Heating module applied to panel manufacturing process and PEB manufacturing process conveying type equipment

By setting the partition temperature zone in the heating module and using a combination of a thermostat and infrared heating tube, the problem of uneven heating is solved, and uniform heating and efficient production of the panel and PCB board are achieved.

CN223182405UActive Publication Date: 2025-08-01ZHISHENG SCI & TECH GUANGZHOU
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Patent Information

Application Number
CN202421733389.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-07-19
Publication Date
2025-08-01
Estimated Expiration
2034-07-19

AI Technical Summary

Technical Problem

The existing heating methods have uneven heating distribution in the panel process and PEB process, resulting in a decrease in the yield rate of display panels or PCB boards.

Method used

The heating module adopts a partitioned design, including the first hot plate and the second hot plate, is equipped with a continuous vertical and horizontal temperature zone, and is equipped with a thermostat, a temperature sensor and an infrared heating tube. The operating state of the infrared heating tube is adjusted through the temperature sensor to realize partitioned heating.

Benefits of technology

It realizes uniform heating of panels and PCB boards, improves yield, and improves heating efficiency and equipment production capacity through contactless infrared heating.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a heating module applied to panel manufacturing process and PEB manufacturing process conveying type equipment, relates to the field of panel manufacturing process and PEB manufacturing process conveying type heating equipment, and solves the technical problem that the yield of display panels or PCBs (Printed Circuit Boards) is easily reduced when the display panels or PCBs are produced due to non-uniform heating distribution in the conventional heating mode. The hot plate comprises a first hot plate body and a second hot plate body, the first hot plate body is provided with a plurality of first temperature areas which are continuously and vertically divided, the second hot plate body is provided with a plurality of second temperature areas which are continuously and horizontally divided, and a plurality of heating induction modules are installed in the first temperature areas and the second temperature areas. According to the utility model, the hot plate heating is adjusted in a partitioned manner, so that the uniform heating of the PCB is realized, and the process requirements of the PCB are met.
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Description

Technical Field

[0001] The utility model relates to the field of conveyor heating equipment for panel manufacturing process and PEB manufacturing process. More specifically, it relates to a heating module applied to conveyor equipment for panel manufacturing process and PEB manufacturing process. Background Art

[0002] The heating methods in PCB processing mainly include steam heating, superheated water heating, hot oil heating, hot air reflow soldering, infrared reflow soldering, and laser reflow soldering.

[0003] Steam heating directly sends steam from a steam boiler into a laminator and uses the pressure and temperature of the steam for heating. This method has a simple equipment structure and low investment, but the temperature difference fluctuates greatly.

[0004] Superheated water heating involves using a steam boiler to heat a superheated water storage tank, and then pumping the superheated water into the hot pressing plate of the laminator through a pump to achieve heating. This method is energy-saving and has a small temperature difference fluctuation.

[0005] Hot oil heating is similar to superheated water heating, but uses a hot oil boiler for heat supply and maintains the temperature of the hot pressing plate stable through hot oil circulation, with better temperature difference control.

[0006] Infrared reflow soldering uses infrared radiation to transfer heat, with the characteristics of rapid heating and high energy utilization rate, but the temperature distribution may be uneven due to the shape and material of components.

[0007] Laser reflow soldering is a new heating method that uses a high-energy laser beam for precise positioning heating, suitable for micro-components and high-density welding scenarios, with the advantages of rapid and precise heating.

[0008] The area of existing industrial panel displays is getting larger and larger, so the area of display panels and PCB boards is also getting larger and larger. However, the current heating methods have uneven heating distribution, which easily reduces the yield rate of display panels or PCB boards during production. Content of the Utility Model

[0009] The technical problem to be solved by the utility model is to provide a heating module applied to conveyor equipment for panel manufacturing process and PEB manufacturing process to solve the technical problem that the uneven heating distribution of the existing heating methods easily reduces the yield rate of display panels or PCB boards during production.

[0010] A heating module applied to conveyor equipment for panel manufacturing process and PEB manufacturing process according to the utility model includes a first hot plate and a second hot plate. A plurality of continuously vertically divided first temperature zones are provided on the first hot plate, and a plurality of continuously horizontally divided second temperature zones are provided on the second hot plate. A plurality of heating induction modules are installed in both the first temperature zones and the second temperature zones.

[0011] For further improvement, the heating induction module includes a thermostat, a temperature sensor and an infrared heating tube, and both the temperature sensor and the infrared heating tube are electrically connected to the thermostat.

[0012] Furthermore, the infrared heating tube includes an effective heating area and an ineffective heating area.

[0013] Even further, the first temperature zone includes a first sub-zone, a second sub-zone and a third sub-zone, and a plurality of infrared heating tubes extending from one side to the other side of the sub-zone are installed in each of the first sub-zone, the second sub-zone and the third sub-zone.

[0014] Even further, the second temperature zone includes a fourth sub-zone, a fifth sub-zone and a sixth sub-zone. Infrared heating tubes extending into the fifth sub-zone from within their regions are installed in the fourth sub-zone and the sixth sub-zone, and a plurality of infrared heating tubes extending from one side to the other side of their regions are also installed in the fourth sub-zone and the sixth sub-zone.

[0015] Even further, both the first hot plate and the second hot plate are fixedly installed on a fixing plate, and a plurality of handles are provided on the side surface of the fixing plate.

[0016] Even further, a plurality of gaskets are provided at the bottom of the fixing plate. A plurality of threaded holes are provided on the gaskets, and the gaskets are installed on the tabletop by bolts screwed into the threaded holes.

[0017] Beneficial Effects

[0018] The advantages of the present utility model are as follows:

[0019] 1. By providing the first hot plate and the second hot plate, a plurality of continuously vertically divided first temperature zones are provided on the first hot plate, a plurality of continuously horizontally divided second temperature zones are provided on the second hot plate, a thermostat, a temperature sensor and an infrared heating tube are installed in the first hot plate and the second hot plate. The temperature signal of the hot plate is collected by the temperature sensor and input into the thermostat, and the infrared heating tube heats the hot plate, realizing zoned adjustment of the hot plate heating, achieving uniform heating of the PCB board, meeting the heating requirements of different panels, and meeting its process requirements.

[0020] 2. The non-contact infrared heating tube heating adopted by the present utility model can achieve the purpose of rapid temperature rise and increase the production capacity of the equipment. Description of the Drawings

[0021] Figure 1 is a schematic diagram of the overall structure of the heating module of the present utility model;

[0022] Figure 2 is a side view of the overall structure of the heating module of the present utility model;

[0023] Figure 3 Perspective view of the first hot plate and the second hot plate of the present utility model;

[0024] Figure 4 Partition diagram of the first temperature zone, the second temperature zone and the corresponding sub - zones of the present utility model.

[0025] Wherein: 1 - first hot plate, 2 - second hot plate, 3 - first temperature zone, 31 - first sub - zone, 32 - second sub - zone, 33 - third sub - zone, 4 - infrared heating tube, 5 - effective heating area, 6 - ineffective heating area, 7 - fixing plate, 8 - handle, 9 - gasket, 10 - second temperature zone, 11 - fourth sub - zone, 12 - fifth sub - zone, 13 - sixth sub - zone. Specific embodiments

[0026] The following is a further description of the present utility model in combination with embodiments, but it does not constitute any limitation to the present utility model. Any limited modifications made by anyone within the scope of the claims of the present utility model are still within the scope of the claims of the present utility model.

[0027] Refer to Figures 1-4 , a heating module of the present utility model applied to a conveying device for panel manufacturing process and PEB process, which includes a first hot plate 1 and a second hot plate 2. A plurality of continuously vertically divided first temperature zones 3 are provided on the first hot plate 1, and a plurality of continuously horizontally divided second temperature zones 10 are provided on the second hot plate 2. A plurality of heating induction modules are installed in both the first temperature zone 3 and the second temperature zone 10. The first hot plate 1 is close to the feeding side of the PCB conveyor belt, and the second hot plate 2 is close to the discharging side of the PCB conveyor belt. Both the first hot plate 1 and the second hot plate 2 are used to heat the PCB board or the display panel.

[0028] The heating induction module includes a thermostat, a temperature sensor and an infrared heating tube 4. Both the temperature sensor and the infrared heating tube 4 are electrically connected to the thermostat. The infrared heating tube 4 is used to heat the temperature zone 3. The temperature sensor is used to collect the temperature value signal of the temperature zone 3 and input the temperature value signal into the thermostat. The thermostat operates the infrared heating tube 4 according to the temperature value signal. When the temperature value collected by the temperature sensor is lower than the set temperature value, the thermostat makes the infrared heating tube 4 in the working state. When the temperature collected by the temperature sensor is higher than the set temperature, the thermostat makes the infrared heating tube 4 stop working.

[0029] As Figure 3 shown, the infrared heating tube 4 includes a number of effective heating areas 5 or ineffective heating areas 6. The effective heating areas 5 heat the temperature zone.

[0030] As Figure 4As shown, the first temperature zone 3 includes a first sub-zone 31, a second sub-zone 32 and a third sub-zone 33. A plurality of infrared heating tubes 4 extending from one side to the other side of the sub-zone are installed in each of the first sub-zone 31, the second sub-zone 32 and the third sub-zone 33. By installing a plurality of infrared heating tubes 4 in the sub-zone, when one of the infrared heating tubes 4 in the sub-zone fails, the other infrared heating tubes 4 in the sub-zone can continue to heat, thus improving the working efficiency during a failure.

[0031] The second temperature zone 10 includes a fourth sub-zone 11, a fifth sub-zone 12 and a sixth sub-zone 13. Infrared heating tubes 4 extending into the fifth sub-zone 12 from within their regions are also installed in the fourth sub-zone 11 and the sixth sub-zone 13, and a plurality of infrared heating tubes 4 extending from one side to the other side of their regions are also installed in the fourth sub-zone 11 and the sixth sub-zone 13. By installing a plurality of infrared heating tubes 4 on both sides of the fourth sub-zone 11 and the sixth sub-zone 13, the temperatures of the fourth sub-zone 11 and the sixth sub-zone 13 can be ensured, preventing the temperature from dropping due to heat dissipation.

[0032] By dividing different temperature zones to meet the heating requirements of different panels, the heating flexibility is improved. The lengths of each temperature zone are different, thus meeting the heating requirements of different panels.

[0033] The first hot plate 1 and the second hot plate 2 are fixedly installed on the fixing plate 7, and a plurality of handles 8 are provided on the side surface of the fixing plate 7. The handles 8 facilitate people to lift the fixing plate 7.

[0034] A plurality of gaskets 9 are provided at the bottom of the fixing plate 7. The gaskets 9 are provided with a plurality of threaded holes, and the gaskets 9 are installed on the tabletop by bolts screwed into the threaded holes. The fixing of the first hot plate 1 and the second hot plate 2 is realized.

[0035] The working principle of the present utility model is:

[0036] When it is necessary to heat a PCB board or a display panel, turn on the power of the temperature controller and the infrared heating tubes 4. When the PCB board or the display panel is located on the first hot plate 1 and the second hot plate 2, the temperature sensor inputs the temperature value signal into the temperature controller. The temperature controller operates the infrared heating tubes 4 according to the temperature value signal. When the temperature value collected by the temperature sensor is lower than the set temperature value, the temperature controller makes the infrared heating tubes 4 in the working state. When the temperature collected by the temperature sensor is higher than the set temperature value, the temperature controller makes the infrared heating tubes 4 stop working.

[0037] The above are only the preferred embodiments of the present utility model. It should be pointed out that for those skilled in the art, without departing from the structure of the present utility model, several deformations and improvements can still be made, and these will not affect the implementation effect of the present utility model and the practicality of the patent.

Claims

1. A heating module applied to a conveying device in a panel manufacturing process and a PEB manufacturing process, characterized in that, It includes a first hot plate (1) and a second hot plate (2). A plurality of continuously vertically divided first temperature zones (3) are provided on the first hot plate (1), and a plurality of continuously horizontally divided second temperature zones (3) are provided on the second hot plate (2). A plurality of heating induction modules are installed in both the first temperature zones (3) and the second temperature zones (10).

2. The heating module for a conveying device applied to a panel manufacturing process and a PEB manufacturing process according to claim 1, characterized in that, The heating induction module includes a thermostat, a temperature sensor, and an infrared heating tube (4). Both the temperature sensor and the infrared heating tube (4) are electrically connected to the thermostat.

3. The heating module for a conveying device applied to a panel manufacturing process and a PEB manufacturing process according to claim 2, wherein, The infrared heating tube (4) includes an effective heating zone (5) and an ineffective heating zone (6).

4. The heating module applied to the conveying equipment in the panel manufacturing process and the PEB manufacturing process according to claim 2, characterized in that, The first temperature zone (3) includes a first sub-zone (31), a second sub-zone (32), and a third sub-zone (33). A plurality of infrared heating tubes (4) extending from one side of the sub-zone to the other side are installed in each of the first sub-zone (31), the second sub-zone (32), and the third sub-zone (33).

5. The heating module for a conveying device applied to a panel manufacturing process and a PEB manufacturing process according to claim 2, wherein, The second temperature zone (10) includes a fourth sub-zone (11), a fifth sub-zone (12), and a sixth sub-zone (13). Infrared heating tubes (4) extending into the fifth sub-zone (12) from within their regions are installed in the fourth sub-zone (11) and the sixth sub-zone (13), and a plurality of infrared heating tubes (4) extending from one side of their regions to the other side are also installed in the fourth sub-zone (11) and the sixth sub-zone (13).

6. The heating module applied to the conveying equipment for panel manufacturing process and PEB process according to claim 1, characterized in that, Both the first hot plate (1) and the second hot plate (2) are fixedly installed on a fixing plate (7), and a plurality of handles (8) are provided on the side surface of the fixing plate (7).

7. The heating module for a conveying device applied to a panel manufacturing process and a PEB manufacturing process according to claim 6, wherein, A plurality of gaskets (9) are provided at the bottom of the fixing plate (7). A plurality of threaded holes are provided on the gaskets (9), and the gaskets (9) are installed on the tabletop by bolts screwed into the threaded holes.