Integrated cooling structure and pump

Abstract

The utility model discloses an integrated cooling structure and a pump, the integrated cooling structure comprises a shell, the shell is provided with a containing cavity and a cooling channel, and the cooling channel is arranged around the containing cavity; the cooling channel comprises a first channel body and a second channel body, the first channel body is arranged along the periphery of the containing cavity, the second channel body is arranged at one end of the first channel body, and the first channel body and the second channel body form a semi-surrounding type structure with the containing cavity as the center.

Description

Technical Field

[0001] The present application relates to the technical field of cooling structures, and more specifically, to an integrated cooling structure and pump. Background Art

[0002] Water pump motors are widely used in industrial production and urban water supply. Affected by the technical inertia of asynchronous motors, water pump motors on the market mainly adopt the technical solution of synchronous motor plus air cooling. The driver heat sink matched with the motor is installed together with the air-cooled casing, and the fan is used to actively dissipate heat from the casing and the driver heat sink.

[0003] In order to obtain better heat dissipation effect, the air-cooled casing and the driver heat sink need to increase the heat dissipation area, which results in a larger size of the air-cooled water pump all-in-one.

[0004] Therefore, it is necessary to provide a new technical solution to solve the technical problem of how to improve the heat dissipation efficiency without increasing the volume of the cooling structure. Utility Model Content

[0005] One purpose of this application is to provide a new technical solution for an integrated cooling structure.

[0006] According to a first aspect of the present application, an integrated cooling structure is provided, which includes a shell, the shell having a accommodating cavity and a cooling channel, and the cooling channel is arranged around the accommodating cavity; wherein the cooling channel includes a first channel and a second channel, the first channel is arranged along the periphery of the accommodating cavity, and the second channel is arranged at one end of the first channel, and the first channel and the second channel form a semi-enclosed structure with the accommodating cavity as the center.

[0007] Optionally, the first channel is communicated with the second channel, and a liquid inlet and a liquid outlet are provided on the shell, and the liquid inlet and the liquid outlet are respectively communicated with the first channel.

[0008] Optionally, a temperature monitor and a flow control valve are provided in the first channel, the temperature monitor and the flow control valve are signal-connected, the temperature monitor is located at the liquid outlet, and the flow control valve is located at the liquid inlet.

[0009] Optionally, the first channel is communicated with the second channel, and heat sinks are disposed in both the first channel and the second channel.

[0010] Optionally, the first channel and the second channel are both independent spaces, the first channel is connected to a first liquid inlet and a first liquid outlet, and the second channel is connected to a second liquid inlet and a second liquid outlet.

[0011] Optionally, the shell includes an outer shell and a cover plate, the outer shell and the cover plate are integrally formed, the first channel is arranged in the outer shell along the periphery of the accommodating cavity, and the second channel is provided on the cover plate.

[0012] Optionally, the shell includes an outer shell and a cover plate, the outer shell and the cover plate are detachably connected, the cover plate has a protrusion, the protrusion is embedded in the accommodating cavity, and the second channel is provided on the protrusion.

[0013] Optionally, a sealing groove is formed on the outer peripheral surface of the protrusion, and a sealing ring is embedded in the sealing groove. When the protrusion is embedded in the accommodating cavity, the sealing ring abuts against the inner wall of the accommodating cavity.

[0014] According to a second aspect of the present application, a pump is provided, comprising a coupler and the integrated cooling structure as described above, wherein the coupler is located in the accommodating cavity.

[0015] Optionally, the first channel and the second channel form a semi-enclosed structure centered on the coupler.

[0016] In an embodiment of the present application, a first channel centered on the accommodating cavity is opened in the shell to dissipate heat around the component to be dissipated in the accommodating cavity, and a semi-enclosed cooling channel centered on the accommodating cavity is formed by the second channel and the first channel, so that the heat dissipation area of the component to be dissipated in the accommodating cavity is increased, thereby effectively improving the heat dissipation efficiency.

[0017] Other features and advantages of the present application will become apparent from the following detailed description of exemplary embodiments of the present application with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the application and, together with the description, serve to explain the principles of the application.

[0019] Figure 1 Schematic diagram of the cooling structure in the embodiment of the present application;

[0020] Figure 2 is a schematic cross-sectional view of the cooling structure in an embodiment of the present application;

[0021] Figure 3 2 is a schematic diagram of a front view cross-sectional structure of a cooling structure in an embodiment of the present application;

[0022] Figure 4 yes Figure 1 A top view of

[0023] Figure 5 yes Figure 1 Bottom view of .

[0024] Description of reference numerals:

[0025] 1- shell;

[0026] 11-accommodation cavity;

[0027] 12-cooling channel;

[0028] 121-first channel; 122-second channel;

[0029] 2-Liquid inlet;

[0030] 3-Liquid outlet. DETAILED DESCRIPTION

[0031] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that unless otherwise specifically stated, the relative arrangements of components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present application.

[0032] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the present disclosure, its application, or uses.

[0033] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered part of the specification.

[0034] In all examples shown and discussed herein, any specific values should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0035] It should be noted that like reference numerals and letters refer to like items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0036] According to one embodiment of the present application, an integrated cooling structure is provided, which includes a shell 1 and a cover plate, the cover plate being connected to the shell 1, the shell 1 having a accommodating cavity 11 and a cooling channel 12, the cooling channel 12 being arranged around the accommodating cavity 11; wherein the cooling channel 12 includes a first channel 121 and a second channel 122, the first channel 121 being arranged along the periphery of the accommodating cavity 11, the second channel 122 being arranged on the cover plate, the first channel 121 and the second channel 122 forming a semi-enclosed structure centered on the accommodating cavity 11.

[0037] like Figures 1 to 5As shown, the integrated cooling structure includes a housing 1. The housing 1 has a rectangular block-shaped outer structure and a columnar accommodating cavity 11 inside. The accommodating cavity 11 is used to place the heat dissipation component.

[0038] Cooling channels 12 are provided on the housing 1 along the circumference of the accommodating cavity 11 and on the cover plate. The cooling channels 12 on the housing 1 can be connected to the cooling channels 12 on the cover plate, or can be independent cooling channels 12. A cooling medium is fed into the cooling channels 12 to dissipate heat from the components to be cooled within the accommodating cavity 11.

[0039] The cooling channel 12 includes a first channel 121 and a second channel 122 .

[0040] The first channel 121 is provided in the housing 1 and arranged around the accommodating cavity 11 to dissipate the circumferential heat of the heat dissipating element through the first channel 121. The first channel 121 can dissipate heat by conveying a cooling medium or by providing a heat sink.

[0041] The second channel 122 is provided on the cover plate. The second channel 122 can be a cavity provided in the cover plate, or a channel provided in the cover plate in the form of spiral pipe arrangement and / or circuitous pipe arrangement, so as to dissipate heat from the top and / or bottom of the component to be cooled in the accommodating cavity 11.

[0042] By providing the first channel 121 and the second channel 122 to semi-enclose the heat dissipation element, the cooling area of the heat dissipation element is increased, thereby effectively improving the heat dissipation efficiency.

[0043] Of course, in the embodiment of the present application, the cooling channel 12 is not limited to the above structure, and those skilled in the art can configure it according to actual needs. For example, the first channel 121 can be a cavity provided in the housing 1, or a flow channel spirally provided in the housing 1.

[0044] In the embodiment of the present application, a first channel 121 centered on the accommodating cavity 11 is opened in the shell 1 to dissipate heat around the component to be cooled in the accommodating cavity 11. A semi-enclosed cooling channel 12 centered on the accommodating cavity 11 is formed by the second channel 122 and the first channel 121, so that the heat dissipation area of the component to be cooled in the accommodating cavity 11 is increased, thereby effectively improving the heat dissipation efficiency.

[0045] In addition, by arranging the cooling channel 12 in the shell 1, not only can the shell 1 be made lighter and the production cost reduced, but the shell 1 can also be fully utilized to dissipate heat from the heat dissipating elements, thereby avoiding the shell 1 being too large and occupying too much space due to the additional cooling structure.

[0046] In one example, the first channel 121 is communicated with the second channel 122 , and a liquid inlet 2 and a liquid outlet 3 are provided on the housing 1 , and the liquid inlet 2 and the liquid outlet 3 are respectively communicated with the first channel 121 .

[0047] like Figures 1 to 5 As shown, the housing 1 is provided with a liquid inlet 2 and a liquid outlet 3. The liquid inlet 2 and the liquid outlet 3 are respectively connected to the cooling channel 12. A cooling medium is injected into the cooling channel 12 through the liquid inlet 2 to absorb the heat released by the heat dissipation component in the accommodating cavity 11. The absorbed cooling medium is discharged through the liquid outlet 3 for circulation, thereby cooling the heat dissipation component.

[0048] The cooling channel 12 includes a first channel 121 and a second channel 122. The first channel 121 is arranged with the accommodating chamber 11 as the center, and dissipates heat from the periphery of the heat dissipation component within the accommodating chamber 11 through the first channel 121. The second channel 122 is arranged at the top and / or bottom of the accommodating chamber 11, and dissipates heat from the top and / or bottom of the heat dissipation component within the accommodating chamber 11 through the second channel 122. The first channel 121 is connected to the second channel 122, so that the cooling channel 12 forms a semi-enclosed and / or enclosed structure around the accommodating chamber 11, effectively increasing the heat dissipation area of the heat dissipation component and improving heat dissipation efficiency.

[0049] Of course, in the embodiment of the present application, the cooling channel 12 is not limited to the above structure, and those skilled in the art can configure it according to actual needs. For example, the first channel 121 and the second channel 122 are not connected, and the first channel 121 and the second channel 122 are respectively connected to the liquid inlet 2 and the liquid outlet 3.

[0050] In one example, a temperature monitor and a flow control valve are provided in the first channel 121 , and the temperature monitor and the flow control valve are signal-connected. The temperature monitor is located at the liquid outlet 3 , and the flow control valve is located at the liquid inlet 2 .

[0051] like Figures 1 to 5 As shown, the first channel 121 and the second channel 122 are in a connected state, the cooling medium is injected into the first channel 121 through the liquid inlet 2, flows through the second channel 122, and is discharged through the liquid outlet 3 of the first channel 121 for circulation.

[0052] A temperature monitor and a flow control valve are installed in the cooling channel 12. The temperature monitor is located at the liquid outlet 3 and monitors the temperature of the cooling medium as it exits the cooling channel 12. The flow control valve is located at the liquid inlet 2 and regulates the flow of the cooling medium injected into the cooling channel 12.

[0053] When the temperature of the cooling medium discharged from the liquid outlet 3 is greater than the set value range, the flow control valve is activated to increase the flow rate of the cooling medium injected into the cooling channel 12 to speed up the flow speed of the cooling medium in the cooling channel 12 and improve the heat dissipation efficiency of the heat dissipation component in the accommodating cavity 11.

[0054] When the temperature of the cooling medium discharged from the liquid outlet 3 is within the set value range, it means that the cooling medium in the cooling channel 12 can effectively dissipate heat for the heat-dissipating component in the accommodating cavity 11 without increasing the flow rate of the cooling medium.

[0055] When the temperature of the cooling medium discharged from the liquid outlet 3 is lower than the set value range, it means that the cooling medium in the cooling channel 12 can fully dissipate the heat of the components to be cooled in the accommodating cavity 11. The flow control valve starts to reduce the flow rate of the cooling medium injected into the cooling channel 12 to reduce the flow speed of the cooling medium in the cooling channel 12.

[0056] Of course, in the embodiment of the present application, the cooling channel 12 is not limited to the functions described above, and those skilled in the art can configure it according to actual needs. For example, when the external temperature is too low to affect the activation of the components in the accommodating chamber 11, a heat medium can be injected into the cooling channel 12 through the liquid inlet 2 to assist in the activation of the components.

[0057] In one example, the first channel 121 is communicated with the second channel 122 , and heat sinks are disposed in both the first channel 121 and the second channel 122 .

[0058] like Figures 1 to 5 As shown, the first channel 121 is connected to the second channel 122, and the first channel 121 and the second channel 122 form a semi-enclosed cooling channel 12 centered at the accommodating cavity 11. Heat-absorbing materials such as heat sinks or heat dissipation nets are arranged in the cooling channel 12 to absorb heat energy released by the heat dissipation element, thereby cooling the heat dissipation element.

[0059] Of course, in the embodiments of the present application, the cooling channel 12 is not limited to the above cooling method, and those skilled in the art can configure it according to actual needs. For example, a heat-absorbing material can be provided in the accommodating cavity 11, and the heat-absorbing material is attached to the inner wall of the accommodating cavity 11 and close to the cooling channel 12. The heat-absorbing material absorbs the heat energy released by the heat dissipating element in the accommodating cavity 11, and the heat energy is discharged through the cooling medium in the cooling channel 12, thereby achieving cooling of the heat dissipation structure.

[0060] In one example, the first channel 121 and the second channel 122 are both independent spaces. The first channel 121 is connected to a first liquid inlet and a first liquid outlet, and the second channel 122 is connected to a second liquid inlet and a second liquid outlet.

[0061] In the embodiment of the present application, the cooling channel 12 includes a first channel 121 and a second channel 122 . The first channel 121 and the second channel 122 are in a disconnected state and are two independent spaces.

[0062] The first channel 121 is arranged in the shell 1 with the accommodating chamber 11 as the center. The first channel 121 can be a pipe for the flow of cooling medium, or it can be an annular cavity arranged in the shell 1 with the accommodating chamber 11 as the center. A first liquid inlet and a first liquid outlet are provided on the shell 1, and the first liquid inlet and the first liquid outlet are respectively connected to the first channel 121. The cooling medium is injected into the first channel 121 through the first liquid inlet, and the cooling medium after absorbing heat energy is discharged from the first channel 121 through the first liquid outlet. The cooling medium flows in the first channel 121 to absorb the heat energy released by the heat dissipation element in the accommodating chamber 11, thereby accelerating the cooling rate of the heat dissipation element.

[0063] The second channel 122 is provided in the housing 1 and is located at the top and / or bottom of the accommodating cavity 11. The second channel 122 can be a pipe for the flow of the cooling medium or a cavity. The second channel 122 is connected to a second liquid inlet and a second liquid outlet. The cooling medium is injected into the second channel 122 through the second liquid inlet, and the cooling medium after absorbing the heat energy is discharged from the second channel 122 through the second liquid outlet. As the cooling medium flows in the second channel 122, the cooling medium absorbs the heat energy released from the top and / or bottom of the heat dissipation element to be dissipated, thereby increasing the heat dissipation area and improving the heat dissipation efficiency.

[0064] Of course, in the embodiment of the present application, the cooling channel 12 is not limited to the above configuration, and those skilled in the art can configure it according to actual needs. For example, heat sinks can be provided in the first channel 121 and the second channel 122, or heat sinks can be provided in the first channel 121 and cooling medium can be injected into the second channel 122, or cooling medium can be injected into the first channel 121 and heat sinks can be placed in the second channel 122, etc.

[0065] In one example, the housing 1 includes an outer shell and a cover plate, the outer shell and the cover plate are integrally formed, the first channel 121 is arranged in the outer shell along the periphery of the accommodating cavity 11, and the second channel 122 is provided on the cover plate.

[0066] In an embodiment of the present application, the shell 1 includes an outer shell and a cover plate. The cover plate and the outer shell are integrally formed, and the cover plate and the shell 1 form a semi-enclosed structure centered on the accommodating cavity 11. An accommodating cavity 11 is provided in the outer shell, and the heat dissipation element is located in the accommodating cavity 11. A first channel 121 is provided in the outer shell. When the heat dissipation element is started and releases heat energy, a cooling medium is injected into the first channel 121 to cool the heat dissipation element in the accommodating cavity 11. By providing a cooling channel 12 centered on the accommodating cavity 11 in the outer shell, the heat dissipation element in the accommodating cavity 11 can be dissipated in multiple directions, thereby increasing the cooling efficiency.

[0067] The cover plate is arranged on the top and / or bottom of the housing. The second channel 122 is arranged in the cover plate, and the top and / or bottom of the heat dissipation element are cooled through the second channel 122 in the cover plate, thereby increasing the heat dissipation area and effectively improving the heat dissipation efficiency.

[0068] Of course, in the embodiment of the present application, the housing 1 is not limited to the above structure, and those skilled in the art can configure it according to actual needs. For example, the cover plate is detachably connected to the housing 1.

[0069] In one example, the housing 1 includes an outer shell and a cover plate, the outer shell and the cover plate are detachably connected, the cover plate has a protrusion, the protrusion is embedded in the accommodating cavity 11, and the second channel 122 is provided on the protrusion.

[0070] In the embodiment of the present application, the housing includes an outer shell and a cover plate, and the cover plate is detachably connected to the outer shell. By detachably connecting the cover plate to the outer shell, it is convenient to take out, place, inspect, etc. the heat dissipation component in the accommodating groove.

[0071] The cover is mounted on the top and / or bottom of the housing and has a protrusion. When the cover is connected to the housing, the protrusion fits into the accommodating cavity 11. The protrusion fits into the accommodating cavity 11, tightly connecting the cover and the housing. In this state, the first channel 121 communicates with the second channel 122.

[0072] Of course, in the embodiment of the present application, the cooling channel 12 is not limited to the above structure, and those skilled in the art can configure it according to actual needs. For example, the first channel 121 and the second channel 122 are independent spaces.

[0073] The second channel 122 is a cavity disposed within the cover plate, and is positioned correspondingly to the protrusion. By providing the second channel 122 within the protrusion of the cover plate, the second channel 122 within the cover plate is closer to the heat dissipation element, more fully absorbing the heat released by the heat dissipation element, thereby accelerating the cooling of the interior of the accommodating cavity 11.

[0074] Of course, in the embodiment of the present application, the second channel 122 is not limited to the above structure, and those skilled in the art can configure it according to actual needs. For example, the second channel 122 can also be a channel for the flow of cooling medium.

[0075] In one example, the protrusion has a limiting groove, and the limiting groove forms a limiting fit with the element to be cooled in the accommodating cavity 11 .

[0076] In the embodiment of the present application, the protrusion is located within the accommodating cavity 11, and the heat dissipation element is placed within the accommodating cavity 11. A retaining groove is provided on the side of the protrusion near the heat dissipation element. When the cover plate is connected to the housing, the top and / or bottom of the heat dissipation element are embedded in the retaining groove, preventing the position of the heat dissipation element from changing when the heat dissipation element is activated, thereby affecting the stability of the device. Furthermore, by embedding the heat dissipation element in the retaining groove, the contact area between the second channel 122 and the heat dissipation element is increased, thereby accelerating the cooling of the heat dissipation element.

[0077] Of course, the cover plate in the embodiment of the present application is not limited to the above structure, and those skilled in the art can configure it according to actual needs. For example, a protrusion is provided on the side of the cover plate close to the heat dissipation element, and the protrusion is embedded in the top and / or bottom of the heat dissipation element.

[0078] In one example, a sealing groove is formed on the outer peripheral surface of the protrusion, and a sealing ring is embedded in the sealing groove. When the protrusion is embedded in the accommodating cavity 11 , the sealing ring abuts against the inner wall of the accommodating cavity 11 .

[0079] In this embodiment of the present application, the cover plate and the housing are detachably connected, and the protrusion is used to enhance the tightness of the connection between the housing and the cover. When the cover plate and the housing are connected, the protrusion is embedded in the accommodating cavity 11. Both the accommodating cavity 11 and the protrusion are cylindrical structures. The outer wall of the protrusion abuts the inner wall of the accommodating cavity 11.

[0080] A sealing groove is provided on the outer circumference of the protrusion, and a sealing ring is embedded in the sealing groove. When the cover plate is connected to the housing, the protrusion is embedded in the receiving groove, and the sealing ring embedded in the sealing groove abuts against the inner wall of the receiving groove, thereby sealing the connection gap between the cover plate and the housing. This prevents the cooling medium from flowing into the receiving groove through the connection gap when the first and second pipes are connected, causing damage to the heat dissipation component.

[0081] According to another embodiment of the present application, a pump is provided. The pump includes a coupler and the integrated cooling structure as described above. The coupler is located in the accommodating cavity 11 .

[0082] In the embodiment of the present application, the heat dissipation component placed in the receiving groove is a coupler. The coupler generates heat during operation, and the integrated cooling structure dissipates heat and cools the coupler, effectively extending the service life of the coupler.

[0083] In one example, the first channel 121 and the second channel 122 form a semi-enclosed structure centered on the coupler.

[0084] In the embodiment of the present application, the coupler is disposed in a receiving groove of the housing 1. The housing 1 has a first channel 121 and a second channel 122. The first channel 121 and the second channel 122 form a semi-enclosed structure with the receiving groove as the center. The heat dissipation of the coupler is carried out in multiple directions to increase the contact area between the cooling channel 12 and the coupler, thereby effectively improving the heat dissipation efficiency.

[0085] Although some specific embodiments of the present application have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present application. It should be understood by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the present application. The scope of the present application is defined by the appended claims.

Claims

1. An integrated cooling structure, characterized in that: The invention comprises a housing (1), wherein the housing (1) has a receiving cavity (11) and a cooling channel (12), and the cooling channel (12) is arranged around the receiving cavity (11); The cooling channel (12) comprises a first channel (121) and a second channel (122), wherein the first channel (121) is arranged along the periphery of the accommodating cavity (11), and the second channel (122) is arranged at one end of the first channel (121), and the first channel (121) and the second channel (122) form a semi-enclosed structure centered on the accommodating cavity (11).

2. The integrated cooling structure according to claim 1, characterized in that: The first channel (121) is in communication with the second channel (122); a liquid inlet (2) and a liquid outlet (3) are provided on the housing (1); the liquid inlet (2) and the liquid outlet (3) are respectively in communication with the first channel (121).

3. The integrated cooling structure according to claim 2, characterized in that: A temperature monitor and a flow control valve are provided in the first channel (121), and the temperature monitor and the flow control valve are signal-connected. The temperature monitor is located at the liquid outlet (3), and the flow control valve is located at the liquid inlet (2).

4. The integrated cooling structure according to claim 1, characterized in that: The first channel (121) is communicated with the second channel (122), and heat sinks are arranged in both the first channel (121) and the second channel (122).

5. The integrated cooling structure according to claim 1, characterized in that: The first channel (121) and the second channel (122) are both independent spaces; the first channel (121) is connected to a first liquid inlet and a first liquid outlet, and the second channel (122) is connected to a second liquid inlet and a second liquid outlet.

6. The integrated cooling structure according to claim 1, characterized in that: The housing (1) comprises an outer shell and a cover plate, the outer shell and the cover plate are integrally formed, the first channel (121) is arranged in the outer shell along the periphery of the accommodating cavity (11), and the second channel (122) is provided on the cover plate.

7. The integrated cooling structure according to claim 1, characterized in that: The housing (1) comprises an outer shell and a cover plate, the outer shell and the cover plate are detachably connected, the cover plate has a protrusion, the protrusion is embedded in the accommodating cavity (11), and the second channel (122) is provided on the protrusion.

8. The integrated cooling structure according to claim 7, characterized in that: A sealing groove is provided on the outer peripheral surface of the protruding portion, and a sealing ring is embedded in the sealing groove. When the protruding portion is embedded in the accommodating cavity (11), the sealing ring abuts against the inner wall of the accommodating cavity (11).

9. A pump, characterized in that: It comprises a coupler and the integrated cooling structure according to any one of claims 1 to 8, wherein the coupler is located in the accommodating cavity (11).

10. The pump according to claim 9, characterized in that The first channel (121) and the second channel (122) form a semi-enclosed structure centered on the coupler.

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