Heat dissipation assembly and power conversion equipment

Abstract

The utility model relates to the technical field of device heat dissipation, in particular to a heat dissipation assembly and power conversion equipment. The heat dissipation assembly comprises a liquid cooling plate, a heat exchanger and a water pump, the liquid cooling plate comprises a first plate face and a second plate face, the first plate face is used for exchanging heat with a heating device, the liquid cooling plate is provided with a water inlet and a communicating outlet, and the liquid cooling plate, the heat exchanger and the water pump are communicated to form a circulating heat dissipation loop; the first connecting part is provided with a communicating inlet, the second connecting part is provided with a water outlet, the first connecting part is arranged on the second plate face, and the communicating inlet communicates with the communicating outlet. According to the heat dissipation assembly provided by the invention, heat dissipation of the heating device is realized, and the heat dissipation and cooling effects of the heating device are ensured. In addition, the heat dissipation assembly can integrate the liquid cooling plate and the heat exchanger into a whole, the occupied space of the heat dissipation assembly is reduced, and the heat dissipation and cooling effects on the heating device are improved.

Description

Technical Field

[0001] This application relates to the technical field of device heat dissipation, and particularly to a heat dissipation component and a power conversion device. Background Art

[0002] A power conversion device is a power conversion component that is used to convert electrical energy from one form to another to achieve energy transmission and control under different power requirements. As the power of the power conversion device increases, the heat flux density of the power conversion device becomes higher and higher. Therefore, a heat dissipation component is required to dissipate heat from the power conversion device to ensure the normal operation of the power conversion device.

[0003] With the development of power electronic devices towards smaller size and higher integration, the installation space for heat dissipation components is often insufficient. However, if there are no good heat dissipation measures for power devices, it will not only limit the application scenarios of power devices, but also hinder the optimization of product performance. How to enhance the heat dissipation ability of power devices under high power density conditions has become a key problem that needs to be solved urgently. Summary of the Utility Model

[0004] The purpose of this application is to provide a heat dissipation component and a power conversion device to improve the heat dissipation effect on heat-generating devices and reduce the occupied space of the heat dissipation component.

[0005] To achieve this purpose, this application adopts the following technical solutions:

[0006] A heat dissipation component includes:

[0007] A liquid cooling plate, the liquid cooling plate includes a first plate surface and a second plate surface, the first plate surface is used for heat exchange with a heat-generating device, and the liquid cooling plate has a water inlet and a communication outlet; and

[0008] A heat exchanger and a water pump, the liquid cooling plate, the heat exchanger and the water pump are connected to form a circulating heat dissipation loop, the heat exchanger includes a first connection part and a second connection part that are connected, the first connection part has a communication inlet, the second connection part has a water outlet, the first connection part is arranged on the second plate surface and the communication inlet is communicated with the communication outlet.

[0009] As an optional solution, the second connection part is also arranged on the second plate surface.

[0010] As an optional solution, the heat exchanger is a serpentine flat tube heat exchanger, the heat exchanger further includes a main body part, the first connection part, the main body part and the second connection part are connected in sequence, and the main body part is serpentine.

[0011] As an optional solution, the heat exchanger is a serpentine flat tube heat exchanger, and the heat exchanger further includes:

[0012] A bottom plate disposed on the second plate surface, with a plurality of communicating flow channels spaced inside the bottom plate; and

[0013] A plurality of heat exchange pipes, each of which is U-shaped. The plurality of heat exchange pipes are arranged in sequence and disposed on the bottom plate. Adjacent two communicating flow channels are connected by one heat exchange pipe. The heat exchange pipe at the head end is connected to the first connection part, and the heat exchange pipe at the tail end is connected to the second connection part.

[0014] As an alternative, the heat exchanger is a parallel flow heat exchanger, and the heat exchanger further includes:

[0015] A plurality of connecting flat pipes, which are arranged in parallel and at intervals. Each connecting flat pipe is connected between the first connection part and the second connection part.

[0016] As an alternative, the plurality of connecting flat pipes are arranged at intervals in the horizontal direction.

[0017] As an alternative, the plurality of connecting flat pipes are arranged at intervals in the vertical direction, and among two adjacent arranged connecting flat pipes, the inner diameter of the connecting flat pipe located above is larger than the inner diameter of the connecting flat pipe located below.

[0018] As an alternative, the heat dissipation assembly further includes:

[0019] A plurality of heat dissipation fins, with a plurality of the heat dissipation fins spaced on the heat exchanger.

[0020] A power conversion device includes a device box body, a heating device, and the heat dissipation assembly as described above. A heat dissipation air duct is provided inside the device box body, and the heat exchanger is located in the heat dissipation air duct.

[0021] As an alternative, the heat dissipation assembly further includes:

[0022] A heat dissipation fan, which is installed in the heat dissipation air duct.

[0023] As an alternative, the heat dissipation air duct includes an external circulation heat dissipation air duct. The heating device includes a power device, the power device is located in the external circulation heat dissipation air duct, and the first plate surface is attached and connected to the power device.

[0024] As an alternative, the power conversion device further includes:

[0025] A reactor, which is electrically connected to the heating device and is located in the external circulation heat dissipation air duct.

[0026] As an alternative, the heat dissipation air duct includes an independent outer circulation heat dissipation air duct and an inner circulation heat dissipation air duct. The heating device includes a power device and an electronic device that are electrically connected. The heat exchanger includes a first heat exchanger and a second heat exchanger that are connected. The first heat exchanger and the second heat exchanger are arranged on the second plate surface. The power device and the first heat exchanger are both located in the outer circulation heat dissipation air duct. The electronic device and the second heat exchanger are both located in the inner circulation heat dissipation air duct. And the first plate surface is attached to the power device.

[0027] The present application provides a heat dissipation assembly, which includes a liquid cooling plate, a heat exchanger and a water pump. The liquid cooling plate, the heat exchanger and the water pump are connected to form a circulating heat dissipation loop. And the first plate surface on the liquid cooling plate is used for heat exchange with the heating device, so as to achieve the heat dissipation and cooling effect on the heating device. In addition, the liquid cooling plate has a water inlet and a communication outlet. The heat exchanger includes a first connection part and a second connection part that are connected. The first connection part has a communication inlet, and the second connection part has a water outlet. The communication inlet is communicated with the communication outlet. And the first connection part is arranged on the second plate surface of the liquid cooling plate, so as to integrate the liquid cooling plate and the heat exchanger into one body, so that there is no need to connect the liquid cooling plate and the heat exchanger through additional pipelines and plugs, reducing the cost, reducing the risk of liquid leakage, and reducing the communication path between the liquid cooling plate and the heat exchanger. Furthermore, the heat exchange path of the entire heat dissipation assembly is reduced, improving the heat dissipation effect. In addition, by integrating the liquid cooling plate and the heat exchanger into one body, the occupied space of the heat dissipation assembly is also reduced.

[0028] The present application also provides a power conversion device. By applying the above heat dissipation assembly, there is no need to connect the liquid cooling plate and the heat exchanger through additional pipelines and plugs, reducing the cost, reducing the risk of liquid leakage, improving the heat dissipation and cooling effect on the heating device, and reducing the occupied space of the heat dissipation assembly. Description of the Drawings

[0029] Figure 1 is a partial structural schematic diagram of the heat dissipation assembly provided in the first embodiment of the present application Figure 1 ;

[0030] Figure 2 is a partial structural schematic diagram of the heat dissipation assembly provided in the first embodiment of the present application Figure 2 ;

[0031] Figure 3 is a structural block diagram of the power conversion device provided in the first embodiment of the present application;

[0032] Figure 4 is a partial structural schematic diagram of the heat dissipation assembly provided in the second embodiment of the present application Figure 1 ;

[0033] Figure 5 It is a partial structural schematic diagram of the heat dissipation component provided in the second embodiment of the present application Figure 2 ;

[0034] Figure 6 It is a partial structural schematic diagram of the heat dissipation component provided in the third embodiment of the present application Figure 1 ;

[0035] Figure 7 It is a partial structural schematic diagram of the heat dissipation component provided in the third embodiment of the present application Figure 2 ;

[0036] Figure 8 It is a partial structural schematic diagram of the heat dissipation component provided in the third embodiment of the present application Figure 3 ;

[0037] Figure 9 It is a structural block diagram of the power conversion device provided in the fourth embodiment of the present application;

[0038] Figure 10 It is a structural block diagram of the power conversion device provided in the fifth embodiment of the present application.

[0039] In the figure:

[0040] 1. Equipment box body; 11. Heat dissipation air duct; 111. Outer circulation heat dissipation air duct; 112. Inner circulation heat dissipation air duct; 113. Air inlet; 114. Air outlet;

[0041] 2. Heating device; 21. Power device; 22. Electronic device;

[0042] 3. Heat dissipation component; 31. Liquid cooling plate; 311. Water inlet; 312. First plate surface; 313. Second plate surface; 3131. First plane; 3132. Second plane; 314. Communication outlet; 32. Heat exchanger; 301. First heat exchanger; 302. Second heat exchanger; 321. First connection part; 3211. Communication inlet; 322. Main body part; 323. Second connection part; 324. Water outlet; 325. Bottom plate; 3250. Partition plate; 3251. Communication flow channel; 326. Heat exchange pipeline; 327. Connecting flat pipe; 33. Water pump; 34. Heat dissipation fan; 341. First heat dissipation fan; 342. Second heat dissipation fan; 35. Heat dissipation fin;

[0043] 4. Reactor. Specific embodiments

[0044] In order to make the technical problems solved by the present application, the technical solutions adopted and the achieved technical effects clearer, the technical solutions of the present application will be further described below with reference to the drawings and through specific embodiments.

[0045] In the description of the present application, unless otherwise clearly defined and limited, the terms "connected", "connected to", and "fixed" shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0046] In the present application, unless otherwise clearly defined and limited, the first feature being "above" or "below" the second feature may include the direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but in contact through additional features between them. Moreover, the first feature being "above", "over", and "on top of" the second feature includes that the first feature is directly above and obliquely above the second feature, or merely indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature being "below", "beneath", and "under" the second feature includes that the first feature is directly below and obliquely below the second feature, or merely indicates that the horizontal height of the first feature is lower than that of the second feature.

[0047] In the description of this embodiment, the orientation or positional relationship such as "above", "below", "left", and "right" is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of description and simplifying the operation, rather than indicating or implying that the device or component referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application. In addition, the terms "first" and "second" are only used for distinction in description and do not have special meanings.

[0048] Embodiment 1

[0049] In the prior art, the heat dissipation component in the power conversion device includes a liquid cooling plate, a heat exchanger, and a water pump. The liquid cooling plate, the heat exchanger, and the water pump are connected to form a circulating heat dissipation loop, and the liquid cooling plate is used for heat exchange with the heating device to achieve heat dissipation and temperature reduction of the heating device. However, both the liquid cooling plate and the heat exchanger need to be connected through additional pipelines and plugs. The setting of the pipelines and plugs greatly increases the cost of heat dissipation and also increases the risk of liquid leakage. In addition, due to the separate arrangement of the liquid cooling plate and the heat exchanger, the occupied space of the entire heat dissipation component is greatly increased, the heat exchange path is increased, and the heat dissipation effect is reduced.

[0050] To solve the above problems, as Figures 1 to 3As shown in the figure, this embodiment provides a heat dissipation component 3, which includes a liquid cooling plate 31, a heat exchanger 32, and a water pump 33. Among them, the liquid cooling plate 31 includes a first plate surface 312 and a second plate surface 313. The first plate surface 312 is used for heat exchange with the heat generating device 2. The liquid cooling plate 31 has a water inlet 311 and a communicating outlet 314. The liquid cooling plate 31, the heat exchanger 32, and the water pump 33 are connected to form a circulating heat dissipation loop. The heat exchanger 32 includes a first connecting portion 321 and a second connecting portion 323 that are connected. The first connecting portion 321 has a communicating inlet 3211, and the second connecting portion 323 has a water outlet 324. The communicating inlet 3211 is connected to the communicating outlet 314, and the first connecting portion 321 is arranged on the second plate surface 313. For the heat dissipation component 3 provided in this embodiment, by connecting the liquid cooling plate 31, the heat exchanger 32, and the water pump 33 to form a circulating heat dissipation loop, and enabling the first plate surface 312 of the liquid cooling plate 31 to exchange heat with the heat generating device 2, the heat dissipation and temperature reduction effect on the heat generating device 2 can be achieved. In addition, by connecting the communicating inlet 3211 to the communicating outlet 314 and arranging the first connecting portion 321 of the heat exchanger 32 on the second plate surface 313 of the liquid cooling plate 31, the liquid cooling plate 31 and the heat exchanger 32 are integrated into one body, so that there is no need to connect the liquid cooling plate 31 and the heat exchanger 32 through additional pipelines and plugs, reducing the cost and the risk of liquid leakage, and also reducing the connecting path between the liquid cooling plate 31 and the heat exchanger 32, thereby reducing the heat exchange path of the entire heat dissipation component 3 and improving the heat dissipation effect. In addition, by integrating the liquid cooling plate 31 and the heat exchanger 32 into one body, the occupied space of the entire heat dissipation component 3 is also reduced.

[0051] Optionally, in this embodiment, the water outlet 324 is connected to the water inlet 311 through the water pump 33, so that the liquid cooling plate 31, the heat exchanger 32, and the water pump 33 are sequentially connected to form a circulating heat dissipation loop.

[0052] Optionally, in this embodiment, as Figure 1 and Figure 2 shown, the second connecting portion 323 is also arranged on the second plate surface 313. With the above arrangement, the heat exchange path of the entire heat dissipation component 3 and the occupied space of the heat dissipation component 3 are further reduced.

[0053] Optionally, in this embodiment, the liquid cooling plate 31 and the heat exchanger 32 can be integrally formed parts, that is, the first connecting portion 321 and the second connecting portion 323 are integrally formed with the second plate surface 313. In other embodiments, the liquid cooling plate 31 and the heat exchanger 32 can also be integrated into an integral structure by welding, that is, both the first connecting portion 321 and the second connecting portion 323 are welded to the second plate surface 313.

[0054] Optionally, in this embodiment, as Figure 1 and Figure 2As shown, the heat exchanger 32 is a serpentine flat tube heat exchanger. The serpentine flat tube heat exchanger has the advantages of simple structure, convenient operation and management, and can withstand high pressure. Specifically, the heat exchanger 32 further includes a main body portion 322. The first connection portion 321, the main body portion 322, and the second connection portion 323 are connected in sequence, and the main body portion 322 is serpentine. The specific structural design of the heat exchanger 32 enables the first connection portion 321 and the second connection portion 323 to be integrated with the liquid cooling plate 31, and only the bending operation needs to be performed on the main body portion 322, which is convenient for production and processing.

[0055] Specifically, as Figure 2 shown by the direction of the arrow in the figure, under the action of the water pump 33, the cooling medium enters the liquid cooling plate 31 through the water inlet 311, and then sequentially enters the first connection portion 321 through the communication outlet 314 and the communication inlet 3211, and then passes through the main body portion 322 in the first connection portion 321 and enters the second connection portion 323. It then returns to the liquid cooling plate 31 through the water outlet 324 on the second connection portion 323. It should be noted that the heating device 2 is disposed on the first plate surface 312, the water inlet 311 is located at one end of the heating device 2, the communication outlet 314 is located at the other end of the heating device 2, the coolant in the liquid cooling plate 31 completely passes through the heating device 2 and then enters the communication inlet 3211 of the heat exchanger 32. The cooling channel in the liquid cooling plate 31 and the heat exchange channel in the main body portion 322 of the heat exchanger 32 are connected but completely isolated, ensuring that the coolant completely exchanges heat with the heating device 2 before entering the heat exchanger 32.

[0056] Optionally, in this embodiment, as Figure 1 and Figure 2 shown, the heat dissipation assembly 3 further includes a plurality of heat dissipation fins 35. A plurality of heat dissipation fins 35 are arranged at intervals on the heat exchanger 32. By arranging a plurality of heat dissipation fins 35 at intervals on the heat exchanger 32, the heat exchange area of the heat exchanger 32 is increased, effectively improving the heat exchange performance of the heat exchanger 32. Specifically, in this embodiment, a plurality of heat dissipation fins 35 are arranged at intervals on the serpentine main body portion 322, thereby improving the heat dissipation effect on the main body portion 322. Optionally, in this embodiment, the heat dissipation fins 35 can be V-shaped fins, and the heat dissipation fins 35 can also be U-shaped fins. The specific form of the heat dissipation fins 35 is not limited in this embodiment.

[0057] As Figure 3As shown in the figure, this embodiment also provides a power conversion device, which includes a device housing 1, a heating device 2, and the above-mentioned heat dissipation component 3. Among them, a heat dissipation air duct 11 is provided in the device housing 1, and the heat exchanger 32 is located in the heat dissipation air duct 11. By applying the above-mentioned heat dissipation component 3, the power conversion device provided in this embodiment enables the liquid cooling plate 31 and the heat exchanger 32 to be connected without additional pipelines and plugs, reducing costs and the risk of liquid leakage, improving the heat dissipation and cooling effect on the heating device 2, and also reducing the occupied space of the heat dissipation component 3.

[0058] Optionally, in this embodiment, as Figure 3 shown, the heat dissipation air duct 11 is an external circulation heat dissipation air duct 111, the heating device 2 is a power device 21, and the heat exchanger 32 is a first heat exchanger 301. The power device 21, the liquid cooling plate 31, and the first heat exchanger 301 are all located in the external circulation heat dissipation air duct 111, and the first plate surface 312 of the liquid cooling plate 31 is attached to the power device 21. With the above settings, when dissipating heat from the power device 21, the cooling medium flowing into the liquid cooling plate 31 from the first heat exchanger 301 exchanges heat with the power device 21 to achieve liquid cooling of the power device 21. And the cooling medium after heat exchange and temperature rise flows back to the first heat exchanger 301 under the action of the water pump 33. The first heat exchanger 301 exchanges heat in the external circulation heat dissipation air duct 111 to cool the cooling medium. The cooled cooling medium flows into the liquid cooling plate 31 again to perform liquid cooling on the power device 21, and so on in a cycle, thereby achieving the cooling of the power device 21. It should be noted that the device housing 1 is provided with an air inlet 113 and an air outlet 114 communicating with the outside. The two ends of the external circulation heat dissipation air duct 111 are respectively communicated with the air inlet 113 and the air outlet 114, so that the cold air from the outside enters the external circulation heat dissipation air duct 111 in the device housing 1 through the air inlet 113. The cold air exchanges heat with the high-temperature cooling medium in the first heat exchanger 301 in the external circulation heat dissipation air duct 111. The cold air after heat exchange rises in temperature and is discharged from the air outlet 114, while the high-temperature cooling medium in the first heat exchanger 301 is cooled after heat exchange with the cold air, so that the cooled cooling medium flows into the liquid cooling plate 31 again to perform liquid cooling on the power device 21.

[0059] Optionally, in this embodiment, the liquid cooling plate 31, the first heat exchanger 301, and the water pump 33 are connected end to end in sequence to form a circulating heat dissipation loop. In addition, in this embodiment, a flow disturbance structure is provided in the liquid cooling flow channel inside the liquid cooling plate 31, thereby increasing the heat exchange area of the liquid cooling plate 31, improving the heat exchange performance of the liquid cooling plate 31, and further improving the liquid cooling effect of the liquid cooling plate 31 on the power device 21. Optionally, in this embodiment, the flow disturbance structure can be in the form of flow disturbance columns or staggered teeth. This embodiment does not limit the specific form of the flow disturbance structure.

[0060] Optionally, in this embodiment, as Figure 3 shown, the heat dissipation component 3 provided in this embodiment further includes a heat dissipation fan 34, and the heat dissipation fan 34 is installed in the heat dissipation air duct 11. Specifically, in this embodiment, the heat dissipation fan 34 is the first heat dissipation fan 341, and the first heat dissipation fan 341 is installed in the outer circulation heat dissipation air duct 111, thereby promoting the air circulation in the outer circulation heat dissipation air duct 111 and improving the ventilation and cooling effect of the outer circulation heat dissipation air duct 111 on the cooling medium in the first heat exchanger 301.

[0061] Optionally, in this embodiment, as Figure 3 shown, the power conversion device further includes a reactor 4, the reactor 4 is electrically connected to the power device 21, and the reactor 4 is located in the outer circulation heat dissipation air duct 111, thereby realizing the ventilation and cooling effect on the reactor 4. In addition, by placing both the reactor 4 and the first heat exchanger 301 in the outer circulation heat dissipation air duct 111, the first heat dissipation fan 341 is shared for ventilation and heat dissipation, effectively reducing the number of fans installed, lowering the power consumption and cost, and also reducing the noise generated during the operation of the fans. In this embodiment, as Figure 3 shown by the direction of the arrow in, under the action of the first heat dissipation fan 341, the cold air from the outside enters the outer circulation heat dissipation air duct 111 through the air inlet 113. After the cold air exchanges heat with the cooling medium in the first heat exchanger 301 in the outer circulation heat dissipation air duct 111, it then passes through the reactor 4 to perform air-cooling heat dissipation on the reactor 4, and finally is discharged through the air outlet 114. Optionally, in other embodiments, the reactor 4 can also be placed separately in a duct, and a separate fan is used to ventilate and dissipate heat from the reactor 4.

[0062] Embodiment Two

[0063] The heat dissipation component 3 provided in this embodiment is basically the same as that in Embodiment One. The difference between the heat dissipation component 3 provided in this embodiment and that in Embodiment One lies in: the specific structure of the heat exchanger 32 is different.

[0064] Specifically, in this embodiment, as Figure 4 and Figure 5 shown, the heat exchanger 32 is a serpentine flat tube heat exchanger, and the heat exchanger 3 is further provided with a bottom plate 325 and a plurality of heat exchange pipes 326. Among them, the bottom plate 325 is arranged on the second plate surface 313, and a plurality of communicating channels 3251 are arranged at intervals inside the bottom plate 325. Each heat exchange pipe 326 is in a U shape, and a plurality of heat exchange pipes 326 are arranged in sequence and are arranged on the bottom plate 325. Adjacent two communicating channels 3251 are connected by one heat exchange pipe 326. The heat exchange pipe 326 at the head end is connected to the first connecting portion 321, and the heat exchange pipe 326 at the tail end is connected to the second connecting portion 323. As Figure 5As shown by the arrow direction in the figure, the above settings enable the cooling medium to enter the liquid cooling plate 31 through the water inlet 311 under the action of the water pump 33, and then enter the first connecting part 321 through the communication outlet 314 and the communication inlet 3211 in sequence, enter the first heat exchange pipe 326 through the first connecting part 321, then pass through each heat exchange pipe 326 in sequence through the corresponding communication flow channel 3251, and finally enter the second connecting part 323 through the heat exchange pipe 326 at the end, and then return to the liquid cooling plate 31 through the water outlet 324 on the second connecting part 323. The structural design of the heat exchanger 32 enables multiple heat exchange pipes 326 to be connected in sequence to form a serpentine channel, and the bottom plate 325 is arranged on the second plate surface 313, making the structure of the heat exchanger 32 more compact.

[0065] In this embodiment, as Figure 4 and Figure 5 shown, a partition plate 3250 is arranged inside the bottom plate 325, and the partition plate 3250 divides the internal cavity of the bottom plate 325 into each communication flow channel 3251. In other embodiments, it can also be that the liquid cooling plate 31 with a cooling channel is welded to the housing formed by the bottom plate 325 and the partition plate 3250 to form each communication flow channel 3251.

[0066] Optionally, in this embodiment, a plurality of heat dissipation fins 35 are arranged at intervals on each heat exchange pipe 326, so as to improve the heat dissipation effect of the heat exchange pipe 326.

[0067] Embodiment Three

[0068] The heat dissipation assembly 3 provided in this embodiment is basically the same as that in Embodiment One. The difference between the heat dissipation assembly 3 provided in this embodiment and that in Embodiment One lies in: the specific structure of the heat exchanger 32 is different.

[0069] In this embodiment, as Figures 6 to 8 shown, the heat exchanger 32 in this embodiment is a parallel flow heat exchanger, and the parallel flow heat exchanger has the advantages of compact structure, large heat transfer coefficient, difficult dirt retention and small resistance.

[0070] Specifically, as Figures 6 to 8 shown, the heat exchanger 32 further includes a plurality of connecting flat tubes 327, and the plurality of connecting flat tubes 327 are arranged in parallel and at intervals, and each connecting flat tube 327 communicates between the first connecting part 321 and the second connecting part 323. As Figure 7 and Figure 8As shown by the arrow direction in the figure, the above settings enable the cooling medium to enter the liquid cooling plate 31 through the water inlet 311 under the action of the water pump 33, and then enter the first connection part 321 through the communication outlet 314 and the communication inlet 3211 in sequence. The cooling medium entering the first connection part 321 enters the second connection part 323 through each connecting flat tube 327, and then returns to the liquid cooling plate 31 through the water outlet 324 on the second connection part 323.

[0071] Optionally, as Figure 6 and Figure 7 shown, the multiple connecting flat tubes 327 are arranged at intervals in the horizontal direction, ensuring that the cooling medium in the first connection part 321 can uniformly flow into each connecting flat tube 327 and finally converge to the second connection part 323, ensuring the heat exchange effect of each connecting flat tube 327.

[0072] As Figure 8 shown, if the multiple connecting flat tubes 327 are arranged at intervals in the vertical direction, and in two adjacent connecting flat tubes 327, the inner diameter of the connecting flat tube 327 located above is larger than the inner diameter of the connecting flat tube 327 located below. The above settings enable the heat exchanger 32 to adjust the inner diameter of each connecting flat tube 327 according to the use scenario and the placement angle, increase the inner diameter of the connecting flat tube 327 at a higher position, thereby reducing the internal flow resistance of the connecting flat tube 327 at a higher position, so that the flow rate of the cooling medium flowing into each connecting flat tube 327 is uniform and the heat exchange effect is increased.

[0073] Optionally, in this embodiment, a plurality of heat dissipation fins 35 are arranged at intervals between two adjacent connecting flat tubes 327, thereby improving the heat dissipation effect of the connecting flat tubes 327.

[0074] Embodiment 4

[0075] This embodiment provides a power conversion device. The power conversion device provided in this embodiment is basically the same as that in Embodiment 1. The difference between the power conversion device provided in this embodiment and that in Embodiment 1 is as follows:

[0076] As Figure 9As shown, in this embodiment, the heat dissipation air duct 11 includes an independent outer circulation heat dissipation air duct 111 and an inner circulation heat dissipation air duct 112. The heat generating device 2 includes an electrically connected power device 21 and an electronic device 22. Both the electronic device 22 and the power device 21 are electrically connected to the reactor 4. And the heat exchanger 32 includes a first heat exchanger 301 and a second heat exchanger 302 which are connected in communication. The liquid cooling plate 31, the first heat exchanger 301, the water pump 33 and the second heat exchanger 302 are sequentially connected end to end to form a circulating heat dissipation loop. The heat dissipation fan 34 includes a first heat dissipation fan 341 and a second heat dissipation fan 342. The second heat dissipation fan 342, the electronic device 22 and the second heat exchanger 302 are all located in the inner circulation heat dissipation air duct 112. The first heat dissipation fan 341 and the first heat exchanger 301 are both located in the outer circulation heat dissipation air duct 111. And the first plate surface 312 is attached to and connected with the power device 21. The first connection part 321 of the second heat exchanger 302 is arranged on the second plate surface 313.

[0077] With the above settings, under the action of the water pump 33, the low-temperature cooling medium enters the second heat exchanger 302 to exchange heat with the hot air in the inner circulation heat dissipation air duct 112, so that the hot air in the inner circulation heat dissipation air duct 112 is cooled to form cold air. And under the action of the second heat dissipation fan 342, air-cooled heat dissipation of the electronic device 22 is realized. Then the cooling medium in the second heat exchanger 302 enters the liquid cooling plate 31 and exchanges heat with the power device 21 attached to and connected with the liquid cooling plate 31 to realize liquid-cooled temperature reduction of the power device 21. Then the cooling medium heated up in the liquid cooling plate 31 enters the first heat exchanger 301. Under the action of the first heat dissipation fan 341, the outside cold air enters the outer circulation heat dissipation air duct 111 through the air inlet 113. After the cold air exchanges heat with the cooling medium in the first heat exchanger 301 in the outer circulation heat dissipation air duct 111, the cooled cooling medium returns to the second heat exchanger 302 in the first heat exchanger 301, and so on.

[0078] It should be noted that in this embodiment, the structures of the second heat exchanger 302 and the first heat exchanger 301 can both be in the form of the serpentine flat tube heat exchanger in the first embodiment or the second embodiment above, or both can be in the form of the parallel flow heat exchanger in the third embodiment above. And heat dissipation fins 35 are arranged on both the second heat exchanger 302 and the first heat exchanger 301.

[0079] In addition, it should be noted that in this embodiment, only the first connection part 321 of the second heat exchanger 302 is arranged on the second plate surface 313, so that only the second heat exchanger 302 is integrated with the liquid cooling plate 31, and the first heat exchanger 301 is not integrated with the liquid cooling plate 31.

[0080] Optionally, in this embodiment, the reactor 4 is placed alone in a duct and is ventilated and cooled by a separate fan.

[0081] Embodiment V

[0082] This embodiment provides a power conversion device. The power conversion device provided in this embodiment is basically the same as that in Embodiment I. The difference between the power conversion device provided in this embodiment and that in Embodiment I is as follows:

[0083] In this embodiment, as Figure 10 shown, the heat dissipation air duct 11 includes an independent outer circulation heat dissipation air duct 111 and an inner circulation heat dissipation air duct 112. The heating device 2 includes an electrically connected power device 21 and an electronic device 22. Both the electronic device 22 and the power device 21 are electrically connected to the reactor 4. And the heat exchanger 32 includes a first heat exchanger 301 and a second heat exchanger 302 that are communicated with each other. The liquid cooling plate 31, the first heat exchanger 301, the water pump 33, and the second heat exchanger 302 are sequentially connected end to end to form a circulating heat dissipation loop. The heat dissipation fan 34 includes a first heat dissipation fan 341 and a second heat dissipation fan 342. The first heat dissipation fan 341, the first heat exchanger 301, the liquid cooling plate 31, the power device 21, and the reactor 4 are all located in the outer circulation heat dissipation air duct 111. The second heat dissipation fan 342, the electronic device 22, and the second heat exchanger 302 are all located in the inner circulation heat dissipation air duct 112. The first connection portions 321 of the first heat exchanger 301 and the second heat exchanger 302 are both arranged on the second plate surface 313 of the liquid cooling plate 31, and the first plate surface 312 is in fit connection with the power device 21.

[0084] With the above settings, under the action of the water pump 33, the low-temperature cooling medium enters the second heat exchanger 302 to exchange heat with the hot air in the internal circulation heat dissipation air duct 112, so that the hot air in the internal circulation heat dissipation air duct 112 is cooled to form cold air, and under the action of the second heat dissipation fan 342, air-cooled heat dissipation of the electronic device 22 is realized. Then, the cooling medium in the second heat exchanger 302 enters the liquid cooling plate 31 and exchanges heat with the power device 21 attached to the liquid cooling plate 31 to realize liquid cooling and temperature reduction of the power device 21. Next, the cooling medium heated in the liquid cooling plate 31 enters the first heat exchanger 301. Under the action of the first heat dissipation fan 341, the outside cold air enters the external circulation heat dissipation air duct 111 through the air inlet 113. After the cold air exchanges heat with the cooling medium in the first heat exchanger 301 in the external circulation heat dissipation air duct 111, the cooled cooling medium returns to the second heat exchanger 302 in the first heat exchanger 301, and so on. And after the cold air exchanges heat with the cooling medium in the first heat exchanger 301 in the external circulation heat dissipation air duct 111, it then passes through the reactor 4 to perform air-cooled heat dissipation on the reactor 4, and finally is discharged through the air outlet 114. It should be noted that since the first heat exchanger 301 and the second heat exchanger 302 are integrally arranged on the second plate surface 313 of the liquid cooling plate 31, the cost is further reduced, the risk of liquid leakage is reduced, and the heat exchange path of the heat dissipation component 3 and the occupied space of the heat dissipation component 3 are further reduced.

[0085] In this embodiment, the second plate surface 313 includes a first plane 3131 and a second plane 3132 connected at an angle. Among them, the first connecting portion 321 of the first heat exchanger 301 is arranged on the first plane 3131, the first connecting portion 321 of the second heat exchanger 302 is arranged on the second plane 3132, a communication outlet 314 is arranged at the corresponding positions of the first plane 3131 and the second plane 3132, and the communication inlet 3211 on the first connecting portion 321 of the first heat exchanger 301 is communicated with the communication outlet 314 on the first plane 3131, and the communication inlet 3211 on the first connecting portion 321 of the second heat exchanger 302 is communicated with the communication outlet 314 on the second plane 3132.

[0086] Optionally, in this embodiment, the structures of the second heat exchanger 302 and the first heat exchanger 301 can both be in the form of the serpentine flat tube heat exchanger in the first or second embodiment above, or both can be in the form of the parallel flow heat exchanger in the third embodiment above. And heat dissipation fins 35 are arranged on both the second heat exchanger 302 and the first heat exchanger 301.

[0087] It should be noted that, in this embodiment, the inner circulation cooling air duct 112 is located in a separate chamber to ensure the sealing protection level for the electronic device 22. In addition, it should be noted that, in this embodiment, a communication avoidance hole is provided between the outer circulation cooling air duct 111 and the inner circulation cooling air duct 112, and the side of the second plane 3132 facing the second heat exchanger 302 is connected to the second heat exchanger 302 in the inner circulation cooling air duct 112 through the avoidance hole. Preferably, in this embodiment, the outer periphery of the avoidance hole is coated with sealant, and the sealant is located at the connection between the second plane 3132 and the second heat exchanger 302, thereby ensuring the sealing effect between the outer circulation cooling air duct 111 and the inner circulation cooling air duct 112.

[0088] Obviously, the above embodiments of the present application are merely examples for clearly explaining the present application, rather than limiting the implementation manners of the present application. For those of ordinary skill in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation manners here. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present application shall be included in the protection scope of the claims of the present application.

Claims

1. A heat dissipation component, characterized in that, Comprising: A liquid cooling plate (31), the liquid cooling plate (31) includes a first plate surface (312) and a second plate surface (313), the first plate surface (312) is used for heat exchange with the heat generating device (2), and the liquid cooling plate (31) has a water inlet (311) and a communication outlet (314); and A heat exchanger (32) and a water pump (33), the liquid cooling plate (31), the heat exchanger (32) and the water pump (33) are connected to form a circulating heat dissipation loop, the heat exchanger (32) includes a connected first connection part (321) and a second connection part (323), the first connection part (321) has a communication inlet (3211), the second connection part (323) has a water outlet (324), the first connection part (321) is arranged on the second plate surface (313) and the communication inlet (3211) is communicated with the communication outlet (314).

2. The heat dissipation component according to claim 1, wherein The second connection part (323) is also arranged on the second plate surface (313).

3. The heat dissipation component according to claim 2, wherein The heat exchanger (32) is a serpentine flat tube heat exchanger, the heat exchanger (32) further includes a main body part (322), the first connection part (321), the main body part (322) and the second connection part (323) are sequentially connected, and the main body part (322) is serpentine.

4. The heat dissipation component according to claim 2, characterized in that, The heat exchanger (32) is a serpentine flat tube heat exchanger, and the heat exchanger (32) further includes: A bottom plate (325), the bottom plate (325) is arranged on the second plate surface (313), and a plurality of communication flow channels (3251) are arranged at intervals inside the bottom plate (325); and A plurality of heat exchange pipes (326), each heat exchange pipe (326) is U-shaped, the plurality of heat exchange pipes (326) are arranged in sequence and arranged on the bottom plate (325), and adjacent two communication flow channels (3251) are communicated through one heat exchange pipe (326), the heat exchange pipe (326) at the head end is communicated with the first connection part (321), and the heat exchange pipe (326) at the tail end is communicated with the second connection part (323).

5. The heat dissipation component according to claim 2, wherein The heat exchanger (32) is a parallel flow heat exchanger, and the heat exchanger (32) further includes: A plurality of connecting flat tubes (327), the plurality of connecting flat tubes (327) are arranged in parallel and at intervals, and each connecting flat tube (327) is communicated between the first connection part (321) and the second connection part (323).

6. The heat dissipation component according to claim 5, wherein The plurality of connecting flat tubes (327) are arranged at intervals in the vertical direction, and among two adjacent arranged connecting flat tubes (327), the inner diameter of the connecting flat tube (327) located above is larger than the inner diameter of the connecting flat tube (327) located below.

7. The heat dissipation component according to any one of claims 1 to 6, characterized in that, The heat dissipation assembly (3) further includes: A plurality of heat dissipation fins (35), and a plurality of the heat dissipation fins (35) are arranged at intervals on the heat exchanger (32).

8. A power conversion device, characterized in that, Including an equipment box body (1), a heat generating device (2) and the heat dissipation assembly according to any one of claims 1 to 7, a heat dissipation air duct (11) is arranged in the equipment box body (1), and the heat exchanger (32) is located in the heat dissipation air duct (11).

9. The power conversion device according to claim 8, characterized in that, The heat dissipation component (3) further includes: A heat dissipation fan (34), which is installed in the heat dissipation air duct (11).

10. The power conversion device according to claim 8 or 9, characterized in that, The heat dissipation air duct (11) includes an outer circulation heat dissipation air duct (111), the heat generating device (2) includes a power device (21), the power device (21) is located in the outer circulation heat dissipation air duct (111), and the first plate surface (312) is in close contact connection with the power device (21).

11. The power conversion device according to claim 10, characterized in that, The power conversion device further includes: A reactor (4), which is electrically connected to the heat generating device (2), and the reactor (4) is located in the outer circulation heat dissipation air duct (111).

12. The power conversion device according to claim 8 or 9, characterized in that, The heat dissipation air duct (11) includes an independent outer circulation heat dissipation air duct (111) and an inner circulation heat dissipation air duct (112), the heat generating device (2) includes an electrically connected power device (21) and an electronic device (22), and the heat exchanger (32) includes a connected first heat exchanger (301) and a second heat exchanger (302). The first heat exchanger (301) and the second heat exchanger (302) are arranged on the second plate surface (313). The power device (21) and the first heat exchanger (301) are both located in the outer circulation heat dissipation air duct (111), the electronic device (22) and the second heat exchanger (302) are both located in the inner circulation heat dissipation air duct (112), and the first plate surface (312) is in close contact connection with the power device (21).

Images