Electronic element group, photosensitive element module, camera module and electronic device

Abstract

The utility model discloses an electronic component group, a photosensitive component module, a camera module and an electronic device. The electronic component group comprises a first electronic component, an electronic component board and a flexible circuit. The first electronic component is arranged on the electronic component board, the electronic component board comprises a first circuit and a second circuit, and the first circuit and the second circuit are respectively arranged on opposite sides of the first electronic component. The flexible circuit is arranged on the electronic component board, and the flexible circuit comprises a connecting part, a bending part and an electric path. The connecting part is connected with the electronic component board. The bending part is arranged on the side, away from the first electronic element, of the connecting part. The electrical path comprises a first end and a second end, at least one part of the electrical path is arranged on the bending part, and the first end and the second end are electrically connected with the first circuit and the second circuit respectively. Therefore, the design density of the electronic component group can be improved.

Description

Technical Field

[0001] The present disclosure relates to an electronic component group, an image sensor module, and a camera module, and particularly to an electronic component group, an image sensor module, and a camera module applied to a portable electronic device. Background Art

[0002] In recent years, portable electronic devices have developed rapidly, such as smart electronic devices, tablet computers, etc., which have flooded into modern people's lives. The camera modules, image sensor modules, and their electronic component groups mounted on portable electronic devices have also developed vigorously. However, with the increasing progress of technology, users' requirements for the quality of electronic component groups are also getting higher and higher. Therefore, developing an electronic component group with a circuit structure that can achieve the limit size to improve the design density has become an important and urgent problem in the industry. Summary of the Utility Model

[0003] The present disclosure provides an electronic component group, an image sensor module, a camera module, and an electronic device. By bending a flexible circuit in cooperation with an electronic component board solution to achieve a circuit structure with a limit size, thereby improving the design density of the electronic component group.

[0004] According to an embodiment of the present disclosure, an electronic component group includes a first electronic component, an electronic component board, and a flexible circuit. The first electronic component is disposed on the electronic component board, and the electronic component board includes a first circuit and a second circuit, wherein the first circuit and the second circuit are respectively disposed on opposite sides of the first electronic component, and the first circuit is electrically connected to the first electronic component. The flexible circuit is disposed on the electronic component board, and the flexible circuit includes a connecting portion, a bending portion, and an electrical path. The connecting portion connects the electronic component board. The bending portion is disposed on a side of the connecting portion away from the first electronic component and is bent along a thickness direction of the electronic component board. The electrical path includes a first end and a second end, and at least a part of the electrical path is disposed in the bending portion, wherein the first end and the second end are respectively electrically connected to the first circuit and the second circuit, and the first end and the second end are disposed on the connecting portion.

[0005] For the electronic component group according to the foregoing embodiment, the bending portion can be relatively fixed to the electronic component board.

[0006] For the electronic component group according to the foregoing embodiment, it may further include a hardness reinforcement plate, wherein the hardness reinforcement plate is disposed on the bending portion, and the hardness reinforcement plate is relatively fixed to the electronic component board.

[0007] For the electronic component group according to the foregoing embodiment, the electronic component board may further include a bending guiding structure, the bending guiding structure is correspondingly disposed on a side of the bending portion connecting the connecting portion, and the bending portion is bent along the bending guiding structure.

[0008] An electronic component group according to the embodiment described in the previous paragraph, wherein the size of the bent portion in the thickness direction of the electronic component board may be less than or equal to the size of the bent portion in a direction perpendicular to the thickness direction of the electronic component board and perpendicular to a thickness direction of the bent portion.

[0009] An electronic component group according to the embodiment described in the previous paragraph, wherein the bent portion may include a bending auxiliary hole, the bending auxiliary hole is disposed on a side of the bent portion close to the electronic component board, and an electrical path is disposed around the bending auxiliary hole. The size of the bending auxiliary hole in the thickness direction of the electronic component board may be less than or equal to the size of the bending auxiliary hole in a direction perpendicular to the thickness direction of the electronic component board and perpendicular to a thickness direction of the bent portion.

[0010] An electronic component group according to the embodiment described in the previous paragraph may further include a shape maintaining element, wherein the shape maintaining element is correspondingly disposed on a side of the connecting portion connected to the bent portion, and the shape maintaining element is relatively fixed to the electronic component board.

[0011] An electronic component group according to the embodiment described in the previous paragraph, wherein the connecting portion of the flexible circuit may include a window, and the window is disposed opposite to the first electronic component.

[0012] An electronic component group according to the embodiment described in the previous paragraph may further include a multilayer circuit board, wherein the multilayer circuit board may include an electronic component board and a flexible circuit, and the flexible circuit extends away from the first electronic component from the electronic component board.

[0013] An electronic component group according to the embodiment described in the previous paragraph, wherein the electronic component board may further include a component corresponding hole, and the first electronic component is disposed in the component corresponding hole.

[0014] An electronic component group according to the embodiment described in the previous paragraph may further include a second electronic component, wherein the second electronic component is disposed on the electronic component board, and the second electronic component is electrically connected to a second circuit. The electronic component board may further include a third circuit, and the third circuit is electrically connected to the first electronic component and the second electronic component.

[0015] An electronic component group according to the embodiment described in the previous paragraph, wherein the electronic component board may further include a contact point. The electrical path may include a first sub-path and a second sub-path, the first sub-path and the second sub-path are respectively electrically connected to the first circuit and the second circuit, and the first sub-path and the second sub-path are electrically connected through the contact point.

[0016] An electronic component group according to the embodiment described in the previous paragraph, wherein the bent portion does not include other electronic components.

[0017] According to an embodiment of the present disclosure, a photosensitive element module is provided, including the electronic component group as described in the foregoing embodiment. The first electronic component is a photosensitive element.

[0018] The photosensitive element module according to the foregoing embodiment may further include a bracket, wherein the bracket includes a through hole, the through hole is correspondingly arranged with the photosensitive element, and the bending part is arranged on the bracket.

[0019] The photosensitive element module according to the foregoing embodiment, wherein the electronic component group may further include a hardness reinforcement plate, the hardness reinforcement plate is arranged on the bending part, and the hardness reinforcement plate is relatively fixed to the bracket.

[0020] The photosensitive element module according to the foregoing embodiment, wherein the bracket may further include a bending guiding structure, the bending guiding structure is correspondingly arranged on one side of the connecting part connected to the bending part, and the bending part is bent along the bending guiding structure.

[0021] The photosensitive element module according to the foregoing embodiment, wherein the connecting part of the flexible circuit may include a window, and the window is relatively arranged with a photosensitive surface of the photosensitive element. The flexible circuit is light-tight, the window may include a plurality of protrusions, the protrusions taper in the direction close to the photosensitive surface, and the length of the protrusions in the direction close to the photosensitive element may be between 0.08 mm and 0.43 mm.

[0022] According to an embodiment of the present disclosure, a camera module is provided, including the photosensitive element module according to the foregoing embodiment and an imaging lens, wherein the imaging lens is relatively arranged with the photosensitive element.

[0023] The camera module according to the foregoing embodiment, wherein an imaging lens height is defined in the thickness direction of the imaging lens from the photosensitive element to the electronic component board, and a bending part height is defined in the thickness direction of the bending part of the flexible circuit from the photosensitive element to the electronic component board. The imaging lens height may be greater than or equal to the bending part height.

[0024] The camera module according to the foregoing embodiment, wherein the electronic component group may further include a hardness reinforcement plate, the hardness reinforcement plate is arranged on the bending part, and the hardness reinforcement plate is relatively fixed to the imaging lens.

[0025] The camera module according to the foregoing embodiment, wherein the imaging lens may include a bending guiding structure, the bending guiding structure is correspondingly arranged on one side of the connecting part connected to the bending part, and the bending part is bent along the bending guiding structure.

[0026] The camera module according to the foregoing embodiment, wherein the bending part of the flexible circuit is light-tight, and the bending part may include a shielding area. The shielding area is arranged on the side of the bending part away from the connecting part, and the shielding area is correspondingly arranged with the image height of the imaging lens.

[0027] According to an embodiment of the present disclosure, an electronic device is provided, including the camera module according to the foregoing embodiment.

[0028] According to an embodiment of the present disclosure, an electronic component group is provided, which includes a first electronic component, a second electronic component, an electronic component board, and a flexible circuit. The second electronic component is spaced apart from the first electronic component. The first electronic component and the second electronic component are disposed on the electronic component board. The flexible circuit is disposed on the electronic component board, and the flexible circuit includes a connecting portion, a bending portion, and an electrical path. The connecting portion connects the electronic component board. The bending portion is disposed on a side of the connecting portion away from the first electronic component and the second electronic component, and the bending portion is bent along a thickness direction of the electronic component board. The electrical path includes a first end and a second end, and at least a part of the electrical path is disposed in the bending portion, wherein the first end and the second end are respectively electrically connected to the first electronic component and the second electronic component, and the first end and the second end are disposed on the connecting portion.

[0029] The electronic component group according to the embodiment described in the previous paragraph may further include a hardness reinforcement plate, wherein the hardness reinforcement plate is disposed on the bending portion, and the hardness reinforcement plate is relatively fixed to the electronic component board.

[0030] In the electronic component group according to the embodiment described in the previous paragraph, the dimension of the bending portion in the thickness direction of the electronic component board may be less than or equal to the dimension of the bending portion in a direction perpendicular to the thickness direction of the electronic component board and perpendicular to a thickness direction of the bending portion.

[0031] In the electronic component group according to the embodiment described in the previous paragraph, the bending portion may include a bending auxiliary hole, the bending auxiliary hole is disposed on a side of the bending portion close to the electronic component board, and the electrical path is disposed around the bending auxiliary hole. The dimension of the bending auxiliary hole in the thickness direction of the electronic component board may be less than or equal to the dimension of the bending auxiliary hole in a direction perpendicular to the thickness direction of the electronic component board and perpendicular to a thickness direction of the bending portion.

[0032] The electronic component group according to the embodiment described in the previous paragraph may further include a multilayer circuit board, wherein the multilayer circuit board may include the electronic component board and the flexible circuit, and the flexible circuit extends from the electronic component board in a direction away from the first electronic component.

[0033] In the electronic component group according to the embodiment described in the previous paragraph, the electronic component board may further include a component corresponding hole, and the first electronic component is disposed in the component corresponding hole.

[0034] According to an embodiment of the present disclosure, a photosensitive element module is provided, which includes the electronic component group as described in the foregoing embodiment. The first electronic component is a photosensitive element.

[0035] In the photosensitive element module according to the embodiment described in the previous paragraph, the connecting portion of the flexible circuit may include a window, and the window is disposed opposite to a photosensitive surface of the photosensitive element. The flexible circuit is light-tight, the window may include a plurality of protrusions, the protrusions taper in a direction close to the photosensitive surface, and the length of the protrusions in a direction close to the photosensitive element may be between 0.08 mm and 0.43 mm.

[0036] According to an embodiment of the present disclosure, a camera module is provided, which includes an image sensor module as described in the foregoing embodiment and an imaging lens, wherein the imaging lens is disposed opposite to the image sensor.

[0037] For the camera module according to the embodiment described in the previous paragraph, an imaging lens height is defined in the thickness direction of the imaging lens from the image sensor to the electronic component board, and a bending portion height is defined in the thickness direction of the bending portion of the flexible circuit from the image sensor to the electronic component board. The imaging lens height can be greater than or equal to the bending portion height.

[0038] According to an embodiment of the present disclosure, an electronic device is provided, which includes the camera module as described in the foregoing embodiment. Description of the Drawings

[0039] Figure 1A Shows a perspective view of the camera module according to the first embodiment of the present disclosure;

[0040] Figure 1B Shows in accordance with Figure 1A An exploded view of the camera module according to the first embodiment;

[0041] Figure 1C Shows in accordance with Figure 1A A cross-sectional view of the camera module according to the first embodiment;

[0042] Figure 1D Shows in accordance with Figure 1A An exploded view of the image sensor module according to the first embodiment;

[0043] Figure 1E Shows in accordance with Figure 1A A top view of the camera module according to the first example of the first embodiment;

[0044] Figure 1F Shows in accordance with Figure 1A A top view of the camera module according to the second example of the first embodiment;

[0045] Figure 1G Shows in accordance with Figure 1A A top view of the camera module according to the third example of the first embodiment;

[0046] Figure 1H Shows in accordance with Figure 1A A top view of the camera module according to the fourth example of the first embodiment;

[0047] Figure 1I Shows in accordance with Figure 1A A top view of the camera module according to the fifth example of the first embodiment;

[0048] Figure 1JShows according to Figure 1A A top view of the camera module in the sixth embodiment of the first embodiment;

[0049] Figure 2A Shows a perspective view of the camera module according to the second embodiment of the present disclosure;

[0050] Figure 2B Shows according to Figure 2A An exploded view of the camera module in the second embodiment;

[0051] Figure 2C Shows according to Figure 2A A schematic diagram of the imaging optical path range of the camera module in the second embodiment;

[0052] Figure 2D Shows according to Figure 2A A cross-sectional view of the camera module in the first embodiment of the second embodiment;

[0053] Figure 2E Shows according to Figure 2A A schematic diagram of the photosensitive element module in the first embodiment of the second embodiment;

[0054] Figure 2F Shows according to Figure 2A A perspective view of the camera module in the second embodiment of the second embodiment;

[0055] Figure 3A Shows a perspective view of the camera module according to the third embodiment of the present disclosure;

[0056] Figure 3B Shows according to Figure 3A A partial cross-sectional view of the camera module in the third embodiment;

[0057] Figure 3C Shows according to Figure 3A An exploded view of the camera module in the third embodiment;

[0058] Figure 3D Shows according to Figure 3A An exploded view of the photosensitive element module in the third embodiment;

[0059] Figure 3E Shows according to Figure 3A A partial enlarged view of the camera module in the third embodiment;

[0060] Figure 4A Shows a perspective view of the camera module according to the fourth embodiment of the present disclosure;

[0061] Figure 4B Shows according to Figure 4A An exploded view of the camera module in the fourth embodiment;

[0062] Figure 4C Showing a partially enlarged view of the camera module according to Figure 4B the fourth embodiment;

[0063] Figure 4D Showing a exploded view of the photosensitive element module according to Figure 4A the fourth embodiment;

[0064] Figure 4E Showing a partially exploded view of the photosensitive element module according to Figure 4A the fourth embodiment;

[0065] Figure 4F Showing a top view of the photosensitive element module according to Figure 4A the fourth embodiment;

[0066] Figure 4G Showing a partially enlarged view of the photosensitive element module according to Figure 4F the fourth embodiment;

[0067] Figure 5A Showing a perspective view of the camera module according to the fifth embodiment of the present disclosure;

[0068] Figure 5B Showing a schematic view of the camera module according to Figure 5A the fifth embodiment;

[0069] Figure 5C Showing a cross-sectional view of the camera module according to Figure 5A the fifth embodiment;

[0070] Figure 5D Showing a partially enlarged view of the camera module according to Figure 5C the fifth embodiment;

[0071] Figure 5E Showing another schematic view of the camera module according to Figure 5A the fifth embodiment;

[0072] Figure 5F Showing a exploded view of the camera module according to Figure 5A the fifth embodiment;

[0073] Figure 5G Showing a top view of the photosensitive element module according to Figure 5A the fifth embodiment;

[0074] Figure 5H Showing a partially enlarged view of the photosensitive element module according to Figure 5A the fifth embodiment;

[0075] Figure 6A Showing a perspective view of the electronic device according to the sixth embodiment of the present disclosure;

[0076] Figure 6B Illustrate according to Figure 6A A schematic diagram of the electronic device in the sixth embodiment;

[0077] Figure 7 Illustrate a schematic diagram of the electronic device applied to a drone according to the seventh embodiment of the present disclosure;

[0078] Figure 8 Illustrate a schematic diagram of the electronic device applied to an automobile according to the eighth embodiment of the present disclosure;

[0079] Figure 9 Illustrate a schematic diagram of the electronic device applied to a computer according to the ninth embodiment of the present disclosure; and

[0080] Figure 10 Illustrate a schematic diagram of the electronic device applied to a wearable device according to the tenth embodiment of the present disclosure.

[0081]

Symbol Description

[0082] 10, 20, 30, 40, 50: Camera module

[0083] 11, 21, 31, 41, 51: Photosensitive element module

[0084] 12, 22, 32, 42, 52: Imaging lens

[0085] 111, 211, 311, 411, 511: First electronic component

[0086] 112, 212, 312, 412, 512: Second electronic component

[0087] 120, 220, 320, 420, 520, 64: Electronic component board

[0088] 121, 221, 321, 421, 521: First circuit

[0089] 122, 222, 322, 422, 522: Second circuit

[0090] 124, 224, 524: Component corresponding hole

[0091] 125, 225, 325: Third circuit

[0092] 130, 230, 330, 430, 53 : Flexible circuit

[0093] 131, 231, 331, 431, 531: Connection part

[0094] 132,232,332,432: Bend portion

[0095] 133,233,333,433,533: Electrical path

[0096] 141,241,541: Bend assist hole

[0097] 142,342: Window opening

[0098] 144,244: Masking area

[0099] 145,245,345,445,545: First end

[0100] 146,246,346,446,546: Second end

[0101] 151,551: Hardness reinforcement plate

[0102] 152,352: Shape - maintaining element

[0103] 154,254,554: Substrate

[0104] 155,255: Circuit layer

[0105] 160,260,460,560: Bracket

[0106] 161,261,357,461: Through - hole

[0107] 23,43: Filter element

[0108] 234: Secondary bend portion

[0109] 253,553: Multilayer circuit board

[0110] 323,423,523: Bend guiding structure

[0111] 326: Contact point

[0112] 327: First sub - path

[0113] 328: Second sub - path

[0114] 356: Heat dissipation structure

[0115] 442a,542a: First window opening

[0116] 442b,542b: Second window opening

[0117] 447: Anti - glare structure

[0118] 447a: Protrusion

[0119] 530a: First flexible circuit

[0120] 530b: Second flexible circuit

[0121] 532a: first bending portion

[0122] 532b: second bending portion

[0123] 571: Upper circuit

[0124] 572:Hard layer

[0125] 573: Lower circuit

[0126] 574: Connecting wire

[0127] 60: Electronic devices

[0128] 610: Image acquisition control interface

[0129] 611: Video playback button

[0130] 612: Camera module switch button

[0131] 613: Focus and photo button

[0132] 614: Integrated menu button

[0133] 615: Zoom control key

[0134] 621: Front camera module

[0135] 622: Wide-angle camera module

[0136] 623: Telephoto camera module

[0137] 624:Ultra-wide-angle camera module

[0138] 625: Macro camera module

[0139] 626:TOF module

[0140] 63: Tip light

[0141] 641:Connector

[0142] 642: Electronic components

[0143] 65: Single-chip system

[0144] 66: Auxiliary focus element

[0145] 661: Light-emitting element

[0146] 70: Drone

[0147] 71a, 81a: Front camera module

[0148] 71b, 81b: Side camera module

[0149] 81c: Rear camera module

[0150] 80: Vehicle

[0151] 90: Computer

[0152] 91a, 1010: Video camera module

[0153] 91b: Infrared light camera module

[0154] 1000: Wearable device

[0155] AI: Avoid interference area

[0156] WD: Bending direction

[0157] RL: Imaging optical path range

[0158] IMG: Photosensitive surface

[0159] I1, I2, I3, I4: External space information

[0160] H1: Imaging lens height

[0161] H2: Bending part height

[0162] H: Image height

[0163] L: Length Detailed implementation manners

[0164] The present disclosure provides an electronic component group, which includes a first electronic component, an electronic component board, and a flexible circuit. The first electronic component is disposed on the electronic component board, and the flexible circuit is disposed on the electronic component board. The flexible circuit includes a connection part, a bending part, and an electrical path, wherein the connection part connects to the electronic component board, the bending part is disposed on a side of the connection part away from the first electronic component, the bending part is bent along a thickness direction of the electronic component board, and at least a part of the electrical path is disposed on the bending part. The electrical path includes a first end and a second end, and the first end and the second end are disposed on the connection part. By bending the flexible circuit in cooperation with the solution of the electronic component board to realize a circuit structure with an extreme size, thereby improving the design density of the electronic component group, which is beneficial to realizing the structure of a multi-functional module or a multi-lens module.

[0165] Specifically, the electronic component board is used to support the first electronic component and may further have at least one function such as mechanical strength support, circuit configuration, electromagnetic interference resistance, or grounding, but is not limited thereto. By means of the bypass design of the flexible circuit, the wiring freedom of the electronic component board can be improved, thereby compressing the volume of the electronic component group. Furthermore, the flexible circuit extends from the electronic component board and returns to the electronic component board to complete the design of the electrical path.

[0166] Furthermore, the flexible circuit can be obtained through a flexible printed circuit (FPC), a multilayer circuit board, but is not limited thereto. The electronic component board can be a printed electronic component board, a ceramic electronic component board, and the electronic component board can be further integrated with the flexible circuit by injection molding.

[0167] The electronic component board can include a first circuit and a second circuit, where the first circuit and the second circuit are respectively disposed on opposite sides of the first electronic component. The first circuit is electrically connected to the first electronic component, and the first end and the second end are respectively electrically connected to the first circuit and the second circuit. Through the flexible circuit, the electrical path can be separated from the first electronic component, which can avoid the influence of the current magnetic effect generated by the circuit on the electronic component, thereby maintaining the working state of the electronic component while miniaturizing the volume, and the flexible circuit can simplify the design of the electronic component board, thereby shortening the design time and improving production efficiency.

[0168] The electronic component group may further include a second electronic component, where the second electronic component is spaced apart from the first electronic component. The second electronic component is disposed on the electronic component board, and the bending portion is disposed on the side of the connecting portion away from the second electronic component. The first end and the second end are respectively electrically connected to the first electronic component and the second electronic component, and the second electronic component is electrically connected to the second circuit. Furthermore, the electronic component board may further include a third circuit, where the third circuit is electrically connected to the first electronic component and the second electronic component. Specifically, the first electronic component and the second electronic component are connected through various connection methods to avoid concentrated loads and reduce the overall size.

[0169] The bending portion can be relatively fixed to the electronic component board. By fixing the bending portion, signal interference caused by shaking can be avoided.

[0170] The electronic component group may further include a hardness reinforcement plate, where the hardness reinforcement plate is disposed on the bending portion, and the hardness reinforcement plate is relatively fixed to the electronic component board. Through the hardness reinforcement plate, the rigidity of the bending portion can be improved to avoid damage. Furthermore, the hardness reinforcement plate can be a metal part to shield signal interference (EMI Shielding), and the hardness reinforcement plate can be further combined with the bending portion to form a composite plate.

[0171] The electronic component board may further include a bending guiding structure, wherein the bending guiding structure is correspondingly arranged on one side of the connecting part connected to the bending part, and the bending part is bent along the bending guiding structure. Thereby, the degree of the bending part protruding from the surface can be reduced to improve the assembly quality.

[0172] The dimension of the bending part in the thickness direction of the electronic component board may be less than or equal to the dimension of the bending part in a direction perpendicular to the thickness direction of the electronic component board and perpendicular to a thickness direction of the bending part. Thereby, the mechanical strength after bending can be ensured.

[0173] The bending part may include a bending auxiliary hole, wherein the bending auxiliary hole is arranged on the side of the bending part close to the electronic component board, and the electrical path is arranged around the bending auxiliary hole. The dimension of the bending auxiliary hole in the thickness direction of the electronic component board may be less than or equal to the dimension of the bending auxiliary hole in a direction perpendicular to the thickness direction of the electronic component board and perpendicular to a thickness direction of the bending part. Thereby, unexpected deformation of the electrical path during bending can be avoided to protect the electrical path.

[0174] The electronic component group may further include a shape maintaining element, wherein the shape maintaining element is correspondingly arranged on one side of the connecting part connected to the bending part, and the shape maintaining element is relatively fixed to the electronic component board. Thereby, damage caused by collision during assembly can be avoided to improve the assembly process. Specifically, the shape maintaining element may be a bracket.

[0175] The connecting part of the flexible circuit may include an opening window, wherein the opening window is arranged opposite to the first electronic component. Thereby, the first electronic component is not shielded by the flexible circuit, enabling the first electronic component to have functions such as light sensing and heat dissipation.

[0176] The electronic component group may further include a multilayer circuit board, wherein the multilayer circuit board includes the electronic component board and the flexible circuit, and the flexible circuit extends away from the first electronic component from the electronic component board.

[0177] The electronic component board may further include a component corresponding hole, wherein the first electronic component is arranged in the component corresponding hole. Thereby, the height difference between the first electronic component and the electronic component board can be reduced to avoid interference between the flexible circuit and the gold wire on the first electronic component. Furthermore, the electronic component board may further include a substrate and a circuit layer, wherein the first electronic component is arranged on the substrate, and the first electronic component is electrically connected to the circuit layer.

[0178] The electronic component board may further include a contact point, and the electrical path may include a first sub-path and a second sub-path, wherein the first sub-path and the second sub-path are respectively electrically connected to the first circuit and the second circuit, and the first sub-path and the second sub-path are electrically connected through the contact point. Thereby, the stability of the flexible circuit can be further improved. Specifically, the first sub-path and the second sub-path may further be gold wires, so as to be completed in one go during the wire bonding process.

[0179] The bent portion may not include other electronic components. Specifically, the first electronic component may include passive components, sensing components, coils, etc., so as to avoid signal interference.

[0180] Each technical feature in the electronic component group of the above disclosure can be combined and configured to achieve the corresponding effects.

[0181] The present disclosure provides a photosensitive element module, including the aforementioned electronic component group, wherein the first electronic component is a photosensitive element.

[0182] The photosensitive element module may further include a bracket, wherein the bracket includes a through hole, the through hole is correspondingly arranged with the photosensitive element, and the bent portion is arranged on the bracket.

[0183] The electronic component group may further include a hardness reinforcement plate, wherein the hardness reinforcement plate is arranged on the bent portion, and the hardness reinforcement plate is relatively fixed to the bracket.

[0184] The bracket may further include a bending guiding structure, wherein the bending guiding structure is correspondingly arranged on one side of the connecting portion connected to the bent portion, and the bent portion bends along the bending guiding structure.

[0185] The opening window may be oppositely arranged to a photosensitive surface of the photosensitive element. The flexible circuit is light-tight. The opening window may include a plurality of protrusions, the protrusions taper in the direction approaching the photosensitive surface, and the length of the protrusions in the direction approaching the photosensitive element may be between 0.08 mm and 0.43 mm. Thereby, the flexible circuit can block the glare generated by the circuit contacts, and the protrusions can further avoid the glare generated by reflection to the photosensitive surface through the opening window. Furthermore, the protrusions taper in the direction parallel to the photosensitive surface and can also taper in the direction perpendicular to the photosensitive surface. The anti-glare structure may include a plurality of protrusions, and the protrusions are continuously arranged along the opening window.

[0186] Each technical feature in the photosensitive element module of the above disclosure can be combined and configured to achieve the corresponding effects.

[0187] The present disclosure provides a camera module, including the aforementioned photosensitive element module and an imaging lens, wherein the imaging lens is oppositely arranged to the photosensitive element. Specifically, the camera module may further have functions such as focusing, zooming, image stabilization, etc., and can achieve the above driving functions through the imaging lens bracket, the imaging lens, or their mutual cooperation, but is not limited thereto.

[0188] The imaging lens defines an imaging lens height in the thickness direction from the photosensitive element to the electronic component board, and the bent portion of the flexible circuit defines a bent portion height in the thickness direction from the photosensitive element to the electronic component board, wherein the imaging lens height may be greater than or equal to the bent portion height.

[0189] The electronic component group may further include a hardness reinforcement plate, where the hardness reinforcement plate is disposed at the bending portion, and the hardness reinforcement plate is fixedly opposed to the imaging lens.

[0190] The imaging lens may include a bending guiding structure, where the bending guiding structure is correspondingly disposed on one side of the connecting portion connected to the bending portion, and the bending portion is bent along the bending guiding structure.

[0191] The bending portion of the flexible circuit may be light-tight, and the bending portion may include a shielding area, where the shielding area is disposed on a side of the bending portion away from the connecting portion, and the shielding area is correspondingly disposed with the image height of the imaging lens. Thereby, non-imaging light entering the imaging lens can be blocked to form flare, so as to improve the optical quality.

[0192] Each technical feature in the camera module of the above disclosure can be combined and configured to achieve the corresponding effects.

[0193] The present disclosure provides an electronic device, which includes the foregoing camera module.

[0194] According to the above embodiments, specific embodiments and examples are proposed below and will be described in detail with reference to the accompanying drawings.

[0195] <First Embodiment>

[0196] Please refer to Figures 1A to 1D , where Figure 1A FIG. shows a perspective view of the camera module 10 according to the first embodiment of the present disclosure, Figure 1B FIG. shows Figure 1A an exploded view of the camera module 10 according to the first embodiment, Figure 1C FIG. shows Figure 1A a cross-sectional view of the camera module 10 according to the first embodiment, Figure 1D FIG. shows Figure 1A an exploded view of the photosensitive element module 11 according to the first embodiment. As can be seen from Figures 1A to 1D , the camera module 10 includes a photosensitive element module 11 and an imaging lens 12, where the imaging lens 12 is disposed opposite to the photosensitive element module 11. Specifically, the camera module 10 may further have functions such as focusing, zooming, and image stabilization, and may achieve the above driving functions through the imaging lens bracket, the imaging lens, or in cooperation with each other, but is not limited thereto.

[0197] The photosensitive element module 11 includes an electronic component group (not shown in the figure), and the electronic component group includes a first electronic component 111, a second electronic component 112, an electronic component board 120, and a flexible circuit 130. The second electronic component 112 is spaced from the first electronic component 111. The first electronic component 111 and the second electronic component 112 are disposed on the electronic component board 120, and the flexible circuit 130 is disposed on the electronic component board 120. Specifically, the first electronic component 111 may be a photosensitive element, and the second electronic component 112 may be an image processing element.

[0198] The electronic component board 120 includes a first circuit 121 and a second circuit 122. The first circuit 121 and the second circuit 122 are respectively disposed on opposite sides of the first electronic component 111, and the first circuit 121 is electrically connected to the first electronic component 111.

[0199] The flexible circuit 130 includes a connection portion 131, a bending portion 132, and an electrical path 133. The connection portion 131 connects to the electronic component board 120. The bending portion 132 is disposed on a side of the connection portion 131 away from the first electronic component 111 and the second electronic component 112, and the bending portion 132 is bent along a thickness direction of the electronic component board 120. The electrical path 133 includes a first end 145 and a second end 146, and at least a part of the electrical path 133 is disposed on the bending portion 132.

[0200] The first end 145 and the second end 146 are respectively electrically connected to the first circuit 121 and the second circuit 122, the first end 145 and the second end 146 are respectively electrically connected to the first electronic component 111 and the second electronic component 112, and the first end 145 and the second end 146 are disposed on the connection portion 131.

[0201] Specifically, the electronic component board 120 is used to support the first electronic component 111 and the second electronic component 112, and may further have at least one function such as mechanical strength support, circuit configuration, electromagnetic interference resistance, or grounding. The electronic component board 120 may be a printed electronic component board or a ceramic electronic component board, and the electronic component board 120 may be further integrated with the flexible circuit 130 by injection molding, but is not limited thereto.

[0202] Through the bypass design of bending the flexible circuit 130, the wiring freedom of the electronic component board 120 can be improved, thereby compressing the volume of the electronic component group. On the other hand, through the flexible circuit 130, the circuit can be away from the electronic components (i.e., the first electronic component 111 and the second electronic component 112), which can avoid the influence of the current magnetic effect generated by the circuit on the electronic components, thereby maintaining the working state of the electronic components while miniaturizing the volume, and the flexible circuit 130 can simplify the design of the electronic component board 120, thereby shortening the design time and improving the production efficiency.

[0203] Furthermore, the flexible circuit 130 can be obtained through a flexible printed circuit (FPC) or a multilayer circuit board, but is not limited thereto. Moreover, the flexible circuit 130 extends from the electronic component board 120 and returns to the electronic component board 120 to complete the design of the electrical path 133.

[0204] The bent portion 132 can be relatively fixed to the electronic component board 120. By fixing the bent portion 132, signal interference caused by shaking can be avoided.

[0205] From Figure 1A it can be seen that the dimension of the bent portion 132 in the thickness direction of the electronic component board 120 can be less than or equal to the dimension of the bent portion 132 in the direction perpendicular to the thickness direction of the electronic component board 120 and perpendicular to the thickness direction of the bent portion 132. Thereby, the mechanical strength of the bent portion 132 after bending can be ensured.

[0206] The photosensitive element module 11 may further include a bracket 160, where the bracket 160 includes a through hole 161, the through hole 161 is correspondingly arranged with the first electronic component 111, and the bent portion 132 is arranged on the bracket 160.

[0207] From Figure 1C it can be seen that the imaging lens 12 defines an imaging lens height H1 in the thickness direction of the electronic component board 120 from the first electronic component 111, and the bent portion 132 of the flexible circuit 130 defines a bent portion height H2 in the thickness direction of the electronic component board 120 from the first electronic component 111, where the imaging lens height H1 is greater than the bent portion height H2.

[0208] From Figure 1A it can be seen that the electronic component group may further include a shape-maintaining element 152, where the shape-maintaining element 152 is correspondingly arranged on one side of the connecting portion 131 connected to the bent portion 132, and the shape-maintaining element 152 is relatively fixed to the electronic component board 120. Thereby, damage caused by collision during assembly can be avoided to improve the assembly process.

[0209] From Figures 1B to 1D it can be seen that the electronic component board 120 may further include a component corresponding hole 124, a substrate 154, and a circuit layer 155, where the first electronic component 111 is arranged on the component corresponding hole 124 and the substrate 154, and the first electronic component 111 is electrically connected to the circuit layer 155. Thereby, the height difference between the first electronic component 111 and the electronic component board 120 can be reduced to avoid interference between the flexible circuit 130 and the gold wire on the first electronic component 111.

[0210] The electronic component board 120 may further include a third circuit 125, wherein the second electronic component 112 may be electrically connected to the second circuit 122, and the third circuit 125 is electrically connected to the first electronic component 111 and the second electronic component 112. Specifically, the first electronic component 111 and the second electronic component 112 are connected through various connection methods to avoid concentrated loads and reduce the overall size.

[0211] From Figure 1B and Figure 1D it can be seen that the connecting portion 131 of the flexible circuit 130 may include a window 142, wherein the window 142 is disposed opposite to the first electronic component 111. Thereby, the first electronic component 111 is not shielded by the flexible circuit 130, enabling the first electronic component 111 to have functions such as photosensitivity and heat dissipation.

[0212] The bending portion 132 may not include other electronic components. Specifically, the above-mentioned electronic components include passive components, sensing components, coils, etc., to avoid signal interference.

[0213] Please refer to Figure 1E which shows a top view of the camera module 10 in the first embodiment according to Figure 1A the first implementation manner. From Figure 1E it can be seen that the flexible circuit 130 is disposed on both sides of the imaging lens 12, and the bending portion 132 of the flexible circuit 130 may include a bending auxiliary hole 141, wherein the bending auxiliary hole 141 is disposed on the side of the bending portion 132 close to the electronic component board 120, and the electrical path 133 is disposed around the bending auxiliary hole 141. In the first embodiment of the first implementation manner, the number of bending auxiliary holes 141 is four, but it is not limited thereto.

[0214] Please refer to Figure 1F which shows a top view of the camera module 10 in the second embodiment according to Figure 1A the first implementation manner. From Figure 1F it can be seen that the flexible circuit 130 is disposed on one side of the imaging lens 12.

[0215] Please refer to Figure 1G which shows a top view of the camera module 10 in the third embodiment according to Figure 1A the first implementation manner. From Figure 1G it can be seen that the flexible circuit 130 is disposed on both sides of the imaging lens 12, and the electronic component group may further include a hardness reinforcement plate 151, wherein the hardness reinforcement plate 151 is disposed on the bending portion 132, and the hardness reinforcement plate 151 is relatively fixed to the electronic component board 120, the bracket 160, and the imaging lens 12.

[0216] The rigidity of the bent portion 132 can be enhanced by the hardness reinforcement plate 151 to avoid damage. Further, the hardness reinforcement plate 151 can be a metal part to shield signal interference (EMI Shielding), and the hardness reinforcement plate 151 can be further combined with the bent portion 132 to form a composite plate.

[0217] Please refer to Figure 1H , which shows Figure 1A a top view of the camera module 10 in the fourth embodiment according to the first embodiment. As can be seen from Figure 1H , the flexible circuit 130 is disposed on both sides of the imaging lens 12, and the flexible circuit 130 has an irregular shape. The bent portion 132 of the flexible circuit 130 may include a bending auxiliary hole 141. The bending auxiliary hole 141 is disposed on a side of the bent portion 132 close to the electronic component board 120, and the electrical path 133 is disposed around the bending auxiliary hole 141.

[0218] Please refer to Figure 1I , which shows Figure 1A a top view of the camera module 10 in the fifth embodiment according to the first embodiment. As can be seen from Figure 1I , the flexible circuit 130 is disposed on both sides of the imaging lens 12. The bent portion 132 of the flexible circuit 130 is light-tight, and the bent portion 132 may include a shielding area 144. The shielding area 144 is disposed on a side of the bent portion 132 away from the connecting portion 131, and the shielding area 144 is disposed corresponding to the image height of the imaging lens 12. Thereby, non-imaging light entering the imaging lens 12 can be blocked to form glare, so as to improve the optical quality.

[0219] Specifically, the flexible circuit 130 can shield non-imaging light through the shielding area 144, and can avoid the area interfering with the imaging lens 12, that is, Figure 1I the interference avoidance area AI in

[0220] Please refer to Figure 1J , which shows Figure 1A a top view of the camera module 10 in the sixth embodiment according to the first embodiment. As can be seen from Figure 1J , the flexible circuit 130 is disposed on one side of the imaging lens 12, and the electronic component group may further include a hardness reinforcement plate 151. The hardness reinforcement plate 151 is disposed on the bent portion 132, and the hardness reinforcement plate 151 is relatively fixed to the electronic component board 120, the bracket 160, and the imaging lens 12.

[0221] <Second Embodiment>

[0222] Please refer to Figures 2A to 2C , wherein Figure 2A shows a perspective view of the camera module 20 according to the second embodiment of the present disclosure, Figure 2B shows according to Figure 2AExploded view of the camera module 20 in the second embodiment Figure 2C Illustrating in accordance with Figure 2A Schematic diagram of the imaging optical path range RL of the camera module 20 in the second embodiment. As can be seen from Figures 2A to 2C , the camera module 20 includes a photosensitive element module 21 (labeled in Figure 2E ) and an imaging lens 22, wherein the imaging lens 22 is disposed opposite to the photosensitive element module 21.

[0223] The photosensitive element module 21 includes an electronic component group (not shown in the figure), and the electronic component group includes a first electronic component 211, a second electronic component 212, an electronic component board 220, and a flexible circuit 230. The second electronic component 212 is spaced apart from the first electronic component 211. The first electronic component 211 and the second electronic component 212 are disposed on the electronic component board 220, and the flexible circuit 230 is disposed on the electronic component board 220. Specifically, the first electronic component 211 may be a photosensitive element, and the second electronic component 212 may be an image processing element.

[0224] As can be seen from Figure 2C , the camera module 20 may further include a filter element 23, and the imaging light forms an image on a photosensitive surface IMG of the first electronic component 211 after passing through the filter element 23.

[0225] Please refer to Figure 2D and Figure 2E , wherein Figure 2D Illustrating in accordance with Figure 2A Cross-sectional view of the camera module 20 in the first embodiment of the second embodiment Figure 2E Illustrating in accordance with Figure 2A Schematic diagram of the photosensitive element module 21 in the first embodiment of the second embodiment. As can be seen from Figure 2D and Figure 2E , the electronic component board 220 includes a first circuit 221 and a second circuit 222. The first circuit 221 and the second circuit 222 are respectively disposed on opposite sides of the first electronic component 211, and the first circuit 221 is electrically connected to the first electronic component 211.

[0226] As can be seen from Figures 2C to 2E , the flexible circuit 230 includes a connecting portion 231, a bending portion 232, and an electrical path 233. The connecting portion 231 is connected to the electronic component board 220. The bending portion 232 is disposed on a side of the connecting portion 231 away from the first electronic component 211 and the second electronic component 212, and the bending portion 232 is bent along a thickness direction of the electronic component board 220. The electrical path 233 includes a first end 245 and a second end 246, and at least a part of the electrical path 233 is disposed in the bending portion 232.

[0227] The first end 245 and the second end 246 are electrically connected to the first circuit 221 and the second circuit 222 respectively. The first end 245 and the second end 246 are electrically connected to the first electronic component 211 and the second electronic component 212 respectively, and the first end 245 and the second end 246 are disposed on the connecting portion 231.

[0228] From Figure 2A and Figure 2B it can be seen that the photosensitive element module 21 may further include a bracket 260. The bracket 260 includes a through hole 261. The through hole 261 is correspondingly disposed with the first electronic component 211, and the bending portion 232 is disposed on the bracket 260. Further, the bracket 260 may be a base of an imaging lens.

[0229] From Figure 2B and Figure 2D it can be seen that the electronic component board 220 may further include a component corresponding hole 224, a substrate 254, and a circuit layer 255. The first electronic component 211 is disposed on the component corresponding hole 224 and the substrate 254, and the first electronic component 211 is electrically connected to the circuit layer 255.

[0230] From Figure 2D and Figure 2E it can be seen that the electronic component board 220 may further include a third circuit 225. The second electronic component 212 may be electrically connected to the second circuit 222, and the third circuit 225 is electrically connected to the first electronic component 211 and the second electronic component 212.

[0231] From Figure 2A , Figure 2D and Figure 2E it can be seen that the bending portion 232 of the flexible circuit 230 may include a bending auxiliary hole 241. The bending auxiliary hole 241 is disposed on a side of the bending portion 232 close to the electronic component board 220, and the electrical path 233 is disposed around the bending auxiliary hole 241. Further, the dimension of the bending auxiliary hole 241 in the thickness direction of the electronic component board 220 may be less than or equal to the dimension of the bending auxiliary hole 241 in a thickness direction perpendicular to the thickness direction of the electronic component board 220 and perpendicular to the bending portion 232. Thereby, unexpected deformation of the electrical path 233 during bending can be avoided to protect the electrical path 233.

[0232] From Figure 2B and Figure 2E it can be seen that the electronic component group may further include a multilayer circuit board 253. The multilayer circuit board 253 may include the electronic component board 220 and the flexible circuit 230, and the flexible circuit 230 extends from the electronic component board 220 in a direction away from the first electronic component 211.

[0233] From Figure 2C and Figure 2DIt can be known that the bent portion 232 of the flexible circuit 230 is light-tight, and the bent portion 232 may include a shielding area 244, where the shielding area 244 is disposed on a side of the bent portion 232 away from the connecting portion 231, and the shielding area 244 is correspondingly disposed with the image height H of the imaging lens 22.

[0234] Specifically, through the shielding area 244, the flexible circuit 230 can shield non-imaging light to form an imaging light path range RL as shown in Figure 2C and can avoid the area interfering with the imaging lens 22, that is, Figure 2D the interference avoidance area AI shown in

[0235] Please refer to Figure 2F which shows a perspective view of the camera module 20 in the second embodiment according to the Figure 2A second embodiment. It can be known from Figure 2F that the flexible circuit 230 may further include a plurality of secondary bent portions 234, where the secondary bent portions 234 are further disposed on the bent portion 232, and the secondary bent portions 234 can further strengthen the fixation of the bent portion 232.

[0236] <Third Embodiment>

[0237] Please refer to <s Figures 3A to 3C where Figure 3A shows a perspective view of the camera module 30 according to the third embodiment of the present disclosure, Figure 3B shows a partial cross-sectional view of the camera module 30 according to the Figure 3A third embodiment, Figure 3C shows an exploded view of the camera module 30 according to the Figure 3A third embodiment. It can be known from Figures 3A to 3C that the camera module 30 includes a photosensitive element module 31 (labeled in Figure 3D ) and an imaging lens 32, where the imaging lens 32 is disposed opposite to the photosensitive element module 31.

[0238] Please refer to Figure 3D which shows an exploded view of the photosensitive element module 31 according to the Figure 3A third embodiment. It can be known from Figures 3B to 3D that the photosensitive element module 31 includes an electronic component group (not shown in the figure), and the electronic component group includes a first electronic component 311, a second electronic component 312, an electronic component board 320, and a flexible circuit 330, where the second electronic component 312 is spaced apart from the first electronic component 311, the first electronic component 311 and the second electronic component 312 are disposed on the electronic component board 320, and the flexible circuit 330 is disposed on the electronic component board 320. Specifically, the first electronic component 311 may be a photosensitive element, and the second electronic component 312 may be an image processing element.

[0239] It can be known fromFigure 3D It can be seen that the electronic component board 320 includes a first circuit 321 and a second circuit 322, wherein the first circuit 321 and the second circuit 322 are respectively disposed on opposite sides of the first electronic component 311, and the first circuit 321 is electrically connected to the first electronic component 311.

[0240] Please refer to Figure 3E , which shows a partially enlarged view of the camera module 30 according to Figure 3A the third embodiment. As can be seen from Figure 3B , Figure 3D and Figure 3E , the flexible circuit 330 includes a connecting portion 331, a bending portion 332, and an electrical path 333. The connecting portion 331 is connected to the electronic component board 320. The bending portion 332 is disposed on a side of the connecting portion 331 away from the first electronic component 311 and the second electronic component 312, and the bending portion 332 is bent along a thickness direction of the electronic component board 320. The electrical path 333 includes a first end 345 and a second end 346, and at least a part of the electrical path 333 is disposed in the bending portion 332.

[0241] The first end 345 and the second end 346 are respectively electrically connected to the first circuit 321 and the second circuit 322, the first end 345 and the second end 346 are respectively electrically connected to the first electronic component 311 and the second electronic component 312, and the first end 345 and the second end 346 are disposed on the connecting portion 331.

[0242] As can be seen from Figures 3A to 3C and Figure 3E , the electronic component group may further include a shape maintaining element 352, wherein the shape maintaining element 352 is correspondingly disposed on a side of the bending portion 332 connecting the connecting portion 331, and the shape maintaining element 352 is relatively fixed to the electronic component board 320.

[0243] Specifically, the shape maintaining element 352 may be a bracket, and the shape maintaining element 352 may include a heat dissipation structure 356 and a through hole 357, wherein the heat dissipation structure 356 is correspondingly disposed with the second electronic component 312, and the through hole 357 is correspondingly disposed with the imaging lens 32.

[0244] As can be seen from Figure 3D , the electronic component board 320 may further include a third circuit 325, wherein the second electronic component 312 may be electrically connected to the second circuit 322, and the third circuit 325 is electrically connected to the first electronic component 311 and the second electronic component 312.

[0245] The connecting portion 331 of the flexible circuit 330 may include a window 342, wherein the window 342 is disposed opposite to the first electronic component 311 and the second electronic component 312.

[0246] As can be seen fromFigure 3E It can be seen that the electronic component board 320 may further include a bending guide structure 323, wherein the bending guide structure 323 is correspondingly arranged on one side of the connecting portion 331 connected to the bending portion 332, and the bending portion 332 is bent along the bending guide structure 323. Thereby, the degree of the bending portion 332 protruding from the surface can be reduced to improve the assembly quality.

[0247] From Figure 3D It can be seen that the electronic component board 320 may further include a contact 326, and the electrical path 333 may include a first sub-path 327 and a second sub-path 328, wherein the first sub-path 327 and the second sub-path 328 are respectively electrically connected to the first circuit 321 and the second circuit 322, and the first sub-path 327 and the second sub-path 328 are electrically connected through the contact 326. Thereby, the stability of the flexible circuit 330 can be further improved. Specifically, the first sub-path 327 and the second sub-path 328 may further be gold wires, so as to be completed in one go during the wire bonding process.

[0248] <Fourth Embodiment>

[0249] Please refer to Figure 4A and Figure 4B , wherein Figure 4A shows a perspective view of the camera module 40 according to the fourth embodiment of the present disclosure, Figure 4B shows Figure 4A an exploded view of the camera module 40 according to the Figure 4A and Figure 4B It can be seen that the camera module 40 includes an image sensor module 41 (labeled in Figure 4D ) and an imaging lens 42, wherein the imaging lens 42 is disposed opposite to the image sensor module 41.

[0250] Please refer to Figures 4C to 4E , wherein Figure 4C shows Figure 4B [[ID=3?]]a partially enlarged view of the camera module 40 according to the Figure 4D shows Figure 4A an exploded view of the image sensor module 41 according to the Figure 4E shows Figure 4A a partially exploded view of the image sensor module 41 according to the Figures 4A to 4EIt can be known that the photosensitive element module 41 includes an electronic component group (not shown in the figure), and the electronic component group includes a first electronic component 411, a second electronic component 412, an electronic component board 420, and a flexible circuit 430. The second electronic component 412 is arranged at an interval from the first electronic component 411. The first electronic component 411 and the second electronic component 412 are arranged on the electronic component board 420, and the flexible circuit 430 is arranged on the electronic component board 420. Specifically, the first electronic component 411 can be a photosensitive element, and the second electronic component 412 can be an image processing element.

[0251] It can be known from Figure 4B and Figure 4D that the camera module 40 may further include a filter element 43, and the filter element 43 is arranged corresponding to the first electronic component 411.

[0252] It can be known from Figure 4E that the electronic component board 420 includes a first circuit 421 and a second circuit 422. The first circuit 421 and the second circuit 422 are respectively arranged on opposite sides of the first electronic component 411, and the first circuit 421 is electrically connected to the first electronic component 411.

[0253] It can be known from Figure 4B , Figure 4C and Figure 4E that the flexible circuit 430 includes a connection part 431, a bending part 432, and an electrical path 433. The connection part 431 is connected to the electronic component board 420. The bending part 432 is arranged on a side of the connection part 431 away from the first electronic component 411 and the second electronic component 412, and the bending part 432 is bent along a thickness direction of the electronic component board 420. The electrical path 433 includes a first end 445 and a second end 446, and at least a part of the electrical path 433 is arranged on the bending part 432.

[0254] The first end 445 and the second end 446 are respectively electrically connected to the first circuit 421 and the second circuit 422, the first end 445 and the second end 446 are respectively electrically connected to the first electronic component 411 and the second electronic component 412, and the first end 445 and the second end 446 are arranged on the connection part 431.

[0255] It can be known from Figures 4B to 4D that the photosensitive element module 41 may further include a bracket 460. The bracket 460 includes a through hole 461. The through hole 461 is arranged corresponding to the first electronic component 411 and the filter element 43, and the bending part 432 is arranged on the bracket 460.

[0256] It can be known from Figure 4CIt can be seen that the bracket 460 may further include a bending guiding structure 423, wherein the bending guiding structure 423 is correspondingly arranged on one side of the connecting portion 431 connected to the bending portion 432, and the bending portion 432 bends along the bending guiding structure 423. Further, the bending portion 432 bends along a bending direction WD.

[0257] Please refer to Figure 4F and Figure 4G , wherein Figure 4F shows a top view of the photosensitive element module 41 according to the fourth embodiment. Figure 4A Figure 4G Please refer to Figure 4F and Figures 4E to 4G shows a partially enlarged view of the photosensitive element module 41 according to the fourth embodiment. It can be seen that the connecting portion 431 of the flexible circuit 430 may include a plurality of openings, and the openings are respectively a first opening 442a and a second opening 442b, wherein the first opening 442a is oppositely arranged to a photosensitive surface IMG of the first electronic component 411.

[0258] The flexible circuit 430 is light-tight. The first opening 442a may include an anti-glare structure 447, and the anti-glare structure 447 may include a plurality of protrusions 447a, wherein the protrusions 447a taper in a direction approaching the photosensitive surface IMG, and the length of the protrusions 447a along the direction approaching the first electronic component 411 is L, and the length L is 0.2 mm. Thereby, the flexible circuit 430 can block the glare generated by the circuit contacts, and the protrusions 447a can further prevent the glare generated by being reflected to the photosensitive surface IMG through the first opening 442a. The protrusions 447a taper in a direction parallel to the photosensitive surface IMG, and may further taper in a direction perpendicular to the photosensitive surface IMG, and the protrusions 447a are continuously arranged along the first opening 442a.

[0259] <Fifth Embodiment>

[0260] Please refer to Figure 5A and Figure 5B , wherein Figure 5A shows a perspective view of the camera module 50 according to the fifth embodiment of the present disclosure. Figure 5B Please refer to Figure 5A and Figure 5A shows a schematic diagram of the camera module 50 according to the fifth embodiment. It can be seen from Figure 5B and Figure 5G that the camera module 50 includes a photosensitive element module 51 (labeled in

[0261] Please refer to Figures 5C to 5G , wherein Figure 5C shows a sectional view of the camera module 50 according to the fifth embodiment. Figure 5A ​Figure 5D Shows according to Figure 5C A partially enlarged view of the camera module 50 in the fifth embodiment, Figure 5E Shows according to Figure 5A Another schematic diagram of the camera module 50 in the fifth embodiment, Figure 5F Shows according to Figure 5A An exploded view of the camera module 50 in the fifth embodiment, Figure 5G Shows according to Figure 5A A top view of the photosensitive element module 51 in the fifth embodiment. It can be seen from Figures 5A to 5G that the photosensitive element module 51 includes an electronic component group (not shown in the figure), and the electronic component group includes a first electronic component 511, a second electronic component 512, an electronic component board 520 and a flexible circuit. The second electronic component 512 is spaced from the first electronic component 511. The first electronic component 511 and the second electronic component 512 are disposed on the electronic component board 520, and the flexible circuit is disposed on the electronic component board 520. Specifically, the first electronic component 511 can be a photosensitive element, and the second electronic component 512 can be an image processing element.

[0262] Specifically, the flexible circuit includes a first flexible circuit 530a and a second flexible circuit 530b, and the first flexible circuit 530a and the second flexible circuit 530b are disposed on the electronic component board 520.

[0263] It can be seen from Figure 5F and Figure 5G that the electronic component board 520 includes a first circuit 521 and a second circuit 522. The first circuit 521 and the second circuit 522 are respectively disposed on opposite sides of the first electronic component 511, and the first circuit 521 is electrically connected to the first electronic component 511.

[0264] It can be seen from Figure 5C , Figure 5D and Figure 5F that the first flexible circuit 530a and the second flexible circuit 530b respectively include a connecting portion 531, a bending portion and an electrical path 533. The connecting portion 531 is connected to the electronic component board 520. The bending portion is disposed on a side of the connecting portion 531 away from the first electronic component 511 and the second electronic component 512, and the bending portion is bent along a thickness direction of the electronic component board 520. The electrical path 533 includes a first end 545 and a second end 546, and at least a part of the electrical path 533 is disposed on the bending portion.

[0265] Furthermore, the first flexible circuit 530a includes a first bending portion 532a, and the second flexible circuit 530b includes a second bending portion 532b.

[0266] The first end 545 and the second end 546 are electrically connected to the first circuit 521 and the second circuit 522 respectively. The first end 545 and the second end 546 are electrically connected to the first electronic component 511 and the second electronic component 512 respectively, and the first end 545 and the second end 546 are disposed on the connecting portion 531.

[0267] It can be seen from Figure 5C and Figure 5E that the photosensitive element module 51 may further include a bracket 560. The bracket 560 includes a through hole (not shown in the figure). The through hole is correspondingly disposed with the first electronic component 511, and the first bending portion 532a and the second bending portion 532b are disposed on the bracket 560.

[0268] It can be seen from Figure 5C and Figure 5D that the imaging lens 52 may further include a bending guiding structure 523. One side of the bending guiding structure 523 connected to the connecting portion 531 corresponding to the first bending portion 532a and one side of the bending guiding structure 523 connected to the connecting portion 531 corresponding to the second bending portion 532b are correspondingly disposed, and the first bending portion 532a and the second bending portion 532b are bent along the bending guiding structure 523.

[0269] It can be seen from Figure 5B that the second bending portion 532b of the second flexible circuit 530b may include a bending auxiliary hole 541. The bending auxiliary hole 541 is disposed on the side of the second bending portion 532b close to the electronic component board 520, and the electrical path 533 is disposed around the bending auxiliary hole 541.

[0270] It can be seen from Figure 5F that the connecting portion 531 of the second flexible circuit 530b may include a plurality of openings, and the openings are respectively a first opening 542a and a second opening 542b. The first opening 542a is disposed opposite to a photosensitive surface of the first electronic component 511, and the second opening 542b is disposed opposite to the second electronic component 512.

[0271] It can be seen from Figures 5B to 5G that the electronic component group may further include a hardness reinforcing plate 551. The hardness reinforcing plate 551 is disposed on the first bending portion 532a, and the hardness reinforcing plate 551 is relatively fixed to the electronic component board 520, the bracket 560 and the imaging lens 52.

[0272] Please refer to Figure 5H , which shows a partial enlarged view of the photosensitive element module 51 according to Figure 5A the fifth embodiment. It can be seen from Figure 5HIt can be seen that the electronic component group may further include a multilayer circuit board 553, where the multilayer circuit board 553 may include an electronic component board 520 and a first flexible circuit 530a, and the first flexible circuit 530a extends from the electronic component board 520 in a direction away from the first electronic component 511.

[0273] From Figure 5F and Figure 5H it can be seen that the electronic component board 520 may further include a component corresponding hole 524, a substrate 554, an upper circuit 571, a hard layer 572, a lower circuit 573, and a connection wire 574. The first electronic component 511 is disposed between the component corresponding hole 524 and the substrate 554, the first flexible circuit 530a is disposed between the hard layer 572, the hard layer 572 is respectively disposed on the upper circuit 571 and the lower circuit 573, and the connection wire 574 connects the upper circuit 571 and the first electronic component 511.

[0274] <Sixth Embodiment>

[0275] Please refer to Figure 6A and Figure 6B , where Figure 6A shows a perspective view of the electronic device 60 according to the sixth embodiment of the present disclosure, Figure 6B shows Figure 6A a schematic diagram of the electronic device 60 according to the sixth embodiment. From Figure 6A and Figure 6B it can be seen that the electronic device 60 is a smart phone, and the electronic device 60 may also be a notebook computer, a tablet computer, a dash cam, etc., but is not limited thereto. The electronic device 60 includes a camera module and an imaging control interface 610. Further, the camera module may be the camera module of the foregoing first embodiment to fifth embodiment, but the present disclosure is not limited thereto.

[0276] In the sixth embodiment, the camera modules are respectively a front camera module 621, a wide-angle camera module 622, a telephoto camera module 623, an ultra-wide-angle camera module 624, a macro camera module 625, and a TOF module (Time-Of-Flight) 626. The TOF module 626 may alternatively be other types of camera modules and is not limited to this configuration.

[0277] Specifically, in the sixth embodiment, the front camera module 621 and the TOF module 626 are disposed on the front of the electronic device 60, while the wide-angle camera module 622, the telephoto camera module 623, the ultra-wide-angle camera module 624, and the macro camera module 625 are disposed on the back of the electronic device 60.

[0278] The imaging control interface 610 can be a touch screen, which is used to display images and has touch functions, and can be used to manually adjust the shooting angle. Specifically, the imaging control interface 610 includes an image playback button 611, a camera module switching button 612, a focus and capture button 613, an integrated menu button 614, and a zoom control button 615. Further, the user enters the shooting mode through the imaging control interface 610 of the electronic device 60. The camera module switching button 612 can freely switch to use one of the front camera module 621, the wide-angle camera module 622, the telephoto camera module 623, the ultra-wide-angle camera module 624, and the macro camera module 625 for shooting. The zoom control button 615 is used to adjust the zoom. After framing and determining one of the front camera module 621, the wide-angle camera module 622, the telephoto camera module 623, the ultra-wide-angle camera module 624, and the macro camera module 625, the focus and capture button 613 is used to capture an image. The image playback button 611 allows the user to view the photo after capturing the image. The integrated menu button 614 is used to adjust the details during image capture (such as timed shooting, shooting ratio, etc.).

[0279] The electronic device 60 may further include a notification light 63. The notification light 63 is disposed on the front of the electronic device 60 and can be used to notify the user of unread messages, missed calls, and the status of the mobile phone.

[0280] Further, after the user enters the shooting mode through the imaging control interface 610 of the electronic device 60, the imaging light rays of the camera modules are converged on the photosensitive element, and an electronic signal related to the image is output to the image signal processor (not shown in the figure) of the single-chip system 65. The single-chip system 65 may further include a random access memory (RAM) (not shown in the figure), a central processing unit (not shown in the figure), and a storage unit (not shown in the figure), and may further include, but is not limited to, a display unit, a control unit, a read-only memory (ROM), or a combination thereof.

[0281] Furthermore, the electronic device 60 may further include an image software processor and an image signal processor, and may further integrate the image software processor, the image signal processor, a position locator, a transmission signal processor, a gyroscope, a storage unit, and a random access memory into the single-chip system 65.

[0282] In response to the camera specifications of the electronic device 60, the electronic device 60 may further include an optical image stabilization component (not shown in the figure). Further, the electronic device 60 may further include at least one auxiliary focusing element 66 and at least one sensing element (not shown in the figure). The auxiliary focusing element 66 may include a light-emitting element 661 for compensating color temperature, an infrared ranging element (not shown in the figure), a laser focusing module (not shown in the figure), etc. The sensing element may have the functions of sensing physical momentum and actuation energy, such as an accelerometer, a gyroscope, a Hall Effect Element, a position locator, and a transmission signal processor, to sense the shaking and jitter applied by the user's hand or the external environment, thereby facilitating the automatic focusing function of the camera module configuration in the electronic device 60 and the performance of the optical image stabilization component, so as to obtain good imaging quality, and helping the electronic device 60 according to the present disclosure to have various shooting functions, such as optimized selfies, low-light HDR (High Dynamic Range) imaging, high-resolution 4K (4K Resolution) video recording, etc. In addition, the user can directly visually observe the shooting screen of the camera through the image capture control interface 610 and manually operate the framing range on the image capture control interface 610 to achieve the automatic focusing function of what you see is what you get.

[0283] Furthermore, the camera module, the optical image stabilization component, the sensing element, the auxiliary focusing element 66, and the electronic component 642 may be disposed on an electronic component board 64 and electrically connected to related components such as an image signal processor through a connector 641 to execute the shooting process, where the electronic component board 64 may be a flexible printed circuit board (FPC). Current electronic devices such as smartphones tend to be thin and light. Configuring the camera module and related components on the electronic component board and then integrating the circuits to the main board of the electronic device using a connector can meet the mechanical design and circuit layout requirements of the limited space inside the electronic device and obtain a greater margin, and also make the automatic focusing function of its camera module more flexible to control through the touch screen of the electronic device. In the sixth embodiment, the sensing element and the auxiliary focusing element 66 are disposed on the electronic component board 64 and at least one other flexible printed circuit board (not shown in the figure), and are electrically connected to related components such as an imaging signal processing element through corresponding connectors to execute the shooting process. In other embodiments (not shown in the figure), the sensing element and the auxiliary optical element may also be disposed on the main board of the electronic device or other forms of carrier boards according to the mechanical design and circuit layout requirements.

[0284] Furthermore, the wide-angle camera module 622 can capture images within a certain range with high pixel counts, featuring high resolution and low distortion. The imaging result of the telephoto camera module 623 can have a smaller viewing angle and depth of field than that of the wide-angle camera module 622, and can be used to photograph moving targets. That is, the actuator (not shown in the figure) of the electronic device 60 can drive the telephoto camera module 623 to perform fast and continuous auto focus on the target, so that the target object will not become blurred due to moving away from the focused position. The imaging result of the ultra-wide-angle camera module 624 can have a larger viewing angle and depth of field than that of the wide-angle camera module 622, but is often accompanied by larger distortion.

[0285] Specifically, by using camera modules with different focal lengths for framing and combining with image processing techniques, the zoom function can be achieved on the electronic device 60.

[0286] <Seventh Embodiment>

[0287] Please refer to Figure 7 , which shows a schematic diagram of the electronic device applied to the drone 70 according to the seventh embodiment of the present disclosure. As Figure 7 can be seen, the electronic device (not labeled in the figure) includes a camera module. Further, the camera module can be the camera module of the foregoing first to fifth embodiments, but the present disclosure is not limited thereto.

[0288] In the seventh embodiment, the camera modules are a front camera module 71a and a side camera module 71b respectively.

[0289] Specifically, the front camera module 71a is disposed at the front end of the drone 70, and the side camera module 71b is disposed at the side of the drone 70. Thereby, the electronic device can cope with complex ambient light.

[0290] <Eighth Embodiment>

[0291] Please refer to Figure 8 , which shows a schematic diagram of the electronic device applied to the vehicle 80 according to the eighth embodiment of the present disclosure. As Figure 8 can be seen, the electronic device (not labeled in the figure) includes a camera module. Further, the camera module can be the camera module of the foregoing first to fifth embodiments, but the present disclosure is not limited thereto.

[0292] In the eighth embodiment, the camera modules are a front camera module 81a, a side camera module 81b, and a rear camera module 81c respectively.

[0293] The front camera module 81a, side camera module 81b, and rear camera module 81c are respectively disposed at the front end, side, and rear end of the vehicle 80, thereby helping the driver obtain external space information outside the vehicle 80, such as external space information I1, I2, I3, I4, but not limited thereto. Thereby, more perspectives can be provided to reduce blind spots, which in turn helps to improve driving safety.

[0294] <Ninth Embodiment>

[0295] Please refer to Figure 9 , which shows a schematic diagram of the electronic device applied to the computer 90 according to the ninth embodiment of the present disclosure. As can be seen from Figure 9 , the electronic device (not shown in the figure) includes a camera module. Further, the camera module can be the camera module of the foregoing first to fifth embodiments, but the present disclosure is not limited thereto.

[0296] In the ninth embodiment, the camera modules are a video camera module 91a and an infrared camera module 91b, and both the video camera module 91a and the infrared camera module 91b are disposed on the front surface of the computer 90.

[0297] <Tenth Embodiment>

[0298] Please refer to Figure 10 , which shows a schematic diagram of the electronic device applied to the wearable device 1000 according to the tenth embodiment of the present disclosure. As can be seen from Figure 10 , the electronic device (not shown in the figure) includes a camera module. Further, the camera module can be the camera module of the foregoing first to fifth embodiments, but the present disclosure is not limited thereto.

[0299] In the tenth embodiment, the camera module is a video camera module 1010, and the video camera module 1010 is disposed on the front surface of the wearable device 1000.

[0300] Although the present utility model has been disclosed as above in embodiments and examples, it is not intended to limit the present utility model. Any person having ordinary knowledge in the technical field to which the present utility model pertains may make some modifications and refinements without departing from the spirit and scope of the present utility model. Therefore, the protection scope of the present utility model shall be defined by the appended claims.

Claims

1. An electronic component group, characterized in that, Comprising: A first electronic component; An electronic component board, on which the first electronic component is disposed, and the electronic component board includes a first circuit and a second circuit, wherein the first circuit and the second circuit are respectively disposed on opposite sides of the first electronic component, and the first circuit is electrically connected to the first electronic component; and A flexible circuit, disposed on the electronic component board, and the flexible circuit includes: A connecting portion for connecting the electronic component board; A bending portion, disposed on a side of the connecting portion away from the first electronic component, and bent along a thickness direction of the electronic component board; and An electrical path, including a first end and a second end, and at least a part of the electrical path is disposed in the bending portion, wherein the first end and the second end are respectively electrically connected to the first circuit and the second circuit, and the first end and the second end are disposed on the connecting portion.

2. The electronic component group according to claim 1, wherein, The bending portion is relatively fixed to the electronic component board.

3. The electronic component group according to claim 2, wherein Further comprising: A hardness reinforcement plate, disposed on the bending portion, and the hardness reinforcement plate is relatively fixed to the electronic component board.

4. The electronic component group according to claim 1, wherein, The electronic component board further includes: A bending guiding structure, correspondingly disposed on a side of the bending portion connecting to the connecting portion, and the bending portion is bent along the bending guiding structure.

5. The electronic component group according to claim 1, characterized in that A dimension of the bending portion in the thickness direction of the electronic component board is less than or equal to a dimension of the bending portion in a direction perpendicular to the thickness direction of the electronic component board and perpendicular to a thickness direction of the bending portion.

6. The electronic component group according to claim 1, characterized in that, The bending portion includes: A bending auxiliary hole, disposed on a side of the bending portion close to the electronic component board, and the electrical path is disposed around the bending auxiliary hole; Wherein, a dimension of the bending auxiliary hole in the thickness direction of the electronic component board is less than or equal to a dimension of the bending auxiliary hole in a direction perpendicular to the thickness direction of the electronic component board and perpendicular to a thickness direction of the bending portion.

7. The electronic component group according to claim 1, wherein Further comprising: A shape maintaining element, correspondingly disposed on a side of the bending portion connecting to the connecting portion, and the shape maintaining element is relatively fixed to the electronic component board.

8. The electronic component group according to claim 1, wherein, The connecting portion of the flexible circuit includes: An opening window, disposed opposite to the first electronic component.

9. The electronic component group according to claim 1, characterized in that, Further comprising: A multilayer circuit board, including the electronic component board and the flexible circuit, wherein the flexible circuit extends from the electronic component board in a direction away from the first electronic component.

10. The electronic component group according to claim 1, characterized in that, The electronic component board further includes: A component corresponding hole, in which the first electronic component is disposed.

11. The electronic component group according to claim 1, wherein, Further comprising: A second electronic component, disposed on the electronic component board, and the second electronic component is electrically connected to the second circuit; Wherein, the electronic component board further includes a third circuit, and the third circuit is electrically connected to the first electronic component and the second electronic component.

12. The electronic component group according to claim 1, wherein, The electronic component board further includes a contact point; Wherein, the electrical path includes a first sub-path and a second sub-path, the first sub-path and the second sub-path are respectively electrically connected to the first circuit and the second circuit, and the first sub-path and the second sub-path are electrically connected through the contact point.

13. The electronic component group according to claim 1, wherein The bending portion does not include other electronic components.

14. A photosensitive element module, characterized in that, Comprising: The electronic component group according to claim 1; Wherein, the first electronic component is a photosensitive component.

15. The photosensitive element module according to claim 14, wherein Further comprising: A bracket, including a through hole; Wherein, the through hole is correspondingly disposed with the photosensitive component, and the bending portion is disposed on the bracket.

16. The photosensitive element module according to claim 15, wherein The electronic component group further includes: A hardness reinforcement plate is disposed at the bending portion, and the hardness reinforcement plate is relatively fixed to the bracket.

17. The photosensitive element module according to claim 15, wherein, The bracket further includes: A bending guiding structure is correspondingly disposed on one side of the connecting portion connected to the bending portion, and the bending portion bends along the bending guiding structure.

18. The photosensitive element module according to claim 14, wherein, The connecting portion of the flexible circuit includes an opening window, and the opening window is disposed opposite to a photosensitive surface of the photosensitive element; Wherein, the flexible circuit is light-tight, the opening window includes a plurality of protrusions, the plurality of protrusions taper in a direction approaching the photosensitive surface, and the length of the plurality of protrusions in a direction approaching the photosensitive element is between 0.08 mm and 0.43 mm.

19. A camera module, characterized in that, Includes: The photosensitive element module as described in claim 14; and An imaging lens is disposed opposite to the photosensitive element.

20. The camera module according to claim 19, wherein The imaging lens defines an imaging lens height in a thickness direction of the electronic component board from the photosensitive element, and the bending portion of the flexible circuit defines a bending portion height in the thickness direction of the electronic component board from the photosensitive element; Wherein, the imaging lens height is greater than or equal to the bending portion height.

21. The camera module according to claim 19, wherein, The electronic component group further includes: A hardness reinforcement plate is disposed at the bending portion, and the hardness reinforcement plate is relatively fixed to the imaging lens.

22. The camera module according to claim 19, wherein The imaging lens includes: A bending guiding structure is correspondingly disposed on one side of the connecting portion connected to the bending portion, and the bending portion bends along the bending guiding structure.

23. The camera module according to claim 19, characterized in that, The bending portion of the flexible circuit is light-tight, the bending portion includes a shielding area, the shielding area is disposed on a side of the bending portion away from the connecting portion, and the shielding area is correspondingly disposed with the image height of the imaging lens.

24. An electronic device, characterized in that, Includes: The camera module as described in claim 19.

25. An electronic component group, characterized in that, Includes: A first electronic component; A second electronic component is spaced apart from the first electronic component; An electronic component board, the first electronic component and the second electronic component are disposed on the electronic component board; and A flexible circuit is disposed on the electronic component board, and the flexible circuit includes: A connecting portion connects the electronic component board; A bending portion is disposed on a side of the connecting portion away from the first electronic component and the second electronic component, and the bending portion bends along a thickness direction of the electronic component board; and An electrical path includes a first end and a second end, and at least a part of the electrical path is disposed in the bending portion, wherein the first end and the second end are respectively electrically connected to the first electronic component and the second electronic component, and the first end and the second end are disposed in the connecting portion.

26. The electronic component group according to claim 25, wherein Further includes: A hardness reinforcement plate is disposed at the bending portion, and the hardness reinforcement plate is relatively fixed to the electronic component board.

27. The electronic component group according to claim 25, wherein, The size of the bending portion in the thickness direction of the electronic component board is less than or equal to the size of the bending portion in a direction perpendicular to the thickness direction of the electronic component board and perpendicular to a thickness direction of the bending portion.

28. The electronic component group according to claim 25, wherein, The bending portion includes: A bending auxiliary hole is disposed on a side of the bending portion close to the electronic component board, and the electrical path is disposed around the bending auxiliary hole; Wherein, the size of the bending auxiliary hole in the thickness direction of the electronic component board is less than or equal to the size of the bending auxiliary hole in a direction perpendicular to the thickness direction of the electronic component board and perpendicular to a thickness direction of the bending portion.

29. The electronic component group according to claim 25, characterized in that, Further includes: A multi-layer circuit board includes the electronic component board and the flexible circuit, wherein the flexible circuit extends away from the first electronic component from the electronic component board.

30. The electronic component group according to claim 25, wherein, The electronic component board further includes: A component corresponding hole, and the first electronic component is disposed in the component corresponding hole.

31. A photosensitive element module, characterized in that, Comprising: The electronic component group according to claim 25; Wherein, the first electronic component is a photosensitive component.

32. The photosensitive element module according to claim 31, wherein The connection portion of the flexible circuit includes a window, and the window is disposed opposite to a photosensitive surface of the photosensitive component; Wherein, the flexible circuit is light-tight, the window includes a plurality of protrusions, the plurality of protrusions taper in a direction approaching the photosensitive surface, and a length of the plurality of protrusions in a direction approaching the photosensitive component is between 0.08 mm and 0.43 mm.

33. A camera module, characterized in that, Comprising: The photosensitive component module according to claim 31; and An imaging lens, disposed opposite to the photosensitive component.

34. The camera module according to claim 33, characterized in that, The imaging lens defines an imaging lens height in a thickness direction of the electronic component board from the photosensitive component, and the bent portion of the flexible circuit defines a bent portion height in the thickness direction of the electronic component board from the photosensitive component; Wherein, the imaging lens height is greater than or equal to the bent portion height.

35. An electronic device, characterized in that, Comprising: The camera module according to claim 33.

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