Welding device for PCB (Printed Circuit Board) surface mounting

Abstract

The utility model discloses a welding device for PCB (Printed Circuit Board) surface mounting, which comprises a welding device main body, a supporting table is arranged on the welding device main body, a first plate sheet welding groove is formed in the supporting table, a second plate sheet welding groove is formed in the first plate sheet welding groove, and a third plate sheet welding groove is formed in the second plate sheet welding groove. A pair of grooves are formed in the third sheet welding groove, a pair of movable grooves are formed in the supporting table, the movable grooves communicate with the corresponding grooves, a pair of rotating shafts are rotationally matched with the interiors of the movable grooves, a supporting plate is arranged at one end of the driving rod, and the supporting plate is matched with the grooves. The PCB can be jacked up from the welding groove through pressing operation, rapid and lossless taking out of the PCB is achieved, the taking-out process of the PCB is simpler, more convenient and faster, the risk that elements on the PCB fall off or are damaged due to dragging operation is effectively avoided, and the integrity and reliability of the PCB and the elements of the PCB are greatly improved.

Description

Technical Field

[0001] The utility model relates to the technical field of PCB board processing, in particular to a welding device for PCB board patches. Background Art

[0002] With the rapid development of the electronics industry, PCBs, as core components in electronic products, have a direct impact on the performance and production cost of the entire electronic product. Therefore, soldering devices are required for PCB patch soldering. To this end, China has authorized a utility model patent (Announcement No.: CN216462610U) that discloses a PCB patch soldering device. During the soldering process, the entire welding machine power box can rotate in a circle using the metal support rods and horizontal swing shaft at the bottom, and the mobile function of the drive coupling can achieve highly flexible solder joints.

[0003] However, the above-mentioned device still has some shortcomings when in use: in the existing soldering device, a board soldering groove is provided on the support table, and the size structure of the PCB board needs to be consistent with the structure of the board soldering groove so that the PCB board can be stably placed in the soldering groove for soldering. However, after the PCB board is soldered, there is a certain inconvenience in the process of removing the PCB board. It is often necessary to pull it upwards, and during this process, caution is required to avoid damaging the components. This removal method is not only inefficient but also increases the labor intensity of the operator. Therefore, a soldering device for PCB board patch is proposed to address the above situation. Utility Model Content

[0004] The utility model aims to solve the shortcomings of the prior art in that after welding, the efficiency of removing the PCB board is low and components on the PCB board are easily damaged, and a PCB board patch welding device is proposed.

[0005] In order to achieve the above purpose, the present invention adopts the following technical solutions:

[0006] A soldering device for PCB board patches includes a soldering device body, a support platform is provided on the soldering device body, a first plate soldering groove is provided on the support platform, a second plate soldering groove is provided in the first plate soldering groove, a third plate soldering groove is provided in the second plate soldering groove, a pair of grooves are provided in the third plate soldering groove, and a pair of movable grooves are provided on the support platform, and the movable grooves are connected to the corresponding grooves.

[0007] A pair of rotating shafts are rotatably fitted in the movable groove, one end of the pair of rotating shafts is fixedly connected to a driving rod, one end of the driving rod is provided with a supporting plate, and the supporting plate is fitted with the groove.

[0008] Preferably, a pair of rotating shafts are both sleeved with torsion springs, and two ends of the pair of torsion springs respectively contact the surface of the movable slot and the driving rod.

[0009] Preferably, the driving rod is provided with a pressing portion at one end away from the supporting plate, and the pressing portion is a rectangular block structure.

[0010] Preferably, a rubber pad is provided on the top of the supporting plate, and the rubber pad is on the same horizontal plane as the bottom surface of the third plate welding groove.

[0011] Preferably, the driving rod is arranged obliquely in the movable groove.

[0012] Preferably, a pair of circular holes are provided in the movable groove, and the circular holes cooperate with the rotating shaft.

[0013] The utility model has the following beneficial effects:

[0014] 1. The utility model adopts the structural design of the groove, movable groove, rotating shaft, driving rod and supporting plate, and can lift the PCB board from the soldering groove by pressing the operation, thereby realizing the rapid and non-destructive removal of the PCB board. The PCB board removal process is simpler and faster, and the risk of components on the PCB board falling off or being damaged due to the pulling operation is effectively avoided, which greatly improves the integrity and reliability of the PCB board and its components.

[0015] 2. The utility model adopts the structural design of the first plate welding groove, the second plate welding groove and the third plate welding groove, so that the welding device can be compatible with and process PCB boards of various specifications, meet the needs of PCB boards of different sizes, and also provide convenience for flexible adjustment during the production process. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a structural schematic diagram of the welding device;

[0017] Figure 2 Schematic diagram of the structure of the support platform;

[0018] Figure 3 Schematic diagram of the assembly structure of the driving rod and the supporting plate;

[0019] Figure 4 for Figure 3 Schematic diagram of the structure with a partial enlargement at point A in the middle.

[0020] In the figure: 1. Welding device body; 2. Support platform; 201. First plate welding groove; 202. Second plate welding groove; 203. Third plate welding groove; 204. Groove; 205. Movable groove; 3. Rotating shaft; 4. Driving rod; 401. Pressing part; 5. Torsion spring; 6. Support plate. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0022] Reference Figure 1-4 A soldering device for PCB board patch includes a soldering device body 1. Specifically, the composition structure of the soldering device body 1 is the same as that of the prior art (Announcement No.: CN216462610U) except for the upper support shaft platform. Its working principle and connection method are the same, and no further details will be given here.

[0023] A support platform 2 is provided on the welding device body 1, and a first plate welding groove 201 is provided on the support platform 2. A second plate welding groove 202 is provided in the first plate welding groove 201, and a third plate welding groove 203 is provided in the second plate welding groove 202. A pair of grooves 204 are provided in the third plate welding groove 203, and a pair of movable grooves 205 are provided on the support platform 2, and the movable grooves 205 are connected to the corresponding grooves 204.

[0024] Furthermore, the design of multiple soldering slots enables the soldering device to be compatible with and process PCB boards of various specifications, adapting to the needs of PCB boards of different sizes, while also facilitating flexible adjustments during the production process.

[0025] A pair of rotating shafts 3 are rotatably engaged in the movable groove 205. Specifically, a pair of circular holes are provided in the movable groove 205, and the circular holes cooperate with the rotating shafts 3. The corresponding ends of the pair of rotating shafts 3 are fixedly connected with a driving rod 4. Specifically, the driving rod 4 is tiltedly arranged in the movable groove 205, and a support plate 6 is provided at one end of the driving rod 4, and the support plate 6 cooperates with the groove 204.

[0026] like Figure 2 and Figure 3 As shown, a rubber pad is provided on the top of the supporting plate 6 , and the rubber pad is on the same horizontal plane as the bottom surface of the third plate welding groove 203 .

[0027] Specifically, the rubber pad is provided to protect the PCB board when the PCB board is lifted up.

[0028] like Figure 3 and Figure 4 As shown, a pair of rotating shafts 3 are both sleeved with torsion springs 5 , and two ends of the pair of torsion springs 5 respectively contact the surface of the movable slot 205 and the driving rod 4 .

[0029] Specifically, the provision of the torsion spring 5 can ensure that the driving rod 4 will rotate only when disturbed by an external force, thereby ensuring the stability of the PCB board to be welded after being placed in the welding groove during the welding operation.

[0030] like Figure 3 and Figure 4 As shown, the driving rod 4 is provided with a pressing portion 401 at one end away from the supporting plate 6 , and the pressing portion 401 is a rectangular block structure.

[0031] Specifically, after the welding operation is completed, the worker can press the pressing part 401 downward, and the pressing part 401 drives the driving rod 4 to rotate, thereby causing the support plate 6 to tilt up, and lift the PCB board from the welding groove, thereby realizing the rapid and non-destructive removal of the PCB board, making the PCB board removal process simpler and faster, effectively avoiding the risk of components on the PCB board falling off or being damaged due to the pulling operation, and greatly improving the integrity and reliability of the PCB board and its components.

[0032] The above is only a preferred specific implementation method of the present invention, but the protection scope of the present invention is not limited to this. Any technician familiar with the technical field within the technical scope disclosed by the present invention can make equivalent replacements or changes based on the technical solution and utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A soldering device for PCB board patch, comprising a soldering device body (1), characterized in that: The welding device body (1) is provided with a support platform (2), the support platform (2) is provided with a first plate welding groove (201), the first plate welding groove (201) is provided with a second plate welding groove (202), the second plate welding groove (202) is provided with a third plate welding groove (203), the third plate welding groove (203) is provided with a pair of grooves (204), the support platform (2) is provided with a pair of movable grooves (205), the movable grooves (205) are communicated with the corresponding grooves (204); A pair of rotating shafts (3) are rotatably engaged in the movable groove (205), and a driving rod (4) is fixedly connected to one end of each of the rotating shafts (3). A supporting plate (6) is provided at one end of the driving rod (4), and the supporting plate (6) is engaged with the groove (204).

2. A PCB patch soldering device according to claim 1, characterized in that: A pair of rotating shafts (3) are both sleeved with torsion springs (5), and two ends of the pair of torsion springs (5) respectively contact the surface of the movable groove (205) and the driving rod (4).

3. A PCB board patch soldering device according to claim 1, characterized in that: The driving rod (4) is provided with a pressing portion (401) at one end away from the supporting plate (6), and the pressing portion (401) is a rectangular block structure.

4. A PCB patch soldering device according to claim 3, characterized in that: A rubber pad is provided on the top of the support plate (6), and the rubber pad is on the same horizontal plane as the bottom surface of the third plate welding groove (203).

5. The PCB patch soldering device according to claim 3, characterized in that: The driving rod (4) is tiltedly arranged in the movable groove (205).

6. A PCB board patch soldering device according to claim 2, characterized in that: A pair of circular holes are provided in the movable groove (205), and the circular holes cooperate with the rotating shaft (3).

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