Inductor epoxy glue curing forming device

Abstract

The utility model relates to the technical field of curing forming, and discloses an inductance epoxy glue curing forming device which comprises a curing box, a UV curing lamp is fixedly installed on the inner side wall of the curing box, a driving box is fixedly arranged at the bottom of the curing box, a driving motor is fixedly arranged in the driving box, and the driving motor is connected with the UV curing lamp. And a rotating shaft extending into the curing box is fixedly arranged at the output end of the driving motor, a placing disc is fixedly arranged at the upper end of the rotating shaft, a magnetic induction coil is placed on the upper surface of the placing disc, and an elastic pressing mechanism for fixing the magnetic induction coil is arranged on the surface of the placing disc. According to the utility model, the magnetic induction coil can be rotated at an angle, so that different surfaces of the magnetic induction coil are illuminated by the UV curing lamp, the curing forming efficiency of the inductance epoxy glue is improved, and the production period is shortened.

Description

Technical Field

[0001] The utility model relates to the technical field of curing and molding, in particular to an inductive epoxy adhesive curing and molding device. Background Art

[0002] Photocuring refers to the curing process of monomers, oligomers or polymer matrices under light induction. During the current production of electromagnetic induction coils, epoxy glue needs to be applied between the electromagnetic induction coil and the base to form and fix them, and then the epoxy glue is cured by a photocuring device.

[0003] In the curing process of inductor epoxy adhesive using existing curing devices, the UV curing lamp can only partially irradiate the electromagnetic induction coil due to the large distribution of epoxy adhesive on the electromagnetic induction coil. This reduces the curing effect of the inductor epoxy adhesive and prolongs the production cycle. To address this issue, a device for curing inductor epoxy adhesive is proposed. Utility Model Content

[0004] The purpose of the utility model is to solve the problem of low efficiency of curing and molding of inductive epoxy adhesive in the prior art, and to propose an inductive epoxy adhesive curing and molding device.

[0005] In order to achieve the above purpose, the present invention adopts the following technical solutions:

[0006] An inductive epoxy adhesive curing and molding device includes a curing box, an inner side wall of the curing box is fixedly mounted with a UV curing lamp, a bottom of the curing box is fixedly mounted with a drive box, a drive motor is fixedly mounted inside the drive box, an output end of the drive motor is fixedly mounted with a rotating shaft extending into the interior of the curing box, an upper end of the rotating shaft is fixedly mounted with a placement plate, an upper surface of the placement plate is mounted with a magnetic induction coil, and a surface of the placement plate is provided with an elastic pressing mechanism for fixing the magnetic induction coil.

[0007] Preferably, the elastic pressing mechanism includes an L-shaped pressure rod, a connecting plate and a spring, the L-shaped pressure rod is symmetrically inserted and arranged on both sides of the surface of the placement plate, the bent upper ends of the two L-shaped pressure rods are pressed and contacted with the base of the magnetic induction coil, the lower ends of the two L-shaped pressure rods extend to the bottom of the placement plate and are fixedly connected to the connecting plate, the springs are symmetrically fixed on both sides of the lower surface of the placement plate, and the lower ends of the two springs are fixedly connected to the connecting plate.

[0008] Preferably, a non-slip rubber pad is fixedly provided on the curved upper end of the L-shaped pressure rod.

[0009] Preferably, a circular hole is provided in the middle of the connecting plate, and the shaft wall of the rotating shaft vertically passes through the circular hole of the connecting plate.

[0010] Preferably, the drive motor is a reduction motor.

[0011] Preferably, the side wall of the curing box is provided with a take-in / take-out opening, and a box cover is provided inside the take-in / take-out opening.

[0012] Compared with the prior art, the present invention provides an inductive epoxy adhesive curing and molding device, which has the following beneficial effects:

[0013] 1. The inductive epoxy adhesive curing and molding device is equipped with a driving motor, a rotating shaft and a placement disk. After the magnetic induction coil is pressed and fixed on the surface of the placement disk, the driving motor is turned on to work. The driving motor can drive the rotating shaft to rotate, and the rotating shaft can drive the placement disk to rotate, thereby enabling the magnetic induction coil to rotate at an angle, so that different surfaces of the magnetic induction coil can be illuminated by the UV curing lamp, thereby improving the curing and molding efficiency of the inductive epoxy adhesive.

[0014] 2. The inductive epoxy adhesive curing and molding device is equipped with an L-shaped pressure rod, a connecting plate and a spring. Before the magnetic induction coil is placed on the surface of the placement disk, the connecting plate is manually pushed upward, causing the L-shaped pressure rod to move upward and compress the spring. At this time, the bottom of the magnetic induction coil can be inserted under the L-shaped pressure rod. The elastic force applied to the connecting plate by the spring enables the L-shaped pressure rod to press the base of the magnetic induction coil tightly and fix it on the surface of the placement disk, thereby increasing the placement stability of the magnetic induction coil and preventing the magnetic induction coil from falling off the surface of the placement disk.

[0015] The parts not involved in this device are the same as the existing technology or can be implemented using existing technology. The utility model can rotate the magnetic induction coil at an angle so that different surfaces of the magnetic induction coil are illuminated by the UV curing lamp, thereby improving the curing efficiency of the inductive epoxy adhesive and shortening the production cycle. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a three-dimensional diagram of an inductive epoxy adhesive curing and molding device proposed in the utility model;

[0017] Figure 2 for Figure 1 Cross-section diagram of the curing box and the drive box;

[0018] Figure 3 for Figure 2 Top view of the middle L-shaped compression rod and connecting plate;

[0019] Figure 4 for Figure 2 Side view of the middle L-shaped compression rod and connecting plate.

[0020] In the figure: 1. Curing box; 2. UV curing lamp; 3. Drive box; 4. Drive motor; 5. Rotating shaft; 6. Placement plate; 7. Magnetic induction coil; 8. L-shaped pressure rod; 9. Connecting plate; 10. Spring; 11. Anti-slip rubber pad; 12. Box cover. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0022] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they cannot be understood as limitations on the present invention.

[0023] Example 1

[0024] Reference Figure 1-2 An inductive epoxy adhesive curing molding device includes a curing box 1, a side wall of the curing box 1 is provided with a take-out port, and a box cover 12 is provided inside the take-out port. By opening the box cover 12, an artificial hand can be ensured to reach the interior of the curing box 1. A UV curing lamp 2 is fixedly installed on the inner wall of the curing box 1, a driving box 3 is fixedly provided at the bottom of the curing box 1, a driving motor 4 is fixedly provided inside the driving box 3, a rotating shaft 5 extending into the interior of the curing box 1 is fixedly provided at the output end of the driving motor 4, a placing plate 6 is fixedly provided on the upper end of the rotating shaft 5, a magnetic induction coil 7 is placed on the upper surface of the placing plate 6, and a magnetic induction coil 7 is placed. The surface of the disk 6 is provided with an elastic pressing mechanism for fixing the magnetic induction coil 7. After the magnetic induction coil 7 is pressed and fixed to the surface of the placement disk 6 by the elastic pressing mechanism, the drive motor 4 and the UV curing lamp 2 are turned on to work. The drive motor 4 can drive the rotating shaft 5 to rotate, and the rotating shaft 5 can drive the placement disk 6 to rotate, so that the magnetic induction coil 7 can rotate at an angle, so that different surfaces of the magnetic induction coil 7 can be illuminated by the UV curing lamp 2, thereby improving the curing and molding efficiency of the induction epoxy glue. The drive motor 4 adopts a reduction motor, which can realize the slow rotation of the magnetic induction coil 7 inside the curing box 1.

[0025] Example 2

[0026] Reference Figure 2-4, the elastic pressing mechanism includes an L-shaped pressure rod 8, a connecting plate 9 and a spring 10. The L-shaped pressure rod 8 is symmetrically inserted and arranged on both sides of the surface of the placement disk 6. The bent upper ends of the two L-shaped pressure rods 8 are pressed and contacted with the base of the magnetic induction coil 7. The lower ends of the two L-shaped pressure rods 8 extend to the bottom of the placement disk 6 and are fixedly connected to the connecting plate 9. A circular hole is provided in the middle of the connecting plate 9. The shaft wall of the rotating shaft 5 vertically passes through the circular hole of the connecting plate 9. The springs 10 are symmetrically fixed on both sides of the lower surface of the placement disk 6, and the lower ends of the two springs 10 are fixedly connected to the connecting plate 9. Before the magnetic induction coil 7 is placed on the surface of the placement disk 6, it is manually pressed. The connecting plate 9 is pushed upward, so that the L-shaped pressure rod 8 moves upward and compresses the spring 10. At this time, the bottom of the magnetic induction coil 7 can be inserted under the L-shaped pressure rod 8, and the elastic force applied to the connecting plate 9 by the spring 10 enables the L-shaped pressure rod 8 to press and fix the base of the magnetic induction coil 7 to the surface of the placement disk 6, thereby increasing the placement stability of the magnetic induction coil 7 and preventing the magnetic induction coil 7 from falling off the surface of the placement disk 6; the curved upper end of the L-shaped pressure rod 8 is fixed with an anti-slip rubber pad 11, which can increase the friction resistance between the base of the induction coil 7 and the induction coil 7, so that the induction coil 7 can be firmly pressed against the surface of the placement disk 6.

[0027] The above is only a preferred specific implementation method of the present invention, but the protection scope of the present invention is not limited to this. Any technician familiar with the technical field within the technical scope disclosed by the present invention can make equivalent replacements or changes based on the technical solution and utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. An inductive epoxy adhesive curing and molding device, comprising a curing box (1), characterized in that: A UV curing lamp (2) is fixedly mounted on the inner wall of the curing box (1), a driving box (3) is fixedly mounted on the bottom of the curing box (1), a driving motor (4) is fixedly mounted inside the driving box (3), a rotating shaft (5) extending into the interior of the curing box (1) is fixedly mounted on the output end of the driving motor (4), a placement plate (6) is fixedly mounted on the upper end of the rotating shaft (5), a magnetic induction coil (7) is placed on the upper surface of the placement plate (6), and an elastic pressing mechanism for fixing the magnetic induction coil (7) is provided on the surface of the placement plate (6).

2. The inductive epoxy adhesive curing molding device according to claim 1, characterized in that: The elastic pressing mechanism comprises an L-shaped pressure rod (8), a connecting plate (9) and a spring (10). The L-shaped pressure rod (8) is symmetrically inserted and arranged on both sides of the surface of the placement plate (6). The bent upper ends of the two L-shaped pressure rods (8) are pressed and contacted with the base of the magnetic induction coil (7). The lower ends of the two L-shaped pressure rods (8) extend to the bottom of the placement plate (6) and are fixedly connected to the connecting plate (9). The spring (10) is symmetrically fixedly arranged on both sides of the lower surface of the placement plate (6), and the lower ends of the two springs (10) are fixedly connected to the connecting plate (9).

3. The inductive epoxy adhesive curing molding device according to claim 2, characterized in that: An anti-slip rubber pad (11) is fixedly provided on the curved upper end of the L-shaped pressure rod (8).

4. The inductive epoxy adhesive curing molding device according to claim 2, characterized in that: A circular hole is provided in the middle of the connecting plate (9), and the shaft wall of the rotating shaft (5) vertically passes through the interior of the circular hole of the connecting plate (9).

5. The inductive epoxy adhesive curing molding device according to claim 1, characterized in that: The driving motor (4) is a reduction motor.

6. The inductive epoxy adhesive curing molding device according to claim 1, characterized in that: The side wall of the curing box (1) is provided with a take-in / take-out opening, and a box cover (12) is provided inside the take-in / take-out opening.

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