Sealing structure and miniature microphone module comprising same

Abstract

The utility model provides a sealing structure and a miniature microphone module comprising the same. The sealing structure comprises a mounting plate; the two extension plates are formed by extending along the two sides of the mounting plate, and the extension plates and the mounting plate are integrally formed; the mounting plate is provided with a convex block, the center of the convex block coincides with the center of the mounting plate, and the convex block abuts against the MIC piece. According to the utility model, the support fastens the sealing structure on the shell through the bolt, each MIC piece adopts an independent sealing structure, so that the convex block of the sealing structure abuts against the vertical wall of the MIC piece, when the convex block applies pressure to the MIC piece, one side, in contact with the foam gasket, of the MIC piece extrudes the foam gasket, and the foam gasket is prevented from falling off. The side, close to the foam gasket, of the MIC piece can be sealed through the sealing structure, and therefore the MIC piece sealing effect can be guaranteed by adopting the mode that the MIC piece is extruded through the independent sealing structure, and it can be guaranteed that sealing of the array MIC pieces is more consistent.

Description

Technical Field

[0001] The utility model relates to the technical field of miniature microphones, and particularly relates to a sealing structure and a miniature microphone module containing the sealing structure. Background Art

[0002] In the field of using voice as a sound source for localization, linear MIC arrays and circular MIC arrays are generally used. The principle is that the distances from different MICs to the sound source are different, and the angle and azimuth of the sound source relative to the MIC array are calculated based on this tiny time difference. It is required that the surface for the MIC to collect audio must be sealed or completely open. Due to limitations such as appearance design, the sealing requirements for the MIC are often very high, and the sealing consistency of each MIC in each array should be good.

[0003] Currently, for surface-mounted MICs, the pcb and the housing are generally locked to achieve the sealing between the end face of the MIC and the housing. In this sealing form, due to problems such as the manufacturing precision of the housing, the precision and flatness of the pcb, and the inconsistent height of MIC surface mounting, the sealing pressure will be inconsistent, resulting in inconsistent sealing effects. Another type is wire-bonded MICs, where the MIC and the housing are sealed with glue. The sealing consistency of this operation method is also not good. Because it is easy for the pressure applied to each MIC during glue application to be inconsistent without specific tooling fixtures, this will cause inconsistent pressing or fitting degrees of the MIC to the housing. Summary of the Utility Model

[0004] Based on this, the purpose of the utility model is to provide a sealing structure and a miniature microphone module for a miniature microphone that can make the sealing of the array MIC more consistent.

[0005] The utility model provides the following technical solutions: A sealing structure for sealing an MIC component, comprising:

[0006] A mounting plate;

[0007] Extension plates, two extension plates formed by extending along both sides of the mounting plate. The extension plates are integrally formed with the mounting plate, and the two extension plates are symmetrically arranged;

[0008] A wire hole, the wire hole provided on the mounting plate, and the wire hole penetrates the mounting plate from top to bottom;

[0009] Through holes, through holes are provided on both extension plates, and the through holes penetrate the extension plates from top to bottom;

[0010] A convex block, a convex block is provided on the mounting plate, the center of the convex block coincides with the center of the mounting plate, and the convex block abuts against the MIC component.

[0011] Further, the bump is a continuous and closed annular bump.

[0012] Further, the bump is composed of multiple discontinuous protrusions arranged in an annular array.

[0013] Further, the wire holes are composed of multiple non - communicating micro - holes.

[0014] Further, the bump is slidably connected to the mounting plate, and a plurality of elastic members are connected between the bump and the mounting plate.

[0015] Further, a groove adapted to the bump is formed on the mounting plate, the bump is slidably connected in the groove, and the plurality of elastic members are evenly spaced in the groove.

[0016] A micro - microphone module includes a housing, a MIC component, the above - mentioned sealing structure, a connecting member, and a foam gasket; wherein, the housing includes a shell body and a plurality of blind holes arranged on the inner side of the shell body; the MIC component includes a MIC main body and a plurality of leads arranged on the MIC main body; the foam gasket is arranged on the bottom surface of the blind hole, the MIC main body is arranged in the blind hole, one side of the MIC main body is in contact with the foam gasket, the sealing structure is fixed on the upper side of the blind hole through the connecting member, and the bump of the sealing structure abuts against the vertical wall of the MIC main body, and the leads are led out through the wire holes of the sealing structure.

[0017] Further, threaded holes are formed on both sides of the shell body where the blind holes are located, the connecting member is a bolt, and the bolt passes through the through - hole of the sealing structure and is threadedly connected to the threaded hole to fix the sealing structure.

[0018] The beneficial effects of the utility model are as follows: The sealing structure is fastened to the housing by bolts, and each MIC component adopts a separate sealing structure, so that the bump of the sealing structure abuts against the vertical wall of the MIC component. When the bump applies pressure to the MIC component, the side of the MIC component in contact with the foam gasket squeezes the foam gasket, and the sealing structure can seal the side of the MIC component close to the foam gasket, that is, achieve the sealing effect on the front sound cavity of the MIC component. Therefore, by using the method of squeezing the separate sealing structure of the MIC component, the sealing effect of the MIC component can be ensured, and the sealing of the array MIC components can be made more consistent. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a three - dimensional structure diagram of the micro - microphone module of the present utility model.

[0020] Figure 2 It is a sectional three - dimensional structure diagram of the micro - microphone module of the present utility model.

[0021] Figure 3 This is an exploded three-dimensional structural schematic diagram of the micro microphone module of the present utility model.

[0022] Figure 4 This is the first three-dimensional structural schematic diagram of the sealing structure of the present utility model.

[0023] Figure 5 This is the second three-dimensional structural schematic diagram of the sealing structure of the present utility model.

[0024] The reference numerals in the drawings are: 1 - outer shell, 11 - housing, 12 - blind hole, 13 - threaded hole, 2 - sealing structure, 21 - mounting plate, 22 - extension plate, 23 - wire hole, 24 - through hole, 25 - convex block, 26 - groove, 27 - spring, 3 - bolt, 4 - MIC component, 41 - MIC main body, 42 - lead wire, 43 - vertical wall, 5 - foam gasket. Detailed implementation manners

[0025] For the convenience of understanding the present utility model, the present utility model will be described more comprehensively below with reference to the relevant drawings. Several embodiments of the present utility model are shown in the drawings. However, the present utility model can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present utility model more thorough and comprehensive.

[0026] It should be noted that when an element is referred to as being "fixedly provided on" another element, it can be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are only for the purpose of illustration.

[0027] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which the present utility model belongs. The terms used in the specification of the present utility model herein are only for the purpose of describing specific embodiments and are not intended to limit the present utility model. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0028] Please refer to Figure 4 , which is the first embodiment of the present utility model. This embodiment provides a sealing structure 2 for sealing the MIC component 4, including: a mounting plate 21, an extension plate 22, a wire hole 23, a wire hole 23 and a convex block 25.

[0029] Among them, the mounting plate 21 is circular, and two extension plates 22 extending along both sides of the mounting plate 21 are integrally formed with the mounting plate 21, and the two extension plates 22 are symmetrically arranged; the wire hole 23 provided on the mounting plate 21 penetrates the mounting plate 21 from top to bottom. In other embodiments, the wire hole 23 can be composed of a plurality of non-connected micropores, and the size of the micropores is adapted to the lead 42 of the MIC component 4 to facilitate the lead 42 of the MIC component 4 to pass through the micropores; through holes 24 are provided on both of the two extension plates 22, and the through holes 24 penetrate the extension plates 22 from top to bottom. The through holes 24 facilitate the installation of the sealing structure 2 on the housing 11 of the miniature microphone module. When installing the sealing structure 2, since the two extension plates 22 are symmetrically arranged, a balanced force effect can be achieved during installation; the convex block 25 fixedly connected to the mounting plate 21, the center of the convex block 25 coincides with the center of the mounting plate 21, and the convex block 25 abuts against the MIC component 4. In this embodiment, the convex block 25 is a continuous and closed annular convex block 25. In other embodiments, the convex block 25 can be composed of a plurality of discontinuous protrusions arranged in an annular array.

[0030] When using the sealing structure 2, the operator can align the through hole 24 of the sealing structure 2 with the threaded hole 13 of the housing 1, then pass the bolt 3 through the through hole 24 and screw it into the threaded hole 13, and use an electric screwdriver with precise torque control to screw in the bolt 3. At the same time, when installing the sealing structure 2, the lead 42 on the MIC component 4 in the blind hole 12 is led out through the wire hole 23. When installing the sealing structure 2, the convex block 25 of the sealing structure 2 applies pressure to the MIC component 4 and sinks the convex block 25 into the blind hole 12, which can achieve the positioning function, and the convex block 25 abuts against the vertical wall 43 of the MIC component 4. The vertical wall 43 of the MIC component 4 has good strength and the MIC component 4 is not easily damaged. When the convex block 25 applies pressure to the MIC component 4, the side of the MIC component 4 in contact with the foam gasket 5 squeezes the foam gasket 5. Thus, the sealing structure 2 can seal the side of the MIC component 4 close to the foam gasket 5, that is, achieve the sealing effect on the front sound cavity of the MIC component 4.

[0031] In summary, the sealing structure 2 is fastened to the housing 1 by bolts 3. Each MIC component 4 adopts a separate sealing structure 2, with the bump 25 of the sealing structure 2 abutted against the vertical wall 43 of the MIC component 4. When the bump 25 applies pressure to the MIC component 4, the side of the MIC component 4 in contact with the foam gasket 5 squeezes the foam gasket 5, and the sealing structure 2 can seal the side of the MIC component 4 close to the foam gasket 5, that is, achieve the sealing effect on the front sound cavity of the MIC component 4. Therefore, by using the method of squeezing the separate sealing structure 2 of the MIC component 4, the sealing effect of the MIC component 4 can be ensured, and the sealing of the array of MIC components 4 can be made more consistent.

[0032] Please refer to Figure 5 , which shows the sealing structure 2 of the second embodiment of the present invention. The difference between the sealing structure 2 of this embodiment and the sealing structure 2 in the first embodiment is that: the bump 25 is slidably connected to the mounting plate 21, and a plurality of elastic members are connected between the bump 25 and the mounting plate 21. The elastic members are springs 27; a groove 26 adapted to the bump 25 is provided on the mounting plate 21, and the bump 25 is slidably connected in the groove 26, and the plurality of elastic members are evenly spaced in the groove 26.

[0033] It can be understood that when the sealing structure 2 is installed on the housing 1, the bump 25 contacts the vertical wall 43 of the MIC component 4. When the extrusion force of the bump 25 on the vertical wall 43 of the MIC component 4 is too large, in order to protect the MIC component 4 well, the bump 25 will slide into the groove 26, and the spring 27 is compressed. Thus, the bump 25 can better squeeze the MIC component 4, and the effect of protecting the MIC component 4 can also be achieved.

[0034] Please refer to Figures 1 to 3 , which shows the third embodiment of the present invention. This embodiment provides a micro-microphone module, which includes: a housing 1, a MIC component 4, the sealing structure 2 described in the first embodiment or the second embodiment, a connecting member, and a foam gasket 5; wherein, the housing 1 includes a housing body 11 and a plurality of blind holes 12 provided inside the housing body 11, and the plurality of blind holes 12 are arranged in an array; the MIC component 4 includes a MIC main body 41 and a plurality of leads 42 provided on the MIC main body 41; the bottom surface of the blind hole 12 is provided with the foam gasket 5, the MIC main body 41 is arranged in the blind hole 12, and one side of the MIC main body 41 is in contact with the foam gasket 5. The sealing structure 2 is fixed above the blind hole 12 through the connecting member, and the bump 25 of the sealing structure 2 abuts against the vertical wall 43 of the MIC main body 41, and the lead 42 is led out through the wire hole 23 of the sealing structure 2.

[0035] Further, threaded holes 13 are formed on both sides of the housing 11 where the blind hole 12 is located. The connecting member is a bolt 3. The bolt 3 passes through the through hole 24 of the sealing structure 2 and is threadedly connected to the threaded hole 13 to fix the sealing structure 2.

[0036] In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0037] The above-described embodiments merely represent several implementation manners of the present invention. The description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the patent of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can still be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the appended claims.

Claims

1. A sealing structure for sealing an MIC component, characterized in that, Comprising: Mounting plate; Extension plates, two extension plates formed by extending along both sides of the mounting plate, the extension plates are integrally formed with the mounting plate, and the two extension plates are symmetrically arranged; Wire holes, the wire holes provided on the mounting plate, the wire holes penetrate the mounting plate from top to bottom; Through holes, through holes are provided on both of the extension plates, and the through holes penetrate the extension plates from top to bottom; Protrusions, protrusions are provided on the mounting plate, the center of the protrusion coincides with the center of the mounting plate, and the protrusion abuts against the MIC component.

2. The sealing structure according to claim 1, characterized in that, The protrusion is a continuous and closed annular protrusion.

3. The sealing structure according to claim 1, characterized in that, The protrusion is composed of multiple discontinuous protrusions arranged in an annular array.

4. The sealing structure according to claim 1, characterized in that, The wire hole is composed of multiple non-connected micro holes.

5. The sealing structure according to claim 1, characterized in that, The protrusion is slidably connected to the mounting plate, and a plurality of elastic members are connected between the protrusion and the mounting plate.

6. The sealing structure according to claim 5, characterized in that, A groove adapted to the protrusion is formed on the mounting plate, the protrusion is slidably connected in the groove, and a plurality of the elastic members are evenly spaced in the groove.

7. A miniature microphone module, characterized in that, Comprising a housing, a MIC component, the sealing structure according to any one of claims 1-6, a connecting member, and a foam gasket; wherein, the housing includes a shell body and a plurality of blind holes provided on the inner side of the shell body; the MIC component includes a MIC main body and a plurality of leads provided on the MIC main body; the bottom surface of the blind hole is provided with the foam gasket, the MIC main body is arranged in the blind hole, and one side of the MIC main body is in contact with the foam gasket, the sealing structure is fixed on the upper side of the blind hole through the connecting member, and the protrusion of the sealing structure abuts against the vertical wall of the MIC main body, and the lead is led out through the wire hole of the sealing structure.

8. The miniature microphone module according to claim 7, wherein Threaded holes are formed on both sides of the shell where the blind holes are located, the connecting member is a bolt, and the bolt passes through the through hole of the sealing structure and is threadedly connected to the threaded hole to fix the sealing structure.

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