Heat conduction structure and electronic equipment

Abstract

The utility model provides a heat conduction structure and electronic equipment. The length of the heat conduction structure is adjustable, the heat conduction structure comprises a first heat dissipation piece and a second heat dissipation piece, the first heat dissipation piece comprises a first heat dissipation plate and a first heat conduction plate connected with the first heat dissipation plate, and the second heat dissipation piece comprises a second heat dissipation plate and a second heat conduction plate connected with the second heat dissipation plate. The first heat conduction plate and the second heat conduction plate extend oppositely and can move relatively, and the first heat conduction plate and the second heat conduction plate are in heat transfer connection. According to the heat conduction structure, the adaptability of the heat conduction structure can be improved, the heat dissipation requirements of devices with different heights are met, and the heat dissipation cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation of heating devices, and more specifically, to a heat conduction structure and an electronic device. Background Art

[0002] Inside an inverter / power device, there are various electronic components, such as a PCB board, an IGBT module, capacitors, resistors, inductors, reactances, etc. To ensure the reliable operation of these components, they need to have certain waterproof and dustproof performance. Therefore, most components are placed in a sealed cavity, which is called an electronic cavity. Since these components themselves have impedance, they will generate heat due to the loss caused by the passing current during operation. To avoid the accumulation of heat in the device, it is necessary to dissipate the heat of these components so that the temperature of the components is within the allowable range.

[0003] The existing heat dissipation methods for electronic cavities mainly include natural conduction and radiation heat dissipation, or adding a turbulent flow fan inside to enhance heat dissipation. In addition, an air-air heat exchanger can also be used for indirect heat exchange with the external ambient temperature. However, during the actual operation process, the situation of high temperature of local components is often obvious. For example, if the heat dissipation of the entire cavity is increased due to the over-temperature of a single component, it is necessary to design a corresponding heat dissipation structure according to the structure of the single component, or adjust the layout of other components inside the electronic cavity to make room, which results in a high design cost and poor adaptability. Summary of the Utility Model

[0004] The main purpose of the utility model is to provide a heat conduction structure and an electronic device, which can improve the adaptability of the heat conduction structure, meet the heat dissipation requirements of components with different heights, and reduce the heat dissipation cost.

[0005] To achieve the above purpose, according to one aspect of the utility model, a heat conduction structure is provided. The length of the heat conduction structure is adjustable. One end of the heat conduction structure is connected to a heating module, and the other end is connected to a housing. The heat conduction structure can adapt to the distance between the heating module and the housing. The heat generated by the heating module is transferred to the housing through the heat conduction structure and dissipated by the housing.

[0006] Furthermore, the heat conduction structure includes a first heat dissipation member and a second heat dissipation member. The first heat dissipation member includes a first heat dissipation plate and a first heat conduction plate connected to the first heat dissipation plate. The second heat dissipation member includes a second heat dissipation plate and a second heat conduction plate connected to the second heat dissipation plate. The first heat conduction plate and the second heat conduction plate extend towards each other and can move relative to each other. The first heat conduction plate and the second heat conduction plate are thermally connected to each other.

[0007] Furthermore, the first heat conduction plate and the second heat conduction plate are in sliding contact and cooperation;

[0008] Alternatively, the first heat conduction plate and the second heat conduction plate are connected by a flexible heat conduction member;

[0009] Alternatively, the gap between the first heat conducting plate and the second heat conducting plate is filled with a flexible heat conducting material or a heat conducting insulating material.

[0010] Furthermore, at least one of the first heat conducting plate and the second heat conducting plate is a cylindrical structure, the first heat conducting plate is sleeved with the second heat conducting plate, and the outer surface of the first heat conducting plate is in contact fit with the inner surface of the second heat conducting plate.

[0011] Furthermore, the heat conducting structure further includes a telescopic member, and the telescopic member is supported and arranged between the first heat dissipation plate of the first heat dissipation member and the second heat dissipation plate of the second heat dissipation member.

[0012] Furthermore, the telescopic member is an elastic member; or, the telescopic member is a telescopic sleeve;

[0013] And / or, the space between the first heat dissipation plate and the second heat dissipation plate in the heat conducting structure is filled with a heat conducting insulating material;

[0014] And / or, the surface of the heat conducting structure is coated with a heat conducting insulating layer.

[0015] Furthermore, the heat conducting structure includes a spring piece, and both ends of the spring piece are in surface contact with the heat generating module and the outer shell respectively;

[0016] Alternatively, the heat conducting structure includes a spring piece, and heat conducting sheets are respectively arranged at both ends of the spring piece, and the spring piece is in contact with the heat generating module and the outer shell respectively through the heat conducting sheets.

[0017] Furthermore, the contact surface of the heat conducting structure is coated with a heat conducting insulating layer.

[0018] According to another aspect of the present invention, an electronic device is provided, which includes an outer shell and a heat generating module. The outer shell has an electronic cavity, the heat generating module is arranged in the electronic cavity, and a heat conducting structure is arranged between at least part of the heat generating module and the inner wall of the outer shell, and the heat conducting structure is the above-mentioned heat conducting structure.

[0019] Furthermore, the heat generating module includes at least one heat generating element encapsulated with heat conducting glue.

[0020] Applying the technical solution of the present utility model, the length of the heat conduction structure is adjustable. One end of the heat conduction structure is connected to the heating module, and the other end is connected to the housing. The heat conduction structure can adapt to the distance between the heating module and the housing. The heat generated by the heating module is transmitted to the housing through the heat conduction structure and dissipated by the housing. This heat conduction structure can utilize its own heat conduction function to transfer the heat of the heating device to the housing, enabling the heat to be quickly dissipated from the housing, achieving rapid heat conduction of the heating device, avoiding heat accumulation of the heating device. The length of the heat conduction structure is adjustable, and the overall length of the heat conduction structure can be adjusted by using the length adjustment function of the heat conduction structure, so that the length of the heat conduction structure can adapt to the distance between the heating device and the housing, thereby ensuring the heat transfer effect of the heat conduction structure on the heating device. The characteristic that the length of the heat conduction structure is adjustable enables this heat conduction structure to be applicable to the heat conduction of heating devices with different heights, with good adaptability. Moreover, during the length adjustment process of the heat conduction structure, heat transfer connection is always maintained. Therefore, the heat conduction effect on heating devices with different heights can be ensured, avoiding the disconnection of the heat conduction path on the large heat structure, ensuring the continuity of heat transfer, and ensuring the heat conduction effect of the heat conduction structure on heating devices with different heights. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The accompanying drawings forming a part of this application are used to provide a further understanding of the present utility model. The schematic embodiments of the present utility model and their descriptions are used to explain the present utility model and do not constitute an improper limitation to the present utility model. In the drawings:

[0022] Figure 1 shows a schematic structural diagram of the heat conduction structure of an embodiment of the present utility model;

[0023] Figure 2 shows a perspective structural diagram of the heat conduction structure of an embodiment of the present utility model;

[0024] Figure 3 shows a perspective structural diagram of the heat conduction structure of an embodiment of the present utility model;

[0025] Figure 4 shows a schematic installation structure diagram of the heat conduction structure of an embodiment of the present utility model;

[0026] Figure 5 shows a structural diagram of the heat conduction structure of an embodiment of the present utility model;

[0027] Figure 6 shows a schematic installation structure diagram of the heat conduction structure of an embodiment of the present utility model;

[0028] Figure 7 shows an exploded structural diagram of the heating component of an embodiment of the present utility model;

[0029] Figure 8 The figure shows the filling process diagram of the heat-conducting material of the heat-conducting structure of the embodiment of the present utility model; and

[0030] Figure 9 The figure shows the three-dimensional structure diagram of the housing of the heat-conducting structure of an embodiment of the present utility model.

[0031] Among them, the above-mentioned drawings include the following reference numerals:

[0032] 1. First heat dissipation member; 11. First heat-conducting plate; 12. First heat dissipation plate; 2. Second heat dissipation member; 21. Second heat-conducting plate; 22. Second heat dissipation plate; 3. Telescopic member; 31. Spring piece; 32. Heat-conducting sheet; 4. Outer shell; 41. Housing; 42. Cover plate; 43. Heat dissipation teeth; 5. Heating module; 6. Electronic cavity; 7. Heat-conducting material; 8. Heat-conducting insulating layer; 9. Heat-conducting structure. Detailed implementation manners

[0033] It should be noted that, without conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present utility model will be described in detail below with reference to the drawings and in combination with the embodiments.

[0034] For the convenience of understanding, first, the application scenario of the structure of this embodiment will be introduced:

[0035] Various heating elements such as resistors, capacitors, inductors, IGBTs, MOS transistors, diodes, triodes, etc. are arranged on a circuit board, and the circuit board is installed in an electronic cavity. In addition, other heat dissipation devices such as fans, heat exchangers, and cold plates are also provided in the electronic cavity. The heights and sizes of different heating elements are different. Therefore, the distances from the tops of different heating elements to the inner wall of the outer shell are also different. At the same time, the operating conditions and physical and chemical properties of different heating elements are also different. Therefore, the heat dissipation and heat generation of different heating elements are very different. Therefore, key heat dissipation needs to be carried out for the heating element with a relatively larger heat generation compared to other heating elements.

[0036] Combined with reference to Figures 1 to 9 As shown, the present utility model provides a heat-conducting structure. The length of the heat-conducting structure is adjustable. One end of the heat-conducting structure is connected to a heating module, and the other end of the heat-conducting structure is connected to an outer shell. The heat-conducting structure can adapt to the distance between the heating module and the outer shell. A part of the heat generated by the heating module is transferred to the outer shell through the heat-conducting structure, and the outer shell dissipates heat. The heat generated by the heating module is transferred to the outer shell through the heat-conducting structure, which means that the heat-conducting structure is one of the heat dissipation paths for the heating module. In practical applications, at least more than half of the heat of the heating module can be transferred to the outer shell through the heat-conducting structure; it can also be less than or equal to half of the heat that is transferred to the outer shell through the heat-conducting structure.

[0037] In use, after adjusting the length of the heat conduction structure according to the distance between the top of the heating module 5 and the outer shell 4, one end of the heat conduction structure is installed on the top of the heating module 5 by direct installation, sleeving, bonding or welding, and then the outer shell is covered so that the other end of the heat conduction structure contacts the outer shell 4. Further, an adhesive with heat conduction function can also be provided on the other end of the heat conduction structure that contacts the outer shell 4.

[0038] This heat conduction structure can utilize its own heat conduction effect to transfer the heat of the heating device to the outer shell, enabling the heat to quickly dissipate from the outer shell, achieving rapid heat conduction of the heating device, avoiding heat accumulation of the heating device, and reducing the burden on the heat dissipation device inside the equipment housing. Under normal circumstances, it further realizes improving the heat dissipation capacity of the equipment without changing the power of the radiator and the circuit inside the housing, and thus improves the power density of the equipment; moreover, the length of the heat conduction structure can be adjusted, and the overall length of the heat conduction structure can be adjusted by using the length adjustment function of the heat conduction structure, so that the length of the heat conduction structure can adapt to the distance between the heating device and the outer shell, thereby ensuring the heat transfer effect of the heat conduction structure on the heating device. The feature that the length of the heat conduction structure is adjustable enables this heat conduction structure to be applicable to the heat conduction of heating devices with different heights and has good adaptability.

[0039] The length of the heat conduction structure can be adjusted, which means that the length of the heat conduction structure can be adjusted according to the height of the actual space between the top of the device and the equipment outer shell before installation. Once installed, the length of the heat conduction structure does not change if it is not disassembled.

[0040] Generally, in order to shorten the length of the heat transfer path to improve the heat dissipation effect, the adjustment of the length of the heat conduction structure is usually carried out in a straight line from the top of the heating device to the housing. However, in actual applications, if the heat conduction structures corresponding to the heating devices are set relatively densely, a region with a higher temperature will be formed on the housing. Therefore, by bending the heat conduction structure, one or more of the heat conduction structures can be dispersed at the end connected to the housing, thereby increasing the distance between the ends of the heat conduction structures connected to the housing, avoiding the concentration of heat on the housing, increasing the thermal difference at both ends of the heat conduction structure, and improving the heat dissipation effect.

[0041] The adjustable length of the heat conduction structure can achieve the bending of the heat conduction structure in the space inside the housing.

[0042] In addition, during the disassembly process, the length of the heat conduction structure can be adjusted according to actual needs: for example, one end of the heat conduction structure is fixed to the top of the heating device, and the other end is fixed to the inner side wall of the housing. During the adjustment of the length of the heat conduction structure during disassembly, heat transfer connection is always maintained, so that the heat conduction path can be avoided from being disconnected on the large heat conduction structure, ensuring the continuity of heat transfer and the heat conduction effect of the heat conduction structure on heating devices with different heights.

[0043] In one embodiment, the heat conduction structure includes a first heat dissipation member 1 and a second heat dissipation member 2. The first heat dissipation member 1 includes a first heat dissipation plate 12 and a first heat conduction plate 11 connected to the first heat dissipation plate 12. The second heat dissipation member 2 includes a second heat dissipation plate 22 and a second heat conduction plate 21 connected to the second heat dissipation plate 22. The first heat conduction plate 11 and the second heat conduction plate 21 extend towards each other and are capable of relative movement, and are heat transfer connected between the first heat conduction plate 11 and the second heat conduction plate 21.

[0044] Of course, in practical applications, the heat conduction structure may include a first heat dissipation member 1, one or more transition members, and a second heat dissipation member 2. The first heat dissipation member 1, the transition member, and the second heat dissipation member 2 are connected in series in sequence, and the three are telescopically arranged along the path from the heat generating module 5 to the housing 4. In practical applications, the way that the heat conduction structure includes a first heat dissipation member 1 and a second heat dissipation member 2 is easier to manufacture and install, and there are fewer connection points between adjacent structures, making it easier to conduct heat.

[0045] In this embodiment, by providing the first heat dissipation member 1 and the second heat dissipation member 2, the heat conduction structure can utilize the heat conduction effect of the first heat dissipation member 1 and the second heat dissipation member 2 to transfer the heat of the heat generating device to the housing, so that the heat can quickly dissipate from the housing, achieving rapid heat conduction of the heat generating device, avoiding heat accumulation of the heat generating device. The first heat dissipation member 1 and the second heat dissipation member 2 extend towards each other and are capable of relative movement, and the distance between the first heat dissipation member 1 and the second heat dissipation member 2 can be adjusted by using the relative movement between the first heat dissipation member 1 and the second heat dissipation member 2, so that the distance between the first heat dissipation member 1 and the second heat dissipation member 2 can be adapted to the distance between the heat generating device and the housing, thereby ensuring the heat transfer effect of the first heat dissipation member 1 and the second heat dissipation member 2 on the heat generating device. The characteristic that the first heat dissipation member 1 and the second heat dissipation member 2 change the length of the heat conduction structure by adjusting the relative position enables the heat conduction structure to be applicable to the heat conduction of heat generating devices with different heights, with good adaptability, and the first heat dissipation member 1 and the second heat dissipation member 2 also remain heat transfer connected during the adjustment process of the relative position, so that the heat conduction effect on heat generating devices with different heights can be ensured, avoiding the disconnection of the heat conduction path at the connection position between the first heat dissipation member 1 and the second heat dissipation member 2, ensuring the continuity of heat transfer, and ensuring the heat conduction effect of the heat conduction structure on heat generating devices with different heights.

[0046] In one embodiment, the first heat conduction plate 11 and the second heat conduction plate 21 are connected by a flexible heat conduction member.

[0047] In this embodiment, the first heat conducting plate 11 and the second heat conducting plate 21 may not be in direct contact, and are thermally connected through a flexible heat conducting member. During the process of adjusting the distance between the first heat conducting plate 11 and the second heat conducting plate 21, the flexible heat conducting member can deform to adapt to the change in the distance between the first heat conducting plate 11 and the second heat conducting plate 21. Since the first end of the flexible heat conducting member always maintains a good connection relationship with the first heat conducting plate 11, and the second end of the flexible heat conducting member always maintains a good connection relationship with the second heat conducting plate 21, a continuous heat conduction path and good heat conduction effect can be always maintained between the first heat conducting plate 11 and the second heat conducting plate 21 through the flexible heat conducting member. As a result, the heat of the heat generating device can be quickly transmitted to the housing through the second heat dissipation plate 22, the second heat conducting plate 21, the flexible heat conducting member, the first heat conducting plate 11 and the first heat dissipation plate 12, and the housing conducts the heat away, realizing the rapid heat dissipation of the heat generating device and avoiding heat accumulation of the heat generating device.

[0048] The flexible heat conducting member can be an integral strip structure, or can be multiple strip structures or rod structures arranged at intervals along the circumferences of the first heat conducting plate 11 and the second heat conducting plate 21, etc. The flexible heat conducting member is, for example, a heat conducting silica gel sheet or a graphene film. The flexible heat conducting member can be fixedly connected to the first heat conducting plate 11 and the second heat conducting plate 21 by means of bonding, sleeving, etc., so as to effectively conduct heat between the first heat conducting plate 11 and the second heat conducting plate 21.

[0049] In one embodiment, the first heat conducting plate 11 and the second heat conducting plate 21 are in sliding contact and cooperation. In this embodiment, the first heat conducting plate 11 and the second heat conducting plate 21 always remain in contact during the sliding process. Therefore, during the process of adjusting the distance between the first heat dissipation member 1 and the second heat dissipation member 2, the first heat conducting plate 11 and the second heat conducting plate 21 always remain in contact, so that the heat conduction path always remains continuous. The heat of the heat generating device can be transmitted to the housing through the second heat dissipation plate 22, the second heat conducting plate 21, the first heat conducting plate 11 and the first heat dissipation plate 12, and the housing conducts the heat away, realizing the rapid heat dissipation of the heat generating device and avoiding heat accumulation of the heat generating device.

[0050] In this embodiment, the shapes of the first heat conducting plate 11 and the second heat conducting plate 21 can be designed as needed, as long as it is ensured that the first heat conducting plate 11 and the second heat conducting plate 21 can always remain in contact during the relative movement process. In practical applications, the first heat dissipation member 1 and the second heat dissipation member 2 with non-cylindrical structures can also be used: for example, the first heat conducting plate 11 and the first heat dissipation plate 12 are integrally in an L-shaped structure, or a T-shaped structure, and / or the second heat dissipation member 2 having the same or similar structure as the first heat dissipation member 1.

[0051] In one embodiment, both the first heat conducting plate 11 and the second heat conducting plate 21 are cylindrical structures. The first heat conducting plate 11 is sleeved within the second heat conducting plate 21, and there is a contact fit between the outer surface of the first heat conducting plate 11 and the inner surface of the second heat conducting plate 21.

[0052] In this embodiment, both the first heat conducting plate 11 and the second heat conducting plate 21 can be cylindrical structures with a constant cross-section. Therefore, during the relative movement of the first heat conducting plate 11 and the second heat conducting plate 21, the outer surface of the first heat conducting plate 11 can always be in contact with the inner surface of the second heat conducting plate 21, and the two will not disengage during the movement, thus effectively ensuring the continuity of the heat transfer path.

[0053] The cross-section of the cylindrical structure can be circular, elliptical, polygonal, or other cross-sectional shapes.

[0054] In one embodiment, the first heat conducting plate 11 includes at least two oppositely arranged first arc-shaped plates, and the second heat conducting plate 21 includes at least two oppositely arranged second arc-shaped plates. The first arc-shaped plates and the second arc-shaped plates are correspondingly arranged, and there is a contact fit between the outer surface of the first arc-shaped plate and the inner surface of the second arc-shaped plate.

[0055] In this embodiment, at least two oppositely arranged first arc-shaped plates of the first heat conducting plate 11 can form a first guiding and limiting structure, and at least two oppositely arranged second arc-shaped plates of the second heat conducting plate 21 can form a second guiding and limiting structure. When the first heat conducting plate 11 is located within the second heat conducting plate 21, at least two oppositely arranged second arc-shaped plates of the second heat conducting plate 21 form a sliding guiding space, and the first guiding and limiting structure formed by at least two oppositely arranged first arc-shaped plates of the first heat conducting plate 11 slides within the sliding guiding space. Due to the arc-shaped structure of the second arc-shaped plate, effective limiting of the sliding of the first arc-shaped plate can be achieved.

[0056] In one embodiment, the first heat conducting plate 11 includes at least two oppositely arranged first arc-shaped plates, the second heat conducting plate 21 is a cylindrical structure, and the second heat conducting plate 21 is located within the space formed by the first arc-shaped plates and is in contact fit with the first arc-shaped plates.

[0057] In this embodiment, at least two oppositely arranged first arc-shaped plates of the first heat conducting plate 11 form a sliding guiding space, and the diameter of the inner wall surface of the first arc-shaped plate is the same as the diameter of the outer wall surface of the cylindrical structure of the second heat conducting plate 21, so that the cylindrical structure of the second heat conducting plate 21 can slide within the sliding guiding space defined by the first arc-shaped plates and always maintain a good contact fit with the first arc-shaped plates, thereby ensuring the continuity of the heat transfer path between the first heat dissipation member 1 and the second heat dissipation member 2.

[0058] In one embodiment, the first heat conducting plate 11 includes at least two oppositely arranged first arc-shaped plates. The second heat conducting plate 21 is a cylindrical structure. The second heat conducting plate 21 is sleeved outside the first arc-shaped plates and is in contact and cooperation with the first arc-shaped plates.

[0059] In this embodiment, at least two oppositely arranged first arc-shaped plates of the first heat conducting plate 11 form a sliding guiding structure. The diameter of the outer wall surface of the first arc-shaped plates is the same as the diameter of the inner wall surface of the cylindrical structure of the second heat conducting plate 21, so that the cylindrical structure of the second heat conducting plate 21 can define the sliding direction defined by the first arc-shaped plates and always maintain good contact and cooperation with the first arc-shaped plates, thereby ensuring the continuity of the heat transfer path between the first heat dissipating member 1 and the second heat dissipating member 2.

[0060] In one embodiment, the heat conducting structure further includes a telescopic member 3. The telescopic member 3 is arranged between the first heat dissipating member 1 and the second heat dissipating member 2. The first end of the telescopic member 3 is in contact and cooperation with the first heat dissipating member 1, and the second end of the telescopic member 3 is in contact and cooperation with the second heat dissipating member 2.

[0061] The first heat dissipating member 1 and the second heat dissipating member 2 are connected by the telescopic member 3, and the distance between the first heat dissipating member 1 and the second heat dissipating member 2 can be adjusted by the telescopic action of the telescopic member 3, so that the distance between the first heat dissipating member 1 and the second heat dissipating member 2 can be adapted to the distance between the heat generating device and the housing, thereby ensuring the heat transfer effect of the first heat dissipating member 1 and the second heat dissipating member 2 on the heat generating device. The characteristic that the first heat dissipating member 1 and the second heat dissipating member 2 adjust the distance through the telescopic member 3 enables the heat conducting structure to be applicable to the heat conduction of heat generating devices with different heights, with good adaptability. Moreover, the first heat dissipating member 1 and the second heat dissipating member 2 also always maintain heat transfer connection during the distance adjustment process, so that the heat conduction effect on heat generating devices with different heights can be ensured, the heat conduction path is prevented from being disconnected at the connection position of the first heat dissipating member 1 and the second heat dissipating member 2, the continuity of heat transfer is ensured, and the heat conduction effect of the heat conducting structure on heat generating devices with different heights is ensured.

[0062] In practical applications, the telescopic member 3 usually uses a telescopic member made of a metal material. Therefore, the heat conduction cross-sectional area of the heat conducting structure can be increased, and while controlling the distance between the first heat conducting plate 12 and the second heat conducting plate 22, the heat conduction efficiency is improved.

[0063] In this embodiment, the spacing between the heating device and the housing is adapted by the telescopic member 3, which better adapts to the different spacing characteristics between different heating devices and the housing, so that the heat conduction structure can adapt to the heat dissipation of different heating devices. On the basis of ensuring that the different heating devices in the housing have a good spatial layout, each heating device can have a continuous heat conduction path and a good heat conduction effect, making the device layout inside the electronic device more reasonable, the design cost lower, and the structure more compact. In one embodiment, the telescopic member 3 is an elastic member.

[0064] In this embodiment, the first heat sink 1 is installed on the shell, and the second heat sink 2 is installed on the heating device. An elastic member is used as a telescopic member to adjust the distance between the first heat sink 1 and the second heat sink 2. The elastic force of the elastic member can be used to achieve adaptive adjustment of the distance between the first heat sink 1 and the second heat sink 2. After the heat-conducting structure is installed between the heating device and the shell, the elastic member can automatically adjust the distance between the first heat sink 1 and the second heat sink 2, and at the same time apply elastic force to the first heat sink 1 and the second heat sink 2, so that the first heat sink 1 can fully contact with the shell, and the second heat sink 2 can fully contact with the heating device, thereby effectively ensuring the heat transfer effect from the heating device to the shell, so that the heat generated by the heating device can be quickly transmitted to the shell through the heat-conducting structure and dissipated through the shell.

[0065] In one embodiment, the telescopic member 3 is a telescopic sleeve. After the distance between the first heat dissipation member 1 and the second heat dissipation member 2 is adjusted to the desired position, thermal conductive adhesive is poured into the telescopic sleeve.

[0066] In this embodiment, the telescopic sleeve is a conical sleeve, and the thermal conductive structure can use the conical telescopic sleeve to match heating modules of different diameters. After the height is adjusted, thermal conductive glue can be poured into the conical sleeve to improve the thermal conductive effect of the thermal conductive structure and at the same time improve the bonding strength between the conical sleeve and the heating device.

[0067] In one embodiment, the heat-conducting structure includes a spring sheet 31, and the two ends of the spring sheet 31 are in contact with the heating module and the outer shell surface respectively. Furthermore, in order to improve the heat conduction effect, heat-conducting sheets 32 are respectively provided at both ends of the spring sheet 31, and the spring sheet 31 is in contact with the heating module and the outer shell surface respectively through the heat-conducting sheets 32.

[0068] In this embodiment, the elastic expansion and contraction ability of the spring sheet 31 can be used to adjust the length of the heat-conducting structure, thereby adapting the distance between the heating module and the shell, achieving uninterrupted heat transmission, and improving the heat dissipation effect of the heating module.

[0069] In one embodiment, the surface of the heat-conducting structure is coated with a heat-conducting insulating layer 8 to achieve insulation between the heat-generating module 5 and the housing while conducting heat; alternatively, the contact surfaces in contact with the heat-generating module 5 and the housing 4 are coated with the heat-conducting insulating layer 8. Coating the contact surfaces with the heat-conducting insulating layer can reduce the amount of heat-conducting insulating material used, thereby reducing costs.

[0070] For a heat-conducting structure including a first heat-dissipating member 1 and a second heat-dissipating member 2, the heat-conducting insulating layer 8 can be coated on the contact surfaces of the first heat-conducting plate 11 and / or the second heat-conducting plate 21.

[0071] In this embodiment, by coating the heat-conducting insulating layer 8 on the contact surfaces of the first heat-conducting plate 11 and / or the second heat-conducting plate 21, the contact area between the first heat-conducting plate 11 and the second heat-conducting plate 21 can be increased, the heat transfer efficiency between the first heat-conducting plate 11 and the second heat-conducting plate 21 can be improved, and the problem of poor heat transfer effect caused by gaps in the surface contact between the first heat-conducting plate 11 and the second heat-conducting plate 21 due to processing errors or other reasons can be avoided.

[0072] In order to ensure good heat-conducting effects between the heat-conducting structure, the heat-generating device, and the outer shell, in one embodiment, both the first heat-dissipating plate 12 and the second heat-dissipating plate 22 adopt a flat plate structure, and the outer surfaces of the first heat-dissipating plate 12 and the second heat-dissipating plate 22 are coated with a heat-conducting insulating material, so that the first heat-dissipating plate 12 and the second heat-dissipating plate 22 themselves have a large heat-conducting area. At the same time, the heat-conducting insulating material can be used to adapt to the mating surface of the heat-generating device or the outer shell, so that the uneven areas on the mating surface of the heat-generating device or the outer shell can be filled with the heat-conducting insulating material, thereby forming a large contact surface between the heat-generating device and the outer shell and the heat-conducting structure, and improving the heat-conducting efficiency and heat-conducting effect.

[0073] In one embodiment, when the heat-conducting structure further includes a telescopic member 3, the heat-conducting insulating layer 8 can be coated on the surface of the telescopic member 3.

[0074] In one embodiment, when the heat-conducting structure includes a spring piece 31, the heat-conducting insulating layer 8 is coated on the surface of the spring piece 31.

[0075] The heat-conducting insulating material can be a heat-conducting adhesive, so that the connection between the heat-conducting structure and the heat-generating device or the outer shell can be realized by using the heat-conducting adhesive, the problem of position offset of the heat-conducting structure relative to the heat-generating device and the outer shell during use can be avoided, the position stability of the heat-conducting structure can be improved, and the heat-conducting effect of the heat-conducting structure can be ensured.

[0076] The above-mentioned heat-conducting insulating material can be heat-conducting silicone grease, heat-conducting gel, heat-conducting pad / ceramics, etc.

[0077] The first end of the telescopic member 3 and the first heat dissipation plate 12 may be in a butt-joint relationship or a fixed connection relationship, and the second end of the telescopic member 3 and the second heat dissipation plate 22 may be in a butt-joint relationship or a fixed connection relationship.

[0078] In one embodiment, the end face area of the heat dissipation member provided on the heat generating device is larger than the end face area of the heat dissipation member provided on the housing. For example, the first heat dissipation member 1 is provided on the housing, and the second heat dissipation member 2 is provided on the heat generating device. At this time, the area of the first heat dissipation plate 12 is smaller than the area of the second heat dissipation plate 22, so that the heat on the heat generating device can be more easily transferred to the second heat dissipation plate 22, improving the heat dissipation effect of the heat conduction structure on the heat generating device.

[0079] In one embodiment, in practical applications, the inner wall of the first heat dissipation member 1 or the second heat dissipation member 2 has a certain inclination angle relative to the axial direction. For example, when one of them adopts a conical cylinder structure, or due to processing errors, the overlapping part between the first heat conduction plate 11 and the second heat conduction plate 21 is not all in contact, so there may be a fitting gap between the two. After the distance between the first heat dissipation member 1 and the second heat dissipation member 2 is adjusted in place, a thermally conductive insulating material is filled in the gap to improve the heat conduction efficiency.

[0080] In this embodiment, the first heat conduction plate 11 and the second heat conduction plate 21 do not contact each other, and there is a gap between them. When the distance between the first heat dissipation member 1 and the second heat dissipation member 2 is adjusted in place, a thermally conductive insulating material can be filled in the gap between the first heat conduction plate 11 and the second heat conduction plate 21, so as to realize the thermally conductive connection between the first heat conduction plate 11 and the second heat conduction plate 21. Since the thermally conductive insulating material is densely filled between the first heat conduction plate 11 and the second heat conduction plate 21, the heat transfer path between the first heat conduction plate 11 and the second heat conduction plate 21 can be made continuous, so that the heat of the heat generating device can be quickly transferred to the housing through the heat transfer path, improving the heat dissipation efficiency of the heat generating device.

[0081] During the operation of the heat generating device, if a certain heat generating device overheats or the heat generating device needs to be cooled down, this heat dissipation structure is placed on the surface of the heat generating device. The connection between the heat dissipation structure and the heat generating device can be achieved by means such as bonding and mechanical fixing. In order to enhance heat exchange, a thermally conductive material can be coated on the outer sides of the upper and lower heat dissipation plates of the heat dissipation structure; after the heat dissipation structure is installed, the housing is assembled, and the heat dissipation plates of the heat dissipation structure will contact the inner side of the housing. The heat generated by the heat generating device during operation is conducted along the heat dissipation structure to the housing, and then transferred from the housing to the outside air for heat dissipation.

[0082] Refer to in combination Figures 4 to 7As shown, according to an embodiment of the present utility model, an electronic device includes a housing 4 and a heating module 5. The housing 4 has an electronic cavity 6, and the heating module 5 is disposed within the electronic cavity 6. A heat conduction structure 9 is provided between at least a part of the heating module 5 and the inner wall of the housing 4, and the heat conduction structure 9 is the above-mentioned heat conduction structure.

[0083] In this embodiment, the first heat dissipation member 1 of the heat conduction structure 9 is disposed on the housing 4, and the second heat dissipation member 2 is disposed on the heating module 5. Here, the heating module 5 is the above-mentioned heating device. The heat of the heating module 5 can be transmitted to the second heat dissipation member 2 through the first heat dissipation member 1, and then transmitted to the housing 4 through the second heat dissipation member 2 and dissipated through the housing 4.

[0084] In one embodiment, a heat conduction material 7 is filled between the heating module 5 and the inner wall of the housing 4.

[0085] In this embodiment, by filling the heat conduction material 7 between the heating module 5 and the inner wall of the housing 4, the heat transfer efficiency of the heating module 5 can be improved by using the heat conduction material 7, and the heat dissipation effect of the heating module 5 can be further improved.

[0086] In one embodiment, the heat conduction material 7 is a soft heat conduction material.

[0087] The original potting area of the heating module 5 is filled with a highly thermally conductive or phase-change soft heat conduction material. The soft heat conduction material is designed to have a certain volume. When the original potting area is filled, the gap between the heating module 5 and the housing 4 can be filled, which plays a role in enhancing the heat dissipation performance of the heating module 5; when the heating module 5 fails and needs to be replaced, the housing 4 is disassembled, the filled soft heat conduction material is removed, and after replacement and repair, the soft heat conduction material is refilled, which can reduce waste while facilitating maintenance.

[0088] In one embodiment, the volume of the heat conduction material 7 is 0.95 - 0.98 of the gap volume between the heating module 5 and the inner wall of the housing 4.

[0089] The soft heat conduction material is a soft deformable material with high thermal conductivity. The specific material is not limited to paraffin, thermal gel, cooling oil, etc. The material form can be liquid, gel, paste, etc. A protective film can be wrapped outside the soft heat conduction material; the use of the soft heat conduction material requires prior calculation of the usage volume, and the size of the volume is equal to 0.95 - 0.98 of the gap volume between the device and the housing, and the remaining 0.05 - 0.02 is reserved for the expansion volume of the internal filled heat conduction material at high temperatures.

[0090] The housing 4 includes a housing body 41 and a cover plate 42. The cover plate 42 is used in cooperation with the housing body 41 and encloses the entire electronic cavity 6 with the housing body 41 to accommodate the soft heat conduction material and the heating module 5.

[0091] In one embodiment, in order to improve the heat dissipation effect of the housing 4, heat dissipation teeth 43 or heat sinks and other heat dissipation-enhancing structures can be added to the surface of the housing 4.

[0092] During actual use, after the heat-generating module 5 is fixed inside the housing 4, the heat-conducting material 7 with the calculated required volume is filled into the housing 4. Depending on the type of heat-conducting material 7 used, it can be selected to press the heat-conducting material 7 into the gap between the housing 4 and the heat-generating module 5 under an external force to ensure good filling contact between the two. Subsequently, the cover plate 42 is connected to the housing body 41, and finally, the fabricated housing as a whole is installed in the inverter / power device for normal use.

[0093] When the heat-generating module 5 needs to be repaired, the cover plate 42 on the housing body 41 is opened, and the heat-conducting material 7 filled in the housing 4 is taken out. Subsequently, after the abnormal heat-generating module 5 is replaced and repaired, the heat-conducting material 7 is reinstalled, the cover plate 42 is installed, and the repaired housing 4 as a whole is reinstalled in the inverter / power device.

[0094] In one embodiment, the heat-generating module 5, the heat-conducting material 7, and the housing body 41 can form a whole by means of potting with the heat-conducting material 7. Using the housing body 41 as a small housing to form a closed structure, so that the heat-generating module 5, the heat-conducting material 7, and the housing body 41 form an integral heat-generating component. Then, the heat-generating component realizes heat conduction through a heat-conducting structure provided between the housing body 41 and the large housing of the device.

[0095] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should also be understood that when the terms "comprise" and / or "include" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or their combinations.

[0096] It should be noted that the terms "first", "second", etc. in the description and claims of the present application and the above-mentioned drawings are used to distinguish similar objects and do not necessarily need to describe a specific order or sequence. It should be understood that such data can be interchanged under appropriate circumstances so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein.

[0097] The above are only the preferred embodiments of the present utility model and are not used to limit the present utility model. For those skilled in the art, the present utility model can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. A heat conduction structure, characterized in that, The length of the heat conduction structure is adjustable. The heat conduction structure includes a first heat dissipation member (1) and a second heat dissipation member (2). The first heat dissipation member (1) includes a first heat dissipation plate (12) and a first heat conduction plate (11) connected to the first heat dissipation plate (12). The second heat dissipation member (2) includes a second heat dissipation plate (22) and a second heat conduction plate (21) connected to the second heat dissipation plate (22). The first heat conduction plate (11) and the second heat conduction plate (21) extend towards each other and are capable of relative movement, and are heat transfer connected between the first heat conduction plate (11) and the second heat conduction plate (21).

2. The heat conduction structure according to claim 1, characterized in that The first heat conduction plate (11) and the second heat conduction plate (21) are in sliding contact and cooperation; Alternatively, the first heat conduction plate (11) and the second heat conduction plate (21) are connected by a flexible heat conduction member; Alternatively, the space between the first heat conduction plate (11) and the second heat conduction plate (21) is filled with a flexible heat conduction material or a heat conduction insulating material.

3. The heat conduction structure according to claim 1, characterized in that At least one of the first heat conduction plate (11) and the second heat conduction plate (21) is a cylindrical structure. The first heat conduction plate (11) is sleeved with the second heat conduction plate (21), and the outer surface of the first heat conduction plate (11) is in contact and cooperation with the inner surface of the second heat conduction plate (21).

4. The heat conduction structure according to claim 1, wherein The heat conduction structure further includes a telescopic member (3). The telescopic member (3) is supported and arranged between the first heat dissipation plate (12) of the first heat dissipation member (1) and the second heat dissipation plate (22) of the second heat dissipation member (2).

5. The heat conduction structure according to claim 4, wherein The telescopic member (3) is an elastic member; or, the telescopic member (3) is a telescopic sleeve; And / or, the space between the first heat dissipation plate (12) and the second heat dissipation plate (22) in the heat conduction structure is filled with a heat conduction insulating material; And / or, the surface of the heat conduction structure is coated with a heat conduction insulating layer (8).

6. The heat conduction structure according to claim 1, wherein The heat conduction structure includes a spring piece (31); Alternatively, the heat conduction structure includes a spring piece (31), and heat conduction pieces (32) are respectively arranged at both ends of the spring piece (31).

7. The heat conduction structure according to any one of claims 1 to 4 and 6, characterized in that, The contact surface of the heat conduction structure is coated with a heat conduction insulating layer (8).

8. An electronic device, comprising a housing (4) and a heating module (5), the housing (4) having an electronic cavity (6), the heating module (5) being disposed within the electronic cavity (6), a heat conduction structure (9) being provided between at least a part of the heating module (5) and the inner wall of the housing (4), characterized in that, The heat conduction structure (9) is the heat conduction structure according to any one of claims 1 to 7.

9. The electronic device according to claim 8, wherein, The heating module (5) includes at least one heating element encapsulated with heat-conducting glue.

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