Infrared sensor and detection assembly

Abstract

The utility model discloses an infrared sensor and a detection assembly, and relates to the technical field of semiconductors, the infrared sensor comprises a heat insulation shell, a sensing chip and a signal acquisition chip, the heat insulation shell is provided with a cavity and a connecting hole communicated with the cavity; the sensing chip is arranged on the heat insulation shell and is used for outputting a sensing signal when sensing an infrared signal; the signal acquisition chip comprises a chip body, a first conductive piece and a second conductive piece, the chip body is arranged in the cavity, the first conductive piece is arranged on the chip body and electrically connected with the sensing chip, and the second conductive piece is arranged on the chip body, extends out of the connecting hole and is used for being electrically connected with the circuit board; the chip body is used for collecting induction signals output by the induction chip and forwarding the collected induction signals to the circuit board. According to the technical scheme of the utility model, the assembling convenience and efficiency of the infrared sensor can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to an infrared sensor and a detection component. Background Art

[0002] Existing infrared sensors are generally plug-in type. During assembly, plug-ins are required to plug the infrared sensor into the circuit board. After the plug-in is completed, the connection between the infrared sensor and the circuit board is soldered and fixed, and finally the redundant pins are manually cut off. This assembly method is complicated and inconvenient to operate. Utility Model Content

[0003] The main purpose of the utility model is to provide an infrared sensor and a detection component, aiming to improve the convenience and efficiency of the infrared sensor in assembly.

[0004] To achieve the above-mentioned purpose, the infrared sensor proposed by the present invention includes:

[0005] A heat-insulating shell having a cavity and a connecting hole communicating with the cavity;

[0006] A sensing chip, disposed in the heat-insulating housing, configured to output a sensing signal when sensing an infrared signal;

[0007] The signal acquisition chip includes a chip body, a first conductive member, and a second conductive member. The chip body is arranged in the cavity, the first conductive member is arranged in the chip body and electrically connected to the sensing chip, and the second conductive member is arranged in the chip body and extends from the connection hole for electrical connection to the circuit board; the chip body is used to collect the sensing signal output by the sensing chip and forward the collected sensing signal to the circuit board.

[0008] In one embodiment, the heat-insulating outer shell includes a heat-insulating bottom plate and a shell body connected to the heat-insulating bottom plate to enclose the cavity, and the heat-insulating bottom plate is provided with the connecting hole.

[0009] In one embodiment, the thermal insulation base plate is provided with a limiting groove, the bottom of the chip body is provided in the limiting groove, the top of the chip body extends out of the limiting groove, and the first conductive member and the second conductive member are separately provided at the top of the chip body.

[0010] In one embodiment, a fixing portion extends outward from the shell body, and the fixing portion is fixedly attached to the thermal insulation bottom plate on a side facing the thermal insulation bottom plate.

[0011] In one embodiment, the second conductive part includes a first electrical connection portion and a second electrical connection portion, the first electrical connection portion is provided on the chip body, one end of the second electrical connection portion is connected to the first electrical connection portion, and the other end of the second electrical connection portion extends from the connection hole and bends and extends toward the width direction of the chip body.

[0012] In one embodiment, a plurality of the second conductive members are provided, and the plurality of the second conductive members are spaced apart along the length direction of the chip body; a plurality of the connection holes are provided, and the plurality of the second conductive members extend from the plurality of the connection holes one by one.

[0013] In one embodiment, the signal acquisition chip is a SOP8 chip;

[0014] And / or, the first conductive member is a pad;

[0015] And / or, the second conductive member is a pin.

[0016] In one embodiment, the infrared sensor further includes a filter element, which is disposed in the heat-insulating housing and facing the sensing chip, and is used to filter light other than infrared light.

[0017] In one embodiment, the infrared sensor further includes a conductive bracket, which is disposed in the cavity and electrically connects the sensing chip and the first conductive member.

[0018] The present invention also provides a detection component, including a circuit board; and / or the infrared sensor as described above.

[0019] The present invention comprises a heat-insulating housing, a sensing chip, and a signal acquisition chip; the heat-insulating housing has a cavity and a connection hole connected to the cavity; the sensing chip is disposed in the heat-insulating housing and is configured to output a sensing signal when sensing an infrared signal; the signal acquisition chip comprises a chip body, a first conductive member, and a second conductive member, the chip body being disposed in the cavity, the first conductive member being disposed in the chip body and electrically connected to the sensing chip, and the second conductive member being disposed in the chip body and extending from the connection hole; in practical application, the second conductive member can be directly electrically connected to a circuit board outside the heat-insulating housing, without the need for manual plug-in connection or manual soldering and fixing of the connection between the second conductive member and the circuit board, thereby achieving electrical connection between the signal acquisition chip and the circuit board, allowing the chip body to collect the sensing signal output by the sensing chip and forward the collected sensing signal to the circuit board, thereby achieving signal transmission, thereby simplifying the structure of the infrared sensor and improving the convenience and efficiency of the infrared sensor in assembly. In addition, the present invention has a simple structure and is easy to install, and the sensing chip and signal acquisition chip can be tested to determine whether the chip is normal before reassembly, thereby improving production yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The accompanying drawings are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present invention, and together with the description, serve to explain the principles of the present invention.

[0021] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0022] Figure 1 This is a schematic diagram of the structure of the infrared sensor provided by the utility model;

[0023] Figure 2 for Figure 1 Front view of

[0024] Figure 3 for Figure 1 Rear view;

[0025] Figure 4 for Figure 1 Exploded diagram of .

[0026] Description of Figure Numbers:

[0027] 100. Infrared sensor; 1. Thermal insulation shell; 11. Thermal insulation bottom plate; 111. Connection hole; 112. Limiting groove; 12. Shell body; 13. Fixing part; 2. Sensing chip; 3. Signal acquisition chip; 31. Chip body; 32. First conductive part; 33. Second conductive part; 331. First electrical connection part; 332. Second electrical connection part; 4. Filter; 5. Conductive bracket.

[0028] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0030] Existing infrared sensors are generally plug-in type. During assembly, plug-ins are required to plug the infrared sensor into the circuit board. After the plug-in is completed, the connection between the infrared sensor and the circuit board is soldered and fixed, and finally the redundant pins are manually cut off. This assembly method is complicated and inconvenient to operate.

[0031] To this end, the present invention proposes an infrared sensor 100 , aiming to improve the convenience and efficiency of assembling the infrared sensor 100 .

[0032] Reference Figures 1 to 4 In one embodiment of the present invention, the infrared sensor 100 includes:

[0033] The heat-insulating housing 1 has a cavity and a connecting hole 111 communicating with the cavity;

[0034] The sensing chip 2 is provided in the heat-insulating housing 1 and is used to output a sensing signal when sensing an infrared signal;

[0035] The signal acquisition chip 3 includes a chip body 31, a first conductive member 32, and a second conductive member 33. The chip body 31 is arranged in the cavity, the first conductive member 32 is arranged in the chip body 31 and is electrically connected to the sensing chip 2, and the second conductive member 33 is arranged in the chip body 31 and extends from the connection hole 111 for electrical connection to the circuit board; the chip body 31 is used to collect the sensing signal output by the sensing chip 2 and forward the collected sensing signal to the circuit board.

[0036] In this embodiment, the thermally insulating housing 1 can be designed based on the installation requirements of the sensing chip 2 and the signal acquisition chip 3. As an example, the thermally insulating housing 1 is a cylindrical structure having a cavity and a connection hole 111 connected to the cavity. The connection hole 111 is provided at the bottom of the thermally insulating housing 1. It should be noted that the thermally insulating housing 1 is made of a heat-insulating material. The thermally insulating housing 1 isolates the heat generated by the circuit board from the outside of the thermally insulating housing 1 as much as possible, reducing the impact of heat on the electrical components within the thermally insulating housing 1.

[0037] The sensing chip 2 can be implemented using a ceramic sensing chip. The ceramic sensing chip can be arranged in the cavity of the thermal insulation shell 1 or on the thermal insulation shell 1. When the ceramic sensing chip is arranged in the cavity of the thermal insulation shell 1, the thermal insulation shell 1 also has an opening connected to the cavity. The position of the opening is set corresponding to the position of the ceramic sensing chip. In this way, visible light and infrared signals from the external environment can be irradiated to the ceramic sensing chip through the opening. When the ceramic sensing chip senses the infrared signal, it generates a sensing signal and outputs it to the signal acquisition chip 3. When the ceramic sensing chip is arranged on and outside the thermal insulation shell 1, visible light and infrared signals from the external environment are directly irradiated to the ceramic sensing chip. When the ceramic sensing chip senses the infrared signal, it generates a sensing signal and outputs it to the signal acquisition chip 3.

[0038] The signal acquisition chip 3 can be implemented using an SOP8 chip. The SOP8 chip has the characteristics of small size, low power consumption, excellent performance and easy integration, which can effectively reduce the volume of the infrared sensor 100 and reduce its power consumption. The SOP8 chip includes a chip body 31, a first conductive member 32 and a second conductive member 33. The chip body 31 is installed in the cavity to reduce the influence of factors in the external environment. The first conductive member 32 can be implemented using a pad, which is fixedly connected and electrically connected to the chip body 31 and electrically connected to the sensing chip 2, that is, the pad electrically connects the chip body 31 and the sensing chip 2. The second conductive member 33 can be implemented using a pin, with the solder pin fixedly connected and electrically connected to the chip body 31 and extending out of the thermal insulation housing 1 through the connection hole 111. In actual application, the pin can be directly electrically connected to the circuit board of the product outside the thermal insulation housing 1, without the need for manual connection using a plug-in, nor the need for manual soldering of the connection between the second conductive member 33 and the circuit board. This can achieve the connection between the signal acquisition chip 3 and the circuit board, allowing the chip body 31 to collect the sensing signal output by the sensing chip 2 and forward the collected sensing signal to the circuit board, thereby achieving signal transmission. Through the above connection method, not only can the structure of the infrared sensor 100 be simplified, but the convenience and efficiency of the assembly of the infrared sensor 100 can also be improved.

[0039] The technical solution of the present invention comprises a heat-insulating housing 1, a sensing chip 2 and a signal acquisition chip 3. The heat-insulating housing 1 has a cavity and a connection hole 111 connected to the cavity. The sensing chip 2 is arranged in the heat-insulating housing 1 and is used to output a sensing signal when sensing an infrared signal. The signal acquisition chip 3 includes a chip body 31, a first conductive member 32 and a second conductive member 33. The chip body 31 is arranged in the cavity. The first conductive member 32 is arranged in the chip body 31 and electrically connected to the sensing chip 2. The second conductive member 33 is arranged in the chip body 31 and extends from the connection hole 111. In actual application, the second conductive member 33 can be directly electrically connected to the circuit board outside the heat-insulating housing 1 without the need for manual connection using a plug-in or manual welding and fixing of the connection between the second conductive member 33 and the circuit board. The electrical connection between the signal acquisition chip 3 and the circuit board can be achieved, so that the chip body 31 can collect the sensing signal output by the sensing chip 2 and forward the collected sensing signal to the circuit board, thereby realizing signal transmission, thereby simplifying the structure of the infrared sensor 100 and improving the convenience and efficiency of the assembly of the infrared sensor 100. In addition, the present invention has a simple structure and is easy to install. It can also test the sensing chip 2 and the signal acquisition chip 3 to determine whether the chips are normal before assembling them, thereby improving the production yield.

[0040] It is understandable that there are many forms of implementation of the thermal insulation shell 1. Figure 4 In one embodiment of the present invention, the thermal insulation shell 1 includes a thermal insulation bottom plate 11 and a shell body 12 connected with the thermal insulation bottom plate 11 to form the cavity, and the thermal insulation bottom plate 11 is provided with the connecting hole 111.

[0041] In this embodiment, by configuring the thermally insulating outer shell 1 as a separate structure consisting of a thermally insulating base plate 11 and a shell body 12, the sensing chip 2 and the signal acquisition chip 3 can be conveniently placed within the shell body 12, thereby improving the ease of assembly of the infrared sensor 100. Furthermore, by providing a connection hole 111 on the thermally insulating base plate 11, when the thermally insulating base plate 11 is placed on a circuit board, the second conductive member 33 can be directly electrically connected to the circuit board through the connection hole 111, thereby improving the ease of connection between the two and shortening the connection distance between the second conductive member 33 and the circuit board, thereby allowing the second conductive member 33 to be designed smaller and reducing the size of the infrared sensor 100. Furthermore, the thermally insulating base plate 11 is made of a heat-insulating material, which isolates the circuit board from heat and reduces the impact of heat on the chip.

[0042] Optionally, the connection between the heat-insulating base plate 11 and the shell body 12 can be a fixed connection, such as welding, or a detachable connection, such as a magnetic connection, plug-in connection, snap-on connection, etc.

[0043] If the thermal insulation base plate 11 is fixedly connected to the shell body 12, the fixing method can improve the structural stability of the thermal insulation shell 1; if the thermal insulation base plate 11 and the shell body 12 are detachably connected, when the sensing chip 2 or the signal acquisition chip 3 is damaged, the thermal insulation shell 1 can be disassembled to achieve the maintenance or replacement of the sensing chip 2 or the signal acquisition chip 3, thereby improving the convenience of maintenance or replacement of related components.

[0044] According to the above content, in order to strengthen the installation of the chip body 31, refer to Figure 4 In one embodiment of the present invention, the thermal insulation base plate 11 is provided with a limiting groove 112, the bottom of the chip body 31 is provided in the limiting groove 112, the top of the chip body 31 extends out of the limiting groove 112, and the first conductive member 32 and the second conductive member 33 are respectively provided at the top of the chip body 31.

[0045] In this embodiment, a retaining groove 112 is provided on one side of the thermal insulation base plate 11 within the cavity. The bottom of the chip body 31 fits within the retaining groove 112 to secure the chip body 31. The top of the chip body 31 extends outside the retaining groove 112, facilitating the installation of a first conductive member 32 and a second conductive member 33. The first conductive member 32 is located on the top surface of the chip body 31 to facilitate electrical connection to the sensor chip 2. The second conductive member 33 is located on the side of the chip body 31 to shorten the height distance between it and the connection hole 111, thereby reducing its size.

[0046] Reference Figure 4 In one embodiment of the present invention, the shell body 12 has a fixing portion 13 extending outward, and the fixing portion 13 is fixedly attached to the insulating bottom plate 11 on one side facing the insulating bottom plate 11. In this way, the gap between the shell body 12 and the insulating bottom plate 11 caused by the connection can be reduced, the sealing of the cavity of the insulating shell 1 can be improved, dust and other substances can be reduced from entering the cavity, and the life of the components in the cavity can be increased.

[0047] It is understandable that there are many ways to implement the second conductive member 33. Figure 4 In one embodiment of the present invention, the second conductive member 33 includes a first electrical connection portion 331 and a second electrical connection portion 332. The first electrical connection portion 331 is provided on the chip body 31, one end of the second electrical connection portion 332 is connected to the first electrical connection portion 331, and the other end of the second electrical connection portion 332 extends from the connection hole 111 and bends and extends toward the width direction of the chip body 31.

[0048] To ensure the normal transmission of signals, refer to Figure 4In one embodiment of the present invention, multiple second conductive members 33 are provided, spaced apart along the length of the chip body 31. Multiple connection holes 111 are provided, with the second conductive members 33 extending one-on-one from the connection holes 111 for electrical connection to the circuit board. This arrangement ensures that even if one or two second conductive members 33 become damaged or unstable, the remaining functioning second conductive members 33 can maintain the connection between the infrared sensor 100 and the circuit board, thereby ensuring normal signal transmission.

[0049] Reference Figure 4 In one embodiment of the present invention, the infrared sensor 100 further includes a filter 4, which is disposed in the heat-insulating housing 1 and facing the sensing chip 2. The filter 4 is used to filter light other than infrared light.

[0050] In this embodiment, the optical filter 4 can be implemented as an optical filter, which is mounted on the heat-insulating housing 1 and disposed toward the sensing chip 2. The optical filter is used to filter light other than infrared light, so that the sensing chip 2 can quickly and accurately sense the infrared signal and output the sensing signal to the signal acquisition chip 3, which then forwards it to the circuit board, thereby improving signal transmission efficiency.

[0051] To reduce the heat of the sensor chip 2, refer to Figure 4 In one embodiment of the present invention, the infrared sensor 100 further includes a conductive bracket 5 , which is disposed in the cavity and electrically connects the sensing chip 2 and the first conductive member 32 .

[0052] In this embodiment, a conductive bracket 5 is further provided in the cavity of the heat-insulating shell 1. The conductive bracket 5 is located between the chip body 31 and the sensing chip 2. One end of the conductive bracket 5 is electrically connected to the sensing chip 2, and the other end of the conductive bracket 5 is electrically connected to the first conductive member 32. That is, the conductive bracket 5 serves as a connection medium between the sensing chip 2 and the first conductive member 32. In this way, the number of structural layers is increased, which can isolate the heat conducted from the circuit board to the signal acquisition chip 3 and then to the sensing chip 2, reduce the heating of the sensing chip 2, reduce the signal fluctuation of the sensing chip 2, and improve the detection performance of the infrared sensor 100.

[0053] The present invention also proposes a detection component, which includes a circuit board; and / or an infrared sensor 100. The specific structure of the infrared sensor 100 refers to the above embodiment. Since this detection component adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought by the technical solutions of the above embodiments, which will not be repeated here.

[0054] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. All equivalent structural transformations made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or direct / indirect application in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. An infrared sensor, characterized in that: include: A heat-insulating shell having a cavity and a connecting hole communicating with the cavity; A sensing chip, disposed in the heat-insulating housing, configured to output a sensing signal when sensing an infrared signal; The signal acquisition chip includes a chip body, a first conductive member, and a second conductive member. The chip body is arranged in the cavity, the first conductive member is arranged in the chip body and electrically connected to the sensing chip, and the second conductive member is arranged in the chip body and extends from the connection hole for electrical connection to the circuit board; the chip body is used to collect the sensing signal output by the sensing chip and forward the collected sensing signal to the circuit board.

2. The infrared sensor according to claim 1, wherein The heat-insulating outer shell includes a heat-insulating bottom plate and a shell body connected with the heat-insulating bottom plate to enclose the cavity, and the heat-insulating bottom plate is provided with the connecting hole.

3. The infrared sensor according to claim 2, wherein: The heat-insulating bottom plate is provided with a limiting groove, the bottom of the chip body is arranged in the limiting groove, the top of the chip body extends out of the limiting groove, and the first conductive member and the second conductive member are respectively arranged on the top of the chip body.

4. The infrared sensor according to claim 2, wherein: A fixing portion extends outward from the shell body, and the fixing portion is fixedly attached to the heat insulation bottom plate at one side facing the heat insulation bottom plate.

5. The infrared sensor according to claim 1, wherein The second conductive part includes a first electrical connection part and a second electrical connection part. The first electrical connection part is arranged on the chip body, one end of the second electrical connection part is connected to the first electrical connection part, and the other end of the second electrical connection part extends out from the connection hole and bends and extends toward the width direction of the chip body.

6. The infrared sensor according to claim 1, wherein There are a plurality of second conductive members, which are spaced apart along the length direction of the chip body; there are a plurality of connection holes, which extend one-to-one from the connection holes.

7. The infrared sensor according to claim 1, wherein: The signal acquisition chip is a SOP8 chip; And / or, the first conductive member is a pad; And / or, the second conductive member is a pin.

8. The infrared sensor according to claim 1, wherein The infrared sensor further comprises a filter element, which is arranged in the heat-insulating housing and faces the sensing chip, and is used for filtering light except infrared light.

9. The infrared sensor according to claim 1, wherein: The infrared sensor further includes a conductive bracket, which is disposed in the cavity and electrically connects the sensing chip and the first conductive member.

10. A detection component, characterized in that: comprising a circuit board; and / or, an infrared sensor according to any one of claims 1 to 9.

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