LED packaging structure

Abstract

The utility model provides an LED packaging structure, which comprises a substrate, a metal box dam edge, glass and a chipset accommodated in an accommodating space, the substrate, the metal box dam edge and the glass jointly form the accommodating space, the substrate comprises a first surface, a second surface and a plurality of conductive holes penetrating through the substrate, the first surface is provided with a plurality of electrode parts arranged at intervals, and the second surface is provided with a plurality of conductive holes penetrating through the second surface. The first surface is provided with a plurality of electrode parts, the second surface is provided with a plurality of bonding pads corresponding to the plurality of electrode parts, the plurality of electrode parts comprise a first positive electrode part, a second positive electrode part and a first negative electrode part, the chipset comprises a plurality of LED chips which are connected in parallel, the positive electrode of each LED chip is electrically connected with one of the first positive electrode part and the second positive electrode part, and the negative electrode of each LED chip is electrically connected with the first negative electrode part. According to the utility model, through the common-cathode and common-anode circuit, the effects of amplifying power and mixing wavebands are realized, and compared with a traditional product, the space is effectively saved, and the cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of LED packaging structures, and particularly relates to an LED packaging structure. Background Art

[0002] LED (Light Emitting Diode, semiconductor light emitting diode) is a commonly used light emitting device that emits light by the recombination of electrons and holes. It is widely used in the field of lighting. LED packaging refers to the packaging of light emitting chips, and its function is to provide sufficient protection for the chips to prevent them from failing due to long-term exposure to air or mechanical damage, so as to improve the stability of the chips. At present, in order to meet the requirements of terminal products, LED packaging is required to be light, thin, short, and small. However, the luminous power of a single LED packaging on the market is small and does not meet the needs of customers.

[0003] UVLED refers to an ultraviolet semiconductor light source that adopts the LED light emitting principle, including all electromagnetic radiation wavelengths between 200nm and 400nm. According to its emission wavelength, it can be further divided into UVA (320nm - 400nm, long-wave ultraviolet), UVB (280nm - 315nm, medium-wave ultraviolet), and UVC (200nm - 280nm, short-wave ultraviolet) bands. The UVC band can be used for sterilization and disinfection, UVA can achieve photocatalysis, and UVB can be used for plant growth and medical use. The wavelength band of a single LED packaging on the market is single.

[0004] Patent No. CN112089862A discloses a UVC LED all-inorganic or semi-inorganic packaging structure with ultraviolet semiconductors in parallel, which includes a substrate, and at least two UVC chips arranged on the substrate. The substrate includes an upper surface provided with UVC chips and a lower surface opposite to the upper surface. The upper surface is provided with pad pairs corresponding to the UVC chips. Each UVC chip is arranged between a pair of pad pairs and is electrically connected to them. The UVC chips are connected in parallel with each other. In this patent, two UVC chips are used to increase the luminous power, but each UVC chip requires a pair of pad pairs for connection. If more chips are used, the overall packaging size will increase.

[0005] Therefore, it is necessary to provide a new LED packaging structure to solve the above technical problems. Summary of the Utility Model

[0006] Aiming at the deficiencies of the prior art, the purpose of the utility model is to provide an LED packaging structure that can improve the luminous power and save space.

[0007] To achieve the above object, the present utility model provides an LED packaging structure, which includes a substrate, a metal dam edge, glass that jointly form a receiving space, and a chip group received in the receiving space. The substrate includes a first surface, a second surface, and a plurality of conductive holes penetrating the substrate. The first surface has a plurality of electrode portions arranged at intervals, and the second surface has a plurality of pads corresponding to the plurality of electrode portions. The plurality of electrode portions include a first positive electrode portion, a second positive electrode portion, and a first negative electrode portion. The chip group includes a plurality of LED chips connected in parallel. The positive electrode of each of the plurality of LED chips is electrically connected to one of the first positive electrode portion and the second positive electrode portion, and the negative electrode of each of the plurality of LED chips is electrically connected to the first negative electrode portion.

[0008] Preferably, the chip group further includes an indicator light chip, and the plurality of electrode portions further include a third positive electrode portion and a second negative electrode portion. The two poles of the indicator light chip are respectively electrically connected to the third positive electrode portion and the second negative electrode portion.

[0009] Preferably, the plurality of LED chips include a first LED chip, a second LED chip, a third LED chip, and a fourth LED chip. The positive electrodes of the first LED chip and the second LED chip are electrically connected to the first positive electrode portion, and the negative electrodes of the first LED chip and the second LED chip are electrically connected to the first negative electrode portion. The positive electrodes of the third LED chip and the fourth LED chip are electrically connected to the second positive electrode portion, and the negative electrodes of the third LED chip and the fourth LED chip are electrically connected to the first negative electrode portion. The chip group further includes a Zener diode, and the two poles of the Zener diode are respectively electrically connected to the first positive electrode portion and the first negative electrode portion.

[0010] Preferably, the first positive electrode portion extends along a first direction, the second positive electrode portion includes a first region extending along the first direction and a second region extending along a second direction, the first negative electrode portion includes a third region extending along the first direction and a fourth region extending along the second direction, the first direction is perpendicular to the second direction, the first positive electrode portion and the third region are adjacent to each other and form the first interval, the third region and the first region are adjacent to each other and form the second interval, the third region and the second region are adjacent to each other and form the third interval, the first interval, the second interval, and the third interval are equal, the first LED chip and the second LED chip are arranged in the first interval, and the Zener diode, the third LED chip, and the fourth LED chip are arranged in the second interval.

[0011] Preferably, the plurality of pads include a first pad electrically connected to the first positive electrode portion, a second pad electrically connected to the second positive electrode portion, a third pad electrically connected to the first negative electrode portion, and the plurality of pads further include a fourth pad electrically connected to the third positive electrode portion and a fifth pad electrically connected to the second negative electrode portion.

[0012] Preferably, the plurality of pads include a first pad electrically connected to the first positive electrode portion and the second positive electrode portion, a second pad electrically connected to the first negative electrode portion, a third pad electrically connected to the third positive electrode portion, and a fourth pad electrically connected to the second negative electrode portion.

[0013] To achieve the above object, the present invention further provides an LED packaging structure, which includes a substrate, a metal dam edge, glass that jointly form a receiving space, and a chip group received in the receiving space. The substrate includes a first surface, a second surface, and a plurality of conductive holes penetrating the substrate. The first surface has a plurality of electrode portions arranged at intervals, and the second surface has a plurality of pads corresponding to the plurality of electrode portions. The plurality of electrode portions include a first positive electrode portion and a first negative electrode portion. The chip group includes a plurality of LED chips connected in parallel. The positive electrode of each of the plurality of LED chips is electrically connected to the first positive electrode portion, and the negative electrode of each of the plurality of LED chips is electrically connected to the first negative electrode portion.

[0014] Preferably, the plurality of LED chips include a first LED chip, a second LED chip, a third LED chip, and a fourth LED chip. The chip group further includes an indicator light chip and a Zener diode. The two poles of the Zener diode are electrically connected to the first positive electrode portion and the first negative electrode portion respectively. The plurality of electrode portions further include a second positive electrode portion and a second negative electrode portion. The two poles of the indicator light chip are electrically connected to the second positive electrode portion and the second negative electrode portion respectively.

[0015] Preferably, the plurality of pads include a first pad electrically connected to the first positive electrode portion, a second pad electrically connected to the first negative electrode portion, a third pad electrically connected to the second positive electrode portion, and a fourth pad electrically connected to the second negative electrode portion.

[0016] Preferably, the first positive electrode portion includes a first region extending in a first direction and a second region extending in a second direction, the first negative electrode portion includes a third region, a fourth region extending in the first direction, and a fifth region extending in the second direction, the first direction is perpendicular to the second direction, the first region and the third region are adjacent to each other and form a first interval, the first region and the fourth region are adjacent to each other and form a second interval, the second region and the third region are adjacent to each other and form a third interval, the first interval, the second interval, and the third interval are equal in distance, the first LED chip and the second LED chip are disposed in the first interval, the third LED chip and the fourth LED chip are disposed in the second interval, and the Zener diode is disposed in the third interval.

[0017] The utility model realizes the effects of amplifying power and mixing bands through a common cathode and common anode circuit. Compared with traditional products, it effectively saves space and reduces costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a front view of the first embodiment of an LED packaging structure of the utility model;

[0019] Figure 2 is Figure 1 the rear view shown;

[0020] Figure 3 is Figure 1 the sectional view taken along line A-A shown;

[0021] Figure 4 is a rear view of the second embodiment of an LED packaging structure of the utility model;

[0022] Figure 5 is a front view of the third embodiment of an LED packaging structure of the utility model;

[0023] Figure 6 is a front view of the fourth embodiment of an LED packaging structure of the utility model;

[0024] Figure 7 is Figure 5 the rear view shown. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0025] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0026] Embodiment 1

[0027] As Figures 1 to 3 shown, the present utility model provides an LED packaging structure 100, which includes a substrate 1, a metal dam edge 2, and a glass 3 that jointly form a receiving space 10. It also includes a chip group 4 received in the receiving space 10 and a plurality of pads 5 fixed to the substrate 1 and exposed outside.

[0028] The substrate 1 is a ceramic substrate, and the glass 3 is a flat plate-shaped glass or a hemispherical quartz glass, but is not limited thereto.

[0029] The substrate 1 includes a first surface 11, a second surface 12, and a plurality of conductive holes 13 penetrating through the substrate 1, and conductive metal is provided in the conductive holes 13.

[0030] The metal dam edge 2 is disposed on the first surface 11. A welding layer 31 is disposed on the side of the glass 3 close to the substrate 1, and the glass 3 and the metal dam edge 2 are welded and fixed through the welding layer 31.

[0031] The first surface 11 has a plurality of electrode portions 6 disposed at intervals.

[0032] The second surface 12 includes a heat dissipation area 121, a protection area 122, and a plurality of conductive portions 123 that are electrically connected to the plurality of electrode portions 6 through the plurality of conductive holes 13. The pads 5 are fixed to the corresponding plurality of conductive portions 123, and the pads 5 are electrically connected to the chip group 4 through the plurality of conductive portions 123 and the plurality of electrode portions 6.

[0033] The heat dissipation area 121 is a thermoelectric separation layer, and the protection area 122 is a solder mask layer.

[0034] The chip group 4 is fixed to the first surface 11, and the pads 5 are fixed to the second surface 12.

[0035] The plurality of electrode portions 6 include a first positive electrode portion 61, a second positive electrode portion 62, and a first negative electrode portion 63. Two conductive holes 13 are respectively provided on the first positive electrode portion 61, the second positive electrode portion 62, and the first negative electrode portion 63. In other embodiments, the number of the conductive holes 13 is not limited.

[0036] The chip group 4 includes a plurality of LED chips connected in parallel, and the plurality of LED chips are flip-chip LED chips. For example, it is any one or a combination of UVA / UVB / UVC.

[0037] The positive electrode of each LED chip is electrically connected to one of the first positive electrode portion 61 and the second positive electrode portion 62, and the negative electrode of each LED chip is electrically connected to the first negative electrode portion 63. Through such a design, all the LED chips are connected in parallel, thereby forming a common cathode and common anode circuit. Compared with the traditional technology, more chips can be packaged in a limited space, improving the overall power.

[0038] Specifically, several LED chips include a first LED chip 41 and a second LED chip 42. The anodes of the first LED chip 41 and the second LED chip 42 are electrically connected to a first anode portion 61, and the cathodes of the first LED chip 41 and the second LED chip 42 are electrically connected to a first cathode portion 63.

[0039] Specifically, several LED chips include a third LED chip 43 and a fourth LED chip 44. The anodes of the third LED chip 43 and the fourth LED chip 44 are electrically connected to a second anode portion 62, and the cathodes of the third LED chip 43 and the fourth LED chip 44 are electrically connected to the first cathode portion 63.

[0040] In other embodiments, the number and types of LED chips are not limited.

[0041] Specifically, the chipset 4 further includes a Zener diode 45. The two poles of the Zener diode 45 are electrically connected to the first anode portion 61 and the first cathode portion 63 respectively. The Zener diode 45 functions as electrostatic protection.

[0042] Specifically, the chipset 4 further includes an indicator chip 46. The several electrode portions 6 further include a third anode portion 64 and a second cathode portion 65. The two poles of the indicator chip 46 are respectively connected to the third anode portion 64 and the second cathode portion 65. Since some LED chips cannot be seen by the human eye during operation, the indicator chip 46 can be used to determine whether it is operating normally.

[0043] Conductive holes 13 are respectively provided on the third anode portion 64 and the second cathode portion 65. In other embodiments, the number of conductive holes 13 is not limited.

[0044] The first anode portion 61 and the first cathode portion 63 form a first interval 71, the second anode portion 62 and the first cathode portion 63 form a second interval 72 and a third interval 73. The first interval 71, the second interval 72, and the third interval 73 are equal in distance. The first anode portion 61 extends along a first direction, the second anode portion 62 includes a first region 621 extending along the first direction and a second region 622 extending along a second direction. The first cathode portion 63 includes a third region 631 extending along the first direction and a fourth region 632 extending along the second direction. The first direction is perpendicular to the second direction. The first anode portion 61 is adjacent to the third region 631 and forms the first interval 71, the third region 631 is adjacent to the first region 621 and forms the second interval 72, and the third region 631 is adjacent to the second region 622 and forms the third interval 73.

[0045] The first LED chip 41 and the second LED chip 42 are disposed in the first interval 71, and the Zener diode 45, the third LED chip 43, and the fourth LED chip 44 are disposed in the second interval 72.

[0046] The first positive electrode part 61 is rectangular, the second positive electrode part 62 is L-shaped, and the first negative electrode part 63 is L-shaped. The second positive electrode part 62 and the first negative electrode part 63 are arranged approximately symmetrically and together form a rectangular outline. The first positive electrode part 61, the second positive electrode part 62, the first negative electrode part 63, the third positive electrode part 64, and the second negative electrode part 65 together form a square outline.

[0047] The pad 5 includes a first pad 51 electrically connected to the first positive electrode part 61, a second pad 52 electrically connected to the second positive electrode part 62, and a third pad 53 electrically connected to the first negative electrode part 63.

[0048] The pad 5 further includes a fourth pad 54 electrically connected to the third positive electrode part 64 and a fifth pad 55 electrically connected to the second negative electrode part 65.

[0049] The working principle of an LED packaging structure 100 of the present utility model is as follows: The first pad 51 and the second pad 52 are jointly connected to the positive electrode of the power supply, and the third pad 53 is connected to the negative electrode of the power supply. When an input voltage is applied, the first LED chip 41, the second LED chip 42, the third LED chip 43, and the fourth LED chip 44 can be simultaneously lit. The effect of amplifying the power is achieved through a common cathode and common anode circuit. A mixed band can be achieved by using different types of LED chips, such as a mixed band of UVB + UVC, but not limited thereto.

[0050] The fourth pad 54 is connected to the positive electrode of the power supply, and the fifth pad 55 is connected to the negative electrode of the power supply. When an input voltage is applied, the indicator chip 46 can be lit. Thus, it is possible to determine whether the LED chip is working properly through the indicator chip 46.

[0051] Embodiment 2

[0052] As Figure 4 shown, in this embodiment, the pad 5' includes a first pad 51' electrically connected to the first positive electrode part 61 and the second positive electrode part 62, a second pad 52' electrically connected to the first negative electrode part 63, a third pad 53' electrically connected to the third positive electrode part 64, and a fourth pad 54' electrically connected to the second negative electrode part 65.

[0053] The working principle of this embodiment is as follows: The first pad 51' is connected to the positive electrode of the power supply, and the second pad 52' is connected to the negative electrode of the power supply. When an input voltage is applied, the first LED chip 41, the second LED chip 42, the third LED chip 43, and the fourth LED chip 44 can be simultaneously lit. The effect of amplifying the power is achieved through a common cathode and common anode circuit. A mixed band can be achieved by using different types of LED chips, such as a mixed band of UVB + UVC, but not limited thereto.

[0054] The third pad 53' is connected to the positive pole of the power supply, and the fourth pad 54' is connected to the negative pole of the power supply. When inputting voltage, the indicator chip 46 can be lit. Thus, it is possible to determine whether the LED chip is working properly through the indicator chip 46.

[0055] Therefore, an LED packaging structure 100 of the present utility model sets multiple chips in one package through a common cathode and common anode circuit, thereby achieving power amplification and multi-band requirements.

[0056] In summary, the beneficial effects of an LED packaging structure 100 of the present utility model are as follows: A common cathode and common anode circuit is formed through the cooperation of the first positive electrode part, the second positive electrode part, the first negative electrode part, and several LED chips, achieving the effects of amplifying power and mixing bands. Compared with traditional products, it effectively saves space and reduces costs.

[0057] Embodiment 3

[0058] As Figure 5 shown, the present utility model provides an LED packaging structure 200, which is substantially the same as the structure of Embodiment 1, except that: the first positive electrode part 61', the second positive electrode part 62', the first negative electrode part 63', the third positive electrode part 64', and the second negative electrode part 65' together form a circular contour.

[0059] Embodiment 4

[0060] As Figures 6 - 7 shown, the present utility model provides an LED packaging structure 300. This embodiment has the same substrate, metal dam edge, and glass structure as Embodiment 1, except that it further includes a chip group 4, several electrode parts 8, and several pads 9.

[0061] The electrode part 8 includes a first positive electrode part 81 and a first negative electrode part 82. The chip group 4 includes several LED chips connected in parallel. The positive electrode of each LED chip is electrically connected to the first positive electrode part 81, and the negative electrode of each LED chip is electrically connected to the first negative electrode part 82.

[0062] The several LED chips include a first LED chip 41, a second LED chip 42, a third LED chip 43, and a fourth LED chip 44. In other embodiments, the number and types of LED chips are not limited.

[0063] The chip group 4 further includes an indicator chip 46, and the electrode part 8 further includes a second positive electrode part 83 and a second negative electrode part 84. The two poles of the indicator chip 46 are electrically connected to the second positive electrode part 83 and the second negative electrode part 84 respectively.

[0064] The chip group 4 further includes a Zener diode 45. The two poles of the Zener diode 45 are electrically connected to the first positive electrode part 81 and the first negative electrode part 82 respectively. The Zener diode 45 functions as electrostatic protection.

[0065] The pad 9 includes a first pad 91 electrically connected to the first positive electrode portion 81, a second pad 92 electrically connected to the first negative electrode portion 82, a third pad 93 electrically connected to the second positive electrode portion 83, and a fourth pad 94 electrically connected to the second negative electrode portion 84.

[0066] The first positive electrode portion 81 includes a first region 811 extending along a first direction and a second region 812 extending along a second direction. The first negative electrode portion 82 includes a third region 821, a fourth region 822 extending along the first direction, and a fifth region 823 extending along the second direction. The first direction is perpendicular to the second direction. The first region 811 and the third region 821 are adjacent to each other and form a first interval 85. The first region 811 and the fourth region 822 are adjacent to each other and form a second interval 86. The second region 812 and the third region 821 are adjacent to each other and form a third interval 87. The first interval 85, the second interval 86, and the third interval 87 are equal in distance. The first LED chip 41 and the second LED chip 42 are disposed in the first interval 85. The third LED chip 43 and the fourth LED chip 44 are disposed in the second interval 86. The Zener diode 45 is disposed in the third interval 87.

[0067] Specifically, the first positive electrode portion 81 is in a T shape, and the first negative electrode portion 82 is in a U shape. The first positive electrode portion 81 and the first negative electrode portion 82 together form a rectangular outline. The first positive electrode portion 81, the first negative electrode portion 82, the second positive electrode portion 83, and the second negative electrode portion 84 together form a square outline.

[0068] The working principle of an LED packaging structure of the present utility model is as follows: The first pad 91 is connected to the positive electrode of the power supply, and the second pad 92 is connected to the negative electrode of the power supply. When an input voltage is applied, the first LED chip 41, the second LED chip 42, the third LED chip 43, and the fourth LED chip 44 can be simultaneously lit. The effect of amplifying power is achieved through a common cathode and common anode circuit. Different types of LED chips can be used to achieve a mixed band, such as a mixed band of UVB + UVC, but it is not limited thereto.

[0069] The third pad 93 is connected to the positive electrode of the power supply, and the fourth pad 94 is connected to the negative electrode of the power supply. When an input voltage is applied, the indicator chip 46 can be lit. Thus, it is possible to determine whether the LED chip is working properly through the indicator chip 46.

[0070] In summary, the beneficial effects of an LED packaging structure of the present utility model are as follows: A common cathode and common anode circuit is formed through the cooperation of the first positive electrode portion, the first negative electrode portion, and several LED chips, achieving the effects of amplifying power and a mixed band. Compared with traditional products, it effectively saves space and reduces costs.

[0071] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the various embodiments of the present application.

Claims

1. An LED packaging structure, which includes a substrate, a metal dam edge, glass that jointly form a receiving space, and a chip set received in the receiving space. The substrate includes a first surface, a second surface, and a plurality of conductive holes penetrating through the substrate, and is characterized in that, The first surface has a plurality of electrode portions arranged at intervals, the second surface has a plurality of pads corresponding to the plurality of electrode portions, the plurality of electrode portions include a first positive electrode portion, a second positive electrode portion, and a first negative electrode portion, the chip group includes a plurality of LED chips connected in parallel, the positive electrode of each of the plurality of LED chips is electrically connected to one of the first positive electrode portion and the second positive electrode portion, and the negative electrode of each of the plurality of LED chips is electrically connected to the first negative electrode portion; The chip group further includes an indicator lamp chip, the plurality of electrode portions further include a third positive electrode portion and a second negative electrode portion, and two poles of the indicator lamp chip are respectively electrically connected to the third positive electrode portion and the second negative electrode portion.

2. The LED packaging structure according to claim 1, wherein The plurality of LED chips include a first LED chip, a second LED chip, a third LED chip, and a fourth LED chip. The positive electrodes of the first LED chip and the second LED chip are electrically connected to the first positive electrode portion, the negative electrodes of the first LED chip and the second LED chip are electrically connected to the first negative electrode portion, the positive electrodes of the third LED chip and the fourth LED chip are electrically connected to the second positive electrode portion, the negative electrodes of the third LED chip and the fourth LED chip are electrically connected to the first negative electrode portion, the chip group further includes a Zener diode, and two poles of the Zener diode are respectively electrically connected to the first positive electrode portion and the first negative electrode portion.

3. An LED packaging structure according to claim 2, wherein The first positive electrode portion extends along a first direction, the second positive electrode portion includes a first region extending along the first direction and a second region extending along a second direction, the first negative electrode portion includes a third region extending along the first direction and a fourth region extending along the second direction, the first direction is perpendicular to the second direction, the first positive electrode portion and the third region are adjacent to each other and form a first interval, the third region and the first region are adjacent to each other and form a second interval, the third region and the second region are adjacent to each other and form a third interval, the first interval, the second interval, and the third interval are equal, the first LED chip and the second LED chip are arranged in the first interval, and the Zener diode, the third LED chip, and the fourth LED chip are arranged in the second interval.

4. An LED packaging structure according to claim 3, characterized in that, The plurality of pads include a first pad electrically connected to the first positive electrode portion, a second pad electrically connected to the second positive electrode portion, a third pad electrically connected to the first negative electrode portion, the plurality of pads further include a fourth pad electrically connected to the third positive electrode portion and a fifth pad electrically connected to the second negative electrode portion.

5. An LED packaging structure according to claim 3, wherein, The plurality of pads include a first pad electrically connected to the first positive electrode portion and the second positive electrode portion, a second pad electrically connected to the first negative electrode portion, a third pad electrically connected to the third positive electrode portion, and a fourth pad electrically connected to the second negative electrode portion.

6. An LED packaging structure, which includes a substrate, a metal dam edge, glass that jointly form a receiving space, and a chip set received in the receiving space. The substrate includes a first surface, a second surface, and a plurality of conductive vias penetrating the substrate, and is characterized in that, The first surface has a plurality of electrode portions arranged at intervals, the second surface has a plurality of pads corresponding to the plurality of electrode portions, the plurality of electrode portions include a first positive electrode portion and a first negative electrode portion, the chip group includes a plurality of LED chips connected in parallel, the positive electrode of each of the plurality of LED chips is electrically connected to the first positive electrode portion, and the negative electrode of each of the plurality of LED chips is electrically connected to the first negative electrode portion; The plurality of LED chips include a first LED chip, a second LED chip, a third LED chip, and a fourth LED chip. The chip group further includes an indicator lamp chip and a Zener diode. Two poles of the Zener diode are electrically connected to the first positive electrode portion and the first negative electrode portion respectively. The plurality of electrode portions further include a second positive electrode portion and a second negative electrode portion. Two poles of the indicator lamp chip are electrically connected to the second positive electrode portion and the second negative electrode portion respectively.

7. An LED packaging structure according to claim 6, characterized in that, The plurality of pads include a first pad electrically connected to the first positive electrode portion, a second pad electrically connected to the first negative electrode portion, a third pad electrically connected to the second positive electrode portion, and a fourth pad electrically connected to the second negative electrode portion.

8. An LED packaging structure according to claim 7, wherein The first positive electrode portion includes a first region extending along a first direction and a second region extending along a second direction. The first negative electrode portion includes a third region, a fourth region extending along the first direction, and a fifth region extending along the second direction. The first direction is perpendicular to the second direction. The first region and the third region are adjacent to each other and form a first interval. The first region and the fourth region are adjacent to each other and form a second interval. The second region and the third region are adjacent to each other and form a third interval. The first interval, the second interval, and the third interval are equal in distance. The first LED chip and the second LED chip are arranged in the first interval. The third LED chip and the fourth LED chip are arranged in the second interval. The Zener diode is arranged in the third interval.

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