low; at the same time, the equipment occupies a large space, resulting in waste;

[0006] 2. Before unloading, generally, the ceramic plate is heated to make the wafer peel off from the ceramic plate (heating makes the wax oil that plays an adhesive role between the wafer and the ceramic plate melt), and then the wafer is removed and collected by a material receiving mechanism. In this way, since the wafer and the ceramic plate are in a peeled state after heating, there is a probability that the wafer will slip relative to the ceramic plate when the ceramic plate is tilted or moved, and it is very difficult to ensure the precise docking of the wafer with the material receiving structure, resulting in the problem that the wafer cannot be normally received. Summary of the Utility Model

[0007] The technical problem to be solved by the utility model is to overcome the deficiencies of the prior art and provide an improved cleaning and unloading integrated device for ceramic plates with wafers.

[0008] To solve the above technical problems, the utility model adopts the following technical solutions:

[0009] A cleaning and unloading integrated device for ceramic plates with wafers, the upper surface of the ceramic plate is adhered with wafers, and the integrated device includes:

[0010] A rack having a cleaning area, a wafer unloading area and a transfer area that are interconnected;

[0011] A material rack having a material placement area connected to the transfer area and used for placing wafer-carrying ceramic trays and / or empty ceramic trays;

[0012] A cleaning mechanism disposed in the cleaning area and including a first positioning member and a cleaning member. The first positioning member has a first positioning area for horizontally positioning the wafer-carrying ceramic tray, and the cleaning area formed by the cleaning member covers the upper surface of the ceramic tray and the wafer, the side surface and the lower surface of the ceramic tray;

[0013] A wafer unloading mechanism disposed in the wafer unloading area and including a transfer track for sequentially transferring wafers, a second positioning member having a second positioning area for horizontally positioning the wafer-carrying ceramic tray, a receiving member having a wafer receiving groove, and a wafer shoveling member. The second positioning area and the receiving groove are respectively connected to the feeding end and the discharging end of the transfer track. The wafer shoveling member includes a shovel blade movably disposed above the second positioning area, and the shovel blade is used for peeling the wafer from the upper surface of the ceramic tray and feeding it into the transfer track;

[0014] A transfer robot disposed in the transfer area and used for transferring the wafer-carrying ceramic tray and / or the empty ceramic tray between the material placement area, the first positioning area and the second positioning area.

[0015] According to a specific embodiment and preferred aspect of the present invention, the first positioning member includes a plurality of support rollers that rollingly support the lower surface of the ceramic tray, a plurality of clamping wheels that are circumferentially spaced around the ceramic tray and can clamp or loosen along the radial direction of the ceramic tray, and a driving wheel for driving the ceramic tray to rotate around its own center line.

[0016] Preferably, the cleaning member includes a spray head, a first brush body and a second brush body correspondingly disposed above, beside and below the first positioning area. As the ceramic tray rotates, the flushing area formed by the spray head covers the upper surface of the ceramic tray and the wafer, and the brushing areas formed by the first brush body and the second brush body cover the side surface and the lower surface of the ceramic tray. Herein, through the relative movement between the ceramic tray and the cleaning member, the omnidirectional cleaning of the ceramic tray and the wafer is realized, effectively improving the cleaning effect.

[0017] Specifically, the flushing fluid sprayed by the spray head is two-fluid; and / or, in the orthographic projection on the horizontal plane, the spray head can move in a direction close to or away from the center of the ceramic tray; and / or, in the orthographic projection on the horizontal plane, the fluid sprayed by the spray head flows in a direction away from the center of the ceramic tray. Herein, it is beneficial for the impurities flushed out to separate from the ceramic tray and reduce residues.

[0018] According to another specific implementation and preferred aspect of the present utility model, the transfer area is arranged between the cleaning area and the lower wafer area; the transfer manipulator includes a rotating base that rotates around the vertical direction, a linear guide rail arranged on the rotating base, and a pick-and-place arm that is slidably arranged on the linear guide rail and is used for picking and placing the ceramic trays. Herein, the structure is simple and compact, which is convenient for installation and implementation.

[0019] Preferably, the linear guide rail includes a first guide rail and a second guide rail that are arranged side by side at intervals; the pick-and-place arm includes a first arm body and a second arm body that are correspondingly slidably arranged on the first guide rail and the second guide rail, wherein the pick-and-place ends formed by the first arm body and the second arm body are arranged vertically aligned; and / or, the transfer manipulator further includes a lifting drive component for driving the up-and-down movement of the rotating base. Herein, when one pick-and-place end grabs the wafer-carrying ceramic tray to be cleaned and moves it to the cleaning area, the other can take out the wafer-carrying ceramic tray that has completed cleaning and then place the one to be cleaned in the corresponding positioning area; similarly, when one pick-and-place end grabs the wafer-carrying ceramic tray that has completed cleaning and moves it to the lower wafer area, the other can take out the empty ceramic tray that has completed wafer unloading and place the wafer-carrying ceramic tray to be unloaded in the corresponding positioning area, thereby effectively improving the processing efficiency.

[0020] According to another specific implementation and preferred aspect of the present utility model, there is an adhesive layer between the upper surface of the ceramic tray and the wafer; the spatula has a tool head that can be inserted between the ceramic tray and the wafer, and a spatula surface is formed on the tool head. As the spatula moves closer to the feeding end, the tool head synchronously breaks the adhesive layer, and the corresponding wafer gradually detaches from the upper surface of the ceramic tray and enters the spatula surface. When the spatula surface is docked with the transfer track, the wafer falls from the spatula surface onto the transfer track and is transported towards the receiving trough. Herein, the spatula realizes non-destructive peeling of the wafer, improving the product yield.

[0021] Preferably, the spatula includes a tool holder and a tool body whose one end is fixedly connected to the tool holder, wherein the other end of the tool body extends obliquely downward towards the feeding end to form a tool head, and a spatula surface is formed on the upper surface of the tool head; the lower surface of the tool head intersects with the spatula surface from the side close to the feeding end, and the formed angle is 13° - 17°; during wafer unloading, the lower surface of the tool head is arranged in contact with the upper surface of the ceramic tray; a step portion protruding upward is further formed on the side of the spatula surface far from the feeding end. When the wafer enters the spatula surface, the wafer abuts against the step portion from the edge; in the orthographic projection on the horizontal plane, during wafer unloading, the center lines of the wafer and the tool head coincide. Herein, the auxiliary support for the tool head is formed through the contact surface to enhance the anti-deformation ability of the tool head and extend the service life; the displacement of the wafer on the spatula surface is restricted by the step portion, so as to facilitate the wafer to quickly fall onto the transfer track for receiving materials.

[0022] According to another specific implementation and preferred aspect of the present utility model, the second positioning component includes a positioning platform capable of vacuum-adsorbing the porcelain disk and a plurality of clamping blocks circumferentially and spaced apart around the positioning platform, wherein the plurality of clamping blocks can move closer to or away from each other to clamp or release the porcelain disk; the positioning platform has a horizontal state and an inclined state. During the lower sheet operation, the positioning platform is in the inclined state, and the upper surface of the porcelain disk is arranged parallel to the transmission surface formed by the transmission track. Here, when the positioning platform is in the horizontal state, it is convenient for the manipulator to accurately place the porcelain disk on the positioning platform; when the positioning platform is in the inclined state, it is beneficial to peel off the wafer and enter the transmission track, reducing the probability of the wafer being bumped and damaged.

[0023] In addition, the material receiving component includes a lifting frame and a material box arranged on the lifting frame. A plurality of material receiving grooves are formed on the material box and are distributed vertically. The lifting frame drives the material box and drives the plurality of material receiving grooves to be sequentially docked with the discharge end; there are a plurality of material boxes and they are distributed vertically and spaced apart. Here, the orderly receiving of multiple wafers is realized; at the same time, the plurality of material boxes can be continuously replaced to meet the requirements of batch and efficient production.

[0024] Due to the implementation of the above technical solutions, the present utility model has the following advantages compared with the prior art:

[0025] The cleaning process and the unloading process of the prior art are two separate processes, that is, the ceramic discs with wafers are cleaned in batches on a cleaning machine and then temporarily stored on a transport vehicle, and then transported to the unloading machine by the transport vehicle for unloading. The operation is cumbersome, time-consuming and labor-intensive, and the processing efficiency is low. At the same time, the equipment occupies a large space, resulting in waste. At the same time, since the wafers and the ceramic discs are in a peeling state after heating, when controlling the rotation of the ceramic discs to drive the wafers to align with the slide or drive multiple wafers to dock with the slide in turn, the wafers can easily be misaligned under the influence of centrifugal force, making it difficult to ensure that the wafers are accurately docked with the slide, and the wafers may even fall off the ceramic disc, causing the wafers to be unable to dock properly. The problem of frequent material collection; the present application carries out an overall design of the structure of the integrated equipment for cleaning and unloading the ceramic disc with wafers, which cleverly solves the shortcomings and defects of the existing technology. After adopting the integrated equipment, the transfer robot grabs the ceramic disc with wafers to be cleaned from the material loading area and transfers it to the first positioning area for positioning, and then the cleaning component cleans the upper surface, side and lower surface of the ceramic disc and the wafer; after cleaning, the transfer robot transfers the cleaned ceramic disc with wafers to the second positioning area, peels off the wafer with a scraper and sends it to the transmission track to transfer it to the receiving trough for material collection; finally, the transfer robot transfers the empty ceramic disc with wafers to the material loading area. Therefore, compared with the prior art, the present invention, on the one hand, is based on the state that the chip remains adhered to the ceramic plate, and the cooperation of the second positioning component, the scraper and the transmission track is used to implement the peeling and unloading of the chip, which effectively avoids the deviation of the chip, ensures that each chip is accurately docked with the transmission track, and greatly improves the success rate of unloading; on the other hand, it realizes the integration of ceramic plate loading, cleaning, unloading and recycling, which saves time and labor in operation, effectively improves efficiency, reduces the equipment footprint, and is conducive to improving space utilization; in addition, the structure is simple and reliable, and the implementation cost is low. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 This is a schematic diagram of the three-dimensional structure of a porcelain plate with a piece of film cleaning and unloading integrated equipment of this embodiment;

[0027] Figure 2 for Figure 1 Schematic top view of

[0028] Figure 3 for Figure 1 An enlarged schematic diagram of the structure of the cleaning mechanism;

[0029] Figure 4 for Figure 1 A magnified schematic diagram of the structure of the middle and lower pieces;

[0030] Figure 5 for Figure 4 The main schematic diagram of

[0031] Figure 6 for Figure 4 An enlarged schematic diagram of the structure of the middle blade body;

[0032] Figure 7 for Figure 1 An enlarged schematic diagram of the structure of the transfer robot (partially omitted);

[0033] Among them: ①, rack; q1, cleaning area; q2, unloading area; q3, transfer area;

[0034] ②, material rack; q4, material placement area;

[0035] ③, cleaning mechanism; A1, first positioning component; A10, supporting roller; A11, clamping wheel; a1, first positioning area; A12, driving wheel; A2, cleaning component; A20, nozzle; A21, first brush body; A22, second brush body;

[0036] ④. Unloading mechanism; 1. Transport track; m2. Transport surface; 2. Second positioning component; 20. Positioning platform; 21. Clamping block; a2. Second positioning area; 22. First driving component; 23. Second driving component; 230. Base; 231. Turning seat; 232. Driving member; 24. Third driving component; 3. Material receiving component; 30. Lifting frame; 31. Material box; 310. Material receiving chute; 4. Shovel unit; 40. Shovel blade; 400. Tool holder; 401. Tool body; t. Tool head; m3. Shovel blade surface; b. Step portion; 41. First power component; 42. Second power component;

[0037] ⑤, transfer robot; B1, rotating seat; B2, linear guide; B21, first guide; B22, second guide; B3, pick-and-place arm; B31, first arm body; B32, second arm body; B4, lifting drive component;

[0038] P1, porcelain plate; m1, upper surface; P2, chip. DETAILED DESCRIPTION

[0039] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0040] In the description of the present application, it should be understood that the orientation or positional relationship indicated by terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application.

[0041] In addition, the terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present application, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically and clearly defined.

[0042] In the present application, unless otherwise clearly specified and limited, terms such as "mounted", "connected", "coupled", "fixed", etc. shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the internal communication of two elements or the interaction relationship between two elements, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0043] In the present application, unless otherwise clearly specified and limited, the first feature being "on" or "under" the second feature may be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may be that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature. It should be noted that when an element is referred to as "fixed to" or "disposed on" another element, it may be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected" to another element, it may be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are only for the purpose of illustration and do not represent the only implementation.

[0044] As shown Figures 1 to 7 in the figure, a cleaning and wafer unloading integrated device for a ceramic disk with wafers of this embodiment includes a frame ①, a rack ②, a cleaning mechanism ③, a wafer unloading mechanism ④, and a transfer robot ⑤. On the upper surface m1 of the ceramic disk P1 of this embodiment, multiple wafers P2 are adhered, and among them, the multiple wafers P2 are spaced apart around the center of the ceramic disk P1, and a bonding layer is provided between the upper surface m1 of the ceramic disk and each wafer P2.

[0045] Specifically, the frame ① is a frame composed of horizontal and vertical extending rods, and the outside of the frame is enclosed by a door panel. Inside the frame ①, there are a cleaning area q1, a wafer unloading area q2, and a transfer area q3 that are interconnected. Among them, the transfer area q3 is arranged between the cleaning area q1 and the wafer unloading area q2, and the cleaning mechanism ③, the wafer unloading mechanism ④, and the transfer robot ⑤ are correspondingly arranged in the cleaning area q1, the wafer unloading area q2, and the transfer area q3.

[0046] In this example, the rack ② can be any conventional rack structure for placing ceramic disks. A material placing area q4 that is connected to the transfer area q3 and is used for placing wafer-carrying ceramic disks and / or empty ceramic disks is formed inside the rack ②. Among them, a layered structure is adopted in the material placing area q4, and multiple ceramic disks are placed flat on each layer space of the material placing area q4 in sequence from top to bottom. In some specific embodiments, the rack ② is provided with universal wheels for easy movement.

[0047] In this example, the cleaning mechanism ③ includes a first positioning component A1 and a cleaning component A2. Among them, the first positioning component A1 forms a first positioning area a1 for horizontally positioning the wafer-carrying ceramic disk, and the cleaning area formed by the cleaning component A2 covers the upper surface of the ceramic disk P1 and the wafers P2, the side surface and the lower surface of the ceramic disk P1.

[0048] In some specific embodiments, the first positioning component A1 includes multiple support rollers A10 that roll and support on the lower surface of the ceramic disk P1, multiple clamping wheels A11 that are circumferentially spaced apart around the ceramic disk P1 and can clamp or loosen along the radial direction of the ceramic disk, and a driving wheel A12 for driving the ceramic disk P1 to rotate around its own center line. Among them, a first positioning area a1 is formed between the multiple support rollers A10 and the multiple clamping wheels A11; the driving wheel A12 abuts against the side surface of the ceramic disk from its wheel surface, and drives the ceramic disk to rotate during the rotation of the driving wheel A12; the driving methods of the clamping wheel A11 and the driving wheel A12 are all conventional technical means and will not be elaborated here.

[0049] The cleaning component A2 includes a spray head A20, a first brush body A21, and a second brush body A22 that are correspondingly arranged above, on the side, and below the first positioning area a1. As the ceramic disk rotates, the flushing area formed by the spray head A20 covers the upper surface of the ceramic disk and the wafers, and the brushing areas formed by the first brush body A21 and the second brush body A22 cover the side surface and the lower surface of the ceramic disk.

[0050] Specifically, the flushing fluid ejected by the nozzle A20 is a two-fluid mixture (a mixture of liquid and gas); in the orthographic projection on the horizontal plane, the nozzle A20 can move towards or away from the center of the porcelain plate, and the fluid ejected by the nozzle A20 flows away from the center of the porcelain plate. For the convenience of implementation, a motor is provided on one side of the first positioning area a1, and the output shaft of the motor is connected to the nozzle A20 through a connecting rod. Driven by the motor, the nozzle A20 rotates around the vertical center line to adjust the position of the flushing area formed by the nozzle A20.

[0051] The first brush body A21 and the second brush body A22 are made of PVA material brushes. The first brush body A21 is in the shape of a cylinder, and multiple horizontally extending bristles are circumferentially distributed on the cylinder; the second brush body A22 is in the shape of a disc, and multiple vertically extending bristles are laid flat on the surface of the disc. For further convenience in implementation, the first brush body A21 and the second brush body A22 are respectively driven by motors to rotate around their own axis lines, and the rotation directions are opposite to the rotation direction of the porcelain plate P1.

[0052] In this example, the wafer unloading mechanism ④ includes a transfer track 1 for sequentially transferring wafers, a second positioning member 2 forming a second positioning area a2 for horizontally positioning the wafer-carrying porcelain plate, a receiving member 3 forming a wafer receiving groove, and a wafer shoveling member 4. The second positioning area a2 and the receiving groove are respectively connected to the feeding end and the discharging end of the transfer track 1.

[0053] In some specific embodiments, the transfer track 1 extends obliquely up and down, where the upper end of the transfer track 1 is the feeding end and the lower end is the discharging end. The transfer track 1 forms a transfer surface m2 for sequentially transferring wafers P2 from top to bottom; when the wafer enters the transfer surface m2, the wafer freely slides down along the transfer track 1 under its own weight.

[0054] The second positioning member 2 includes a positioning platform 20 capable of vacuum adsorbing the porcelain plate and a plurality of clamping blocks 21 circumferentially spaced around the positioning platform 20. A second positioning area a2 is formed between the positioning platform 20 and the plurality of clamping blocks 21. The positioning platform 20 has a horizontal state and an inclined state. When the positioning platform 20 is in the horizontal state, the porcelain plate P1 is placed flat and adsorbed and fixed on the positioning platform 20. When unloading the wafer, the positioning platform 20 is in the inclined state, and the upper surface m1 of the porcelain plate is arranged parallel to the transfer surface m2 formed by the transfer track 1; the plurality of clamping blocks 21 can move towards or away from each other to clamp or loosen the porcelain plate, and the contact surfaces of each clamping block 21 are tangent to the corresponding positions on the edge of the porcelain plate P1. At the same time, among the plurality of clamping blocks 21, a part is fixedly arranged relative to the positioning platform 20, and the other part is arranged to reciprocate along the radial direction of the porcelain plate P1.

[0055] For the convenience of implementation, the second positioning component 2 further includes a first driving component 22 and a second driving component 23 respectively connected to the positioning platform 20. The first driving component 22 is used to drive the positioning platform 20 and drive each wafer P2 to be aligned with the feeding end of the transmission track 1 in sequence; the second driving component 23 is used to drive the positioning platform 20 to switch between a horizontal state and an inclined state, and when the positioning platform 20 is in the inclined state, the upper surface m1 of the porcelain plate is arranged in parallel with the transmission surface m2.

[0056] In some specific embodiments, the first driving component 22 uses a conventional motor and is used to drive the positioning platform 20 to rotate around its own central axis; the second driving component 23 includes a base 230, a flipping seat 231 arranged above the base 230, and a driving member 232. One side of the flipping seat 231 is rotatably connected to the base 230 through a pivot, and the other side is rotatably connected to the output shaft of the driving member 232. The positioning platform 20 is arranged on the flipping seat 231. Under the vertical expansion and contraction of the output shaft of the driving member 232, the flipping seat 231 drives the positioning platform 20 to tilt towards the transmission track 1 or return to the horizontal state.

[0057] For the convenience of the second positioning component to receive and discharge materials, the second positioning component 2 further includes a third driving component 24 for driving the lifting movement of the positioning platform 20. In this embodiment, the third driving component 24 uses a conventional lifting cylinder.

[0058] In this example, the material receiving component 3 includes a lifting frame 30 and a material box 31 arranged on the lifting frame 30. A plurality of material receiving grooves 310 for receiving wafers are formed on the material box 31 and are distributed up and down. The lifting frame drives the material box 31 and drives the plurality of material receiving grooves 310 to be sequentially docked with the discharging end of the transmission track 1; there are a plurality of material boxes 31 and they are distributed at intervals up and down.

[0059] In this example, the wafer shoveling unit 4 includes a shovel 40 movably arranged above the positioning platform 20, a first power component 41 for driving the shovel 40 to reciprocate in a direction close to or away from the feeding end of the transmission track 1, and a second power component 42 for driving the shovel 40 to reciprocate in a direction perpendicular to the upper surface of the porcelain plate and / or the transmission surface. The shovel 40 has a blade head t that can be inserted between the porcelain plate P1 and the wafer P2, and a shovel surface m3 is formed on the blade head t. As the shovel 40 moves closer to the feeding end, the blade head t synchronously destroys the adhesive layer, and the corresponding wafer detaches from the upper surface m1 of the porcelain plate and enters the shovel surface m3. When the shovel surface m3 is docked with the transmission surface m2, the wafer falls from the shovel surface m3 onto the transmission surface m2 and is transmitted towards the material receiving groove 310.

[0060] In some specific embodiments, the blade 40 includes a tool holder 400 and a blade body 401 fixedly connected to one end of the tool holder 400. The other end of the blade body 401 extends obliquely downward towards the feeding end of the transfer track 1 and forms a blade tip t. A blade surface m3 is formed on the upper surface of the blade tip t; the lower surface of the blade tip t intersects with the blade surface m3 from the side close to the feeding end, and the formed angle is 13° - 17°; during wafer unloading, the lower surface of the blade tip t is arranged in contact with the upper surface m1 of the ceramic disc; on the side of the blade surface m3 far from the feeding end of the transfer track 1, a stepped portion b protruding upward is further formed. When the wafer enters the blade surface m3, the wafer abuts against the stepped portion b from the edge; in the orthographic projection on the horizontal plane, during wafer unloading, the center line of the wafer aligned with the feeding end of the transfer track 1 coincides with the center line of the blade tip t; the first power component 41 is used to drive the blade 40 to reciprocate along the extending direction of the transfer surface m1. The first power component 41 uses a conventional rodless cylinder. The second power component 42 is connected to the first power component 41 and uses a conventional linear cylinder. The tool holder 400 is fixedly connected to the telescopic rod of the linear cylinder.

[0061] In this example, the transfer manipulator ⑤ is used to transfer the wafer-carrying ceramic disc and / or the empty ceramic disc between the material placement area q4, the first positioning area a1, and the second positioning area a2; the transfer manipulator ⑤ includes a rotating seat B1 rotating around the vertical direction, a linear guide rail B2 arranged on the rotating seat B1, a pick-and-place arm B3 slidably arranged on the linear guide rail B2 and used for picking and placing the ceramic disc, and a lifting drive component B4 used to drive the rotating seat B1 to move up and down.

[0062] In some specific embodiments, the linear guide rail B2 includes a first guide rail B21 and a second guide rail B22 arranged side by side at intervals; the pick-and-place arm B3 includes a first arm body B31 and a second arm body B32 slidably arranged on the first guide rail B21 and the second guide rail B22 respectively. The pick-and-place ends formed by the first arm body B31 and the second arm body B32 are arranged vertically aligned. Here, when one pick-and-place end grabs the wafer-carrying ceramic disc to be cleaned and moves it to the cleaning area, the other can take out the wafer-carrying ceramic disc that has been cleaned and then place the wafer to be cleaned in the corresponding positioning area; similarly, when one pick-and-place end grabs the wafer-carrying ceramic disc that has been cleaned and moves it to the wafer unloading area, the other can take out the empty ceramic disc that has been unloaded and place the wafer-carrying ceramic disc to be unloaded in the corresponding positioning area.

[0063] In summary, after adopting this integrated device, the transfer manipulator grabs the wafer-carrying ceramic disc to be cleaned from the loading area and transfers it to the first positioning area for positioning. Then, the cleaning component cleans the upper surface of the ceramic disc and the wafer, the side surface and the lower surface of the ceramic disc. After the cleaning is completed, the transfer manipulator transfers the cleaned wafer-carrying ceramic disc to the second positioning area, peels off the wafer through a blade and sends it into the transfer track for conveying to the receiving trough to complete the material receiving. Finally, the transfer manipulator transfers the empty ceramic disc after unloading the wafer to the loading area. Therefore, compared with the prior art, on the one hand, based on the state that the wafer remains adhered to the ceramic disc, the peeling and unloading of the wafer are implemented through the cooperation of the second positioning component, the blade and the transfer track, effectively avoiding the offset of the wafer, ensuring the accurate docking of each wafer with the transfer track, and greatly improving the success rate of unloading. On the other hand, the integration of ceramic disc loading, cleaning, unloading and recycling is realized, which saves time and effort in operation, effectively improves the efficiency, reduces the floor area of the equipment, and is beneficial to improving the space utilization rate. In addition, the structure is simple and reliable, and the implementation cost is low. On the third hand, by defining the included angle between the upper and lower surfaces of the tool head, the tool head enters between the ceramic disc and the wafer and has the best damage effect on the bonding layer, which is beneficial to the falling off of the wafer. On the fourth hand, through the upper surface of the ceramic disc, auxiliary support for the tool head is formed to enhance the anti-deformation ability of the tool head and extend the service life. On the fifth hand, the displacement of the wafer on the blade surface is restricted by the step portion, so that the wafer can quickly fall onto the transfer track for material receiving. On the sixth hand, when the second positioning component is in a horizontal state, it is convenient for the manipulator to accurately place the ceramic disc on the second positioning component. When the second positioning component is in an inclined state, it is beneficial to the peeling of the wafer and its entry into the transfer track, reducing the probability of wafer bumping and damage. On the seventh hand, the orderly material receiving of multiple wafers is realized. At the same time, multiple material boxes can be continuously replaced to meet the requirements of batch and efficient production. On the eighth hand, when one pick-and-place end of the pick-and-place arm grabs the wafer-carrying ceramic disc to be cleaned and moves it to the cleaning area, the other pick-and-place end can take out the cleaned wafer-carrying ceramic disc and then place the wafer to be cleaned in the corresponding positioning area. Similarly, when one pick-and-place end grabs the cleaned wafer-carrying ceramic disc and moves it to the unloading area, the other pick-and-place end can take out the empty ceramic disc after unloading and place the wafer-carrying ceramic disc to be unloaded in the corresponding positioning area, thereby effectively improving the processing efficiency. On the ninth hand, through the relative movement between the ceramic disc and the cleaning component, the all-round cleaning of the ceramic disc and the wafer is realized, effectively improving the cleaning effect.

[0064] The above has made a detailed description of the present invention, aiming to enable those skilled in this field to understand the content of the present invention and implement it. However, it should not be used to limit the protection scope of the present invention. Any equivalent changes or modifications made according to the spirit and essence of the present invention should be covered within the protection scope of the present invention.

Claims

1. An integrated device for cleaning and unloading wafers on a ceramic plate, where wafers are adhered to the upper surface of the ceramic plate, characterized in that, The integrated device includes: a frame having a cleaning area, a wafer unloading area, and a transfer area that communicate with each other; a rack having a loading area that communicates with the transfer area and is used for placing wafer-carrying ceramic trays and / or empty ceramic trays; a cleaning mechanism disposed in the cleaning area and including a first positioning member and a cleaning member, wherein the first positioning member forms a first positioning area for horizontally positioning the wafer-carrying ceramic tray, and the cleaning area formed by the cleaning member covers the upper surface of the ceramic tray and the wafer, the side surface, and the lower surface of the ceramic tray; a wafer unloading mechanism disposed in the wafer unloading area and including a transfer track for sequentially transferring wafers, a second positioning member forming a second positioning area for horizontally positioning the wafer-carrying ceramic tray, a receiving member forming a wafer receiving groove, and a wafer shoveling member, wherein the second positioning area and the receiving groove are respectively connected to the feeding end and the discharging end of the transfer track, and the wafer shoveling member includes a shovel blade movably disposed above the second positioning area, and the shovel blade is used for peeling the wafer from the upper surface of the ceramic tray and feeding it into the transfer track; a transfer robot disposed in the transfer area and used for transferring the wafer-carrying ceramic tray and / or the empty ceramic tray between the loading area, the first positioning area, and the second positioning area.

2. The integrated equipment for cleaning and unloading the porcelain plate strip according to claim 1, wherein, The first positioning member includes a plurality of support rollers that rollingly support the lower surface of the ceramic tray, a plurality of clamping wheels that are circumferentially spaced around the ceramic tray and can be clamped or loosened along the radial direction of the ceramic tray, and a driving wheel for driving the ceramic tray to rotate around its own center line.

3. The integrated equipment for cleaning and unloading the porcelain plate strip according to claim 2, characterized in that, The cleaning member includes a spray head, a first brush body, and a second brush body that are correspondingly disposed above, beside, and below the first positioning area. As the ceramic tray rotates, the flushing area formed by the spray head covers the upper surface of the ceramic tray and the wafer, and the brushing areas formed by the first brush body and the second brush body cover the side surface and the lower surface of the ceramic tray.

4. The integrated equipment for cleaning and unloading the porcelain plate tape according to claim 3, characterized in that, The flushing fluid sprayed by the spray head is two-fluid; and / or, in the orthographic projection on the horizontal plane, the spray head can move in a direction approaching or away from the center of the ceramic tray; and / or, in the orthographic projection on the horizontal plane, the fluid sprayed by the spray head flows in a direction away from the center of the ceramic tray.

5. The integrated equipment for cleaning and unloading the porcelain plate strip according to claim 1, characterized in that The transfer area is disposed between the cleaning area and the wafer unloading area; the transfer robot includes a rotating base that rotates around the vertical direction, a linear guide rail disposed on the rotating base, and a pick-and-place arm that is slidably disposed on the linear guide rail and is used for picking and placing the ceramic tray.

6. The integrated equipment for cleaning and unloading the porcelain plate strips according to claim 5, characterized in that, The linear guide rail includes a first guide rail and a second guide rail that are arranged side by side at intervals; the pick-and-place arm includes a first arm body and a second arm body that are correspondingly slidably disposed on the first guide rail and the second guide rail, wherein the pick-and-place ends formed by the first arm body and the second arm body are arranged vertically aligned; and / or, the transfer robot further includes a lifting drive member for driving the rotating base to move up and down.

7. The integrated equipment for cleaning and unloading the porcelain plate tape according to claim 1, characterized in that, There is an adhesive layer between the upper surface of the porcelain plate and the wafer; the spatula has a tool tip that can be inserted between the porcelain plate and the wafer, and a spatula surface is formed on the tool tip. As the spatula moves closer to the feeding end, the tool tip synchronously destroys the adhesive layer, and the corresponding wafer gradually detaches from the upper surface of the porcelain plate and enters the spatula surface. When the spatula surface is docked with the transfer track, the wafer falls from the spatula surface onto the transfer track and is transferred towards the receiving chute.

8. The integrated equipment for cleaning and unloading the porcelain plate strip according to claim 7, characterized in that, The spatula includes a tool holder and a tool body fixedly connected to one end of the tool holder. The other end of the tool body extends obliquely downward towards the feeding end to form the tool tip, and the spatula surface is formed on the upper surface of the tool tip; the lower surface of the tool tip intersects with the spatula surface from the side close to the feeding end, and the formed angle is 13° - 17°; during wafer unloading, the lower surface of the tool tip is arranged in contact with the upper surface of the porcelain plate; a stepped portion protruding upward is further formed on the side of the spatula surface far from the feeding end. When the wafer enters the spatula surface, the wafer abuts against the stepped portion from the edge; in the orthographic projection on the horizontal plane, during wafer unloading, the center lines of the wafer and the tool tip are arranged to coincide.

9. The integrated equipment for cleaning and unloading the porcelain disk strip, according to claim 1, is characterized in that, The second positioning member includes a positioning platform capable of vacuum adsorbing the porcelain plate and a plurality of clamping blocks circumferentially spaced around the positioning platform. The plurality of clamping blocks can move closer to or away from each other to clamp or loosen the porcelain plate; the positioning platform has a horizontal state and an inclined state. During wafer unloading, the positioning platform is in the inclined state, and the upper surface of the porcelain plate is arranged parallel to the transfer surface formed by the transfer track.

10. The integrated equipment for cleaning and unloading the porcelain plate strip according to claim 1, characterized in that, The receiving member includes a lifting frame and a material box arranged on the lifting frame. A plurality of the receiving chutes are formed on the material box and are distributed vertically. The lifting frame drives the material box and drives the plurality of receiving chutes to be sequentially docked with the discharging end; there are a plurality of material boxes and they are spaced vertically.

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