Board splitting jig for SMT (surface mount technology) ceramic substrate

Abstract

A board splitting jig used for an SMT ceramic substrate is provided with a body, the body is provided with a board splitting end used for splitting boards and a detection end used for detecting the product quality after board splitting, the detection end and the board splitting end are integrally connected, the middle of the board splitting end and the middle of the detection end are each provided with a through containing groove, and the board splitting end and the detection end are integrally connected. An opening of the containing groove is located in the upper surface of the body. The accommodating groove located in the board splitting part is defined as a board splitting groove, and the accommodating groove located in the detection end is defined as a detection groove; the top edge of the board dividing groove serves as an abutting edge abutting against a V-cut line, and the top edge of the detection groove serves as a detection line. Through the board splitting end in the board splitting jig for the SMT ceramic substrate, the stability of board splitting quality can be improved, and the labor intensity of board splitting operation can be reduced; and the split products can be inspected through the detection end.

Description

Technical Field

[0001] The utility model relates to the technical field of SMT panel splicing, in particular to a panel splitting fixture for an SMT ceramic substrate. Background Art

[0002] SMT panel splicing refers to the process of splicing multiple individual PCBs into an integral board during SMT production, such as Figure 1 and Figure 2 , to improve production efficiency, reduce costs, optimize logistics and storage, etc., such as a half-hole PCB panel splicing disclosed in Chinese Patent Publication No. CN210899800U. And the SMT panel needs to be split in subsequent processes to separate the SMT panel into individual PCB products. Currently, the splitting methods include automatic splitting and manual splitting. Automatic splitting requires complex equipment and thus has a high cost; while manual splitting is specifically carried out by holding both sides of the SMT panel with both hands and applying force along the V-cut line of the SMT panel. Manual splitting has a low cost. However, since the holding positions, forces, and directions of application of force of different operators will vary, the splitting quality varies from person to person, resulting in unstable splitting quality, and long-term operation causes hand injuries to the operators and the efficiency will also become lower and lower.

[0003] Therefore, in view of the deficiencies of the prior art, it is very necessary to provide a panel splitting fixture for an SMT ceramic substrate to solve the deficiencies of the prior art. Summary of the Utility Model

[0004] The purpose of the utility model is to avoid the deficiencies of the prior art and provide a panel splitting fixture for an SMT ceramic substrate. The panel splitting fixture for an SMT ceramic substrate can reduce the operation intensity and improve the stability of the splitting quality.

[0005] The above object of the utility model is achieved by the following technical measures:

[0006] Provide a panel splitting fixture for an SMT ceramic substrate, which is provided with a body. The body is provided with a splitting end for splitting the panel and a detection end for detecting the quality of the product after splitting. The detection end and the splitting end are integrally connected. A through accommodation groove is provided in the middle of the splitting end and the middle of the detection end. The opening of the accommodation groove is located on the upper surface of the body.

[0007] Define the accommodation groove inside the splitting part as the splitting groove, and define the accommodation groove inside the detection end as the detection groove.

[0008] The top edge of the splitting groove serves as an abutting edge for abutting against the V-cut line, and the top edge of the detection groove serves as the detection line.

[0009] The standard height of the product after depaneling is defined as A, the height of the inspection groove is defined as B, and the height of the depaneling groove is defined as C. B>C, 0.98A≥C≥0.85A, C1.05A≥B>1.00A.

[0010] Further, 0.95A≥C≥0.90A, 1.02A≥B≥1.01A.

[0011] Preferably, a through protective groove for accommodating product functional components is further provided in the middle of the above-mentioned split board end and the middle of the detection end, and the opening of the protective groove is located on the side wall of the accommodating groove.

[0012] Preferably, the main body is provided with a first opening for moving the product, the first opening passes through the split board end and extends to the detection end, and the first opening is parallel to the accommodating groove.

[0013] Preferably, the body is provided with a second opening for moving the product, the second opening passes through the detection end and extends to the plate separation end, and the second opening is parallel to the accommodating groove.

[0014] Preferably, the first opening is located on one side of the body, and the second opening is located on the other side of the body.

[0015] Preferably, the above-mentioned plate splitting end is further provided with a plate splitting blade portion, the plate splitting blade portion is integrally connected to an upper edge of one side of the plate splitting groove, and the plate splitting blade portion extends to the other side of the plate splitting groove.

[0016] Preferably, the front end of the above-mentioned board separation end is provided with an inlet for vertical entry of the SMT ceramic substrate to be separated, and the inlet is the upper opening of the board separation groove; and the width of the upper opening is greater than the width of the SMT ceramic substrate to be separated.

[0017] The utility model discloses a panel separation jig for SMT ceramic substrates, which is provided with a main body, wherein the main body is provided with a panel separation end for performing panel separation and a detection end for detecting the quality of the product after panel separation. The detection end and the panel separation end are integrally connected, and a through receiving groove is provided in the middle of the panel separation end and the middle of the detection end. The opening of the receiving groove is located on the upper surface of the main body; the receiving groove located inside the panel separation part is defined as the panel separation groove, and the receiving groove located inside the detection end is defined as the detection groove; the top edge of the panel separation groove serves as an abutting edge abutting against the V-cut line, and the top edge of the detection groove serves as a detection line. By using the panel separation end in the panel separation jig for SMT ceramic substrates, the stability of panel separation quality can be improved, and the labor intensity of panel separation operation can be reduced; the product after panel separation can be inspected by using the detection end. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The present utility model will be further described with reference to the accompanying drawings, but the content in the drawings shall not constitute any limitation to the present utility model.

[0019] Figure 1 It is a structural diagram of an SMT ceramic substrate.

[0020] Figure 2 It is Figure 1 a schematic diagram of another angle of

[0021] Figure 3 It is a three-dimensional schematic diagram of a board-splitting fixture.

[0022] Figure 4 It is Figure 3 a perspective view of

[0023] Figure 5 It is Figure 3 a left view of

[0024] Figure 6 It is Figure 3 a right view of

[0025] Figure 7 It is a height schematic diagram of the board-splitting groove and the detection groove of the board-splitting fixture.

[0026] Figure 8 It is Figure 3 a schematic diagram when

[0027] Figure 9 It is a three-dimensional schematic diagram of the board-splitting fixture of Embodiment 2.

[0028] Figure 10 It is a three-dimensional schematic diagram of the board-splitting fixture of Embodiment 2.

[0029] Figure 11 It is Figure 10 a sectional view in the direction of "A-A" in

[0030] Figure 12 1]It is Figure 10 a sectional view in the direction of "B-B" in

[0031] [[ID=[]66]] Figure 13 It is Figure 10 a sectional view in the direction of "C-C" in

[0032] In Figures 1 to 13 it includes:

[0033] a main body 10,

[0034] a board-splitting end 100, a board-splitting edge part 110, a feeding port 120,

[0035] Detection end 200, receiving groove 300, protection groove 400, first opening 500, second opening 600,

[0036] SMT ceramic substrate 700, V-cut line 710, functional device 720. Specific implementation mode

[0037] The technical solution of the present utility model will be further described in conjunction with the following embodiments.

[0038] Embodiment 1

[0039] A board-splitting fixture for an SMT ceramic substrate, as Figures 3 to 6 shown, is provided with a body 10. The body 10 is provided with a board-splitting end 100 for board splitting and a detection end 200 for detecting the product quality after board splitting. The detection end 200 and the board-splitting end 100 are integrally connected. A through receiving groove 300 is provided in the middle of the board-splitting end 100 and the middle of the detection end 200. The opening of the receiving groove 300 is located on the upper surface of the body 10.

[0040] The receiving groove 300 located inside the board-splitting part is defined as a board-splitting groove, and the receiving groove 300 located inside the detection end 200 is defined as a detection groove. The top edge of the board-splitting groove serves as an abutting edge for abutting against the V-cut line 710, and the top edge of the detection groove serves as a detection line.

[0041] The standard height of the product after board splitting is defined as A, the height of the detection groove is defined as B, and the height of the board-splitting groove is defined as C. There is B > C, 0.98A ≥ C ≥ 0.85A, 1.05A > B ≥ 1.00A. Further, 0.95A ≥ C ≥ 0.90A, 1.02A ≥ B ≥ 1.01A, as Figure 7 .

[0042] It should be noted that the sizes of C and B are specifically determined according to the size of the SMT ceramic substrate 700 and the requirements for board-splitting quality. Taking a product with a board-splitting height of 15 mm as an example, the requirement for board-splitting burrs of this product is less than or equal to 0.15 mm, the height of the board-splitting groove is 14 mm, and the height of the detection groove is 15.15 mm, because it can be judged that the board-splitting burr exceeds the standard only when the product is higher than the height of the detection groove.

[0043] A through protection groove 400 for accommodating the functional device 720 of the product is further provided in the middle of the board-splitting end 100 and the middle of the detection end 200. The opening of the protection groove 400 is located on the side wall of the receiving groove 300.

[0044] It should be noted that since the functional device 720 of the product is mainly an electronic component and is not likely to be stressed, these functional devices 720 can be well protected through the protection groove 400.

[0045] The method of using the present invention is to place the SMT ceramic substrate 700 into the board separation groove from one side of the board separation end 100, then hold the outside of the SMT ceramic substrate 700 with both hands and gently apply force to the top edge of the board separation groove. Figure 8 The abutting edge presses against the V-CUT line 710, concentrating the applied force there. Based on the principle of leverage, only minimal force is required to separate the product, reducing labor intensity. Furthermore, the height of the depaneling slot is fixed, ensuring consistent depaneling quality regardless of operator. After depaneling, the product is pushed into the inspection slot by the SMT ceramic substrate 700, where it undergoes depaneling burr inspection and is finally ejected from the side of the inspection end 200.

[0046] The depaneling end 100 in the depaneling jig for SMT ceramic substrates can improve the stability of depaneling quality and reduce the labor intensity of depaneling operation; the depaneled product can be inspected through the inspection end 200.

[0047] Example 2

[0048] A depaneling fixture for SMT ceramic substrates, such as Figures 9 to 13 Other features are the same as those of Example 1, with the following additional technical features: The main body 10 is provided with a first opening 500 for moving the product. The first opening 500 extends through the panel separation end 100 and to the detection end 200, and is parallel to the receiving groove 300. The main body 10 is provided with a second opening 600 for moving the product. The second opening 600 extends through the detection end 200 and to the panel separation end 100, and is parallel to the receiving groove 300. The first opening 500 is located on one side of the main body 10, and the second opening 600 is located on the other side of the main body 10.

[0049] It should be noted that when the SMT ceramic substrate 700, the product after depaneling or the waste card cannot be pushed out in the receiving groove 300, a thin hard strip can be inserted from the first opening 500 or the second opening 600 to pull out the SMT ceramic substrate 700, the product after depaneling or the waste card.

[0050] The splitting end 100 is further provided with a splitting blade 110 . The splitting blade 110 is integrally connected to an upper edge of one side of the splitting groove and extends to the other side of the splitting groove.

[0051] It should be noted that the function of the separating blade 110 of this embodiment is to further reduce the force acting to separate the SMT ceramic substrate 700 .

[0052] At the front end of the board-splitting end 100, there is a feeding port 120 for the SMT ceramic substrate 700 to be board-split to vertically enter. The feeding port 120 is an open upper part above the board-splitting groove; and the width of the open upper part is greater than the width of the SMT ceramic substrate 700 to be board-split.

[0053] It should be noted that the board-splitting jig of this embodiment can directly enter the board-splitting groove from the feeding port 120, providing convenience for operation.

[0054] Compared with Embodiment 1, this embodiment can further improve the operation convenience of the board-splitting jig.

[0055] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention rather than to limit the protection scope of the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present invention can be modified or equivalently replaced without departing from the essence and scope of the technical solutions of the present invention.

Claims

1. A board splitting fixture for SMT ceramic substrates, characterized in that: A main body is provided, wherein the main body is provided with a panel separation end for separating panels and a detection end for detecting the quality of products after panel separation, the detection end and the panel separation end are integrally connected, and a through receiving groove is provided in the middle of the panel separation end and the middle of the detection end, and the opening of the receiving groove is located on the upper surface of the main body; The receiving groove located inside the panel separation portion is defined as a panel separation groove, and the receiving groove located inside the detection end is defined as a detection groove; The top edge of the panel separation groove serves as an abutting edge abutting against the V-cut line, and the top edge of the detection groove serves as a detection line.

2. The board-splitting fixture for SMT ceramic substrates according to claim 1, wherein: The standard height of the product after depaneling is defined as A, the height of the inspection groove is defined as B, and the height of the depaneling groove is defined as C. B>C, 0.98A≥C≥0.85A, and 1.05A≥B>1.00A.

3. The board cutting fixture for SMT ceramic substrate according to claim 2, wherein: 0.95A≥C≥0.90A, 1.02A≥B≥1.01A.

4. The board-splitting fixture for SMT ceramic substrates according to claim 1, wherein: A through protection groove for accommodating product functional components is further provided in the middle of the board splitting end and the middle of the detection end, and the opening of the protection groove is located on the side wall of the accommodating groove.

5. The board cutting fixture for SMT ceramic substrate according to claim 1, characterized in that: The main body is provided with a first opening for moving the product, the first opening passes through the plate separation end and extends to the detection end, and the first opening is parallel to the accommodating groove.

6. The board-splitting fixture for SMT ceramic substrates according to claim 5, wherein: The body is provided with a second opening for moving the product, the second opening passes through the detection end and extends to the board separation end, and the second opening is parallel to the accommodating groove.

7. The board cutting fixture for SMT ceramic substrate according to claim 6, characterized in that: The first opening is located on one side of the body, and the second opening is located on the other side of the body.

8. The board splitting fixture for SMT ceramic substrate according to any one of claims 1 to 7, characterized in that: The plate splitting end is further provided with a plate splitting blade portion, which is integrally connected to an upper edge of one side of the plate splitting groove and extends to the other side of the plate splitting groove.

9. The dicing jig for SMT ceramic substrate according to any one of claims 1 to 7, characterized in that: The front end of the board separation end is provided with an inlet for vertical entry of the SMT ceramic substrate to be separated. The inlet is the upper opening of the board separation groove; and the width of the upper opening is greater than the width of the SMT ceramic substrate to be separated.

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