Pipeline anti-blocking structure and semiconductor production equipment

Abstract

The utility model provides a pipeline anti-blocking structure and semiconductor production equipment, the pipeline anti-blocking structure is used for process tail gas treatment, the pipeline anti-blocking structure comprises a gas conveying pipe and a purging pipe which are connected, the gas conveying pipe is used for conveying process tail gas, and the purging pipe is used for being connected with an external gas source so as to introduce purging gas into the gas conveying pipe; the purging pipe is fixed on the outer wall of the gas conveying pipe, the central axis of the purging pipe is inclined to the cross section of the gas conveying pipe, and meanwhile, the central axis of the purging pipe is inclined to the axial section of the gas conveying pipe. The pipeline anti-blocking structure and the semiconductor production equipment provided by the utility model are good in anti-crystallization effect, can effectively prevent the interior of the pipeline from being blocked, are low in production cost, and have remarkable economic benefits.

Description

Technical Field

[0001] The present application relates to the field of semiconductor production technology, and in particular to a pipeline anti-blocking structure and semiconductor production equipment. Background Art

[0002] Various chemical gases are required in semiconductor production. During the process, they are extracted from the cavity by a vacuum pump, forming various toxic and harmful process exhaust gases. The exhaust gas treatment device effectively treats the exhaust gas to reduce pollution to the environment.

[0003] At present, in the plasma dry etching process of semiconductor production, the gases provided are mainly Cl2, CF4, F2, BCl3, SF6, etc. After passing through the vacuum process chamber, unreacted by-products (TiCl x 、AlCl x 、MoCl x 、MoF x , SiO2, Si3N4, TEOS, etc.) These byproducts are easily condensed and adhered to the inner walls of the pumping line and process exhaust system due to the low temperature inside the pipeline, causing pipeline blockage and reducing exhaust efficiency. At the same time, this process also leads to incomplete exhaust treatment, resulting in increased treatment costs.

[0004] Currently, pumping lines and process exhaust gas lines typically use heaters to prevent clogging of the inner walls. This approach works by maintaining a high temperature in the line to mitigate crystallization. However, this approach presents the following challenges: External heaters for pumping lines and process exhaust gas lines require custom installation, resulting in high overall costs. Maintaining the heat continuously requires electricity, resulting in high energy consumption and further increased costs. Furthermore, while heaters can slow the rate of exhaust gas crystallization, over time, a significant amount of crystals will still form on the inner walls of the line, causing clogging. Summary of the Invention

[0005] Based on this, the present application provides a pipeline anti-blocking structure and semiconductor production equipment to improve the problems of high cost and poor anti-blocking effect in the existing technology.

[0006] To achieve the above objectives, the technical solution of the embodiment of the present application is implemented as follows:

[0007] On the one hand, an embodiment of the present application provides a pipeline anti-blocking structure for process exhaust gas treatment, including a gas delivery pipe and a purge pipe connected together, the gas delivery pipe is used to deliver process exhaust gas, and the purge pipe is used to connect to an external gas source to introduce purge gas into the gas delivery pipe; the purge pipe is fixed on the outer wall of the gas delivery pipe, and the central axis of the purge pipe is inclined to the cross-section of the gas delivery pipe, and at the same time, the central axis of the purge pipe is inclined to the axial cross-section of the gas delivery pipe.

[0008] In one embodiment, the angle between the central axis of the purge pipe and the cross section of the gas delivery pipe is in the range of 45°-75°.

[0009] In one embodiment, the axial section where the central axis of the purge pipe and the gas delivery pipe intersect is defined as a preset section, and the angle between the central axis of the purge pipe and the preset section of the gas delivery pipe ranges from 35° to 65°.

[0010] In one embodiment, the end surface of the purge pipe close to one end of the gas delivery pipe is tilted relative to the central axis of the purge pipe to form an oblique surface.

[0011] In one embodiment, a mounting hole is provided on the tube wall of the gas delivery tube, and the mounting hole is used to install the purge tube. One end of the purge tube provided with the beveled surface is inserted into the mounting hole, and the beveled surface is arranged flush with the inner wall surface of the gas delivery tube.

[0012] In one embodiment, the pipeline anti-blocking structure further includes a nitrogen gas source, the nitrogen gas source is connected to the purge pipe, and the gas supply pressure of the nitrogen gas source is 0.2Mpa-0.9Mpa.

[0013] On the other hand, an embodiment of the present application provides a semiconductor production equipment, including the pipeline anti-blocking structure as described above.

[0014] In one embodiment, the semiconductor production equipment also includes a production host, an exhaust gas treatment device and a pumping assembly; the pumping assembly includes a vacuum pump, a first gas delivery pipe and a second gas delivery pipe, the two ends of the first gas delivery pipe are respectively connected to the vacuum pump and the production host, the second gas delivery pipe is respectively connected to the vacuum pump and the exhaust gas treatment device, and the first gas delivery pipe and / or the second gas delivery pipe are provided with the purge pipe.

[0015] In one embodiment, the first gas delivery pipe is provided with the purge pipe, and the purge pipe is provided at one end of the first gas delivery pipe close to the production host.

[0016] In one embodiment, the second gas delivery pipe is provided with the purge pipe, and the purge pipe is provided at one end of the second gas delivery pipe close to the vacuum pump.

[0017] The present application has at least the following beneficial effects: the pipeline anti-blocking structure provided in the embodiment of the present application, by arranging a purge tube on the gas delivery tube, blowing purge gas into the gas delivery tube through the purge tube, thereby blowing the by-products generated in the semiconductor production process downstream to prevent them from condensing on the inner wall of the pipeline. The pipeline anti-blocking structure of the embodiment of the present application tilts the purge tube relative to the cross section and axial section of the gas delivery tube, so that the purge gas can form a vortex in the gas delivery tube, better entraining the by-products in the gas delivery tube to flow downstream, avoiding the formation of condensate on the inner wall of the gas delivery tube, and affecting the normal circulation of the gas. At the same time, the pipeline anti-blocking structure of the embodiment of the present application has low equipment investment cost and low energy consumption in the later stage, which can significantly reduce production costs. The semiconductor production equipment provided in the embodiment of the present application includes the above-mentioned pipeline anti-blocking structure, and therefore also has the above-mentioned beneficial effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the main structure of the pipeline anti-blocking structure of an embodiment of the present application.

[0019] Figure 2 for Figure 1 Schematic diagram of the top view of the cross-sectional structure of the pipeline anti-blocking structure (the arrow indicates the direction of nitrogen flow).

[0020] Figure 3 for Figure 1 The arrow in the cross-sectional diagram of the main structure of the pipeline anti-blocking structure indicates the direction of nitrogen flow).

[0021] Figure 4 for Figure 1 The arrow indicates the direction of nitrogen flow).

[0022] Figure 5 This is a schematic diagram of the structure of the purge tube according to an embodiment of the present application (the arrow indicates the direction of nitrogen gas introduction).

[0023] Figure 6 This is a schematic structural diagram of the semiconductor production equipment according to an embodiment of the present application.

[0024] The meanings of the reference numerals in the accompanying drawings are as follows:

[0025] 1. Gas delivery pipe; 11. First gas delivery pipe; 12. Second gas delivery pipe; 2. Purge pipe; 21. Beveled surface; 3. Nitrogen source; 4. Control valve; 5. Production host; 6. Exhaust gas treatment device; 7. Vacuum pump. DETAILED DESCRIPTION

[0026] The technical solution of this application is further elaborated in detail below with reference to the accompanying drawings and specific embodiments.

[0027] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application pertains. The terms used herein in the specification of this application are intended only to describe specific embodiments and are not intended to limit the implementation of this application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0028] In the description of this application, it should be understood that the terms "center," "up," "down," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inside," "outside," and the like, indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended only to facilitate the description of this application and simplify the description. They do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limiting this application. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0029] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to direct connections, indirect connections through an intermediate medium, or internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0030] See also Figure 1 and Figure 2 The pipeline anti-blocking structure of the embodiment of the present application is used for process exhaust gas treatment, and includes a gas delivery pipe 1 and a purge pipe 2 that are connected and arranged. The gas delivery pipe 1 is used to deliver process exhaust gas, and the purge pipe 2 is used to be connected to an external gas source to introduce purge gas into the gas delivery pipe 1; the purge pipe 2 is fixed on the outer wall of the gas delivery pipe 1, and the central axis of the purge pipe 2 is inclined to the cross-section of the gas delivery pipe 1. At the same time, the central axis of the purge pipe 2 is inclined to the axial cross-section of the gas delivery pipe 1.

[0031] Specifically, if Figure 3 and Figure 4As shown, in this embodiment, the angle β between the central axis L of the purge pipe 2 and the cross-section (BB) of the gas delivery pipe 1 ranges from 45° to 75°; the axial section at the intersection of the central axis L of the purge pipe 2 and the gas delivery pipe 1 is defined as the predetermined cross-section (AA), and the angle α between the central axis L of the purge pipe 2 and the predetermined cross-section (AA) of the gas delivery pipe 1 ranges from 35° to 65°. In other words, the central axis L of the purge pipe 2 is neither coplanar nor parallel with any axial cross-section of the gas delivery pipe 1, nor is it coplanar or parallel with the cross-section (BB) of the gas delivery pipe 1. The setting of these two angles determines the relative position of the purge pipe 2 and the gas delivery pipe 1. This relative position allows the purge gas entering the gas delivery pipe 1 to flow forward in a spiral shape, mixing with the process exhaust gas in the gas delivery pipe 1 and flowing forward together, thereby enhancing the gas's driving force, accelerating the exhaust gas's discharge, and slowing down crystallization within the pipe.

[0032] like Figure 5 As shown, the purge pipe 2 can be made of a stainless steel pipe, such as a 316 stainless steel pipe. The end face of the purge pipe 2 near one end of the gas delivery pipe 1 is tilted relative to the central axis L of the purge pipe 2 to form a bevel 21. The bevel 21 is formed by the cross section at the intersection of the bevel 21 and the central axis L being tilted toward (or away from) the central axis L, that is, it is formed by rotating the cross section at the intersection of the bevel 21 and the central axis L along the axial section passing through the intersection. The relative position of the purge pipe 2 and the gas delivery pipe 1 can also be determined by the angle between the bevel 21 and the central axis L of the purge pipe 2. For example, the angle γ between the bevel 21 and the central axis L of the purge pipe 2 can be set in the range of 15°-45°. A mounting hole is provided on the wall of the gas delivery pipe 1, and the mounting hole is used to install the purge pipe 2. The end of the purge pipe 2 provided with the bevel 21 is inserted into the mounting hole, and the bevel 21 is flush with the inner wall surface of the gas delivery pipe 1. Providing a chamfered surface 21 at one end of purge tube 2 facilitates better alignment of the end face of purge tube 2 with the mounting hole of gas delivery tube 1. The end face of chamfered surface 21 is designed to be as flush as possible with the inner wall of gas delivery tube 1, thereby reducing resistance to gas flow within gas delivery tube 1 caused by the wall of purge tube 2. Furthermore, the dimensions of chamfered surface 21 should be as close as possible to those of the mounting hole to facilitate secure connection of purge tube 2 and gas delivery tube 1 via argon arc welding, maintaining a sealed connection and preventing leakage of process exhaust gas.

[0033] The pipeline anti-blocking structure of the present embodiment also includes a nitrogen source 3, which is connected to the purge pipe 2, and the air supply pressure of the nitrogen source 3 is 0.2Mpa-0.9Mpa. The inlet end of the purge pipe 2 connected to the nitrogen source 3 can be provided with a control valve 4 to control whether nitrogen is passed in, and the nitrogen source 3 can be opened throughout the manufacturing process of the semiconductor. The nitrogen source 3 cooperates with the purge pipe 2 to make the gas advance in a spiral shape with a certain power, which can effectively accelerate the flow of the gas and slow down the crystallization of the inner wall of the pipeline. In semiconductor production workshops, nitrogen source 3 is generally provided. Therefore, the pipeline anti-blocking structure of the present embodiment does not need to be further configured with nitrogen source 3. It is only necessary to connect and fix the purge pipe 2 to the nitrogen source 3 at the work site, which will not increase the investment cost of the equipment, and the increased occupied space is very small and can be ignored.

[0034] In another embodiment of the present application, a semiconductor production device is provided, which includes the above-mentioned pipeline anti-blocking structure.

[0035] Specifically, the semiconductor production equipment includes a production host 5, an exhaust gas treatment device 6, and a pumping assembly. The pumping assembly includes a vacuum pump 7, a first gas delivery pipe 11 (equivalent to the pumping line mentioned in the background technology), and a second gas delivery pipe 12 (equivalent to the process exhaust system pipeline mentioned in the background technology). The two ends of the first gas delivery pipe 11 are respectively connected to the vacuum pump 7 and the production host 5, and the second gas delivery pipe 12 is respectively connected to the vacuum pump 7 and the exhaust gas treatment device 6. A purge pipe 2 is provided on the first gas delivery pipe 11 and / or the second gas delivery pipe 12. The first gas delivery pipe 11 is used to transport the process exhaust generated by the production host 5 to the vacuum pump 7, and the second gas delivery pipe 12 is used to transport the process exhaust flowing out of the vacuum pump 7 to the exhaust treatment device 6.

[0036] Preferably, in order to enhance the anti-blocking effect of the gas delivery pipe 1, a purge pipe 2 can be respectively provided on the first gas delivery pipe 11 and the second gas delivery pipe 12 to prevent the first gas delivery pipe 11 and the second gas delivery pipe 12 from being blocked and to better treat the exhaust gas.

[0037] Preferably, a purge pipe 2 is provided on the first gas delivery pipe 11, located at the end of the first gas delivery pipe 11 near the production host 5. A purge pipe 2 is provided on the second gas delivery pipe 12, located at the end of the second gas delivery pipe 12 near the vacuum pump 7. In other words, the air inlets of the purge pipe 2 are respectively located at the ends of the first gas delivery pipe 11 and the second gas delivery pipe 12 near the process exhaust gas inlet. This increases the driving force of the gas at the air inlet source and further improves the anti-blocking capability of the pipeline anti-blocking structure.

[0038] The energy consumption of nitrogen purge of the pipeline anti-blocking structure of this embodiment is compared with that of a single heating belt vest. The results are as follows:

[0039] Heating belt vest: The initial heating energy consumption is high (current is about 6.75A, power is 1485W), and after stabilization, the energy consumption is about 70% (about 1039W). The average daily energy consumption is 1.0369×4=2.5kW·h, the average daily electricity fee is 2.5×0.76=1.29 yuan, and the average monthly electricity fee is 38.7 yuan; (the initial investment cost of a single heating belt vest equipment is about 262,500 yuan).

[0040] Nitrogen purge: average daily energy consumption: 252L / day, average daily energy consumption is 0.23 yuan / day, and the initial external nitrogen pipeline cost of 1,000 yuan can meet the requirements.

[0041] As can be seen from the above, the use of the pipeline anti-blocking structure of this embodiment not only saves a lot of equipment investment costs, but also significantly reduces energy consumption.

[0042] The pipeline anti-blocking structure and semiconductor production equipment provided in the embodiments of the present application can effectively improve the crystallization problem on the inner wall of the gas delivery pipe. The inclined purge pipe and the pressure of the nitrogen gas source significantly enhance the propulsion force of the gas, eliminating the need for additional equipment, reducing production costs, and ensuring the effectiveness of exhaust gas treatment. Furthermore, the use of nitrogen for purge and anti-blocking reduces energy consumption in the heating belt.

[0043] It should be noted that, in this document, the terms "comprises," "includes," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a process, method, article, or apparatus comprising a series of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, method, article, or apparatus comprising the element.

[0044] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any modifications or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present application should be included in the scope of protection of the present application. Therefore, the scope of protection of the present application should be based on the scope of protection of the claims.

Claims

1. A pipeline anti-blocking structure for process tail gas treatment, characterized in that: The invention comprises a gas delivery pipe (1) and a purge pipe (2) which are connected and arranged, wherein the gas delivery pipe (1) is used to deliver process tail gas, and the purge pipe (2) is used to be connected to an external gas source so as to introduce purge gas into the gas delivery pipe (1); the purge pipe (2) is fixed on the outer wall of the gas delivery pipe (1), and the central axis of the purge pipe (2) is arranged to be inclined to the cross section of the gas delivery pipe (1); at the same time, the central axis of the purge pipe (2) is arranged to be inclined to the axial cross section of the gas delivery pipe (1).

2. The pipeline anti-blocking structure according to claim 1, characterized in that: The included angle between the central axis of the purge pipe (2) and the cross section of the gas delivery pipe (1) is in the range of 45°-75°.

3. The pipeline anti-blocking structure according to claim 1, characterized in that: The axial section at the intersection of the central axis of the purge pipe (2) and the gas delivery pipe (1) is defined as a preset section, and the angle between the central axis of the purge pipe (2) and the preset section of the gas delivery pipe (1) ranges from 35° to 65°.

4. The pipeline anti-blocking structure according to claim 1, characterized in that: The end surface of the purge pipe (2) close to one end of the gas delivery pipe (1) is arranged obliquely relative to the central axis of the purge pipe (2), forming an oblique section (21).

5. The pipeline anti-blocking structure according to claim 4, characterized in that: A mounting hole is provided on the wall of the gas delivery pipe (1), and the mounting hole is used to mount the purge pipe (2). One end of the purge pipe (2) provided with the beveled surface (21) is inserted into the mounting hole, and the beveled surface (21) is flush with the inner wall surface of the gas delivery pipe (1).

6. The pipeline anti-blocking structure according to claim 1, characterized in that: It also includes a nitrogen gas source (3), which is connected to the purge pipe (2), and the gas supply pressure of the nitrogen gas source (3) is 0.2Mpa-0.9Mpa.

7. A semiconductor production equipment, characterized in that It includes the pipeline anti-blocking structure according to any one of claims 1 to 6.

8. The semiconductor production equipment according to claim 7, wherein: The invention also includes a production host (5), an exhaust gas treatment device (6) and a pumping assembly; the pumping assembly includes a vacuum pump (7), a first gas delivery pipe (11) and a second gas delivery pipe (12), the two ends of the first gas delivery pipe (11) are respectively connected to the vacuum pump (7) and the production host (5), the second gas delivery pipe (12) is respectively connected to the vacuum pump (7) and the exhaust gas treatment device (6), and the first gas delivery pipe (11) and / or the second gas delivery pipe (12) are provided with the purge pipe (2).

9. The semiconductor production equipment according to claim 8, wherein The first gas delivery pipe (11) is provided with the purge pipe (2), and the purge pipe (2) is provided at one end of the first gas delivery pipe (11) close to the production host (5).

10. The semiconductor production equipment according to claim 8, wherein The second gas delivery pipe (12) is provided with the purge pipe (2), and the purge pipe (2) is provided at one end of the second gas delivery pipe (12) close to the vacuum pump (7).

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