Packaging structure for improving air tightness of PLCC product
By designing the nanoprotective layer and packaging colloids on the peripheral edge of the LED shard of PLCC products, the problem of poor airtightness of PLCC products is solved, and the cost-effectiveness and stability are improved.
Patent Information
- Application Number
- CN202422370057.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-27
- Publication Date
- 2025-08-01
- Estimated Expiration
- 2034-09-27
AI Technical Summary
The hygroscopic absorption rate of existing PLCC products due to different bracket materials affects the air tightness, resulting in high costs and limited market expansion.
A nanoprotective layer is designed on the periphery of LED scattered particles of PLCC products, and the LED wafer and bonding wire are encapsulated by encapsulating colloids to form a packaging structure to improve airtightness.
Improve airtightness without changing the material of the bracket, reduce development costs, keep product structure and optical characteristics unchanged, and improve stability.
Smart Images
Figure CN223182593U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of LED components, and particularly relates to a packaging structure for improving the airtightness of PLCC products. Background Art
[0002] For the existing PLCC products on the market, the bracket materials are PPA / PCT / EMC / SMC, etc. Due to the different characteristics of plastic materials, the moisture absorption rates of their products are affected, thus ultimately affecting the airtightness of the products. Among the existing plastic material brackets, PPA has the highest moisture absorption rate and poor airtightness. However, compared with products made of materials such as PCT / EMC / SMC, its product cost is the lowest and the market share is relatively large. To improve the airtightness of the product, it is necessary to replace the plastic material with a low moisture absorption rate, which will greatly increase the product development cost and is not conducive to the market expansion of the product. Summary of the Utility Model
[0003] The purpose of the utility model is to solve the defects and deficiencies in the prior art, and design a packaging structure for improving the airtightness of PLCC products. Using the utility model will not change the structure and optical properties of the product itself, and at the same time can improve the airtightness of the product and reduce the failure risk caused by environmental humidity during terminal use.
[0004] To achieve the above purpose, the technical solution adopted by the utility model is: a packaging structure for improving the airtightness of PLCC products, including an LED die and a nano protective layer wrapped around the outer periphery of the LED die. The LED die includes a substrate, an LED chip disposed above the substrate, and bonding wires for conducting between the surface electrodes of the LED chip and the substrate. A bowl cup bracket is further provided above the substrate and around the LED chip, and the bowl cup bracket is filled with a packaging colloid.
[0005] Preferably, the LED chip is fixed on the substrate by die bonding glue, and the die bonding glue is insulating or conductive glue.
[0006] Preferably, there are two bonding wires, which are respectively used for conducting between the positive and negative electrodes of the LED chip (4) and the substrate. [[ID=2C]]
[0007] Preferably, the bonding wires are made of gold wire, alloy wire, silver wire or copper wire.
[0008] Preferably, the packaging colloid wraps the LED chip and the bonding wires and fills the entire bowl cup bracket.
[0009] Preferably, the packaging colloid is silica gel or epoxy glue.
[0010] Preferably, the substrate is made of copper or iron.
[0011] Preferably, the bowl cup bracket is made of plastic, and PPA, PCT, EMC or SMC is selected.
[0012] After adopting the above technical solution, a packaging structure for improving the airtightness of PLCC products provided by the present utility model has the following beneficial effects:
[0013] (1) Through the design of the nano protection layer on the outer periphery of the LED chip in the present utility model, the airtightness of the product can be improved without changing the material of the PLCC bracket, and the development cost of the product has more advantages;
[0014] (2) The present utility model will not have any adverse effects on the application of the product at the terminal, does not change the structure and optical properties of the product itself, and does not require any design modification when the terminal product is applied and can be directly replaced, and the stability of the product is higher and the effect is better. Description of the Drawings
[0015] Figure 1 is a schematic structural diagram of the LED chip in the present utility model;
[0016] Figure 2 is a schematic diagram of a packaging structure for improving the airtightness of PLCC products in the present utility model.
[0017] Among them: substrate 1, bowl cup bracket 2, die bonding glue 3, LED chip 4, bonding wire 5, encapsulation colloid 6, nano protection layer 7. Specific Embodiments
[0018] The present utility model will be further clearly and completely described below with reference to the drawings and specific embodiments. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. The description of at least one exemplary embodiment below is actually only illustrative and in no way limits the present utility model and its application or use. Based on the embodiments in the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present utility model.
[0019] It should be noted that the terms used here are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used here, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, they indicate the presence of features, steps, operations, devices, components and / or combinations thereof.
[0020] Unless otherwise specifically stated, the relative arrangements, numerical expressions, and numerical values of the components and steps set forth in these embodiments do not limit the scope of the present utility model. At the same time, it should be understood that, for the sake of convenience in description, the dimensions of the various parts shown in the drawings are not drawn in actual proportional relationships. Technologies, methods, and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the said technologies, methods, and devices should be regarded as part of the authorization specification. In all the examples shown and discussed here, any specific value should be construed as merely exemplary and not as a limitation. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that like reference numerals and letters denote like items in the following drawings, and thus, once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.
[0021] In the description of the present utility model, it should be understood that the orientation or positional relationships indicated by orientation terms such as "front, rear, upper, lower, left, right", "lateral, vertical, perpendicular, horizontal", and "top, bottom" are generally based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the present utility model and simplifying the description. Without contrary description, these orientation terms do not indicate and imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and thus cannot be construed as limiting the protection scope of the present utility model; the orientation terms "inner, outer" refer to the inside and outside relative to the contour of each component itself.
[0022] For the convenience of description, spatial relative terms such as "above...", "over...", "on the upper surface of...", "above" can be used here to describe the spatial positional relationships of one device or feature with other devices or features as shown in the drawings. It should be understood that the spatial relative terms are intended to encompass different orientations in use or operation in addition to the orientation depicted in the drawings of the device. For example, if the device in the drawing is inverted, the device described as "above other devices or structures" or "over other devices or structures" will then be positioned "below other devices or structures" or "under other devices or structures". Thus, the exemplary term "above..." can include both the orientations of "above..." and "below...". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and corresponding interpretations should be made for the spatial relative descriptions used here.
[0023] In addition, it should be noted that the use of words such as "first", "second", etc. to limit components is only for the convenience of differentiating the corresponding components. Without additional statement, the above words have no special meaning, and thus cannot be construed as limiting the protection scope of the present utility model.
[0024] The present utility model provides a packaging structure for improving the airtightness of PLCC products, as Figure 1-2 shown, which includes an LED die and a nano-protective layer 7 wrapped around the outer periphery of the LED die. The LED die includes a substrate 1, an LED chip 4 disposed above the substrate 1, and bonding wires 5 for conducting between the surface electrodes of the LED chip 4 and the substrate 1. The LED chip 4 is fixedly connected to the pads above the substrate 1. The surface of the substrate 1 where it is connected to the LED chip 4 has a plated conductive layer. The LED chip 4 is fixed on the substrate 1 by die bonding glue 3. The die bonding glue 3 is an insulating or conductive glue. There are two bonding wires 5, which are respectively used for conducting between the positive and negative electrodes of the LED chip 4 and the substrate 1, and the bonding wires 5 can be selected from gold wires, alloy wires, silver wires, copper wires, etc.
[0025] Above the substrate 1 and around the outer periphery of the LED chip 4, there is also a bowl-shaped bracket 2. The bowl-shaped bracket 2 is filled with a packaging colloid 6. Specifically, the packaging colloid 6 wraps the LED chip 4 and the bonding wires 5 and fills the entire bowl-shaped bracket 2. The packaging colloid 6 is silica gel or epoxy glue.
[0026] Furthermore, the substrate 1 is made of copper or iron, and the bowl-shaped bracket 2 is made of plastic, selected from PPA, PCT, EMC or SMC.
[0027] The packaging process of a packaging structure for improving the airtightness of PLCC products according to the present utility model includes the following steps:
[0028] S1. Fix the LED chip 4 on the substrate 1 with conductive glue or other adhesive glue and cure it;
[0029] S2. Connect the electrodes of the LED chip 4 to the bottom substrate 1 through the bonding wires 5 to form conduction;
[0030] S3. Use a dispensing device to dispense silica gel or epoxy glue into the bowl-shaped bracket 2 to wrap and cure the LED chip 2 and the conductive wires 3;
[0031] S4. Use a blanking device to turn the whole product into single LED die products and clean and dry them;
[0032] S5. Immerse the LED die in a container with nano-liquid and cure it (immerse for 5 min and cure at normal temperature for 24 h). After curing, a nano-protective layer will be formed on the outer periphery of the LED die. This protective layer will form a hydrophobic layer and can play a role in isolating water vapor;
[0033] S6. Test and sort the LED die and package them in a carrier tape.
[0034] In summary, the encapsulation structure provided by the present utility model for improving the airtightness of PLCC products, on the one hand, through the design of the nano-protective layer on the outer periphery of the LED chips, can improve the airtightness of the products without changing the material of the PLCC bracket, and the development cost of the products is more advantageous; on the other hand, without changing the structure and optical characteristics of the products themselves, when applied to terminal products, they can be directly replaced without any design modification, and the products have higher stability and better effects, with great market value and worthy of wide promotion and application.
[0035] The above is only a preferred specific embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present utility model, according to the technical solution of the present utility model and its inventive concept, makes equivalent substitutions or changes, and should be covered by the protection scope of the present utility model.
Claims
1. A packaging structure for improving the airtightness of PLCC products, characterized in that: It includes an LED chip and a nano protective layer (7) wrapped around the outer periphery of the LED chip. The LED chip includes a substrate (1), an LED wafer (4) disposed above the substrate (1), and bonding wires (5) for conducting between the surface electrodes of the LED wafer (4) and the substrate (1). A bowl-shaped bracket (2) is further provided above the substrate (1) and outside the periphery of the LED wafer (4), and an encapsulating colloid (6) is filled in the bowl-shaped bracket (2).
2. The encapsulation structure for improving the airtightness of PLCC products according to claim 1, wherein: The LED wafer (4) is fixed on the substrate (1) by a die bonding adhesive (3), and the die bonding adhesive (3) is an insulating or conductive adhesive.
3. The encapsulation structure for improving the airtightness of PLCC products according to claim 1, characterized in that: There are two bonding wires (5), which are respectively used for conducting between the positive and negative electrodes of the LED wafer (4) and the substrate (1).
4. A packaging structure for improving the airtightness of a PLCC product according to claim 1, characterized in that: The bonding wires (5) are selected from gold wires, alloy wires, silver wires or copper wires.
5. A packaging structure for improving the airtightness of a PLCC product according to claim 1, characterized in that: The encapsulating colloid (6) wraps the LED wafer (4) and the bonding wires (5) and fills the entire bowl-shaped bracket (2).
6. The encapsulation structure for improving the airtightness of a PLCC product according to claim 1, characterized in that: The encapsulating colloid (6) is silicone or epoxy resin.
7. A packaging structure for improving the airtightness of a PLCC product according to claim 1, characterized in that: The substrate (1) is selected from copper or iron.
8. The encapsulation structure for improving the airtightness of a PLCC product according to claim 1, wherein: The bowl-shaped bracket (2) is made of plastic and is selected from PPA, PCT, EMC or SMC.