Mobile phone convenient for heat dissipation

Abstract

The utility model discloses a mobile phone convenient for heat dissipation, the mobile phone convenient for heat dissipation comprises a mobile phone body, and the mobile phone body comprises a mainboard; the heat dissipation assembly comprises a heat absorption layer and a first heat pipe, the heat absorption layer comprises a first surface and a second surface, the mainboard is arranged on the first surface, the first heat pipe is arranged on the second surface and embedded in the heat absorption layer, the first heat pipe is of a closed structure, and the first heat pipe is arranged on the first surface and embedded in the heat absorption layer. A liquid absorption core and a working medium are arranged in the first heat pipe, so that cooling circulation is formed in the first heat pipe. Therefore, the heat absorption layer can rapidly absorb heat generated by the mainboard, the heat is prevented from being locally accumulated on the mainboard, the temperature of the mainboard is reduced, stable operation of a mobile phone is guaranteed, the first heat pipe can rapidly take away the heat transmitted by the heat absorption layer through internal cooling circulation, and the efficient heat dissipation effect is achieved; the overall reliability and durability of the mobile phone are improved, and the user experience is improved.

Description

Technical Field

[0001] This application relates to the technical field of mobile phones, and particularly to a mobile phone that is convenient for heat dissipation. Background Art

[0002] Mobile phones have developed into the era of smart phones. With the increasing main frequency, power consumption, and heat generation, the heat problem of mobile phones cannot be ignored. The heat problem has seriously affected the user experience and is also likely to cause the hardware temperature to be too high and burn out mobile phone components. Therefore, the heat dissipation design of mobile phones has become an important topic in the industry.

[0003] In the existing mobile phones, the motherboard is in contact with the mobile phone motherboard through a heat-conducting material, and local hot spots are diffused through heat conduction. However, due to the small space inside the mobile phone, only through conduction heat dissipation, the heat dissipation effect is very poor. Especially when the mobile phone is charging and playing large games or watching high-definition videos, the heat generation of the mobile phone reaches the maximum. When the heat generation of the mobile phone is the largest, it is easy to crash or burn out the hardware due to excessive heat generation, thus reducing the service life of the mobile phone; moreover, the heat generated inside the mobile phone will be transferred to the outer shell of the mobile phone, so that when the user uses the mobile phone with hands, the situation of getting burned hands will occur, thus reducing the user experience of using the mobile phone. Utility Model Content

[0004] This application discloses a mobile phone that is convenient for heat dissipation. The heat absorption layer can quickly absorb the heat generated by the motherboard, avoid the local accumulation of heat on the motherboard, reduce the temperature of the motherboard, ensure the stable operation of the mobile phone, and the first heat pipe can quickly take away the heat transferred from the heat absorption layer by using the internal cooling cycle, achieve an efficient heat dissipation effect, improve the overall reliability and durability of the mobile phone, and enhance the user experience.

[0005] In order to achieve the above object, this application discloses a mobile phone that is convenient for heat dissipation, including:

[0006] A mobile phone body, the mobile phone body includes a motherboard;

[0007] A heat dissipation component, the heat dissipation component includes a heat absorption layer and a first heat pipe. The heat absorption layer includes a first surface and a second surface. The motherboard is disposed on the first surface, and the first heat pipe is disposed on the second surface and embedded in the heat absorption layer. The first heat pipe is a closed structure, and the inside of the first heat pipe has a wick and a working medium to form a cooling cycle inside the first heat pipe.

[0008] In a possible implementation manner, the first heat pipe includes a plurality of first sub-heat pipes parallel to the heat absorption layer and a plurality of connecting pipes, and adjacent first sub-heat pipes are connected in series through the connecting pipes.

[0009] In a possible implementation manner, the first heat pipe is a straight pipe, and multiple first sub-heat pipes are arranged in parallel. The connecting pipe is a straight pipe, and multiple connecting pipes are arranged in parallel.

[0010] In a possible implementation manner, the heat dissipation assembly further includes a second heat pipe. The second heat pipe is a closed structure, and the inside of the second heat pipe is provided with a wick and a working medium to form a cooling cycle inside the second heat pipe. The second heat pipe is perpendicular to the heat absorption layer. The mobile phone body includes a housing. The second heat pipe includes a first end and a second end. The first end is connected to the heat absorption layer, and the second end extends to the housing. A protection structure is provided at a position of the housing corresponding to the second end of the second heat pipe.

[0011] In a possible implementation manner, a concave cavity is formed inside the mobile phone body. A battery slot is provided in the concave cavity. The battery slot is used to support a battery. The battery slot includes a slot bottom plate and a slot side wall surrounding the slot bottom plate. The slot bottom plate is provided with a first heat dissipation slot.

[0012] In a possible implementation manner, there are multiple first heat dissipation slots. The multiple first heat dissipation slots are arranged in parallel and along a first direction. The first direction is the extending direction of the slot bottom plate.

[0013] In a possible implementation manner, the slot side wall includes a first side wall and a second side wall arranged along the first direction. Second heat dissipation slots corresponding to and communicating with the first heat dissipation slots are provided on the first side wall and the second side wall.

[0014] In a possible implementation manner, the second heat dissipation slot penetrates along the thickness direction of the mobile phone body;

[0015] And / or the mobile phone body includes a rear shell detachably arranged on the battery slot. Multiple heat dissipation holes are provided on the rear shell. The multiple heat dissipation holes are arranged in an array. A waterproof plate is provided inside the rear shell corresponding to the heat dissipation holes.

[0016] In a possible implementation manner, the mobile phone body includes a battery slot and a rear shell detachably arranged on the battery slot. An air storage airbag and a sealing airbag communicating with each other are provided inside the rear shell. The air storage airbag is arranged close to the edge of the battery slot. A return spring is provided inside the air storage airbag.

[0017] In a possible implementation manner, an installation slot is provided at one end inside the rear shell. The air storage airbag and the sealing airbag are relatively arranged at two ends of the installation slot. The air storage airbag and the sealing airbag are communicated through an exhaust pipeline.

[0018] Compared with the prior art, the beneficial effects of the present application are as follows: the heat absorption layer has a first surface and a second surface, the first surface is used to support the main board and is in direct contact with the main heat source, and can quickly absorb the heat generated by the main board when it is working. The heat can then be conducted from the main board to the inside of the heat absorption layer and further transferred to the first heat pipe. The first heat pipe is arranged on the second surface of the heat absorption layer and embedded in the heat absorption layer, which can achieve closer thermal contact, reduce thermal resistance, and improve heat transfer efficiency. The liquid absorption core and the working medium inside the closed structure form a cooling cycle. The working medium absorbs heat at one end of the heat pipe and vaporizes. The vapor flows to the other end under the action of the pressure difference, where it releases heat and condenses into liquid, and then flows back to the evaporation end through the capillary action of the liquid absorption core. This cycle repeats to achieve efficient heat transfer.

[0019] The heat-absorbing layer quickly absorbs heat generated by the motherboard, preventing localized heat accumulation and lowering its temperature to ensure stable phone operation. The first heat pipe utilizes an internal cooling circuit to quickly remove heat transferred from the heat-absorbing layer, achieving efficient heat dissipation. Compared to traditional cooling methods, heat pipes offer higher heat conduction efficiency, effectively reducing the phone's operating temperature. This cooling method allows the phone to maintain a low temperature even during high-load operation, such as playing large-scale games or multitasking, avoiding performance degradation, lags, or even freezes caused by overheating. Furthermore, lowering the motherboard temperature extends the lifespan of the motherboard and other electronic components. Effective heat dissipation reduces damage to electronic components caused by overheating, improving the overall reliability and durability of the phone and enhancing the user experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0021] Figure 1 This is a schematic diagram of a mobile phone that is convenient for heat dissipation provided by an embodiment of the present utility model;

[0022] Figure 2 for Figure 1 A partial enlarged view of point A in the middle;

[0023] Figure 3 This is a second structural diagram of a mobile phone that is convenient for heat dissipation provided by an embodiment of the present utility model;

[0024] Figure 4 for Figure 3 A partial enlarged view of point B in the middle;

[0025] Figure 5 Structural schematic diagram of a heat dissipation component of a mobile phone facilitating heat dissipation provided by an embodiment of the present utility model;

[0026] Figure 6 Structural schematic diagram of a mobile phone display battery slot facilitating heat dissipation provided by an embodiment of the present utility model;

[0027] Figure 7 Structural schematic diagram of a rear shell of a mobile phone facilitating heat dissipation provided by an embodiment of the present utility model;

[0028] Figure 8 is Figure 7 Partial enlarged view at position C in

[0029] Explanation of reference numerals:

[0030] 10 - Mobile phone body; 11 - Main board; 12 - Battery slot; 121 - Slot bottom plate; 1211 - First heat dissipation slot; 122 - First side wall; 1221 - Second heat dissipation slot; 13 - Housing; 131 - Rear shell; 1311 - Heat dissipation hole; 1312 - Waterproof plate; 1313 - Air storage airbag; 13131 - Return spring; 1314 - Sealing airbag; 132 - Protection structure;

[0031] 20 - Heat dissipation component; 21 - Heat absorption layer; 22 - First heat pipe; 221 - First sub - heat pipe; 222 - Connecting pipe; 23 - Second heat pipe. Detailed implementation manners

[0032] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0033] In the present application, the terms "installation", "setting", "provided with", "connection", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or there is internal communication between two devices, components, or constituent parts. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0034] In addition, terms such as "first", "second", etc. are mainly used to distinguish different devices, components or parts (the specific types and structures may be the same or different), and are not used to indicate or imply the relative importance and quantity of the indicated devices, components or parts. Unless otherwise specified, the meaning of "a plurality of" is two or more.

[0035] Mobile phones have developed into the era of smart phones. With the increasing main frequency, power consumption and heat generation, the heat generated by mobile phones is also getting higher and higher. The heat problem of mobile phones cannot be ignored. The heat problem has seriously affected the user experience, and it is also easy to cause the hardware temperature to be too high and burn out the mobile phone components. Therefore, the heat dissipation design of mobile phones has become an important topic in the industry.

[0036] Inside the existing mobile phone, the main board is in contact with the mobile phone main board through a heat-conducting material, and local hot spots are diffused through heat conduction. However, due to the small space inside the mobile phone, the heat dissipation effect is very poor only through conduction. Especially when the mobile phone is charging and playing large games or watching high-definition videos, the heat generated by the mobile phone reaches the maximum. When the heat generated by the mobile phone is the largest, it is easy to crash or burn out the hardware due to the excessive heat generated by the mobile phone, thus reducing the service life of the mobile phone; moreover, the heat generated inside the mobile phone will be transferred to the outer shell of the mobile phone, so that when the user uses the mobile phone with his hand, the situation of getting hot will occur, thus reducing the user experience of using the mobile phone.

[0037] In view of this, some embodiments of the present application provide a mobile phone that is convenient for heat dissipation. The heat absorption layer can quickly absorb the heat generated by the main board, avoid the heat from accumulating locally on the main board, reduce the temperature of the main board, ensure the stable operation of the mobile phone, and the first heat pipe can quickly take away the heat transferred from the heat absorption layer by using the internal cooling cycle, achieving an efficient heat dissipation effect, improving the overall reliability and durability of the mobile phone, and enhancing the user experience.

[0038] The following will describe the present application in detail through specific embodiments:

[0039] The mobile phone convenient for heat dissipation according to the embodiment of the present application, as Figures 1-5 shown, a mobile phone convenient for heat dissipation includes a mobile phone body 10. The mobile phone body 10 includes a main board 11 and a heat dissipation component 20. The heat dissipation component 20 includes a heat absorption layer 21 and a first heat pipe 22. The heat absorption layer 21 includes a first surface and a second surface. The main board 11 is disposed on the first surface, and the first heat pipe 22 is disposed on the second surface and embedded in the heat absorption layer 21. The first heat pipe 22 is a closed structure, and the inside of the first heat pipe 22 has a wick and a working medium to form a cooling cycle inside the first heat pipe 22.

[0040] The mobile phone with convenient heat dissipation provided by the embodiment of the present application. The heat absorption layer 21 has a first surface and a second surface. The first surface is used to carry the main board 11 and is in direct contact with the main heat source, capable of quickly absorbing the heat generated when the main board 11 works. Then the heat can be conducted from the main board 11 to the inside of the heat absorption layer 21 and further transferred to the first heat pipe 22. The first heat pipe 22 is arranged on the second surface of the heat absorption layer 21 and is embedded in the heat absorption layer 21, which can achieve closer thermal contact, reduce thermal resistance, and improve the heat transfer efficiency. The wick and the working medium inside the closed structure form a cooling cycle. The working medium vaporizes after absorbing heat at one end of the heat pipe, and the vapor flows to the other end under the action of the pressure difference, where it releases heat and condenses into a liquid, and then returns to the evaporation end through the capillary action of the wick. This cycle is repeated to achieve efficient heat transfer.

[0041] The heat absorption layer 21 can quickly absorb the heat generated by the main board 11, prevent the heat from accumulating locally on the main board 11, reduce the temperature of the main board 11, ensure the stable operation of the mobile phone. The first heat pipe 22 can quickly take away the heat transferred from the heat absorption layer 21 by using the internal cooling cycle, achieving an efficient heat dissipation effect. Compared with the traditional heat dissipation method, the heat conduction efficiency of the heat pipe is higher, which can effectively reduce the working temperature of the mobile phone. This heat dissipation method can keep the mobile phone at a lower temperature when running at high loads, such as playing large games, multitasking, etc., and avoid problems such as performance degradation, lag, and even system crashes caused by overheating. At the same time, reducing the temperature of the main board 11 can extend the service life of the main board 11 and other electronic components. Through effective heat dissipation, the damage to electronic components caused by overheating can be reduced, the overall reliability and durability of the mobile phone can be improved, and the user experience can be enhanced.

[0042] Specifically, as Figure 5 shown, the first heat pipe 22 includes a plurality of first sub-heat pipes 221 arranged parallel to the heat absorption layer 21 and a plurality of connecting pipes 222. Adjacent first sub-heat pipes 221 are connected in series by the connecting pipes 222.

[0043] The first heat pipe 22 includes a plurality of first sub-heat pipes 221 arranged parallel to the heat absorption layer 21 and a plurality of connecting pipes 222, which greatly increases the contact area with the heat absorption layer 21. This enables the heat transferred from the main board 11 to the heat absorption layer 21 to be absorbed by the first heat pipe 22 more quickly and extensively. A larger heat dissipation area means that the heat can be taken away from the heat source faster, thereby effectively reducing the temperature of the main board 11 and improving the heat dissipation efficiency of the mobile phone. The connecting pipes 222 connect adjacent first sub-heat pipes 221 in series to form a continuous heat conduction channel, allowing the heat to flow more smoothly in this channel, reducing thermal resistance, and improving the heat conduction efficiency. The structure of a plurality of first sub-heat pipes 221 connected in series can increase the circulation volume of the working medium inside the heat pipe and better adapt to the heat distribution at different positions, enabling the heat to be guided to the heat dissipation area faster.

[0044] In a possible implementation, as Figure 5 shown, the first heat pipe 22 is a straight pipe, and multiple first sub-heat pipes 221 are arranged in parallel.

[0045] The multiple first sub-heat pipes 221 are arranged in parallel, which can evenly absorb heat from various positions and transfer it to the heat pipe, making the heat distribution in the first heat pipe 22 more uniform, avoiding local overheating or overcooling, helping to protect the electronic components on the main board 11, and extending their service life. The structure of the straight pipe is relatively simple, and it is easier to position and fix during the installation process. Since the internal space of the mobile phone is limited and the shape is complex, the straight pipe and the parallel arrangement are more adaptable to the internal space layout of the mobile phone. The multiple parallel first sub-heat pipes 221 are connected together by a connecting pipe 222 to form a relatively stable structure, which is convenient to install inside the mobile phone and can ensure that the heat pipe will not easily shift or loosen during the use of the mobile phone, ensuring the stability and reliability of the heat dissipation system, reducing the difficulty of heat transfer, thereby reducing the thermal resistance and improving the heat dissipation effect.

[0046] In a possible implementation, as Figure 5 shown, the connecting pipe 222 is a straight pipe, and multiple connecting pipes 222 are arranged in parallel.

[0047] The multiple parallel connecting pipes 222 can make the heat transfer between the first sub-heat pipes 221 more uniform. When heat is transferred between the first sub-heat pipes 221, the parallel connecting pipes 222 can ensure that the heat is transmitted in a more consistent manner, avoiding local heat transfer blockage or non-uniformity, so that the heat dissipation effect of the entire heat pipe system is more stable and efficient. At the same time, the connecting pipe 222 is also set as a straight pipe, with a relatively simple shape structure and less resistance to the internal fluid flow. The multiple parallel straight pipes as the connecting pipe 222 can reduce the resistance during heat transfer, enable the working medium to flow more smoothly between the first sub-heat pipes 221, accelerate the heat transfer speed, and improve the heat transfer efficiency. In another possible implementation, the connecting pipe 222 can also be an arc-shaped pipe.

[0048] Furthermore, as Figures 3-5 shown, the heat dissipation assembly 20 further includes a second heat pipe 23. The second heat pipe 23 is a closed structure, and the inside of the second heat pipe 23 has a wick and a working medium to form a cooling cycle inside the second heat pipe 23. The second heat pipe 23 is perpendicular to the heat absorption layer 21. The mobile phone body 10 includes a housing 13. The second heat pipe 23 includes a first end and a second end. The first end is connected to the heat absorption layer 21, and the second end extends to the housing 13.

[0049] The wick and the working medium inside the second heat pipe 23 form a cooling cycle, which can quickly absorb the heat transferred from the heat absorption layer 21. The second heat pipe 23 arranged perpendicular to the heat absorption layer 21 provides a new heat conduction path for the heat, complementing the first heat pipe 22 and further improving the overall heat dissipation capacity of the heat dissipation component 20. The second heat pipe 23 includes a first end and a second end. The first end is connected to the heat absorption layer 21, and the second end extends to the housing 13, which can quickly guide the heat from the heat absorption layer 21 to the housing 13. The housing 13 usually has a large surface area and can dissipate the heat to the surrounding environment through air convection and other means. This vertical heat conduction direction can reduce the path length and thermal resistance of the heat during conduction, enabling the heat to be transferred from the heat source to the heat dissipation area more quickly and improving the heat dissipation efficiency. The presence of the second heat pipe 23 can help the mobile phone better cope with the situation of long-term high-load use and maintain good performance and reliability.

[0050] In this embodiment, as Figures 1-2 shown, a protective structure 132 is provided at the position of the housing 13 corresponding to the second end of the second heat pipe 23.

[0051] The protective structure 132 can provide protection for the second end of the second heat pipe 23, prevent impurities such as dust and moisture from entering the connection part between the second heat pipe 23 and the housing 13, avoid electrical failures and damages caused by impurities, and reduce the risk of the heat pipe cracking, deforming or being damaged due to the direct action of external force. Exemplarily, the protective structure 132 is a protective net. The second end of the second heat pipe 23 is directly exposed at the housing 13, and there may be a risk of contact with external conductive objects, resulting in a short circuit or electrical failure in the internal circuit of the mobile phone. The protective structure 132 can isolate the heat pipe from external conductive objects and improve the electrical safety of the mobile phone.

[0052] In a possible implementation manner, as Figure 6 shown, a concave cavity is formed inside the mobile phone body 10. A battery slot 12 is provided in the concave cavity. The battery slot 12 is used to support the battery. The battery slot 12 includes a slot bottom plate 121 and a slot side wall surrounding the slot bottom plate 121. A first heat dissipation slot 1211 is formed on the slot bottom plate 121.

[0053] During the charging and discharging process of the battery, heat is generated. If too much heat accumulates, it will affect the performance and lifespan of the battery. The opening of the first heat dissipation groove 1211 increases the contact area between the battery and the surrounding air, which is conducive to faster heat dissipation. The first heat dissipation groove 1211 can guide the flow of hot air, promote convective heat transfer, reduce the working temperature of the battery, improve the charging and discharging efficiency and safety of the battery. The first heat dissipation groove 1211 can make the heat distribution at the bottom of the battery more uniform. When the heat generated at different parts of the battery is uneven, the first heat dissipation groove 1211 can help the heat spread at the bottom of the battery, avoiding local overheating. Uniform heat dissipation helps reduce the thermal stress inside the battery and extend the service life of the battery.

[0054] Furthermore, there are multiple first heat dissipation grooves 1211, and the multiple first heat dissipation grooves 1211 are parallel and arranged along the first direction, and the first direction is the extending direction of the groove bottom plate 121.

[0055] The setting of multiple heat dissipation grooves significantly increases the contact area between the battery and the air. When the battery generates heat during operation, more surface area is exposed to the air, which is conducive to faster heat dissipation. Multiple parallel first heat dissipation grooves 1211 can provide more heat dissipation channels in the same space, improving the heat dissipation efficiency. The parallelly arranged first heat dissipation grooves 1211 can guide the hot air to flow along a specific direction. The hot air forms convection between the heat dissipation grooves, accelerating the transfer and dissipation of heat. This regular hot air flow can prevent heat from accumulating locally, making the overall temperature of the battery more uniform and reducing the impact on the battery performance and lifespan caused by local overheating.

[0056] Furthermore, as Figure 6 shown, the groove side wall includes a first side wall 122 and a second side wall arranged along the first direction, and second heat dissipation grooves 1221 corresponding to and communicating with the first heat dissipation grooves 1211 are provided on the first side wall 122 and the second side wall.

[0057] The first heat dissipation grooves 1211 provide a heat dissipation path at the bottom of the battery, and the corresponding second heat dissipation grooves 1221 further expand the heat dissipation space on the side wall. After the two are connected, a three-dimensional heat dissipation channel from the bottom of the battery to the side wall is formed, which enables the heat generated by the battery to be dissipated to the surrounding environment more quickly, improves the heat dissipation efficiency, effectively reduces the battery temperature, and ensures the battery performance and lifespan. When the mobile phone is in use or there is air flow in the surrounding environment, the air can enter the battery slot 12 through the first heat dissipation grooves 1211 at the bottom, and then flow out through the second heat dissipation grooves 1221 on the side wall, or vice versa. This air convection can accelerate the heat transfer and make the battery heat dissipation more uniform, avoiding local overheating.

[0058] Specifically, the second heat dissipation grooves 1221 penetrate along the thickness direction of the mobile phone body 10.

[0059] The through second heat dissipation groove 1221 provides more paths for heat dissipation. Heat can be transferred from the battery through the first heat dissipation groove 1211 to the second heat dissipation groove 1221 on the side wall, and then directly dissipated to the mobile phone housing 13 along the thickness direction, rather than being limited to conduction inside the battery groove 12. This greatly improves the heat dissipation efficiency, can more quickly reduce the battery temperature, and ensures the stability of the mobile phone during high-load operation. The through second heat dissipation groove 1221 enables air to circulate more freely between the inside and outside of the mobile phone. The cold air outside can enter the mobile phone interior more quickly through the through second heat dissipation groove 1221, exchange with the hot air generated by the battery, accelerate heat dissipation, and effectively reduce the temperature inside the mobile phone, improving the overall heat dissipation effect.

[0060] In this embodiment, as Figure 7 shown, the mobile phone body 10 includes a rear shell 131 detachably arranged on the battery groove 12. A plurality of heat dissipation holes 1311 are formed in the rear shell 131. The plurality of heat dissipation holes 1311 are arranged in an array, and a waterproof plate 1312 is provided inside the rear shell 131 corresponding to the heat dissipation holes 1311.

[0061] The arrangement of the plurality of heat dissipation holes 1311 in an array can increase the heat dissipation area, enabling the heat generated inside the mobile phone to be dissipated to the external environment more quickly. The heat dissipation holes 1311 arranged in an array can make the hot air flow out of the mobile phone evenly, avoiding local overheating, and thus extending the service life of the internal electronic components of the mobile phone. The heat dissipation holes 1311 contribute to promoting the air circulation between the inside and outside of the mobile phone. When the mobile phone is in use, the cold air outside can enter the mobile phone interior through the heat dissipation holes 1311, exchange heat with the heating elements, and then the hot air is discharged from the heat dissipation holes 1311, improving the heat dissipation efficiency. The waterproof plate 1312 provided inside the rear shell 131 corresponding to the heat dissipation holes 1311 can effectively prevent moisture from entering the mobile phone interior through the heat dissipation holes 1311, and can also play a role in dust and dirt prevention, extending the service life of the mobile phone.

[0062] In this embodiment, as Figures 7-8 shown, an air storage airbag 1313 and a sealing airbag 1314 that communicate with each other are provided inside the rear shell 131. The air storage airbag 1313 is arranged close to the edge of the battery groove 12, and a return spring 13131 is provided inside the air storage airbag 1313.

[0063] When the mobile phone back cover 131 is installed, it squeezes the air storage airbag 1313, and the air inside the air storage airbag 1313 is discharged towards the sealing airbag 1314. The sealing of the mobile phone back cover 131 after installation is achieved through the sealing airbag 1314. When the mobile phone back cover 131 is disassembled, the return spring 13131 resets and expands the air storage airbag 1313, and the air in the sealing airbag 1314 is discharged towards the air storage bag. The sealing airbag 1314 and the air storage airbag 1313 are interconnected. The air storage airbag 1313 and the sealing airbag 1314 can adapt to these changes through their own elasticity and the compressibility of the gas, maintaining the sealing of the mobile phone. Good sealing can prevent dust, moisture and other impurities from entering the mobile phone interior, protect the electronic components of the mobile phone, and extend the service life of the mobile phone.

[0064] Specifically, in this embodiment, an installation groove is provided at one end of the inner side of the back cover 131. The air storage airbag 1313 and the sealing airbag 1314 are relatively arranged at both ends of the installation groove, and the air storage airbag 1313 and the sealing airbag 1314 are connected through an exhaust pipeline.

[0065] The connection of the exhaust pipeline enables the impact force to be evenly transmitted and dispersed between the two airbags, avoiding the situation of excessive local stress, enabling the entire back cover 131 to bear the impact more evenly, protecting all parts inside the mobile phone, especially the protection of key components such as the battery is more important. At the same time, when the mobile phone is subjected to an external impact, such as accidentally dropping or being collided, the impact force first acts on the back cover. The air storage airbag 1313 near the edge of the battery slot 12 will be compressed, and the gas quickly flows through the exhaust pipeline towards the sealing airbag 1314. Through its own compression and the transfer of the gas, the air storage airbag 1313 converts most of the impact force into the internal energy of the gas, thereby absorbing and dispersing the impact energy, reducing the direct impact on the internal components of the mobile phone. The sealing airbag 1314 expands after the gas flows in, and can further buffer the remaining impact force, providing double buffering protection for the mobile phone and reducing the risk of damage to the mobile phone due to collision. The air storage airbag 1313 and the sealing airbag 1314 are respectively arranged at both ends of the installation groove, making full use of the space inside the back cover. The installation groove provides a stable position for the installation of the airbag, enabling the airbag to be firmly fixed on the back cover, and at the same time not interfering with other components inside the mobile phone. Without increasing the overall thickness and volume of the mobile phone, the installation of the airbag and the realization of its function are achieved, maintaining the thin and portable nature of the mobile phone.

[0066] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some or all of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A mobile phone facilitating heat dissipation, characterized in that, Comprising: A mobile phone body, the mobile phone body including a main board; A heat dissipation component, the heat dissipation component including a heat absorption layer and a first heat pipe, the heat absorption layer including a first surface and a second surface, the main board being disposed on the first surface, the first heat pipe being disposed on the second surface and embedded in the heat absorption layer, the first heat pipe being a closed structure, the interior of the first heat pipe having a wick and a working medium to form a cooling cycle inside the first heat pipe.

2. The mobile phone facilitating heat dissipation according to claim 1, characterized in that, The first heat pipe includes a plurality of first sub-heat pipes arranged parallel to the heat absorption layer and a plurality of connecting pipes, and adjacent first sub-heat pipes are connected in series by the connecting pipes.

3. The mobile phone facilitating heat dissipation according to claim 2, wherein, The first heat pipe is a straight pipe, a plurality of the first sub-heat pipes are arranged in parallel, the connecting pipes are straight pipes, and a plurality of the connecting pipes are arranged in parallel.

4. The mobile phone facilitating heat dissipation according to claim 1, characterized in that, The heat dissipation component further includes a second heat pipe, the second heat pipe being a closed structure, the interior of the second heat pipe having a wick and a working medium to form a cooling cycle inside the second heat pipe, the second heat pipe being disposed perpendicular to the heat absorption layer, the mobile phone body including a housing, the second heat pipe including a first end and a second end, the first end being connected to the heat absorption layer, the second end extending to the housing, and a protective structure being provided at a position corresponding to the second end of the second heat pipe at the housing.

5. The mobile phone facilitating heat dissipation according to claim 1, characterized in that, A concave cavity is formed inside the mobile phone body, a battery slot is provided inside the concave cavity, the battery slot is used for supporting a battery, the battery slot including a slot bottom plate and a slot side wall surrounding the slot bottom plate, and a first heat dissipation slot is formed in the slot bottom plate.

6. The mobile phone facilitating heat dissipation according to claim 5, wherein, The first heat dissipation slots include a plurality of them, and the plurality of first heat dissipation slots are arranged parallel and along a first direction, the first direction being the extending direction of the slot bottom plate.

7. The mobile phone facilitating heat dissipation according to claim 6, characterized in that, The slot side wall includes a first side wall and a second side wall arranged along the first direction, and second heat dissipation slots corresponding to and communicating with the first heat dissipation slots are provided on the first side wall and the second side wall.

8. The mobile phone facilitating heat dissipation according to claim 7, wherein The second heat dissipation slots penetrate through in the thickness direction of the mobile phone body; And / or the mobile phone body includes a rear shell detachably disposed on the battery slot, a plurality of heat dissipation holes are formed in the rear shell, the plurality of heat dissipation holes are arranged in an array, and a waterproof plate is provided inside the rear shell corresponding to the heat dissipation holes.

9. The mobile phone facilitating heat dissipation according to claim 1, wherein The mobile phone body includes a battery slot and a rear shell detachably disposed on the battery slot, an air storage airbag and a sealing airbag communicating with each other are provided inside the rear shell, the air storage airbag is disposed close to the edge of the battery slot, and a return spring is provided inside the air storage airbag.

10. The mobile phone facilitating heat dissipation according to claim 9, wherein, An installation slot is provided at one end inside the rear shell, the air storage airbag and the sealing airbag are oppositely disposed at both ends of the installation slot, and the air storage airbag and the sealing airbag are communicated through an exhaust pipeline.

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