Radiator, radiating system and power conversion equipment
By filling the cooling medium in the radiator body and setting up the installation port, the heating device and the radiator are directly or indirectly bonded, the heat dissipation problem of high-power density power conversion equipment is solved, and a more efficient heat dissipation effect is achieved.
Patent Information
- Application Number
- CN202421971902.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-13
- Publication Date
- 2025-08-01
- Estimated Expiration
- 2034-08-13
AI Technical Summary
Traditional air-cooled heat dissipation methods cannot meet the heat dissipation needs of high-power density power conversion equipment for power devices, especially the heat dissipation needs of devices such as insulated gate bipolar transistors (IGBTs).
A radiator is designed to fill the cavity of the radiator body with a cooling medium and set up an installation port on the radiator body to make the heating device directly or indirectly fit the radiator body, thereby increasing the projection area of the heating device on the side so that the cooling medium and the heating device are directly in contact with the heating device, and reducing the thermal resistance of the heat dissipation path.
It effectively improves the heat dissipation efficiency of power conversion equipment, meets the heat dissipation needs of high-power density equipment, and improves the cooling effect.
Smart Images

Figure CN223182516U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of heat dissipation technology, and more specifically, to a radiator, a heat dissipation system, and a power conversion device. Background Art
[0002] Traditional power conversion equipment such as photovoltaic inverters, energy storage inverters (PCS, Power Conversion System) and wind power converters mainly use air cooling for heat dissipation. However, with the increase in the power density of power conversion equipment, the loss of power devices such as insulated gate bipolar transistors (IGBT) also increases, making power conversion equipment have higher requirements for the heat dissipation of power devices.
[0003] Therefore, how to improve the heat dissipation efficiency of power conversion equipment has become a technical problem that needs to be solved urgently by those skilled in the art. Utility Model Content
[0004] In view of this, an object of the present application is to provide a heat sink to improve the heat dissipation efficiency of a power conversion device.
[0005] Another object of the present application is to provide a heat dissipation system having the above-mentioned heat dissipation device.
[0006] Another object of the present application is to provide a power conversion device having the above-mentioned heat dissipation system.
[0007] To achieve the above objectives, this application provides the following technical solutions:
[0008] A radiator, comprising:
[0009] The radiator body has a shell, which limits a cavity for accommodating a cooling medium, and the radiator body is provided with a mounting port for mounting a heating device, the mounting port is connected to the cavity, the heating device is directly or indirectly attached to the outer surface of the first side of the radiator body, the heating device covers the mounting port, and the projected area of the heating device on the first side is larger than the projected area of the mounting port on the first side.
[0010] Optionally, in the above-mentioned radiator, an adapter is provided at the mounting port, the heating device is connected to the adapter, and the adapter is in contact with the outer surface of the first side of the radiator body, and a heat dissipation channel connected to the mounting port is provided on the adapter.
[0011] Optionally, in the above radiator, the adapter is connected to the radiator body through a concave-convex fit.
[0012] Optionally, in the above-mentioned radiator, the adapter includes a connecting base, an annular groove is provided on the connecting base, and an annular protrusion that cooperates with the annular groove is provided on the outer surface of the first side of the radiator body.
[0013] Optionally, in the above-mentioned radiator, the heat-generating device is arranged on the connecting base.
[0014] Optionally, in the above-mentioned radiator, the adapter further includes a boss arranged on the connecting base, the projection of the boss on the first side is located within the projection of the connecting base on the first side, and the heat-generating device is arranged on the boss.
[0015] Optionally, in the above-mentioned radiator, the boss and the connecting base are of a split structure;
[0016] The boss is used for welding connection with the heat-generating device.
[0017] Optionally, in the above-mentioned radiator, the boss is made of a metal material; or,
[0018] The boss is provided with a first metal layer.
[0019] Optionally, in the above-mentioned radiator, a second metal layer is provided on the side of the annular groove that fits with the radiator body.
[0020] Optionally, in the above-mentioned radiator, the radiator body has a second side opposite to the first side, and a plurality of heat dissipation fins are provided on the second side of the radiator body.
[0021] Optionally, in the above-mentioned radiator, the heat dissipation fins are provided with cavities communicating with the cavity of the radiator body.
[0022] A heat dissipation system includes the radiator as described in any one of the above.
[0023] Optionally, in the above-mentioned heat dissipation system, a heat exchanger is further included, and the heat exchanger is communicated with the radiator.
[0024] A power conversion device includes a heat-generating device and the heat dissipation system as described in any one of the above, and the heat-generating device is attached to the radiator.
[0025] Optionally, in the above-mentioned power conversion device, a sealed cavity is further included, the heat-generating device is located inside the sealed cavity, the heat dissipation system is located outside the sealed cavity, and an opening for connecting the heat-generating device and the heat dissipation system is provided on the sealed cavity.
[0026] Optionally, in the above power conversion device, a heat dissipation cavity is provided outside the sealed cavity, and the heat dissipation system is located in the heat dissipation cavity.
[0027] Optionally, in the above power conversion device, the heat dissipation cavity includes at least two air vents, and air supply fans are provided at the positions of the air vents.
[0028] The radiator provided by the present application fills a cooling medium in the cavity of the radiator body and simultaneously opens an installation port on the radiator body. When the heat generating device is directly or indirectly attached to the outer surface of the first side of the radiator body, the heat generating device covers the installation port, and the projected area of the heat generating device on the first side is larger than the projected area of the installation port on the first side, which can make the cooling medium in the cavity directly contact the heat generating device, effectively reduce the thermal resistance of the heat dissipation path, improve the heat dissipation performance, and further improve the heat dissipation efficiency of the power conversion device, meeting the heat dissipation requirements of the power device for the high-power density power conversion device.
[0029] The technical features mentioned above, the technical features to be mentioned below, and the technical features separately shown in the drawings can be arbitrarily combined with each other as long as the combined technical features are not contradictory. All feasible feature combinations are the technical contents clearly recorded herein. Any one of the sub-features included in the same statement can be independently applied without necessarily being applied together with other sub-features. BRIEF DESCRIPTION OF THE DRAWINGS
[0030] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only the embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained according to the provided drawings without creative efforts.
[0031] Figure 1 It is a schematic structural diagram of the radiator provided in the first embodiment of the present application;
[0032] Figure 2 It is a schematic structural diagram of the radiator provided in the second embodiment of the present application;
[0033] Figure 3 It is a schematic structural diagram of the radiator provided in the third embodiment of the present application;
[0034] Figure 4 It is a schematic structural diagram of the radiator provided in the fourth embodiment of the present application;
[0035] Figure 5 It is a schematic structural diagram of the adapter provided in the first embodiment of the present application Figure 1 ;
[0036] Figure 6 Structural schematic of the adapter provided in the first embodiment of the present application Figure 2 ;
[0037] Figure 7 Structural schematic of the adapter provided in the second embodiment of the present application;
[0038] Figure 8 Structural schematic of the adapter provided in the third embodiment of the present application;
[0039] Figure 9 Structural schematic of the heat dissipation system provided in the first embodiment of the present application;
[0040] Figure 10 Structural schematic of the heat dissipation system provided in the second embodiment of the present application;
[0041] Figure 11 Structural schematic of the power conversion device provided in the first embodiment of the present application;
[0042] Figure 12 Structural schematic of the power conversion device provided in the second embodiment of the present application;
[0043] Figure 13 Structural schematic of the power conversion device provided in the third embodiment of the present application;
[0044] Figure 14 Structural schematic of the power conversion device provided in the fourth embodiment of the present application.
[0045] Among them, 100 is a radiator, 101 is a housing, 1011 is a cavity, 1012 is a mounting opening, 1013 is an annular protrusion, 1014 is a heat dissipation fin, 1015 is a cavity, 102 is an adapter, 1021 is a heat dissipation channel, 1022 is an annular groove, 1023 is a connection seat, and 1024 is a boss;
[0046] 200 is a heat dissipation system, 201 is a heat exchanger, 2011 is a condenser, 202 is a pipeline, 203 is a driving pump, and 204 is a heat dissipation fan;
[0047] 300 is a power conversion device, 301 is a heating device, 302 is a sealed cavity, 3021 is an opening, 303 is a heat dissipation cavity, 3031 is an air outlet, 3032 is a blowing fan, and 304 is a magnetic device. Specific implementation manners
[0048] The core of the present application lies in providing a radiator to improve the heat dissipation efficiency of the power conversion device.
[0049] Another core of the present application lies in providing a heat dissipation system having the above-mentioned radiator.
[0050] Another core of the present application lies in providing a power conversion device having the above-mentioned heat dissipation system.
[0051] Next, the technical solutions in the embodiments of the present application will be clearly and completely described with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts shall fall within the protection scope of the present application.
[0052] A power conversion device is an electrical device that converts electrical energy from one form to another to achieve energy transmission and control under different power requirements. There are various types of power conversion devices with a wide range of applications, playing a crucial role in many fields such as industry, communication, energy, transportation, and aerospace. Power conversion devices generally include photovoltaic inverters, energy storage inverters (PCS, Power Conversion System), motor controllers, and wind power converters, etc.
[0053] With the increase in the power density of power conversion devices, the losses of power devices such as insulated gate bipolar transistors (IGBTs) also increase accordingly, making the air-cooling method unable to meet the heat dissipation requirements of power devices in high-power-density power conversion devices.
[0054] Therefore, as Figures 1 to 4 shown, an embodiment of the present application discloses a radiator 100, including a radiator body. By filling a cooling medium in the cavity 1011 of the radiator body and simultaneously opening an installation port 1012 on the radiator body, when a heat-generating device 301 is installed in the installation port 1012, the cooling medium in the cavity 1011 can be in direct contact with the heat-generating device 301, effectively reducing the thermal resistance of the heat dissipation path, improving the heat dissipation performance, and further enhancing the heat dissipation efficiency of the power conversion device 300, meeting the heat dissipation requirements of power devices in high-power-density power conversion devices 300.
[0055] Next, the radiator 100 disclosed in the embodiments of the present application will be specifically explained and described in conjunction with Figures 1 to 8 this.
[0056] Among them, as Figure 1As shown, the radiator body has a housing 101, and the housing 101 defines a cavity 1011 for containing a cooling medium. An installation opening 1012 for facilitating the installation of a heat-generating device 301 is provided on the radiator body, and the installation opening 1012 communicates with the cavity 1011. The radiator body has two opposite sides. For the convenience of understanding, the two sides of the radiator body are respectively defined as the first side and the second side, and the side of the radiator body in contact with the cooling medium is defined as the inner surface, and the side of the radiator body away from the cooling medium, i.e., the side not in contact with the cooling medium, is defined as the outer surface. The installation opening 1012 is located on the first side, and the heat-generating device 301 is directly or indirectly attached to the outer surface of the first side of the radiator body.
[0057] For the convenience of understanding, the outer surface of the first side of the radiator body is defined as an installation area where the heat-generating device 301 can be installed. The heat-generating device 301 can be directly attached to the installation area, and at the same time, the heat-generating device 301 covers the installation opening 1012, that is, the projected area of the heat-generating device 301 on the first side is larger than the projected area of the installation opening 1012 on the first side. Thus, the cooling medium in the cavity 1011 can be in direct contact with the heat-generating device 301, effectively reducing the thermal resistance of the heat dissipation path, improving the heat dissipation performance, and further improving the heat dissipation efficiency of the power conversion device, meeting the heat dissipation requirements of the power device for the high-power density power conversion device. The heat-generating device 301 can also be indirectly attached to the installation area through an adapter 102. When the heat-generating device 301 is indirectly attached to the installation area through the adapter 102, the thickness within the contact surface area between the adapter 102 and the outer surface of the first side of the radiator body is not less than the wall thickness within the installation area, that is, the surface of the adapter 102 in contact with the outer surface of the first side of the radiator body can be set flush with the outer surface of the first side of the radiator body or protrude from the outer surface of the first side of the radiator body. And, as Figure 1 shown, the projection of the adapter 102 in the horizontal direction does not coincide with the projection of the side wall of the installation area in the horizontal direction. It should be noted that Figure 1 the arrow direction in
[0058] In some embodiments, the cooling medium can be but is not limited to single-phase media such as oil, and can also be but is not limited to phase-change media such as water. During operation, cooling media such as water and oil can be circulated into the cavity 1011 of the radiator body. The cooling medium can directly contact the heat-generating device 301, more efficiently absorb the heat of the heat-generating device 301 and flow away, thereby improving the heat dissipation efficiency of the power conversion device 300.
[0059] It should be noted that in the power conversion device 300, the heat generating device 301 can be a power module or a magnetic device. The power module usually includes a circuit combination of multiple IGBTs or MOSFETs and diodes, and the above devices work together to achieve high-efficiency and high-performance power conversion. The power module is the main heat generating device in the power conversion device 300. Of course, the radiator 100 disclosed in the embodiments of the present application can be used in, but not limited to, the power conversion device 300, and can also be used in other devices with heat dissipation requirements such as automotive motors or high-voltage transformers. When used in an automotive motor, the heat generating device 301 can be a heat generating device such as an electromagnetic coil. When used in a high-voltage transformer, the heat generating device 301 can be a coil winding or the like.
[0060] As Figure 2 shown, in some embodiments, a plurality of heat dissipation fins 1014 can also be provided on the second side surface of the radiator body, and each heat dissipation fin 1014 is directly connected to the second side surface of the radiator body to increase the heat dissipation area of the radiator 100, thereby obtaining a better heat dissipation effect. Among them, the heat dissipation fins 1014 can adopt a sheet structure or a columnar structure, and each heat dissipation fin 1014 can be distributed vertically along the second side surface of the radiator body. Of course, it can also be distributed horizontally along the second side surface of the radiator body, or be distributed in a matrix on the second side surface of the radiator body. The present application does not limit this here.
[0061] Of course, as Figure 3 shown, in some embodiments, the heat dissipation fins 1014 can also adopt a hollow structure. The heat dissipation fins 1014 are provided with a cavity 1015 communicating with the cavity 1011 of the radiator body, so that the cooling medium can flow into the cavity 1015 of the heat dissipation fins 1014 to improve the heat dissipation efficiency of the cooling medium, and further improve the heat dissipation performance of the radiator 100.
[0062] In some embodiments, the heat generating device 301 can be fixed at the position of the mounting opening 1012 on the first side surface of the radiator body by direct bonding or welding, so that the heat generating device 301 is directly attached to the outer surface of the first side surface of the radiator body, thereby fixing the heat generating device 301 on the radiator 100, ensuring that the cooling medium in the cavity 1011 of the radiator body can be in direct contact with the heat generating device 301, and improving the heat dissipation performance.
[0063] In other embodiments, as Figures 1 to 8As shown, in order to facilitate the connection between the heat generating device 301 and the radiator 100, an adapter 102 is provided between the heat generating device 301 and the mounting opening 1012 of the radiator body. The adapter 102 can be hermetically connected to the position of the mounting opening 1012 of the radiator body by means such as welding, gluing, crimping, flange connection or sealing ring connection. At the same time, the heat generating device 301 can be fixed to the adapter 102 by means such as welding, gluing, crimping, flange connection or sealing ring connection, so as to realize the connection between the heat generating device 301 and the radiator 100. And, in order to ensure that the cooling medium in the cavity 1011 of the radiator body can be in direct contact with the heat generating device 301, a heat dissipation channel 1021 communicating with the mounting opening 1012 is provided on the adapter 102, so that the cooling medium in the cavity 1011 of the radiator body can flow into the heat dissipation channel 1021 through the mounting opening 1012 and flow to the position of the heat generating device at 301 through the heat dissipation channel 1021, so that the cooling medium is in direct contact with the heat generating device 301, while ensuring the convenience of the connection between the heat generating device 301 and the radiator 100, the heat dissipation performance of the radiator 100 is improved.
[0064] Further, the adapter 102 and the radiator body can be connected by concave-convex fit to increase the contact area between the adapter 102 and the radiator body, so as to improve the connection strength and sealing performance. In addition, through the concave-convex fit between the adapter 102 and the radiator body, it can play a role in positioning when assembling the adapter 102 and the radiator body, and improve the assembly efficiency.
[0065] In some embodiments, as Figure 1 and Figure 5 shown, the adapter 102 includes a connection seat 1023, and an annular groove 1022 is provided on the connection seat 1023, and the annular groove 1022 is distributed along the circumference of the heat dissipation channel 1021 of the adapter 102, that is, the annular groove 1022 surrounds the outside of the heat dissipation channel 1021. At the same time, an annular protrusion 1013 matching with the annular groove 1022 is provided on the outer surface of the first side of the radiator body, and the annular protrusion 1013 is distributed along the circumference of the mounting opening 1012 of the radiator body, that is, the annular protrusion 1013 surrounds the outside of the mounting opening 1012 and protrudes away from the cavity 1011 of the radiator body. When the adapter 102 is connected to the radiator body, the annular groove 1022 on the adapter 102 is correspondingly inserted into the annular protrusion 1013 on the radiator body, and at the same time, the adapter 102 and the radiator body are fixed by welding connection or gluing connection, or external threads can also be provided on the outer wall of the annular protrusion 1013 and internal threads can be provided on the inner wall of the annular groove 1022, so that the adapter 102 and the radiator body are connected by thread fit. It should be noted that the adapter 102 can be, but is not limited to, a rectangular shape, and can also be a circular or square shape, etc.
[0066] In some other embodiments, as Figure 4 shown, two layers of annular protrusions 1013 matching with the annular groove 1022 may also be arranged on the outer surface of the first side of the radiator body, and the two layers of annular protrusions 1013 are distributed along the circumference of the mounting opening 1012 of the radiator body, that is, the two layers of annular protrusions 1013 surround the outside of the mounting opening 1012. Meanwhile, a slot for the connection seat 1023 of the adapter 102 to be inserted is formed between the two layers of annular protrusions 1013. For the convenience of understanding, the annular protrusion 1013 close to the mounting opening 1012 is defined as the inner annular protrusion, the annular protrusion 1013 far from the mounting opening 1012 is defined as the outer annular protrusion, the side wall of the annular groove 1022 of the connection seat 1023 close to the heat dissipation channel 1021 is defined as the inner wall, and the side wall of the annular groove 1022 of the connection seat 1023 far from the heat dissipation channel 1021 is defined as the outer wall. When the adapter 102 is connected to the radiator body, the annular groove 1022 on the adapter 102 is correspondingly inserted into the annular protrusion 1013 on the radiator body. At this time, the outer wall of the annular groove 1022 is inserted into the slot formed between the two layers of annular protrusions 1013 and contacts the outer annular protrusion and the inner annular protrusion respectively, and at the same time the inner wall of the annular groove 1022 contacts the inner annular protrusion, further increasing the contact area between the adapter 102 and the radiator body, thereby improving the connection strength and sealing performance.
[0067] Of course, a groove may also be arranged on the radiator body 101 along the circumference of the mounting opening 1012, and a protrusion is arranged on the adapter 102 to achieve a concave-convex fit connection, which will not be elaborated herein.
[0068] It should be noted that the annular groove 1022 can be formed by stamping on the side of the connection seat 1023 facing the heat dissipation body. At the same time, the annular groove 1022 and the annular protrusion 1013 can be continuously distributed to form a closed structure or can be spaced apart to form a non-closed structure, which is not limited herein.
[0069] In some embodiments, the heating device 301 can be arranged on the connection seat 1023 and can be fixed to the connection seat 1023 by welding or gluing to realize the connection and fixation between the heating device 301 and the radiator body.
[0070] To improve the heat exchange effect, in some embodiments, as Figure 6As shown, the adapter 102 further includes a boss 1024 provided on the connection base 1023, and the projection of the boss 1024 is located within the projection of the connection base 1023. So that when the heat-generating device 301 is disposed on the boss 1024, the boss 1024 on the connection base 1023 contacts the edge region of the heat-generating device 301, and the contact area between the adapter 102 and the heat-generating device 301 is smaller. Thus, the contact area between the cooling medium in the cavity 1011 of the radiator body 101 and the heat-generating device 301 can be increased, enhancing the heat exchange effect.
[0071] To facilitate the connection between the boss 1024 of the adapter 102 and the heat-generating device 301, as Figure 8 shown, the boss 1024 and the connection base 1023 can adopt a split structure, that is, the boss 1024 and the connection base 1023 can be made of different materials respectively to meet the requirement of welding connection between the adapter 102 and the heat-generating device 301.
[0072] In some embodiments, the adapter 102 can be integrally made of a metal material, or as Figure 8 shown, only the position of the boss 1024 is made of a metal material, such as copper or aluminum material, or as Figure 7 shown, a metal material can also be sprayed on the part where the boss 1024 is connected to the heat-generating device 301 to form a first metal layer, such as spraying copper or nickel plating on the part where the boss 1024 is connected to the heat-generating device 301, so as to weld with the copper substrate of the heat-generating device 301. Of course, in order to increase the thermal conductivity and improve the heat dissipation efficiency, the adapter 102 can also be integrally made of a high thermal conductivity material, or the boss 1024 is made of a high thermal conductivity material. The high thermal conductivity material can be but is not limited to metal matrix composites, polymer nanocomposites or high thermal conductivity carbon fibers.
[0073] In some embodiments, to facilitate the welding connection between the adapter 102 and the radiator body, the connection base 1023 of the adapter 102 can be made of a metal material, such as copper or aluminum material, so as to weld with the aluminum plate of the radiator body. Of course, a metal material can also be sprayed on the side where the annular groove 1022 fits with the radiator body to form a second metal layer, such as spraying copper or nickel plating on the fitting surface between the annular groove 1022 and the radiator body, so as to weld with the aluminum plate of the radiator body. This is not limited herein.
[0074] As Figure 9 and Figure 10 shown, the embodiment of the present application also discloses a heat dissipation system, including a radiator, and this radiator is the radiator 100 disclosed in the above embodiment. Therefore, it has all the technical effects of the above radiator 100, which will not be elaborated herein.
[0075] In order to improve the heat dissipation effect, in some embodiments, such as Figure 9 and Figure 10 shown, the heat dissipation system further includes a heat exchanger 201, and the heat exchanger 201 and the radiator 100 can be connected through a pipeline 202 to achieve a better heat dissipation effect through the circulation of the cooling medium. Of course, the heat exchanger 201 and the radiator 100 can also adopt an integrated structure.
[0076] When the cooling medium is a phase change medium, such as water, etc., the heat exchanger 201 and the radiator 100 form a siphon heat dissipation system. At this time, the radiator 100 can play the role of an evaporator, and the heat exchanger 201 can play the role of a condenser, as Figure 9 shown. When the heating device 301 generates heat, the phase change medium in the radiator 100 acting as an evaporator absorbs heat and changes from a liquid phase to a gas phase. The medium gas enters the heat exchanger 201 acting as a condenser along the pipeline, releases heat and condenses into a liquid in the heat exchanger 201, and then returns to the radiator 100 through the pipeline to achieve circulation. Among them, the heat exchanger 201 can be, but is not limited to, a parallel flow condenser. In order to ensure a better heat dissipation effect, when the cooling medium is a phase change medium, the height of the heat exchanger 201 is generally not lower than the height of the radiator 100. Of course, a cooling fan 204 can also be provided between the heat exchanger 201 and the radiator 100 to increase the rate at which the gas phase medium enters the heat exchanger 201 to release heat and condense into a liquid phase, thereby improving the heat dissipation efficiency.
[0077] When the cooling medium is a single-phase medium, such as oil, etc., the heat exchanger 201 and the radiator 100 constitute a liquid cooling system. At this time, the radiator 100 can play the role of a liquid cooling plate, as Figure 10 shown. At the same time, in order to drive the cooling medium to circulate in the liquid cooling system composed of the heat exchanger 201 and the radiator 100, a driving pump 203 is provided on the pipeline 202 connecting the heat exchanger 201 and the radiator 100. When the heating device 301 generates heat, the cooling medium in the radiator 100 acting as a liquid cooling plate absorbs heat, and under the action of the driving pump 203, the cooling medium enters the heat exchanger 201. In the heat exchanger 201, the heat is transferred to the external environment. At the same time, under the driving action of the driving pump 203, the cooling medium in the heat exchanger 201 then flows back into the radiator 100, thereby realizing the liquid cooling circulation system. Of course, a plurality of heat dissipation fins can also be provided on the heat exchanger 201, or a cooling fan 204 can be provided between the heat exchanger 201 and the radiator 100 to accelerate the heat dissipation rate of the cooling medium in the heat exchanger 201, thereby improving the heat dissipation efficiency.
[0078] such as Figures 11 to 14As shown in the figure, an embodiment of the present application also discloses a power conversion device 300, which includes a heating device 301 and a heat dissipation system for dissipating heat from the heating device 301. The heat dissipation system is the heat dissipation system 200 disclosed in the above embodiment, so it has all the technical effects of the above heat dissipation system 200, which will not be elaborated herein again.
[0079] Among them, the heating device 301 is attached to the radiator 100 of the heat dissipation system 200 to improve the heat dissipation effect of the heating device 301, so as to meet the heat dissipation requirements of the power conversion device 300 for the power device. The heating device 301 can be a power module or a magnetic attraction device. And hereinafter, unless otherwise specifically explained and described, the heating device 301 refers to the power module. Moreover, the implementation manner in which the heating device 301 is a magnetic attraction device is similar to the implementation manner in which the heating device 301 is a power module, and will not be elaborated hereinafter.
[0080] In some embodiments, as Figure 11 shown, the power conversion device further includes a sealed cavity 302, and the heating device 301 is located inside the sealed cavity 302, and the heat dissipation system 200 is located outside the sealed cavity 302. An opening 3021 for connecting the heating device 301 and the heat dissipation system 200 is provided on the sealed cavity 302. Specifically, the radiator 100 of the heat dissipation system 200 is attached to the outer wall of the sealed cavity 302, and it is ensured that the mounting opening 1012 of the radiator body corresponds to the opening 3021 of the sealed cavity 302. At the same time, the heating device 301 in the sealed cavity 302 is fixed to the radiator 100 through the adapter 102 at the position of the mounting opening 1012 of the radiator body, so as to ensure that the cooling medium in the cavity 1011 of the radiator body can directly contact the heating device 301 and improve the heat dissipation efficiency.
[0081] Furthermore, as Figures 11 to 14 shown, a heat dissipation cavity 303 is provided outside the sealed cavity 302, and the heat dissipation system 200 is located inside the heat dissipation cavity 303. In order to improve the heat dissipation efficiency of the heat dissipation cavity 303, the heat dissipation cavity 303 includes at least two air vents 3031 communicating with the external environment, and a blower fan 3032 for accelerating air flow is provided at the position of the air vents 3031 to improve the heat exchange efficiency of the heat dissipation cavity 303.
[0082] In some embodiments, as Figure 11 shown, when there are two air vents 3031, in order to accelerate the air flow rate and improve the heat exchange efficiency of the heat dissipation cavity 303, the two air vents 3031 are arranged on the same axis. For the convenience of understanding, the two air vents 3031 are respectively defined as an air inlet and an air outlet, and the air inlet is located at the bottom of the heat dissipation cavity 303 ( Figure 11 viewpoint), and the air outlet is located at the top of the heat dissipation cavity 303 ( Figure 11Viewpoint). Meanwhile, a supply fan 3032 that blows air into the interior of the heat dissipation cavity 303 can be arranged at the position of the air inlet, or a supply fan 3032 that exhausts air to the outside of the heat dissipation cavity 303 can be arranged at the position of the air outlet. Of course, supply fans 3032 can also be arranged at the positions of both the air inlet and the air outlet simultaneously to accelerate the rate of air flow, improve the heat exchange efficiency of the heat dissipation cavity 303, and further improve the heat dissipation efficiency of the power conversion device.
[0083] In some embodiments, such as Figure 12 As shown, when there are two or more air outlets 3031, for example, when there are three air outlets 3031, in order to accelerate the rate of air flow and improve the heat exchange efficiency of the heat dissipation cavity 303, two air outlets 3031 are arranged on the same axis, and the other air outlet 3031 is located on the opposite side of the two air outlets 3031. For the convenience of understanding, the two air outlets 3031 located on the same axis are respectively defined as the first air outlet and the second air outlet, and the air outlet 3031 located on the opposite side of the two air outlets 3031 is defined as the third air outlet, and the first air outlet and the second air outlet are respectively located at the bottom and the top of the heat dissipation cavity 303 ( Figure 12 Viewpoint), and the third air outlet is located at the side of the heat dissipation cavity 303 ( Figure 12 Viewpoint). Specifically, the first air outlet and the second air outlet can be air inlets, the third air outlet is an air outlet, and a supply fan 3032 that exhausts air to the outside of the heat dissipation cavity 303 is arranged at the third air outlet to accelerate the air flow rate. Of course, the first air outlet and the second air outlet can also be air outlets, the third air outlet is an air inlet, and a supply fan 3032 that blows air into the interior of the heat dissipation cavity 303 is arranged at the third air outlet, or supply fans 3032 are arranged at the first air outlet, the second air outlet, and the third air outlet. It should be noted that when there are two or more air outlets 3031, the arrangement mode of the air outlets 3031 and the installation positions of the supply fans 3032 are not limited to the modes listed in the above embodiments, and other combinations and layout forms can also be adopted, which will not be listed one by one herein.
[0084] In some embodiments, such as Figure 13 As shown, when the heat dissipation system 200 includes a heat exchanger 201 and the cooling medium is a phase change medium, the heat exchanger 201 and the radiator 100 form a siphon heat dissipation system. At this time, the heat exchanger 201 can be arranged in the heat dissipation cavity 303 outside the sealed cavity 302, and the radiator 100 is exposed to the outside of the sealed cavity 302. Specifically, the heat dissipation cavity 303 can be arranged at the top of the sealed cavity 302 ( Figure 13 Viewpoint), meanwhile, the heat exchanger 201 is located in the heat dissipation cavity 303, and the radiator 100 is located at the side of the sealed cavity 302 ( Figure 13 Viewpoint) so that the height of the heat exchanger 201 is greater than the height of the radiator 100 to ensure a better heat dissipation effect. In addition, on the left and right sides of the heat dissipation cavity 303 (Figure 13 Air outlets 3031 are respectively provided at the (perspectives), and a cooling fan 204 can be arranged between the heat exchanger 201 and the radiator 100, so that the cooling fan 204 is fixed near the air outlet 3031 through a bracket, thereby increasing the rate of the gas-phase medium entering the heat exchanger 201 to release heat and condense into a liquid phase, and at the same time, accelerating the air flow and improving the heat dissipation efficiency.
[0085] In some embodiments, as Figure 14 shown, when the cooling medium is a single-phase medium, the heat exchanger 201 and the radiator 100 form a liquid cooling system. At this time, both the radiator 100 and the heat exchanger 201 can be arranged in a heat dissipation cavity 303 outside the sealed cavity 302. At the same time, two or more air outlets 3031 can also be arranged in the heat dissipation cavity 303 to improve the heat dissipation rate of the cooling medium in the heat exchanger 201, thereby improving the heat dissipation efficiency.
[0086] It should be noted that according to the different functions and different application scenarios of the power conversion device, a magnetic device 304 can also be arranged outside the sealed cavity 302. The magnetic device 304 includes all functional elements located outside the sealed cavity 302 to meet the different functional requirements of the power conversion device and its applications in different scenarios.
[0087] The terms "first" and "second" in the description, claims and drawings of this application are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but may include steps or units that are not listed.
[0088] The above description of the disclosed embodiments enables those skilled in the art to implement or use this application. Various modifications to these embodiments will be obvious to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application will not be limited to the embodiments shown herein, but will be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims
1. A radiator, characterized in that, Comprising: A radiator body having a housing (101), the housing (101) defining a cavity (1011) for containing a cooling medium, and an installation opening (1012) for installing a heat generating device (301) is provided on the radiator body. The installation opening (1012) communicates with the cavity (1011). The heat generating device (301) is directly or indirectly attached to the outer surface of the first side of the radiator body. The heat generating device (301) covers the installation opening (1012), and the projected area of the heat generating device (301) on the first side is larger than the projected area of the installation opening (1012) on the first side.
2. The radiator according to claim 1, wherein A transfer member (102) is provided at the position of the installation opening (1012). The heat generating device (301) is connected to the transfer member (102), and the transfer member (102) is attached to the outer surface of the first side of the radiator body. A heat dissipation channel (1021) communicating with the installation opening (1012) is provided on the transfer member (102).
3. The radiator according to claim 2, characterized in that, The transfer member (102) and the radiator body are connected by a concave-convex fit.
4. The radiator according to claim 3, wherein, The transfer member (102) includes a connection seat (1023), and an annular groove (1022) is provided on the connection seat (1023). An annular protrusion (1013) matching the annular groove (1022) is provided on the outer surface of the first side of the radiator body.
5. The radiator according to claim 4, wherein The heat generating device (301) is disposed on the connection seat (1023).
6. The radiator according to claim 4, wherein, The transfer member (102) further includes a boss (1024) provided on the connection seat (1023). The projection of the boss (1024) on the first side is located within the projection of the connection seat (1023) on the first side. The heat generating device (301) is disposed on the boss (1024).
7. The radiator according to claim 6, characterized in that, The boss (1024) and the connection seat (1023) are of a split structure; The boss (1024) and the heat generating device (301) are connected by welding.
8. The radiator according to claim 6, wherein, The boss (1024) is made of a metal material; or, The boss (1024) is provided with a first metal layer.
9. The radiator according to claim 4, characterized in that, A second metal layer is provided on the side of the annular groove (1022) that fits the radiator body.
10. The radiator according to any one of claims 1 to 9, characterized in that, The radiator body has a second side opposite to the first side, and a plurality of heat dissipation fins (1014) are provided on the second side of the radiator body.
11. The radiator according to claim 10, characterized in that, The heat dissipation fins (1014) are provided with cavities (1015) communicating with the cavity (1011) of the radiator body.
12. A heat dissipation system, characterized in that, Including the radiator (100) according to any one of claims 1 to 11.
13. The heat dissipation system according to claim 12, wherein, Further including a heat exchanger (201), the heat exchanger (201) communicating with the radiator (100).
14. A power conversion device, characterized in that, Including a heat generating device (301) and the heat dissipation system (200) according to claim 12 or 13, the heat generating device (301) being attached to the radiator (100).
15. The power conversion device according to claim 14, characterized in that, It further includes a sealed cavity (302), the heating device (301) is located inside the sealed cavity (302), the heat dissipation system (200) is located outside the sealed cavity (302), and an opening (3021) for connecting the heating device (301) and the heat dissipation system (200) is formed on the sealed cavity (302).
16. The power conversion device according to claim 15, characterized in that, A heat dissipation cavity (303) is arranged outside the sealed cavity (302), and the heat dissipation system (200) is located inside the heat dissipation cavity (303).
17. The power conversion device according to claim 16, wherein, The heat dissipation cavity (303) includes at least two air vents (3031), and air supply fans (3032) are arranged at the positions of the air vents (3031).
Citation Information
Cited By
Heat dissipation device, heat dissipation system, and power conversion apparatus
WO2026036879A1