Inclined insertion type ceramic substrate mother board insertion board box

Abstract

The utility model discloses an oblique insertion type ceramic substrate mother board plugboard box, which comprises an upper cover plate and a box body, the box body is provided with an upper opening, a plurality of groups of positioning blocks which are inserted and matched at intervals are arranged on two sides of the outer sides of the upper cover plate and the box body, and the upper cover plate is arranged at the upper opening of the box body through the positioning blocks in a limiting manner. A plurality of groups of inclined slots are correspondingly formed in two side walls in the box body, and a ceramic substrate mother board is clamped in each group of slots. The utility model has the advantages that the large-batch closed transportation of the ceramic substrate mother board can be realized, the scratching in the transportation process is reduced, and the overall performance is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of ceramic substrate transportation, in particular to an obliquely inserted ceramic substrate motherboard inserting box. Background Art

[0002] Copper-clad ceramic substrates, as a core insulating substrate component, are widely used in the field of power semiconductor device packaging. Copper-clad ceramic substrates are patterned through a process of sintering, lamination, exposure, development, and etching, and are then coated with a metal coating as needed.

[0003] Traditional transportation methods can easily cause scratches on copper-clad ceramic substrates covered with metal coatings during long-distance transportation, affecting the surface properties of the metal coating. Furthermore, there are currently no dedicated long-distance shipping containers for copper-clad ceramic substrate motherboards. Utility Model Content

[0004] The purpose of the utility model is to provide an oblique insertion type ceramic substrate motherboard insertion box, which can realize the closed transportation of ceramic substrate motherboards in large quantities, while reducing scratches during transportation and ensuring overall performance.

[0005] The above technical objectives of the present invention are achieved through the following technical solutions:

[0006] A slanted-insertion ceramic substrate motherboard plug-in box, characterized in that it includes an upper cover and a box body, the box body is open at the top, and several groups of spaced and plug-fitting positioning blocks are provided on both sides of the outer sides of the upper cover and the box body. The upper cover is installed at the upper opening of the box body by limiting the positioning blocks, and multiple groups of obliquely arranged slots are correspondingly provided on the side walls on both sides of the interior of the box body, and a ceramic substrate motherboard is clamped and placed in each group of the slots.

[0007] Preferably, a sponge layer is attached to the inner side of the upper cover and the bottom of the box body to play a buffering role and thus cope with the bumps during transportation.

[0008] Preferably, four groups of grooves are correspondingly provided at the four corners above the upper cover plate, and four groups of protrusions are correspondingly provided at the four corners of the bottom of the box body. The protrusions at the bottom of the box body cooperate with the grooves above the upper cover plate to limit the position.

[0009] Preferably, the protrusions and the grooves are both L-shaped structures of the same size, and the upper and lower adjacent plug-in boxes are stacked up and down by limiting the protrusions and the grooves, which improves space utilization and does not cause displacement during transportation.

[0010] Preferably, the positioning blocks are arranged at equal intervals and protruding from both sides of the outer sides of the upper cover and the box body, the lengths of the positioning blocks are the same, the cross-sections of the positioning blocks are isosceles trapezoids, the positioning blocks of the upper cover and the box body are staggered and fixed to each other up and down, and the upper and lower and front and back directions of the upper cover and the box body can be limited by the cooperation of the obliquely arranged positioning blocks.

[0011] Preferably, the outer sides of the three sides of the opening on the box body are further provided with slots, and three groups of convex strips are provided corresponding to the slots under the upper cover plate. The slots and convex strips cooperate to limit the upper cover plate and the box body in the horizontal direction.

[0012] Preferably, the angle between the slot and the bottom surface of the box body is 80 degrees, which can accommodate more ceramic substrate motherboards while reducing the shaking of the product and avoiding affecting the performance of the product.

[0013] Preferably, the inner wall of the box body is further provided with a placement groove, and a desiccant is arranged in the placement groove.

[0014] Preferably, a card slot is further provided at the front end of the outer portion of the box body, and information identification cards are inserted into the card slot from top to bottom. The desiccant can absorb moisture in the sealed box body to prevent oxidation of the product due to excessive humidity during transportation.

[0015] In summary, the present invention has the following beneficial effects:

[0016] The ceramic substrate motherboard in the utility model is placed through a slot, and the insertion direction is inclined by 80 degrees, which is different from the traditional vertical placement and reduces the shaking of the product during transportation.

[0017] Compared with the traditional open copper sheet rack, the utility model adopts a closed packaging method, which avoids the influence of the external environment, protects the product, and avoids the influence on the performance of the product.

[0018] The ceramic substrate motherboards in the present invention are separated from each other instead of being stacked in traditional packaging, so as to avoid scratching each other between products, realize the transportation of large quantities of ceramic substrate motherboards, and avoid mutual influence between products.

[0019] The box body and the upper cover of the plug-in box of the utility model are respectively provided with protrusions and grooves, and a plurality of plug-in boxes can be fixed by the protrusions and grooves so as to be stacked up and stored stably and limitedly, which cannot be stacked in the traditional placement method.

[0020] The box body of the utility model is provided with a placement groove, and a desiccant is arranged in the placement groove to prevent the product from being oxidized due to excessive humidity during transportation. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1This is a schematic diagram of the upper cover structure of the utility model;

[0022] Figure 2 It is a side view of the upper cover plate of the utility model;

[0023] Figure 3 This is a front view of the upper cover of the utility model;

[0024] Figure 4 This is a top view of the upper cover of the utility model;

[0025] Figure 5 This is a cross-sectional view of the interior of the upper cover of the present invention;

[0026] Figure 6 This is a schematic diagram of the box structure of the utility model;

[0027] Figure 7 It is a side view of the box body of the present utility model;

[0028] Figure 8 This is a rear view of the box body of the utility model;

[0029] Figure 9 This is a top view of the box body of the present utility model;

[0030] Figure 10 This is a cross-sectional view of the interior of the box body of the present utility model;

[0031] Figure 11 This is a schematic diagram of the overall combined structure of the utility model;

[0032] Figure 12 It is an overall combined side view of the utility model;

[0033] Figure 13 This is the overall combined rear view of the utility model;

[0034] Figure 14 It is a top view of the overall combination of the present utility model;

[0035] In the figure: 1-upper cover, 2-box body, 3-positioning block, 4-slot, 5-sponge layer, 6-groove, 7-protrusion, 8-slot, 9-rib, 10-placement slot, 11-card slot. DETAILED DESCRIPTION

[0036] In order to elaborate on the technical solutions adopted by the present invention to achieve the predetermined technical purpose, the technical solutions in the embodiments of the present invention will be clearly and completely described below in combination with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments, and the technical means or technical features in the embodiments of the present invention can be replaced without paying creative work. The present invention will be described in detail below with reference to the drawings and in combination with the embodiments.

[0037] like Figures 1 to 12 The illustrated embodiment shows an obliquely inserted ceramic substrate motherboard plug-in box, comprising an upper cover 1 and a box body 2. The upper cover 1 and the box body 2 can be made of acrylic material. The box body 2 is open at the top. Several groups of spaced and plug-in positioning blocks 3 are provided on both sides of the outer sides of the upper cover 1 and the box body 2. The upper cover 1 is limitedly installed at the upper opening of the box body 2 by the positioning blocks 3. Multiple groups of obliquely arranged slots 4 are correspondingly provided on the side walls on both sides of the interior of the box body 2. A ceramic substrate motherboard is placed in each group of slots 4.

[0038] The inner side of the upper cover 1 and the inner bottom of the box body 2 are both attached with a sponge layer 5 to play a buffering role and thus cope with the bumps during transportation.

[0039] Four groups of grooves 6 are correspondingly provided at the four corners above the upper cover 1, and four groups of protrusions 7 are correspondingly provided at the four corners at the bottom of the box body 2. The protrusions 7 at the bottom of the box body 2 cooperate with the grooves 6 above the upper cover 1 to limit the position.

[0040] The protrusion 7 and the groove 6 are both L-shaped structures of the same size. The upper and lower adjacent plug-in boxes are stacked up and down by the protrusion 7 and the groove 6, which improves space utilization and will not shift during transportation.

[0041] The positioning blocks 3 are arranged at equal intervals and protruding from both sides of the outer sides of the upper cover 1 and the box body 2. The lengths of the positioning blocks 3 are all the same, and the cross-sections of the positioning blocks 3 are isosceles trapezoids. The positioning blocks 3 of the upper cover 1 and the box body 2 are staggered and fixed with each other up and down. By cooperating with the obliquely arranged positioning blocks 3, the upper cover 1 and the box body 2 can be limited in the up and down and front and back directions.

[0042] Slots 8 are further provided on the outer sides of the three sides of the upper opening of the box body 2. Three groups of ridges 9 are provided corresponding to the slots 8 below the upper cover 1. The slots 8 and the ridges 9 cooperate to limit the upper cover 1 and the box body 2 in the horizontal direction.

[0043] The included angle between the slot 4 and the bottom surface of the box body 2 is 80 degrees, which can accommodate more ceramic substrate motherboards while reducing the shaking of the product and avoiding affecting the performance of the product.

[0044] The inner wall of the box body 2 is also provided with a placement groove 10, in which a desiccant is arranged. The desiccant can absorb moisture in the closed box body to prevent the product from being oxidized due to excessive humidity during transportation.

[0045] The front end of the box body 2 is also provided with a card slot 11. Information identification cards are inserted into the card slot 11 from top to bottom. The information of the internal ceramic substrate motherboard can be accurately identified through the information identification card, which is convenient for subsequent classification.

[0046] The ceramic substrate motherboard in the utility model is placed through a slot, and the insertion direction is inclined by 80 degrees, which is different from the traditional vertical placement and reduces the shaking of the product during transportation.

[0047] Compared with the traditional open copper sheet rack, the utility model adopts a closed packaging method, which avoids the influence of the external environment, protects the product, and avoids the influence on the performance of the product.

[0048] The ceramic substrate motherboards in the present invention are separated from each other instead of being stacked in traditional packaging, so as to avoid scratching each other between products, realize the transportation of large quantities of ceramic substrate motherboards, and avoid mutual influence between products.

[0049] The box body and the upper cover of the plug-in box of the utility model are respectively provided with protrusions and grooves, and a plurality of plug-in boxes can be fixed by the protrusions and grooves so as to be stacked up and stored stably and limitedly, which cannot be stacked in the traditional placement method.

[0050] The box body of the utility model is provided with a placement groove, and a desiccant is arranged in the placement groove to prevent the product from being oxidized due to excessive humidity during transportation.

[0051] The above description is only a preferred embodiment of the present invention and does not constitute any form of limitation to the present invention. Although the present invention has been disclosed as a preferred embodiment as above, it is not intended to limit the present invention. Any technician familiar with the profession can make some changes or modifications to equivalent embodiments of the technical content disclosed above without departing from the scope of the technical solution of the present invention. However, any simple modification, equivalent replacement and improvement of the above embodiments made according to the technical essence of the present invention, within the spirit and principles of the present invention, without departing from the content of the technical solution of the present invention, shall still fall within the scope of protection of the technical solution of the present invention.

Claims

1. A tilt-insertion ceramic substrate motherboard plug-in box, characterized in that: The utility model comprises an upper cover plate and a box body, wherein the box body is open at the top, and a plurality of groups of spaced and plug-in positioning blocks are provided on both sides of the outer sides of the upper cover plate and the box body, and the upper cover plate is installed at the upper opening of the box body by limiting the positioning blocks, and a plurality of groups of obliquely arranged slots are correspondingly provided on the side walls on both sides of the inner side of the box body, and a ceramic substrate motherboard is placed in each group of the slots.

2. The oblique insertion type ceramic substrate motherboard plug-in box according to claim 1, characterized in that: The inner side of the upper cover plate and the bottom of the box body are both attached with a sponge layer.

3. The oblique insertion type ceramic substrate motherboard plug-in box according to claim 1, characterized in that: Four groups of grooves are correspondingly provided at the four corners above the upper cover plate, and four groups of protrusions are correspondingly provided at the four corners of the bottom of the box body. The protrusions at the bottom of the box body cooperate with the grooves above the upper cover plate to limit the position.

4. The oblique insertion type ceramic substrate motherboard plug-in box according to claim 3, characterized in that: The protrusion and the groove are both L-shaped structures with the same size.

5. The oblique insertion type ceramic substrate motherboard plug-in box according to claim 1, characterized in that: The positioning blocks are obliquely and equidistantly arranged on both sides of the outer sides of the upper cover and the box body. The lengths of the positioning blocks are the same, and the cross-sections of the positioning blocks are isosceles trapezoids. The positioning blocks of the upper cover and the box body are staggered and fixed to each other up and down.

6. The oblique insertion type ceramic substrate motherboard plug-in box according to claim 1, characterized in that: The outer sides of the three sides of the opening on the box body are further provided with slots, and three groups of convex strips are provided corresponding to the slots under the upper cover plate, and the slots and convex strips cooperate to limit the position.

7. The oblique insertion type ceramic substrate motherboard plug-in box according to claim 1, characterized in that: The included angle between the slot and the bottom surface of the box body is 80 degrees.

8. The oblique insertion type ceramic substrate motherboard plug-in box according to claim 1, characterized in that: The inner wall of the box body is further provided with a placement groove, in which a desiccant is arranged.

9. The oblique insertion type ceramic substrate motherboard plug-in box according to claim 1, characterized in that: The front end of the outer portion of the box body is further provided with a card slot, into which an information identification card is inserted from top to bottom.

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