Semiconductor wafer thinning device convenient for replacing grinding wheel

Abstract

The utility model relates to the technical field of semiconductor wafer processing, in particular to a semiconductor wafer thinning device convenient for replacing a grinding wheel. Comprising a box body, a rotating main shaft and an auxiliary assembly, a driving assembly is arranged at the top of the box body, and the auxiliary assembly comprises a guide plate, a moving frame, a vacuum suction cup, a grinding wheel clamp, a pull rod, a supporting plate, a protection plate and a lifting component. After the wafer is loosened, the grinding wheel body is dragged by a hand, the pull rod continues to be rotated, after the pull rod is completely separated from the grinding wheel clamp, the pull rod is pulled out upwards, at the moment, the grinding wheel clamp can be directly pulled out downwards from the rotating main shaft, and due to the fact that the protection plate is arranged between the wafer and the grinding wheel body, when the grinding wheel body falls off accidentally, direct impact cannot be caused to the wafer; therefore, when the semiconductor wafer is thinned and polished, the safety of replacing the grinding wheel can be improved, and the wafer can be safely processed and used.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor wafer processing, in particular to a semiconductor wafer thinning device which is convenient for replacing a grinding wheel. Background Art

[0002] Existing wafer thinning devices require the replacement of multiple types of grinding wheels during thinning, and the wafer needs to be constantly repositioned, which can easily cause collision damage to the wafer itself, making it very inconvenient to use. Existing wafer thinning devices occupy a large volume, making it inconvenient to take the wafer out and having relatively single functions.

[0003] The prior art CN214685630U discloses a semiconductor wafer thinning device that is easy to replace the grinding wheel. The utility model aims to solve the technical problems of the inconvenience of replacing the grinding wheel and the inconvenience of taking it. In order to solve the above technical problems, the utility model provides a semiconductor wafer thinning device that is easy to replace the grinding wheel. The utility model is mainly composed of a box body, a turntable, a replacement mechanism and a lifting mechanism. By turning on the first motor, the socket block is replaced, thereby realizing the replacement of different types of grinding wheels at the bottom. The operation is simple and the volume is small. By opening the transparent plate, the wafer to be thinned is placed at the top center of the adsorption tray. During the rising process, the shell lifts the adsorption tray upward to contact the top grinding wheel and starts grinding and thinning. The semiconductor wafer does not need to be moved. When it needs to be taken, the worm gear screw elevator is controlled to descend, so that the ejection column ejects the adsorption tray, making it convenient to take out the wafer.

[0004] However, when the above-mentioned semiconductor wafer thinning device that is easy to replace the grinding wheel is actually used, there is a lack of a protective mechanism between the grinding wheel and the wafer when the grinding wheel is replaced. During the grinding wheel replacement process, the grinding wheel fixture and the grinding wheel may fall when they are removed downward for replacement, which may easily cause damage to the wafer and is not conducive to safe processing and use. Utility Model Content

[0005] The purpose of the utility model is to provide a semiconductor wafer thinning device that is easy to replace the grinding wheel. When performing semiconductor wafer thinning and grinding processing, the safety of replacing the grinding wheel can be improved, which is more conducive to the safe processing and use of the wafer.

[0006] To achieve the above-mentioned object, the technical solution adopted by the present invention is as follows: The present invention provides a semiconductor wafer thinning device that is convenient for replacing a grinding wheel, comprising a box body and a rotating spindle, a driving assembly being provided on the top of the box body, the rotating spindle being rotatably connected to the box body and being located on the top of the box body, and further comprising an auxiliary assembly;

[0007] The auxiliary components include a guide plate, a movable frame, a vacuum suction cup, a grinding wheel clamp, a pull rod, a support plate, a guard plate and a lifting component. The guide plate is fixedly connected to the box body and is located in the box body. The movable frame is slidably connected to the guide plate and is located on one side of the guide plate. The vacuum suction cup is fixedly arranged on the top of the movable frame. The grinding wheel clamp is fixedly provided with a grinding wheel body. The grinding wheel clamp is detachably connected to the rotating spindle and is located at the bottom of the rotating spindle. The pull rod is detachably connected to the rotating spindle and is threadedly connected to the grinding wheel clamp and is located on the side of the rotating spindle close to the grinding wheel clamp. The support plate is fixedly connected to the guide plate and is located on both sides of the guide plate. The guard plate is detachably connected to the support plate and is located between the support plates. The lifting component is arranged below the movable frame.

[0008] Among them, the driving assembly includes a mounting bracket, a driving motor and a transmission component. The mounting bracket is fixedly connected to the box body and is located on the side of the box body close to the rotating main shaft; the driving motor is fixedly connected to the mounting bracket and is located on the mounting bracket; the transmission component is arranged on the side of the driving motor close to the rotating main shaft.

[0009] Among them, the transmission component includes a main synchronous toothed wheel, an auxiliary synchronous toothed wheel and a toothed synchronous belt, the main synchronous toothed wheel is fixedly connected to the rotating main shaft and is located on the rotating main shaft; the auxiliary synchronous toothed wheel is fixedly connected to the output shaft of the drive motor and is located on the output shaft of the drive motor; the toothed synchronous belt is respectively engaged with the main synchronous toothed wheel and the auxiliary synchronous toothed wheel, and is located on the side of the main synchronous toothed wheel close to the auxiliary synchronous toothed wheel.

[0010] Among them, the lifting component includes an L-shaped plate and a worm gear screw elevator, the L-shaped plate is fixedly connected to the box body and is located at the bottom of the box body; the worm gear screw elevator is fixedly connected to the L-shaped plate, and its output end is connected to the movable frame and is located on the L-shaped plate.

[0011] The auxiliary component further includes a liquid level sensor and an electric valve. The liquid level sensor is fixedly connected to the box body and is located at the front side of the box body. The electric valve is fixedly connected to the box body and is located at the bottom of the right side wall of the box body.

[0012] The utility model discloses a semiconductor wafer thinning device which is convenient for replacing the grinding wheel. A driving assembly is provided on the top of the box body. The rotating spindle is rotatably mounted on the top of the box body. A grinding wheel clamp is mounted on the bottom of the rotating spindle through a pull rod. The grinding wheel clamp is mounted on the grinding wheel body. A vacuum suction cup is provided on the top of the movable frame and can slide on the guide plate. The guide plate is mounted in the box body. The support plates are mounted on both sides of the guide plate. A guard plate is mounted between the support plates. A lifting component is arranged under the movable frame. When the grinding wheel body is replaced, the lifting component is first controlled to move and the movable frame is lowered to the lowest point. Then, the guard plate is mounted on the support plate. Further, the operator can Use one hand to clamp the special wrench on the clamping part of the rotating spindle, and then use the other hand to reversely rotate the pull rod through the wrench to loosen it. After loosening, remove the wrench from the rotating spindle, hold the grinding wheel body with your hand, and continue to rotate the pull rod. When its threaded part is completely disengaged from the grinding wheel clamp, pull the pull rod upward. At this time, the grinding wheel clamp can be directly pulled downward from the rotating spindle. Because a guard plate is set between the wafer and the grinding wheel body, when the grinding wheel body accidentally falls, it will not cause direct impact on the wafer. Therefore, during the thinning and grinding of semiconductor wafers, the safety of grinding wheel replacement can be improved, which is more conducive to the safe processing and use of wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The present invention can be further described by way of non-limiting embodiments given in the accompanying drawings.

[0014] Figure 1 This is a schematic diagram of the overall structure of a semiconductor wafer thinning device that facilitates replacement of grinding wheels according to the first embodiment of the present invention.

[0015] Figure 2 This is a front view of a semiconductor wafer thinning device that facilitates replacement of grinding wheels according to the first embodiment of the present invention.

[0016] Figure 3 This is a schematic structural diagram of the pull rod of the first embodiment of the present utility model.

[0017] Figure 4 This is a schematic diagram of the overall structure of a semiconductor wafer thinning device that facilitates replacement of grinding wheels according to the second embodiment of the present invention.

[0018] In the figure: 101-box, 102-rotating spindle, 103-guide plate, 104-moving frame, 105-vacuum suction cup, 106-grinding wheel fixture, 107-grinding wheel body, 108-pull rod, 109-support plate, 110-guard plate, 111-mounting bracket, 112-drive motor, 113-main synchronous gear wheel, 114-auxiliary synchronous gear wheel, 115-toothed synchronous belt, 116-L-shaped plate, 117-worm gear screw lift, 201-liquid level sensor, 202-electric valve. DETAILED DESCRIPTION

[0019] In order to enable those skilled in the art to better understand the present invention, the technical solution of the present invention is further described below with reference to the accompanying drawings and embodiments.

[0020] Example 1:

[0021] like Figures 1 to 3 As shown, Figure 1 This is a front view of a semiconductor wafer thinning device that facilitates the replacement of grinding wheels. Figure 2 This is a front view of a semiconductor wafer thinning device that facilitates the replacement of grinding wheels. Figure 3 It is a structural diagram of the pull rod 108. The utility model provides a semiconductor wafer thinning device that is convenient for replacing the grinding wheel: it includes a box body 101, a rotating spindle 102 and an auxiliary component. A driving component is provided on the top of the box body 101. The auxiliary component includes a guide plate 103, a movable frame 104, a vacuum suction cup 105, a grinding wheel clamp 106, a pull rod 108, a support plate 109, a guard plate 110 and a lifting component. The driving component includes a mounting bracket 111, a driving motor 112 and a transmission component. The transmission component includes a main synchronous gear wheel 113, an auxiliary synchronous gear wheel 114 and a toothed synchronous belt 115. The lifting component includes an L-shaped plate 116 and a worm screw elevator 117. The above scheme can improve the safety of replacing the grinding wheel during the semiconductor wafer thinning and grinding process, which is more conducive to the safe processing and use of the wafer. It can be understood that the above scheme can improve the safety of replacing the grinding wheel and is conducive to the safe processing and use of the wafer.

[0022] In this embodiment, a driving assembly is provided on the top of the box body 101, and the rotating spindle 102 is rotatably connected to the box body 101 and is located on the top of the box body 101. The driving assembly is used to drive the rotating spindle 102 to rotate. The interior of the rotating spindle 102 is hollow, which facilitates the penetration of the pull rod 108. The top is a stepped shaft end, and the bottom is provided with a spline cavity to facilitate the installation of the grinding wheel fixture 106. The rotating spindle 102 is installed on the top of the box body 101 through a rotating bearing.

[0023] Among them, the guide plate 103 is fixedly connected to the box body 101 and is located inside the box body 101, the movable frame 104 is slidably connected to the guide plate 103 and is located on one side of the guide plate 103, the vacuum suction cup 105 is fixedly set on the top of the movable frame 104, the grinding wheel clamp 106 is fixedly provided with a grinding wheel body 107, the grinding wheel clamp 106 is detachably connected to the rotating spindle 102 and is located at the bottom of the rotating spindle 102, the pull rod 108 is detachably connected to the rotating spindle 102, and is threadedly connected to the grinding wheel clamp 106, and is located on the side of the rotating spindle 102 close to the grinding wheel clamp 106, the support plate 109 is fixedly connected to the guide plate 103 and is located on both sides of the guide plate 103, the guard plate 110 is detachably connected to the support plate 109 and is located between the support plates 109, and the lifting component is arranged below the movable frame 104. The mounting ears at the bottom of both sides of the guide plate 103 are fixed to the box body 101 by positioning pins and bolts. The guide plate 103 is provided with guide holes for sliding cooperation with the movable frame 104. The articulated cooling water pipe can be directly placed on the guide plate 103. The vacuum suction cup 105 is fixed to the detachable limit plate of the guide plate 103 by bolts for wafer adsorption and fixation. Corresponding air pipe inlet and outlet holes and cooling water pipe inlet and outlet holes are provided on the left top wall of the rear side wall of the box body 101. The grinding wheel body 107 is provided on the grinding wheel clamp 106. The grinding wheel body 107 has a downward U-shaped opening for easy installation. After installation, it will be used for grinding to achieve wafer thinning. The grinding wheel bodies 107 of different sizes will be directly installed on the grinding wheel in advance. The clamp 106 is convenient for quick installation. The bottom of the grinding wheel clamp 106 has a spline shaft end, and the lower side of the spline shaft end is provided with an abutment disc. The bottom of the rotating spindle 102 is a spline cavity, which is convenient for the installation of the grinding wheel clamp 106. A threaded hole is provided on the top of the grinding wheel clamp 106 to facilitate the installation of the external threaded end at the bottom of the pull rod 108. The cross-section of the pull rod 108 is T-shaped, and an external hexagonal end is provided on the top to facilitate the rotation of the wrench. The support plate 109 is fixed to both sides of the guide plate 103 by bolts, and the bolts are set from bottom to top. A non-through slide groove is provided on the support plate 109 to facilitate the installation of the guard plate 110. The guard plate 110 will be removed from the support plate 109 during grinding. The lifting component is used to adjust the vertical grinding position of the movable frame 104.

[0024] Secondly, the mounting bracket 111 is fixedly connected to the housing 101 and is located on the side of the housing 101 near the rotating spindle 102. The drive motor 112 is fixedly connected to the mounting bracket 111 and is located on the mounting bracket 111. The transmission component is disposed on the side of the drive motor 112 near the rotating spindle 102. The mounting bracket 111 is fixed to the top of the housing 101 by bolts, with the bolts countersunk from the inside out. The drive motor 112 is also fixed to the mounting bracket 111 by bolts. The transmission component cooperates with the drive motor 112 to rotate the rotating spindle 102.

[0025] Then, the main synchronous gear 113 is fixedly connected to the rotating main shaft 102 and is located on the rotating main shaft 102; the auxiliary synchronous gear 114 is fixedly connected to the output shaft of the drive motor 112 and is located on the output shaft of the drive motor 112; the toothed synchronous belt 115 is respectively engaged with the main synchronous gear 113 and the auxiliary synchronous gear 114 and is located on the side of the main synchronous gear 113 near the auxiliary synchronous gear 114. The main synchronous gear 113 is fixed to the top step of the rotating main shaft 102 via a flat key and a locking wire ring, and the auxiliary synchronous gear 114 is fixed to the output shaft of the drive motor 112 via a flat key and bolts. The toothed synchronous belt 115 is respectively engaged with the main synchronous gear 113 and the auxiliary synchronous gear 114, thereby forming a transmission structure.

[0026] Finally, the L-shaped plate 116 is fixedly connected to the box body 101 and is located at the bottom of the box body 101. The worm gear screw lift 117 is fixedly connected to the L-shaped plate 116, and its output end is connected to the mobile frame 104 and is located on the L-shaped plate 116. The rectangular fixing ears set on the L-shaped plate 116 are fixed to the box body 101 by bolts. The worm gear screw lift 117 is also fixed to the L-shaped plate 116 by bolts. A power motor is set on the right side of the worm gear screw lift 117. The connection plate on the top of the worm gear screw lift 117 is connected to the mobile frame 104 by bolts.

[0027] When the present invention is used for thinning and grinding of semiconductor wafers, the safety during replacement of the grinding wheel can be improved, which is more conducive to the safe processing of the wafers. When grinding the wafer, the wafer is fixed on the vacuum suction cup 105, and then the driving motor 112 is controlled to move to drive the auxiliary synchronous toothed wheel 114 to rotate. With the cooperation of the toothed synchronous belt 115, the main synchronous toothed wheel 113 is rotated to realize the rotation of the rotating spindle 102, so that the grinding wheel clamp 106 and the grinding wheel body 107 can be rotated, and then the worm gear screw lift 117 is controlled to move to drive the movable frame 104 to move vertically upward, so that the wafer can be driven to approach the grinding wheel body 107 and be ground and thinned by the grinding wheel body 107. When the grinding wheel body 107 is replaced, the lifting component is first controlled to move to lower the movable frame 104 to the lowest point, and then the guard plate 110 is installed on the support On the support plate 109, further, the operator clamps a special wrench on the clamping part of the rotating spindle 102 with one hand, and then, with the other hand, reversely rotates the pull rod 108 through the wrench to loosen it. After loosening, the operator removes the wrench from the rotating spindle 102, drags the grinding wheel body 107 with his hand, and continues to rotate the pull rod 108. When its threaded portion is completely disengaged from the grinding wheel clamp 106, the pull rod 108 is pulled out upward. At this time, the grinding wheel clamp 106 can be directly pulled downward from the rotating spindle 102 to realize the disassembly of the grinding wheel, and then grinding wheels of different sizes can be directly installed. Because the guard plate 110 is set between the wafer and the grinding wheel body 107, when the grinding wheel body 107 accidentally falls, it will not cause direct impact on the wafer to damage it, thereby improving the safety of grinding wheel replacement during semiconductor wafer thinning and grinding processing, which is more conducive to the safe processing and use of wafers.

[0028] Example 2:

[0029] like Figure 4 As shown, Figure 4 It is a front view of a semiconductor wafer thinning device that is convenient for replacing the grinding wheel. On the basis of the first embodiment, the utility model provides a semiconductor wafer thinning device that is convenient for replacing the grinding wheel. The auxiliary component also includes a liquid level sensor 201 and an electric valve 202.

[0030] The liquid level sensor 201 is fixedly connected to the box 101 and located at the front of the box 101. The electric valve 202 is fixedly connected to the box 101 and located at the bottom of the right side wall of the box 101. The liquid level sensor 201 is fixed to the box 101 by bolts. The electric valve 202 has a flange on one side connected to the drain outlet of the box 101 and a flange on the other side connected to the external water pipeline.

[0031] In this embodiment, by setting the liquid level sensor 201, the highest position of the cooling water level at the bottom of the box body 101 can be monitored. When the highest water level signal is detected, the control system controls the electric valve 202 to open according to the feedback signal of the liquid level sensor 201 to automatically drain water and prevent water from overflowing from the front side of the box body 101.

[0032] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the present invention. Anyone skilled in the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by persons skilled in the art without departing from the spirit and technical principles disclosed herein shall be covered by the claims of the present invention.

Claims

1. A semiconductor wafer thinning device that is convenient for replacing grinding wheels, comprising a box and a rotating spindle, wherein a driving assembly is provided on the top of the box, the rotating spindle is rotatably connected to the box and is located on the top of the box, characterized in that: Also included are auxiliary components; The auxiliary components include a guide plate, a movable frame, a vacuum suction cup, a grinding wheel clamp, a pull rod, a support plate, a guard plate and a lifting component. The guide plate is fixedly connected to the box body and is located in the box body. The movable frame is slidably connected to the guide plate and is located on one side of the guide plate. The vacuum suction cup is fixedly arranged on the top of the movable frame. The grinding wheel clamp is fixedly provided with a grinding wheel body. The grinding wheel clamp is detachably connected to the rotating spindle and is located at the bottom of the rotating spindle. The pull rod is detachably connected to the rotating spindle and is threadedly connected to the grinding wheel clamp and is located on the side of the rotating spindle close to the grinding wheel clamp. The support plate is fixedly connected to the guide plate and is located on both sides of the guide plate. The guard plate is detachably connected to the support plate and is located between the support plates. The lifting component is arranged below the movable frame.

2. The semiconductor wafer thinning device for facilitating the replacement of the grinding wheel according to claim 1, characterized in that: The driving assembly includes a mounting bracket, a driving motor and a transmission component. The mounting bracket is fixedly connected to the box and is located on a side of the box close to the rotating spindle; the driving motor is fixedly connected to the mounting bracket and is located on the mounting bracket; the transmission component is arranged on a side of the driving motor close to the rotating spindle.

3. The semiconductor wafer thinning device for facilitating the replacement of the grinding wheel according to claim 2, characterized in that: The transmission component includes a main synchronous toothed wheel, an auxiliary synchronous toothed wheel and a toothed synchronous belt. The main synchronous toothed wheel is fixedly connected to the rotating main shaft and is located on the rotating main shaft; the auxiliary synchronous toothed wheel is fixedly connected to the output shaft of the drive motor and is located on the output shaft of the drive motor; the toothed synchronous belt is respectively engaged with the main synchronous toothed wheel and the auxiliary synchronous toothed wheel, and is located on the side of the main synchronous toothed wheel close to the auxiliary synchronous toothed wheel.

4. The semiconductor wafer thinning device for facilitating the replacement of the grinding wheel according to claim 1, wherein: The lifting component includes an L-shaped plate and a worm gear screw lifter. The L-shaped plate is fixedly connected to the box body and is located at the bottom of the box body. The worm gear screw lifter is fixedly connected to the L-shaped plate, and its output end is connected to the movable frame and is located on the L-shaped plate.

5. The semiconductor wafer thinning device for facilitating the replacement of grinding wheels according to claim 1, wherein: The auxiliary component also includes a liquid level sensor and an electric valve. The liquid level sensor is fixedly connected to the box body and is located at the front side of the box body; the electric valve is fixedly connected to the box body and is located at the bottom of the right side wall of the box body.

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