FPC golden finger structure for preventing ACF golden ball short circuit
By setting pins of different thicknesses in the FPC gold finger structure, the problem of ACF gold ball crushing during LCD testing was solved, thus preventing short circuits.
Patent Information
- Application Number
- CN202422131791.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-30
- Publication Date
- 2025-08-01
- Estimated Expiration
- 2034-08-30
AI Technical Summary
During the testing of the LCD screen, the FPC board, after bonding, may compress the ACF gold balls, potentially causing the gold balls to break and resulting in a short circuit.
Design an FPC gold finger structure in which the thickness of the first binding pin is smaller than that of the second binding pin, increasing the distance between the first binding pin and the test point to prevent crushing.
This effectively prevents the ACF gold balls from breaking during the FPC board bonding process, thus preventing short circuits.
Smart Images
Figure CN223182385U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of display screens, in particular to an FPC gold finger structure for preventing short - circuit of ACF gold balls. Background Art
[0002] At present, liquid crystal display screens need to be tested before leaving the factory to determine whether there are problems with their performance. For some circular liquid crystal display screens, the test points are placed on the FPC binding positions on the glass substrate. However, after the FPC board is bound, the ACF gold balls in the test points will be squeezed, which may cause the ACF gold balls to break, and thus there is a risk of short - circuit. Summary of the Utility Model
[0003] The purpose of the utility model is to overcome the deficiencies in the prior art, and provide an FPC gold finger structure for preventing short - circuit of ACF gold balls, which can prevent the ACF gold balls from being squeezed and broken after the FPC board is bound, thus avoiding short - circuit.
[0004] The purpose of the utility model is realized by the following technical solutions:
[0005] In a first aspect of the present application, an FPC gold finger structure for preventing short - circuit of ACF gold balls is provided, including an FPC board; a pin assembly, the pin assembly includes a first binding pin and a second binding pin, the first binding pin and the second binding pin are respectively arranged on the FPC board, and the thickness of the first binding pin is less than the thickness of the second binding pin.
[0006] The thickness of the first binding pin is 70μm.
[0007] The thickness of the second binding pin is 80μm.
[0008] An insertion end is arranged on the FPC board.
[0009] It further includes a bending position, and the bending position is arranged on the FPC board.
[0010] A rounded - corner part is formed on the FPC board.
[0011] The pin assembly includes a plurality of the first binding pins, and each of the first binding pins is respectively arranged on the FPC board at intervals.
[0012] The pin assembly includes a plurality of the second binding pins, and each of the second binding pins is respectively arranged on the FPC board at intervals.
[0013] The first binding pin has a rectangular cross - section structure.
[0014] The second bonding pin has a rectangular cross-sectional structure.
[0015] Compared with the prior art, the present utility model has at least the following advantages:
[0016] The thickness of the first bonding pin of the present application is less than that of the second bonding pin, thereby increasing the distance between the first bonding pin and the test point, so as to avoid the first bonding pin crushing the ACF gold ball in the test point during the bonding process of the FPC board and prevent the occurrence of a short-circuit phenomenon. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for use in the embodiments will be briefly introduced below.
[0018] Figure 1 It is a schematic structural diagram of an FPC gold finger structure for preventing short circuit of ACF gold balls in an embodiment of the present utility model;
[0019] Figure 2 It is a schematic structural diagram of another embodiment of an FPC gold finger structure for preventing short circuit of ACF gold balls in an embodiment of the present utility model. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0020] The embodiments of the present application will be described in more detail with reference to the drawings. Although the embodiments of the present application are shown in the drawings, it should be understood that the present application can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided to make the present application more thorough and complete, and to fully convey the scope of the present application to those skilled in the art.
[0021] It should be understood that although the terms "first", "second", "third", etc. may be used in the present application to describe various information, these information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of the present application, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present application, "a plurality" means two or more, unless otherwise specifically defined.
[0022] Unless otherwise clearly defined and limited, terms such as "installation", "connection", "linkage", "fixation" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection or an integral one; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0023] Currently, liquid crystal displays need to be tested before leaving the factory to determine whether there are problems with their performance. For some circular liquid crystal displays, the test points are placed on the FPC binding positions on the glass substrate. However, when the FPC board is bound, it will squeeze the ACF gold balls inside the test points, which will cause the ACF gold balls to break, and thus there is a risk of short circuit.
[0024] In view of the above problems, the embodiment of the present application provides an FPC gold finger structure for preventing ACF gold ball short circuit, which can prevent the ACF gold balls from being squeezed and broken after the FPC board is bound, thus avoiding short circuit.
[0025] The technical solutions of the embodiments of the present application will be described in detail below with reference to the accompanying drawings.
[0026] See Figure 1 , an FPC gold finger structure for preventing ACF gold ball short circuit, including an FPC board 100 and a pin assembly 200. The pin assembly 200 includes a first binding pin 210 and a second binding pin 220. The first binding pin 210 and the second binding pin 220 are respectively arranged on the FPC board 100, and the thickness of the first binding pin 210 is less than the thickness of the second binding pin 220.
[0027] It should be noted that the thickness of the first binding pin 210 is less than the thickness of the second binding pin 220, thereby increasing the distance between the first binding pin 210 and the test point position, so as to avoid the first binding pin 210 crushing the ACF gold balls inside the test point position during the binding process of the FPC board 100 and prevent the occurrence of short circuit. Among them, the thickness of the first binding pin 210 is 70μm, the thickness of the second binding pin 220 is 80μm, the first binding pin 210 has a rectangular cross-sectional structure, and the second binding pin 220 has a rectangular cross-sectional structure.
[0028] See Figure 2 , in one embodiment, a plug-in end 110 is arranged on the FPC board 100.
[0029] It should be noted that the plug-in end 110 is used for plugging with the host end.
[0030] See Figure 2 , in one embodiment, the FPC gold finger structure for preventing short - circuit of ACF gold balls further includes a bending position 300, and the bending position 300 is arranged on the FPC board 100. Specifically, a rounded - corner portion 120 is formed on the FPC board 100.
[0031] It should be noted that the bending position 300 is the position where the FPC board 100 is bent, and the setting of the rounded - corner portion 120 can make the corners of the FPC board 100 smoother.
[0032] See Figure 1 , in one embodiment, the pin assembly 200 includes a plurality of first bonding pin feet 210, and each first bonding pin foot 210 is respectively arranged on the FPC board 100 at intervals. Specifically, the pin assembly 200 includes a plurality of second bonding pin feet 220, and each second bonding pin foot 220 is respectively arranged on the FPC board 100 at intervals.
[0033] It should be noted that the number of the first bonding pin feet 210 and the second bonding pin feet 220 is determined according to the number of bonding positions on the glass substrate.
[0034] The solutions of the present application have been described in detail with reference to the accompanying drawings above. In the above - mentioned embodiments, the descriptions of each embodiment have their own emphases. For the parts not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments. Those skilled in the art should also know that the actions and modules involved in the specification are not necessarily essential to the present application. In addition, it can be understood that the steps in the method embodiments of the present application can be adjusted, combined and deleted according to actual needs, and the modules in the device embodiments of the present application can be combined, divided and deleted according to actual needs.
[0035] The above - mentioned embodiments of the present application have been described. The above description is exemplary and not exhaustive, and is not limited to the disclosed embodiments. Many modifications and changes are obvious to those of ordinary skill in the art in the technical field without departing from the scope and spirit of the described embodiments. The choice of terms used herein is intended to best explain the principles of the embodiments, practical applications or improvements to the technologies in the market, or to enable other ordinary skilled persons in the technical field to understand the disclosed embodiments.
Claims
1. An FPC gold finger structure for preventing ACF gold ball short circuit, characterized in that, Including: FPC board; A pin component, the pin component includes a first bonding pin and a second bonding pin, the first bonding pin and the second bonding pin are respectively arranged on the FPC board, and the thickness of the first bonding pin is less than the thickness of the second bonding pin.
2. The FPC gold finger structure for preventing ACF gold ball short circuit according to claim 1, wherein, The thickness of the first bonding pin is 70μm.
3. The FPC gold finger structure for preventing ACF gold ball short circuit according to claim 2, wherein The thickness of the second bonding pin is 80μm.
4. The FPC gold finger structure for preventing ACF gold ball short circuit according to claim 1, wherein A plug-in end is arranged on the FPC board.
5. The FPC gold finger structure for preventing ACF gold ball short circuit according to claim 1, wherein, It further includes a bending position, and the bending position is arranged on the FPC board.
6. The FPC gold finger structure for preventing ACF gold ball short circuit according to claim 1, wherein, A rounded corner part is formed on the FPC board.
7. The FPC gold finger structure for preventing ACF gold ball short circuit according to claim 1, characterized in that, The pin component includes a plurality of the first bonding pins, and each of the first bonding pins is respectively arranged on the FPC board at intervals.
8. The FPC gold finger structure for preventing ACF gold ball short circuit according to claim 1, characterized in that, The pin component includes a plurality of the second bonding pins, and each of the second bonding pins is respectively arranged on the FPC board at intervals.
9. The FPC gold finger structure for preventing ACF gold ball short circuit according to claim 1, characterized in that, The first bonding pin has a rectangular cross-sectional structure.
10. The FPC gold finger structure for preventing ACF gold ball short circuit according to claim 1, characterized in that, The second bonding pin has a rectangular cross-sectional structure.