Heat dissipation device for inversion and boost all-in-one machine and inversion and boost all-in-one machine

Abstract

The utility model provides a heat dissipation device for an inversion and boost all-in-one machine and the inversion and boost all-in-one machine. The heat dissipation device for the inversion and boost all-in-one machine comprises a power conversion box used for accommodating a semiconductor power device; the transformer room is used for accommodating the winding structure; the main power mechanism is used for driving the cooling airflow to flow into the transformer room to dissipate heat of the transformer room; wherein heat generated in the power conversion box is transmitted to a flowing path of cooling air flow of the transformer room by a cooling medium, and the cooling medium comprises cooling liquid or a heat conduction piece or the cooling air flow driven by a main power mechanism. According to the technical scheme of the utility model, the problems of high cost, high power consumption and high noise caused by the arrangement of two sets of heat dissipation systems in the inversion and boost all-in-one machine in the prior art are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of inverter-booster integrated machines, and more specifically, to a heat dissipation device for an inverter-booster integrated machine and an inverter-booster integrated machine. Background Art

[0002] Existing inverter-booster integrated machines include parts such as a power converter (PCS) and a dry-type transformer. The power converter (PCS) generally cools and dissipates heat from semiconductor power devices 3 by means of air cooling, liquid cooling, or heat siphon (phase change); among them, as Figure 1 shown, the power converter (PCS) uses air cooling for heat dissipation. The fan 2 is placed on the top of the power conversion box 1. The air first dissipates heat from the semiconductor power devices 3, then blows to the reactor 5 for heat dissipation, and then takes the heat outside the power conversion box 1. The heat sources of the transformer room 8 - the high- and low-voltage windings and the iron core 7 are placed in the transformer room 1. By means of forced air cooling with the fan 2 arranged in the transformer room and with the assistance of the cross-flow fan 6, the heat is taken outside the transformer room 8 to achieve the cooling of the dry-type transformer. As Figure 2 shown, the power converter (PCS) uses liquid cooling or heat siphon (phase change) for heat dissipation. The semiconductor power devices 3 in the power conversion box 1 are cooled on the evaporator 4. Under the action of one fan 2, the heat is taken away by the outside air through the condenser 9, while the reactor 5 is forced air-cooled by another fan 2. The heat sources of the transformer room 8 - the high- and low-voltage windings and the iron core are placed in the transformer room 1. By means of forced air cooling with the fan 2 arranged in the transformer room and with the assistance of the cross-flow fan, the heat is taken outside the transformer room 8 to achieve the cooling of the dry-type transformer.

[0003] In summary, in actual operation, both the power conversion box and the transformer room have independent heat dissipation systems, and each heat dissipation system is equipped with a fan 2. However, the fans of the two heat dissipation systems result in higher costs and power consumption, and also cause higher noise in the inverter-booster integrated machine. Summary of the Utility Model

[0004] The main purpose of the utility model is to provide a heat dissipation device for an inverter-booster integrated machine and an inverter-booster integrated machine, which solves the problems of high costs, power consumption, and noise in the existing inverter-booster integrated machine due to the setting of two heat dissipation systems.

[0005] To achieve the above object, the present utility model provides a heat dissipation device for an inverter-booster integrated machine, comprising: a power conversion box for accommodating semiconductor power devices; a transformer room for accommodating a winding structure; a main power mechanism for driving cooling air to flow into the transformer room to dissipate heat from the transformer room; wherein, the heat generated in the power conversion box is conveyed by a cooling medium to the flow path of the cooling air flowing into the transformer room, and the cooling medium includes: a coolant or a heat conducting member or the cooling air driven by the main power mechanism.

[0006] Further, the heat dissipation device for the inverter-booster integrated machine further comprises: an air duct housing having an air inlet and an air outlet, the air inlet being communicated with the inside of the power conversion box, and the air outlet being communicated with the inside of the transformer room; the power conversion box has an air inlet, and the transformer room has an air outlet; the main power mechanism drives the cooling air to flow through the air inlet of the power conversion box, the air inlet, the air outlet and the air outlet of the transformer room in sequence.

[0007] Further, the heat dissipation device for the inverter-booster integrated machine further comprises a radiator located in the power conversion box, and the radiator is configured to dissipate heat from the semiconductor power devices.

[0008] Further, the air inlet of the power conversion box and the air inlet are located on both sides of the radiator; and / or, the air outlet of the transformer room and the air outlet are located on both sides of the winding structure.

[0009] Further, the power conversion box comprises a first box body and a second box body. A condenser is provided in the first box body, and an evaporator for dissipating heat from the semiconductor power devices is provided in the second box body; the first box body has an air inlet and an air outlet, the second box body has an air inlet and an air outlet, and the air outlets of the first box body and the second box body are both communicated with the air inlet of the air duct housing; or, the first box body has an air inlet and an air outlet, and the air outlet of the first box body is communicated with the air inlet of the air duct housing; or, the first box body has an air inlet and an air outlet, the second box body has an air inlet and an air outlet, the air outlet of the second box body is communicated with the air inlet of the first box body, and the air outlet of the first box body is communicated with the air inlet of the air duct housing.

[0010] Further, an evaporator is provided in the power conversion box, and the semiconductor power devices are thermally coupled to the evaporator; the heat dissipation device for the inverter-booster integrated machine further comprises a condenser communicated with the evaporator; the condenser is provided in the transformer room or on the transformer room; both the power conversion box and the transformer room have an air inlet and an air outlet.

[0011] Further, the heat dissipation device for the inverter-booster integrated machine further comprises a heat dissipation structure, and the heat dissipation structure includes: a mounting member mounted on the air duct housing; a plurality of heat dissipation members spaced apart from each other on the mounting member, one end of each heat dissipation member extends into the air duct housing, and the other end of each heat dissipation member is located outside the air duct housing.

[0012] Further, an auxiliary power mechanism is provided in the transformer room, and the auxiliary power mechanism is used to accelerate the flow of the cooling air flow.

[0013] Further, the main power mechanism includes a fan, and at least one of the upper part of the power conversion box, inside the power conversion box, inside the transformer room, on the transformer room, and on the air duct housing is provided with a fan.

[0014] Further, according to another aspect of the present invention, the present invention provides an inverter-booster integrated machine, including: the heat dissipation device for the inverter-booster integrated machine as described above; a winding structure installed inside the transformer room; and semiconductor power devices installed inside the power conversion box.

[0015] Further, a reactor is provided inside the power conversion box or inside the transformer room.

[0016] Applying the technical solution of the present invention, the heat generated in the power conversion box is transported to the flow path of the cooling air flow in the transformer room through the cooling medium, so that the power conversion box and the transformer room can share the main power mechanism for heat dissipation. Compared with the prior art in which the power converter and the dry-type transformer each set up a set of heat dissipation systems (that is, the inverter-booster integrated machine requires two sets of heat dissipation systems (i.e., the main power mechanism)), in the present invention, one set of heat dissipation system (i.e., the main power mechanism) can be used to simultaneously realize the heat dissipation of the power converter and the dry-type transformer. In this way, the number of heat dissipation systems (i.e., the main power mechanism) can be reduced, resource integration can be achieved, and thus the power consumption, cost, and noise of the heat dissipation device for the inverter-booster integrated machine can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The specification drawings forming a part of this application are used to provide a further understanding of the present invention. The schematic embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation to the present invention. In the drawings:

[0018] Figure 1 Shows a schematic structural diagram of an inverter-booster integrated machine in the prior art (using air cooling for heat dissipation);

[0019] Figure 2 Shows a schematic structural diagram of an inverter-booster integrated machine in the prior art (using liquid cooling, heat siphon or vapor compression for heat dissipation);

[0020] Figure 3 Shows a schematic structural diagram of Embodiment 1 of the inverter-booster integrated machine of the present invention;

[0021] Figure 4 Shows a schematic structural diagram of Embodiment 2 of the inverter-booster integrated machine of the present invention;

[0022] Figure 5Shows a schematic structural diagram of the third embodiment of the integrated inverter-booster of the present utility model;

[0023] Figure 6 Shows a schematic structural diagram of the fourth embodiment of the integrated inverter-booster of the present utility model;

[0024] Figure 7 Shows a schematic structural diagram of the fifth embodiment of the integrated inverter-booster of the present utility model;

[0025] Figure 8 Shows a schematic structural diagram of the sixth embodiment of the integrated inverter-booster of the present utility model;

[0026] Figure 9 Shows a schematic structural diagram of the seventh embodiment of the integrated inverter-booster of the present utility model;

[0027] Figure 10 Shows a schematic structural diagram of the eighth embodiment of the integrated inverter-booster of the present utility model;

[0028] Figure 11 Shows a schematic structural diagram of the ninth embodiment of the integrated inverter-booster of the present utility model;

[0029] Figure 12 Shows a schematic structural diagram of the tenth embodiment of the integrated inverter-booster of the present utility model;

[0030] Figure 13 Shows a schematic structural diagram of the eleventh embodiment of the integrated inverter-booster of the present utility model;

[0031] Figure 14 Shows a schematic structural diagram of the twelfth embodiment of the integrated inverter-booster of the present utility model;

[0032] Figure 15 Shows a schematic structural diagram of the thirteenth embodiment of the integrated inverter-booster of the present utility model;

[0033] Figure 16 Shows a schematic structural diagram of the fourteenth embodiment of the integrated inverter-booster of the present utility model;

[0034] Figure 17 Shows a schematic structural diagram of the fifteenth embodiment of the integrated inverter-booster of the present utility model;

[0035] Figure 18 Shows a schematic structural diagram of the sixteenth embodiment of the integrated inverter-booster of the present utility model;

[0036] Figure 19 Shows Figure 3 a schematic structural diagram of an embodiment of the heat dissipation structure of the integrated inverter-booster;

[0037] Figure 20 shows the Figure 3 structural schematic diagram of another embodiment of the heat dissipation structure of the inverter-booster integrated machine;

[0038] Figure 21 shows the Figure 3 assembly structural schematic diagram of the heat dissipation structure of the inverter-booster integrated machine.

[0039] Among them, the above-mentioned drawings include the following reference numerals:

[0040] 11. Transformer room; 12. Auxiliary power mechanism; 21. Power conversion box; 211. First box body; 212. Second box body; 22. Main power mechanism; 23. Radiator; 24. Semiconductor power device; 25. Condenser; 26. Evaporator; 27. Reactor; 50. Air duct shell; 51. Air flow inlet; 52. Air flow outlet; 53. Mounting part; 54. Heat dissipation part; 55. Winding structure; 56. Shielding member. Detailed implementation manners

[0041] It should be noted that, without conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present invention will be described in detail below with reference to the drawings and in combination with the embodiments.

[0042] As Figures 3 to 17 shown, the present invention provides a heat dissipation device for an inverter-booster integrated machine. The heat dissipation device for an inverter-booster integrated machine includes a power conversion box 21 for accommodating a semiconductor power device 24; a transformer room 11 for accommodating a winding structure 55; a main power mechanism 22 for driving a cooling air flow to flow into the transformer room 11 to dissipate heat from the transformer room 11; wherein, the heat generated in the power conversion box 21 is delivered to the flow path of the cooling air flow for the transformer room 11 by a cooling medium, wherein the cooling medium includes: coolant or heat conducting member or cooling air flow driven by the main power mechanism.

[0043] In the above technical solution, delivering the heat generated in the power conversion box 21 to the flow path of the cooling air flow for the transformer room 11 by a cooling medium can enable the power conversion box 21 and the transformer room 11 to share the main power mechanism 22 for heat dissipation. Compared with the prior art in which a power converter and a dry-type transformer are each provided with a set of heat dissipation systems (that is, the inverter-booster integrated machine requires two sets of heat dissipation systems (that is, main power mechanisms)), in the present invention, one set of heat dissipation system (that is, the main power mechanism 22) can be used to simultaneously dissipate heat from the power converter and the dry-type transformer. In this way, the number of heat dissipation systems (that is, the main power mechanism 22) can be reduced, resource integration can be achieved, and thus the power consumption, cost and noise of the heat dissipation device for the inverter-booster integrated machine can be reduced.

[0044] Specifically, as Figures 3 to 18As shown, in the embodiment of the present utility model, the main power mechanism 22 includes a fan, and at least one of the upper part of the power conversion box 21, inside the power conversion box 21, inside the transformer substation 11, on the transformer substation 11, and on the air duct housing 50 is provided with a fan. In this way, the fan can provide a cooling air flow to simultaneously dissipate heat from the power conversion box 21 and the transformer substation 11.

[0045] It should be noted that in the embodiment of the present utility model, the fan is provided on the transformer substation 11 means that the fan can be provided outside the transformer substation 11 or on the wall of the transformer substation 11, that is, a groove is opened on the wall of the transformer substation, and the fan is installed in the groove; similarly, the fan is provided on the air duct housing 50 means that the fan can be provided outside the air duct housing 50 or on the shell wall of the air duct housing 50.

[0046] As Figures 3 to 18 shown, in the embodiment of the present utility model, an auxiliary power mechanism 12 is provided inside the transformer substation 11, and the auxiliary power mechanism 12 is used to accelerate the flow of the cooling air flow.

[0047] Through the above settings, while using the main power mechanism 22 to dissipate heat from the components inside the power conversion box 21 and the transformer substation 11, the air flow inside the transformer substation 11 can be smoothly discharged outside the transformer substation 11 under the disturbing flow and boosting of the auxiliary power mechanism 12 to assist in taking the heat inside the transformer substation 11 to the outside.

[0048] Preferably, in the embodiment of the present utility model, the auxiliary power mechanism 12 is a cross-flow fan.

[0049] As Figures 3 to 17 shown, the embodiment of the present utility model provides an inverter-booster integrated machine. The inverter-booster integrated machine includes: the above-mentioned heat dissipation device for the inverter-booster integrated machine; a winding structure 55 installed inside the transformer substation 11; and a semiconductor power device 24 installed inside the power conversion box 21. In this way, the air flow generated by the main power mechanism 22 can simultaneously dissipate heat from the semiconductor power device 24 and the winding structure 55.

[0050] It should be noted that in the embodiment of the present utility model, the semiconductor power device 24 is installed inside the power conversion box 21 to form a power converter (PCS), and the winding structure 55 is located inside the transformer substation 11 to form a dry-type transformer.

[0051] Specifically, in the embodiment of the present utility model, the winding structure 55 includes high-voltage and low-voltage windings and an iron core.

[0052] Specifically, as Figure 3As shown in the figure, in the embodiment of the present utility model, shielding members 56 are provided on both sides of the winding structure 55, and the two shielding members 56 define an air flow channel for placing the winding structure 55, so that more air flow passes between the winding structures 55, thereby increasing the heat dissipation effect of the dry-type transformer.

[0053] Preferably, in the embodiment of the present utility model, the shielding member 56 is provided as a baffle, as Figure 3 shown, baffles are provided on both the left and right sides of the winding structure 55.

[0054] As Figures 3 to 17 shown, in the embodiment of the present utility model, a reactor 27 is provided inside the power conversion box 21 or inside the transformer room 11. In this way, the cooling air flow can be used to dissipate the heat of the reactor 27. Among them, when the reactor 27 is located inside the power conversion box 21, the heat generated by the reactor 27 can be transferred to the flow path of the cooling air flow inside the transformer room 11 by using a cooling medium (the cooling medium can be the cooling air flow in the first embodiment or the coolant in the thirteenth embodiment); when the reactor 27 is located inside the transformer room 11, the heat generated by the reactor 27 can be directly dissipated through the cooling air flow inside the transformer room 11.

[0055] Furthermore, when the reactor 27 is moved into the transformer room 11, the space inside the transformer room 11 can be fully utilized to reduce the volume of the power conversion box 21, thereby improving the power density of the inverter-booster integrated machine.

[0056] Embodiment 1

[0057] As Figure 3 shown, in the first embodiment of the present utility model, the heat dissipation device for the inverter-booster integrated machine further includes: an air duct housing 50, having an air flow inlet 51 and an air flow outlet 52, the air flow inlet 51 is communicated with the inside of the power conversion box 21, and the air flow outlet 52 is communicated with the inside of the transformer room 11; the power conversion box 21 has an air inlet, and the transformer room 11 has an air outlet; the main power mechanism 22 drives the cooling air flow to sequentially flow through the air inlet of the power conversion box 21, the air flow inlet 51, the air flow outlet 52 and the air outlet of the transformer room 11.

[0058] In the above technical solution, by additionally providing the air duct housing 50, the inside of the power conversion box 21 and the inside of the transformer room 11 can be communicated, so that the air inside the transformer room 11 and the power conversion box 21 can flow through each other. In this way, the air flow generated by the main power mechanism 22 can enter the transformer room 11 from the power conversion box 21 to utilize the main power mechanism 22 to simultaneously dissipate the heat of the dry-type transformer and the power converter. In this way, on the one hand, the number of main power mechanisms 22 can be reduced, thereby reducing the power consumption, cost and noise of the heat dissipation device for the inverter-booster integrated machine; on the other hand, the air duct housing 50 can guide the air flow to further reduce the noise of the air flow.

[0059] It should be noted that, as Figure 3 shown, in the first embodiment of the present utility model, the main power mechanism 22 includes a blower, the blower is located in the power conversion box 21, the cooling medium is a cooling air flow, and the blower drives the cooling air flow to convey the heat generated in the power conversion box 21 from the air inlet of the power conversion box 21, the air flow inlet 51, and the air flow outlet 52 to the flow path of the cooling air flow in the transformer substation 11.

[0060] Specifically, as Figure 3 shown, in the first embodiment of the present utility model, a reactor 27 is provided in the power conversion box 21, and the cooling air flow in the power conversion box 21 transfers the heat generated by the reactor 27 to the flow path of the cooling air flow in the transformer substation 11.

[0061] Specifically, in the first embodiment of the present utility model, the air duct housing 50 can also provide an installation space for a noise reduction accessory (i.e., the following heat dissipation structure).

[0062] As Figures 19 to 21 shown, in the first embodiment of the present utility model, the heat dissipation device for the inverter-booster integrated machine further includes a heat dissipation structure, and the heat dissipation structure includes: a mounting member 53 mounted on the air duct housing 50; a plurality of heat dissipation members 54 spaced apart from each other on the mounting member 53, one end of each heat dissipation member 54 extends into the air duct housing 50, and the other end of each heat dissipation member 54 is located outside the air duct housing 50. In this way, the heat of the air duct housing 50 can be transferred to the external environment, thereby effectively reducing the temperature inside the air duct housing 50, and further increasing the heat dissipation effect of the power conversion box 21 or reducing the temperature entering the transformer substation 11.

[0063] It should be noted that the appropriate number, size, and model of the heat dissipation members 54 can be selected according to the heat dissipation requirements, and a space for mounting the mounting member 53 can be reserved on the air duct housing 50 in advance. The fixing method of the air duct housing 50 and the heat dissipation mounting member 53 is not limited, such as bolt locking, etc.

[0064] It should be noted that in the first embodiment of the present utility model, a heat dissipation structure can also be provided on the box wall of the power conversion box 21 and / or the box wall of the transformer substation 11 to increase the heat dissipation effect.

[0065] It should be noted that, as Figure 19 shown, in the first embodiment of the present utility model, the heat dissipation member 54 is a heat sink, for example, a double-sided shovel tooth structure, etc., or, as Figure 20 shown, the heat dissipation member 54 can also be a heat dissipation column.

[0066] As Figure 3As shown in the figure, in the first embodiment of the present utility model, the power converter (PCS) adopts an air-cooled heat dissipation method. The heat dissipation device for the inverter-booster integrated machine further includes a radiator 23 located in the power conversion box 21, and the radiator 23 is configured to dissipate heat from the semiconductor power device 24.

[0067] With the above arrangement, under the action of the main power mechanism 22, the air flow enters the power conversion box 21 through the air inlet of the power conversion box 21. The air flow in the power conversion box 21 flows through the radiator 23 and the reactor 27, and then blows into the transformer room 11 through the air flow inlet 51, the air duct housing 50 and the air flow outlet 52. Moreover, with the assistance of the auxiliary power mechanism 12 in the transformer room 11, the air flow in the transformer room 11 can flow out more smoothly; thus, compared with the prior art in which the inverter-booster integrated machine (whose power converter adopts an air-cooled heat dissipation method) uses two fans to respectively dissipate heat from the power converter and the dry-type transformer, in the first embodiment of the present utility model, the main power mechanism 22 in the transformer room 11 in the prior art can be cancelled, so as to reduce the number of the main power mechanisms 22. The air flow generated by one main power mechanism 22 located in the power conversion box 21 can not only enter the transformer room 11 to dissipate heat from the winding structure 55 in the transformer room 11, but also enter the power conversion box 21 to dissipate heat from the reactor 27 and the semiconductor power device 24 in the power conversion box 21, thereby reducing the power consumption and cost of the heat dissipation device for the inverter-booster integrated machine.

[0068] As Figure 3 shown in the figure, in the first embodiment of the present utility model, the air inlet of the power conversion box 21 and the air flow inlet 51 are located on both sides of the radiator 23; and / or, the air outlet of the transformer room 11 and the air flow outlet 52 are located on both sides of the winding structure 55. In this way, the area of the cooling air flow flowing through the radiator and / or the winding structure 55 can be increased, thereby improving the heat dissipation effect.

[0069] Specifically, in the first embodiment of the present utility model, the main power mechanism 22 is placed on the top of the power conversion box 21, and is arranged with top-inlet and bottom-outlet air flow. The reactor 27 is located below the semiconductor power device 24. The air flow first dissipates heat from the semiconductor power device 24, and then blows to the reactor 27 to dissipate heat from it, and the air flow out of the power conversion box 21 is diverted into the transformer room 11 through the air duct housing 50. Moreover, with the turbulence and assistance of the original auxiliary power mechanism 12 in the transformer room 11, the air flow can be discharged out of the transformer room 11 more smoothly through the winding structure 55.

[0070] In one embodiment, the main power mechanism 22 can be provided only in the transformer room 11.

[0071] Embodiment Two

[0072] As Figure 4As shown in the figure, the difference between the second embodiment and the first embodiment of the present utility model is that the main power mechanism 22 is placed at one end near the air duct housing 50 at the bottom of the power converter (PCS), so that the height of the power conversion box 21 can be reduced.

[0073] The other structures of the second embodiment are the same as those of the first embodiment and will not be elaborated here.

[0074] Embodiment Three

[0075] Due to the relatively large self-air resistance of the reactor 27, the air volume blown by the airflow generated by the main power mechanism 22 to the transformer room 11 is small and the air temperature is high. Therefore, as Figure 5 shown in the figure, the difference between the third embodiment and the first embodiment of the present utility model is that the reactor 27 in the power conversion box 21 can be moved into the transformer room 11 through structural deformation, so that the heat dissipation method of the reactor 27 is the same as that of the winding structure 55. In this way, on the one hand, the air volume output by the power converter (PCS) will increase and the air temperature will decrease, thereby further improving the heat dissipation effect of the dry-type transformer; on the other hand, the space of the transformer room 11 can be fully utilized, reducing the occupied space of the power conversion box 21, thereby improving the power density of the inverter boost integrated machine.

[0076] Specifically, in the third embodiment of the present utility model, an installation through hole is provided on one of the two shielding members 56, and the reactor 27 is arranged in the installation through hole.

[0077] The other structures of the third embodiment are the same as those of the first embodiment and will not be elaborated here.

[0078] Embodiment Four

[0079] As Figure 6 shown in the figure, the difference between the fourth embodiment and the second embodiment of the present utility model is that the reactor 27 in the power conversion box 21 can be moved into the transformer room 11 through structural deformation, so that the heat dissipation method of the reactor 27 is the same as that of the winding structure 55. At this time, the air volume output by the power converter (PCS) will increase and the air temperature will decrease, thereby further improving the heat dissipation effect of the dry-type transformer.

[0080] The other structures of the fourth embodiment are the same as those of the second embodiment and will not be elaborated here.

[0081] Embodiment Five

[0082] As Figure 7As shown in the figure, the difference between the fifth embodiment and the first embodiment of the present utility model is that a main power mechanism 22 is provided in the transformer room 11, that is, the main power mechanism 22 in the power conversion box 21 is moved to the side of the transformer room 11 close to the air flow outlet 52. In this way, on the one hand, the space of the transformer room 11 can be fully utilized, and the space occupied by the main power mechanism 22 in the power conversion box 21 can be reduced, further improving the power density of the inverter-booster integrated machine; on the other hand, placing the main power mechanism 22 in the transformer room 11 can also achieve sharing a set of main power mechanism 22 to complete the heat dissipation of the power converter (PCS) and the dry-type transformer.

[0083] The other structures of the fifth embodiment are the same as those of the first embodiment, and will not be elaborated here.

[0084] Embodiment Six

[0085] As Figure 8 As shown in the figure, the difference between the sixth embodiment and the third embodiment of the present utility model is that a main power mechanism 22 is provided in the transformer room 11, that is, the main power mechanism 22 in the power conversion box 21 is moved to the side of the transformer room 11 close to the air flow outlet 52. In this way, on the one hand, the space of the transformer room 11 can be fully utilized, and the space occupied by the main power mechanism 22 in the power conversion box 21 can be reduced, further improving the power density of the inverter-booster integrated machine; on the other hand, placing the main power mechanism 22 in the transformer room 11 can also achieve sharing a set of main power mechanism 22 to complete the heat dissipation of the power converter (PCS) and the dry-type transformer.

[0086] The other structures of the sixth embodiment are the same as those of the third embodiment, and will not be elaborated here.

[0087] Embodiment Seven

[0088] As Figure 9 As shown in the figure, the difference between the seventh embodiment and the first embodiment of the present utility model is that the power converter (PCS) is cooled by liquid cooling, thermosiphon or vapor compression refrigeration, that is, the radiator 23 is not provided in the power conversion box 21. The power conversion box 21 includes a first box body 211 and a second box body 212. A condenser 25 is provided in the first box body 211, and an evaporator 26 for cooling the semiconductor power device 24 is provided in the second box body 212; the first box body 211 has an air inlet and an air outlet, and the second box body 212 has an air inlet and an air outlet. The air outlet of the first box body 211 and the air outlet of the second box body are both communicated with the air flow inlet 51 of the air duct housing 50.

[0089] Furthermore, the reactor 27 is located in the box body where the evaporator 26 is provided, and the main power mechanism 22 includes two fans, and fans are provided in both the first box body 211 and the second box body 212.

[0090] With the above settings, under the action of the main power mechanism 22, the air flow can enter the first box body 211 and the second box body 212 respectively through two corresponding air inlets on the first box body 211 and the second box body 212. The air flow in the first box body 211 and the second box body 212 can respectively enter the air duct shell 50 through two air flow inlets 51 to converge, and be blown towards the transformer substation room 11 through the air flow outlet 52. In this way, the air flow in the second box body 212 can dissipate heat from the reactor 27, the air flow in the first box body 211 can dissipate heat from the condenser 25, and the air flow blown into the transformer substation room 11 from the air flow outlet 52 can dissipate heat from the transformer substation room 11 under the disturbance and assistance of the auxiliary power mechanism 12, so as to dissipate heat from the winding structure 55 located in the transformer substation room 11. In this way, the number of the main power mechanisms 22 can be reduced, thereby reducing the power consumption, cost and noise of the heat dissipation device for the inverter-booster integrated machine.

[0091] It should be noted that in the seventh embodiment of the present invention, the condenser 25 and the evaporator 26 are respectively the evaporation end and the condensation end of the liquid cooling system.

[0092] Specifically, in the seventh embodiment of the present invention, the semiconductor power device 24 is cooled at the evaporator 26, and its heat is taken away by the outside air through the condenser 25 of the first box body 211, while the reactor 27 is placed in the second box body 212 to achieve forced air cooling through a fan.

[0093] Specifically, as Figure 9 shown, in the seventh embodiment of the present invention, the air duct shell 50 includes a first shell section and a second shell section that are connected and arranged at an angle to form an L-shaped air duct shell 50. The first shell section and the second shell section are respectively connected to the first box body 211 and the second box body 212, and the first shell section is connected to the inside of the transformer substation room 11; in one embodiment, the air duct shell 50 can also be V-shaped.

[0094] Embodiment Eight

[0095] As Figure 10 shown, the difference between the eighth embodiment of the present invention and the seventh embodiment is that a fan is provided in the transformer substation room 11, that is, the fan in the first box body 211 is moved to one side close to the air flow outlet 52 in the transformer substation room 11, and the fan in the second box body 212 is removed. It is also possible to move the fan in the first box body 211 and the fan in the second box body 212 into the transformer substation room 11. In this way, the space of the transformer substation room 11 can be fully utilized, the space occupied by the main power mechanism 22 in the power conversion box 21 can be reduced, the power density of the inverter-booster integrated machine can be improved, and thus a set of fans can be shared by the dry-type transformer and the power converter (PCS) to complete the heat dissipation of the two parts.

[0096] Other structures of the eighth embodiment are the same as those of the seventh embodiment, and will not be described in detail here.

[0097] Embodiment Nine

[0098] As Figure 11 shown, the difference between Embodiment Nine of the present utility model and Embodiment Seven lies in that a blower is provided in either the first box body 211 or the second box body 212, and a blower is provided in the transformer substation 11. That is, the blower in the second box body 212 is retained, and only the blower in the first box body 211 is moved to the side close to the air flow outlet 52 in the transformer substation 11. In this way, the problem that the reactor 27 is far from the main power mechanism 22 can be avoided, and the dry-type transformer and the power converter (PCS) can also share a set of blowers to complete the heat dissipation of the two parts.

[0099] The other structures of Embodiment Nine are the same as those of Embodiment Seven, and will not be described herein again.

[0100] Embodiment Ten

[0101] As Figure 12 shown, the differences between Embodiment Ten of the present utility model and Embodiment Seven are as follows: First, the first box body 211 has an air inlet and an air outlet, and the air outlet of the first box body 211 is communicated with the air flow inlet 51 of the air duct housing 50; Second, the reactor 27 is moved into the transformer substation 11 through structural deformation so that the heat dissipation mode of the reactor 27 is the same as that of the winding structure 55; Third, a blower is provided in the first box body 211, that is, the blower of the power conversion box 21 is set to one.

[0102] Through the above settings, under the action of the main power mechanism 22, the air flow enters the first box body 211 through the air inlet of the first box body 211, and then enters the air duct housing 50 through the air flow inlet 51. The air flow in the air duct housing 50 is diverted to the reactor 27 and the winding structure 55 through the air flow outlet 52 to complete the heat dissipation of the reactor 27 and the dry-type transformer. In this way, on the one hand, the space of the transformer substation 11 can be fully utilized, and the volume of the power conversion box 21 can be reduced. On the other hand, while reducing the number of main power mechanisms 22, the air temperature blown from the power conversion box 21 to the transformer substation 11 is reduced, thereby improving the heat dissipation effect of the dry-type transformer and the reactor 27, and further reducing the heat dissipation cost and power consumption of the inverter boost integrated machine.

[0103] Specifically, in Embodiment Ten of the present utility model, an installation through hole is provided on one of the two shielding members 56, and the reactor 27 is arranged in the installation through hole.

[0104] The other structures of Embodiment Ten are the same as those of Embodiment Seven, and will not be described herein again.

[0105] Embodiment Eleven

[0106] As Figure 13As shown in the figure, the difference between the eleventh embodiment and the tenth embodiment of the present utility model is that a fan is provided in the transformer room 11, that is, the fan in the first box body 211 is moved to the side of the transformer room 11 close to the air flow outlet 52. In this way, the space of the transformer room 11 can be fully utilized, and the space occupied by the main power mechanism 22 in the power conversion box 21 can be reduced, thereby improving the power density of the inverter-booster integrated machine.

[0107] The other structures of the eleventh embodiment are the same as those of the tenth embodiment, and will not be described in detail here.

[0108] Embodiment Twelve

[0109] As Figure 14 shown in the figure, the difference between the twelfth embodiment and the tenth embodiment of the present utility model is that the first box body 211 has an air inlet and an air outlet, the second box body 212 has an air inlet and an air outlet, the air outlet of the second box body 212 is communicated with the air inlet of the first box body 211, and the air outlet of the first box body 211 is communicated with the air flow inlet 51 of the air duct housing 50, that is, the first box body 211 and the second box body 212 are arranged in series, and the second box body 212 is located on the left side of the first box body 211.

[0110] Through the above settings, under the action of the main power mechanism 22, the air flow enters the second box body 212 through the air inlet of the second box body 212, then enters the air inlet of the first box body 211 through the air outlet of the second box body 212, and then enters the air duct housing 50 through the air outlet of the first box body 211 and the air flow inlet 51. The air flow in the air duct housing 50 is led to the reactor 27 and the winding structure 55 through the air flow outlet 52 to complete the heat dissipation of the reactor 27 and the dry-type transformer. In this way, arranging the first box body 211 and the second box body 212 in series can enable the cooling air flow and the evaporator 26 to dissipate heat from the semiconductor power devices 24 in the second box body 212 at the same time, so as to improve the heat dissipation effect.

[0111] Embodiment Thirteen

[0112] As Figure 15 shown in the figure, in the thirteenth embodiment of the present utility model, an evaporator 26 is provided in the power conversion box 21, and the semiconductor power device 24 is thermally coupled to the evaporator ; the heat dissipation device for the inverter-booster integrated machine further includes a condenser 25 communicated with the evaporator 26; the condenser 25 is arranged in the transformer room 11 or on the transformer room 11; both the power conversion box 21 and the transformer room 11 have an air inlet and an air outlet.

[0113] With the above settings, on the one hand, under the action of the main power mechanism 22, the air flow can air-cool the reactor 27 in the power conversion box 21, and the semiconductor power device 24 in the power conversion box 21 is cooled at the evaporator 26, and its heat is transferred to the condenser 25 in the transformer room 11. On the other hand, the cooling air flow can first dissipate heat from the condenser 25 in the transformer room 11, and then the air flow completes the air-cooling of the winding structure 55 under the action of the auxiliary power mechanism 12, and finally the air flow is discharged outside the transformer room 11 under the action of the main power mechanism 22. In this way, on the one hand, by placing the condenser 25 in the transformer room 11, the problem that the heat exchange area of the condenser 25 is limited due to the limited volume of the power conversion box 21 can be solved, so as to increase the heat exchange area of the condenser 25, thereby improving the heat exchange capacity, and the space of the transformer room 11 can be fully utilized, and the volume of the power conversion box 21 can also be reduced. On the other hand, it can be realized that one main power mechanism 22 (i.e., two fans) is used to complete the heat dissipation of the power converter (PCS) and the dry-type transformer, thereby reducing the cost, noise and power consumption of the inverter boost integrated machine.

[0114] Specifically, as Figure 15 shown, in the thirteenth embodiment of the present invention, a reactor 27 is provided in the power conversion box 21. The main power mechanism 22 includes two fans. Fans are provided in both the power conversion box 21 and the transformer room 11. The cooling medium is a coolant. The evaporator 26 transfers the heat generated in the semiconductor power device 24 to the condenser 25 in the transformer room 11 through the coolant. The condenser 25 is located on the flow path of the cooling air flow in the transformer room 11. Among them, the cooling air flow generated by the fan in the power conversion box 21 blows out the heat generated by the reactor 27 from the power conversion box 21, and the fan in the transformer room 11 is used to generate the cooling air flow.

[0115] It should be noted that in the thirteenth embodiment of the present invention, the condenser 25 is placed at the air inlet of the transformer room 11.

[0116] It should be noted that in the thirteenth embodiment of the present invention, the fan of the transformer room 11 is placed at the air outlet of the transformer room 11.

[0117] In one embodiment, the position of the fan in the transformer room 11 is not limited, such as being placed at the air outlet or air inlet of the transformer room 11.

[0118] It should be noted that in the thirteenth embodiment of the present invention, thermal coupling connection is a technology that connects two or more objects by means of heat conduction, and this connection method can effectively conduct heat.

[0119] It should be noted that in the thirteenth embodiment of the present utility model, the condenser 25 is provided on the transformer substation 11, which means that the condenser 25 can be provided outside the transformer substation 11 or on the wall of the transformer substation 11, that is, a groove is formed on the wall of the transformer substation, and the condenser 25 is installed in the groove.

[0120] Embodiment Fourteen

[0121] As Figure 16 shown, the difference between the fourteenth embodiment and the thirteenth embodiment of the present utility model is that the fan of the transformer substation 11 is arranged on one side close to the condenser 25. In this way, the distance between the condenser 25 and the fan can be shortened, so that the air flow can better pass through the condenser 25, and the air flow can smoothly flow through the high and low voltage windings and the iron core, so as to better realize the heat dissipation of the dry-type transformer, and further improve the heat dissipation effect of the inverter-booster integrated machine.

[0122] The other structures of the fourteenth embodiment are the same as those of the thirteenth embodiment, and will not be elaborated here.

[0123] Embodiment Fifteen

[0124] As Figure 17 shown, the difference between the fifteenth embodiment and the thirteenth embodiment of the present utility model is as follows: First, the reactor 27 in the power conversion box 21 can be moved into the transformer substation 11 through structural deformation, so that the heat dissipation method of the reactor 27 is the same as that of the high and low voltage windings and the iron core. Second, only the transformer substation has an air inlet and an air outlet, and only a fan is provided in the transformer substation 11. In this way, on the one hand, the volume of the power conversion box 21 is further compressed, and the space of the transformer substation 11 is fully utilized; on the other hand, the number of fans can be reduced, thereby reducing the cost, power consumption and noise of the inverter-booster integrated machine.

[0125] The other structures of the fifteenth embodiment are the same as those of the thirteenth embodiment, and will not be elaborated here.

[0126] Embodiment Sixteen

[0127] As Figure 18 shown, the difference between the sixteenth embodiment and the fifteenth embodiment of the present utility model is that the fan of the transformer substation 11 is arranged on one side close to the condenser 25. In this way, the distance between the condenser 25 and the fan can be shortened, so that the air flow can better pass through the condenser 25, and the air flow can smoothly flow through the high and low voltage windings, the iron core and the reactor 27, so as to better realize the heat dissipation of the dry-type transformer, and further improve the heat dissipation effect of the inverter-booster integrated machine.

[0128] The other structures of the sixteenth embodiment are the same as those of the fifteenth embodiment, and will not be elaborated here.

[0129] It should be noted that all of the above solutions are applicable to the case where multiple power converters (PCSs) are paralleled with a dry-type transformer. And by additionally providing an air duct housing 50, the outgoing air (or incoming air) of the power converter (PCS) is diverted to the transformer substation 11, avoiding the mutual influence between the outgoing air when multiple PCSs are paralleled.

[0130] From the above description, it can be seen that the above embodiments of the present utility model achieve the following technical effects: The heat generated in the power conversion box is transported to the flow path of the cooling air flow in the transformer substation through the cooling medium, enabling the power conversion box and the transformer substation to share the main power mechanism for heat dissipation. Compared with the prior art where the power converter and the dry-type transformer each have a set of heat dissipation systems (i.e., the inverter-booster integrated machine requires two sets of heat dissipation systems (i.e., the main power mechanism)), in the present utility model, a set of heat dissipation system (i.e., the main power mechanism) can be used to simultaneously achieve the heat dissipation of the power converter and the dry-type transformer. In this way, the number of heat dissipation systems (i.e., the main power mechanism) can be reduced, resource integration can be achieved, and thus the power consumption, cost, and noise of the heat dissipation device for the inverter-booster integrated machine can be reduced.

[0131] The above is only the preferred embodiment of the present utility model and is not intended to limit the present utility model. For those skilled in the art, the present utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. A heat dissipation device for an inverter-booster integrated machine, characterized in that Comprising: A power conversion box (21) for accommodating semiconductor power devices (24); A transformer room (11) for accommodating a winding structure (55); A main power mechanism (22) for driving a cooling air flow to flow into the transformer room (11) to dissipate heat from the transformer room (11); Wherein, the heat generated in the power conversion box (21) is transported by a cooling medium to the flow path of the cooling air flow in the transformer room (11), wherein the cooling medium includes: a coolant or a heat conducting member or a cooling air flow driven by the main power mechanism.

2. The heat dissipation device for the integrated inverter-booster machine according to claim 1, characterized in that, The heat dissipation device for the inverter-booster integrated machine further includes: An air duct housing (50) having an air flow inlet (51) and an air flow outlet (52), the air flow inlet (51) being in communication with the interior of the power conversion box (21), and the air flow outlet (52) being in communication with the interior of the transformer room (11); The power conversion box (21) has an air inlet, and the transformer room (11) has an air outlet; The main power mechanism (22) drives the cooling air flow to sequentially flow through the air inlet of the power conversion box (21), the air flow inlet (51), the air flow outlet (52), and the air outlet of the transformer room (11).

3. The heat dissipation device for the inverter-booster integrated machine according to claim 2, characterized in that The heat dissipation device for the inverter-booster integrated machine further includes a radiator (23) located in the power conversion box (21), and the radiator (23) is configured to dissipate heat from the semiconductor power devices (24).

4. The heat dissipation device for the inverter-booster integrated machine according to claim 3, characterized in that, The air inlet of the power conversion box (21) and the air flow inlet (51) are located on both sides of the radiator (23); and / or, The air outlet of the transformer room (11) and the air flow outlet (52) are located on both sides of the winding structure (55).

5. The heat dissipation device for the integrated inverter-booster according to claim 2, characterized in that, The power conversion box (21) includes a first box body (211) and a second box body (212), a condenser (25) is provided in the first box body (211), and an evaporator (26) for dissipating heat from the semiconductor power devices (24) is provided in the second box body (212); The first box body (211) has an air inlet and an air outlet, the second box body (212) has an air inlet and an air outlet, and the air outlet of the first box body (211) and the air outlet of the second box body are both in communication with the air flow inlet (51) of the air duct housing (50); or, The first box body (211) has an air inlet and an air outlet, and the air outlet of the first box body (211) is in communication with the air flow inlet (51) of the air duct housing (50); or, The first box body (211) has an air inlet and an air outlet, the second box body (212) has an air inlet and an air outlet, the air outlet of the second box body (212) is in communication with the air inlet of the first box body (211), and the air outlet of the first box body (211) is in communication with the air flow inlet (51) of the air duct housing (50).

6. The heat dissipation device for the inverter-booster integrated machine according to claim 1, wherein, An evaporator (26) is provided in the power conversion box (21), and the semiconductor power devices (24) are thermally coupled to the evaporator (26); The heat dissipation device for the inverter-booster integrated machine further includes a condenser (25) communicated with the evaporator (26); the condenser (25) is arranged inside or on the transformer room (11); Both the power conversion box (21) and the transformer room (11) have air inlets and air outlets.

7. The heat dissipation device for the integrated inverter-booster according to claim 1, characterized in that, An evaporator (26) is arranged inside the power conversion box (21), and the semiconductor power device (24) is thermally coupled to the evaporator (26); The heat dissipation device for the inverter-booster integrated machine further includes a condenser (25) communicated with the evaporator (26), and the condenser (25) is arranged inside or on the transformer room (11); The transformer room (11) has an air inlet and an air outlet.

8. The heat dissipation device for the integrated inverter-booster according to any one of claims 2 to 5, characterized in that, The heat dissipation device for the inverter-booster integrated machine further includes a heat dissipation structure, and the heat dissipation structure includes: A mounting member (53) mounted on the air duct housing (50); A plurality of heat dissipation members (54) are arranged at intervals on the mounting member (53), one end of each heat dissipation member (54) extends into the air duct housing (50), and the other end of each heat dissipation member (54) is located outside the air duct housing (50).

9. The heat dissipation device for the integrated inverter-booster according to any one of claims 1 to 7, characterized in that, An auxiliary power mechanism (12) is arranged inside the transformer room (11), and the auxiliary power mechanism (12) is used to accelerate the flow of the cooling air flow.

10. The heat dissipation device for the integrated inverter-booster according to any one of claims 2 to 5, characterized in that The main power mechanism (22) includes a fan, and the fan is arranged on at least one of the power conversion box (21), inside the power conversion box (21), inside the transformer room (11), on the transformer room (11), and on the air duct housing (50).

11. An inverter-booster integrated machine, characterized in that, Comprising: The heat dissipation device for the inverter-booster integrated machine according to any one of claims 1 to 10; A winding structure (55) mounted inside the transformer room (11); A semiconductor power device (24) mounted inside the power conversion box (21).

12. The integrated inverter and boost converter according to claim 11, wherein, A reactor (27) is arranged inside the power conversion box (21) or inside the transformer room (11).

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