Heatable wafer detection device

Abstract

The utility model relates to a heatable wafer detection device, the wafer detection device comprises a sample rack, a mounting seat and a heating mechanism, the sample rack is used for setting a to-be-detected sample; the mounting seat is used for mounting the sample holder; the heating mechanism comprises a heating assembly and a heat conduction pipe, the heating assembly is used for generating heat flow and conveying the heat flow to the heat conduction pipe, and the heat conduction pipe is located on the side, away from the mounting base, of the sample holder so as to heat the to-be-detected sample. The wafer detection device is provided with a heating mechanism so as to heat the to-be-detected sample from the side, away from the sample rack, of the to-be-detected sample.

Description

Technical Field

[0001] The present application relates to the field of wafer detection technology, and in particular to a heatable wafer detection device. Background Art

[0002] Some wafers need to be tested for their performance in a high-temperature environment. Commonly, the metal sample stage is heated to increase the temperature of the metal sample stage. The metal sample stage transfers heat to the wafer and increases the temperature of the wafer, thereby providing a high-temperature environment for wafer testing.

[0003] With the continuous advancement of wafer technology, customer testing requirements are becoming increasingly diverse. When customers need to place a light source below the sample stage, a metal sample stage cannot achieve light transmission, so a glass sample stage is required. However, glass has poor thermal uniformity. Directly heating the glass sample stage will result in uneven temperature distribution on the surface of the glass sample stage, making it difficult to achieve the required specific temperature through heat transfer when the wafer is placed on the glass sample stage. Utility Model Content

[0004] In view of this, the present application provides a heatable wafer detection device, wherein the wafer detection device is provided with a heating mechanism to heat the sample to be detected from the side of the sample to be detected away from the sample holder.

[0005] The present application provides a heatable wafer detection device, which includes: a sample rack, a mounting seat and a heating mechanism, wherein the sample rack is used to place a sample to be detected; the mounting seat is used to install the sample rack; the heating mechanism includes a heating component and a heat pipe, the heating component is used to generate a heat flow and transport the heat flow to the heat pipe, and the heat pipe is located on the side of the sample rack away from the mounting seat to heat the sample to be detected.

[0006] Furthermore, the wafer detection device also includes a microscope assembly and a temperature sensor. The microscope assembly, the temperature sensor and the heat pipe are arranged on the same side of the sample holder, and the temperature sensor is arranged adjacent to the microscope assembly. The microscope assembly is used to observe the sample to be detected, and the temperature sensor is used to detect the temperature of the sample to be detected.

[0007] Furthermore, the wafer detection device also includes a movable frame and a first movable component, the movable frame and the sample frame are arranged on the same side of the mounting seat, the movable frame is used to install the heat pipe, the microscope assembly and the temperature sensor, and the first movable component is arranged between the mounting seat and the movable frame so that the movable frame can move relative to the mounting seat along a first direction; the first movable component includes a first track member and a second track member, the first track member is arranged on the mounting seat and extends along the first direction, the second track member is arranged on the movable frame and can be slidably connected to the first track member along the first direction to drive the heat pipe and the microscope assembly to move relative to the mounting seat along the first direction, so that one of the heat pipe and the microscope assembly moves to above the sample to be detected.

[0008] Furthermore, the movable frame includes a movable part, a connecting part and a mounting part connected in sequence, and the second track member is provided on the side of the movable part facing the mounting seat; the mounting part includes a first mounting component and a second mounting component arranged at intervals, and the first mounting component and the second mounting component are respectively arranged on the side of the connecting part away from the movable part, the first mounting component is used to install the heat pipe, and the second mounting component is used to install the microscope component; the wafer detection device also includes a second movable component, and the second movable component includes a third track member and a fourth track member, the third track member is arranged on the connecting part and extends along the second direction, and the fourth track member is connected to the first mounting component and can be slidably connected to the third track member along the second direction. , to drive the heat pipe to move relative to the mounting seat along the second direction, so as to adjust the distance between the heat pipe and the sample to be detected in the second direction; and the wafer detection device also includes a third moving component, the third moving component includes a fifth track member and a sixth track member, the fifth track member is arranged on the connecting portion and extends along the second direction, the fifth track member and the third track member are spaced apart along the first direction, the sixth track member is connected to the second mounting component and can be slidably connected to the fifth track member along the second direction, so as to drive the microscope assembly to move relative to the mounting seat along the second direction, so as to adjust the distance between the microscope assembly and the sample to be detected in the second direction; wherein, the second direction intersects with the first direction.

[0009] Furthermore, the wafer detection device also includes a first sliding component, which is arranged between the first mounting component and the fourth rail member to adjust the distance between the first mounting component and the fourth rail member along the third direction; the first sliding component includes a first sliding member and a second sliding member, the first sliding member is arranged on the fourth rail member and extends along the third direction, the second sliding member is arranged on the first mounting component and is slidably connected to the first sliding member along the third direction; the wafer detection device also includes a second sliding component, which is arranged between the second mounting component and the sixth rail member to adjust the distance between the second mounting component and the sixth rail member along the third direction; the second sliding component includes a third sliding member and a fourth sliding member, the third sliding member is arranged on the sixth rail member and extends along the third direction, the fourth sliding member is arranged on the second mounting component and is slidably connected to the third sliding member along the third direction; wherein, the third direction intersects with the first direction and the second direction in pairs respectively.

[0010] Further, the first mounting assembly includes a first mounting member, a second mounting member and a third mounting member, one end of the first mounting member is used to mount the heat pipe, the end of the first mounting member facing away from the heat pipe is sleeved on the outer circumference of the second mounting member, the second mounting member extends along the second direction, the position of the first mounting member in the second direction is adjustable compared to the second mounting member, one end of the third mounting member is connected to the second mounting member, and the end of the third mounting member facing away from the second mounting member can be slidably connected to the fourth track member along the third direction; the second mounting assembly includes a fourth mounting member, a fifth mounting member and a sixth mounting member, one end of the fourth mounting member is used to mount the microscope assembly, the end of the fourth mounting member facing away from the microscope assembly is sleeved on the outer circumference of the fifth mounting member, the fifth mounting member extends along the second direction, the position of the fourth mounting member in the second direction is adjustable compared to the fifth mounting member, one end of the sixth mounting member is connected to the fifth mounting member, and the end of the sixth mounting member facing away from the fifth mounting member can be slidably connected to the sixth track member along the third direction.

[0011] Furthermore, the wafer detection device also includes a third sliding assembly and a fourth sliding assembly; the moving part includes a first moving sub-part, a second moving sub-part and a third moving sub-part arranged in sequence along the second direction, and the second track part is provided on the side of the first moving sub-part away from the second moving sub-part, and the third sliding assembly is arranged between the first moving sub-part and the second moving sub-part and extends along the third direction, and is used to guide the second moving sub-part and the third moving sub-part to move relative to the first moving sub-part along the third direction; the fourth sliding assembly is arranged between the second moving sub-part and the third moving sub-part and extends along the first direction, and the end of the third moving sub-part away from the second moving sub-part is connected to the connecting part, and the fourth sliding assembly is used to guide the third moving sub-part and the connecting part to move relative to the second moving sub-part along the first direction.

[0012] Furthermore, the third sliding assembly includes a fifth sliding member and a sixth sliding member, the fifth sliding member is arranged on a side of the first moving sub-section facing the second moving sub-section and extends along the third direction, the sixth sliding member is arranged on a side of the second moving sub-section facing the first moving sub-section and can slide relative to the fifth sliding member along the third direction; the fourth sliding assembly includes a seventh sliding member and an eighth sliding member, the seventh sliding member is arranged on a side of the second moving sub-section facing the third moving sub-section and extends along the first direction, the eighth sliding member is arranged on a side of the third moving sub-section facing the second moving sub-section and can slide relative to the seventh sliding member along the first direction.

[0013] Furthermore, the sample rack includes a first sub-rack, a second sub-rack and a connecting rack, the first sub-rack and the second sub-rack are arranged at intervals, and the first sub-rack is arranged closer to the heat pipe than the second sub-rack; the connecting rack is arranged between the first sub-rack and the second sub-rack and connects the first sub-rack and the second sub-rack respectively, and the first sub-rack, the connecting rack and the second sub-rack form a setting space; the first sub-rack has a light-transmitting portion, and the light-transmitting portion is used to set the sample to be tested. The wafer detection device also includes a backlight assembly, and the backlight assembly is located in the setting space and is arranged corresponding to the light-transmitting portion.

[0014] Furthermore, the wafer detection device also includes a probe assembly and a moving mechanism. The probe assembly and the sample rack are arranged on the mounting base at intervals, and the probe assembly is used to detect the sample to be detected; the moving mechanism is arranged on the side of the sample rack away from the probe assembly and is connected to the sample rack to adjust the relative position of the sample rack and the probe assembly.

[0015] In the present application, the heating mechanism is arranged adjacent to the mounting seat, and the heating component of the heating mechanism heats the air flow inside the heating component to generate a heat flow, and further transmits the heat flow to the heat pipe. The heat pipe is located on the side of the sample holder away from the mounting seat. When the sample to be detected is set on the sample holder, the heat flow emitted by the heat pipe heats the sample to be detected to quickly increase the temperature of the sample to be detected, providing high temperature conditions for the detection of the sample to be detected. When the sample to be detected needs to be tested for its high temperature performance under the condition of a light source, the component providing the light source and the heat pipe can be arranged on opposite sides of the sample holder to take into account the test conditions of the sample to be detected. The wafer detection device of the present application provides a new heating method for the sample to be detected, so that other test conditions of the sample to be detected can be taken into account, thereby improving the detection performance of the wafer detection device on the sample to be detected. In addition, the heating mechanism has a high heating efficiency for the sample to be detected, which facilitates the rapid heating of the sample to be detected and improves the efficiency of the wafer detection device in detecting the sample to be detected. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the implementation. Obviously, the drawings described below are some implementation methods of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0017] Figure 1 This is a schematic structural diagram of a wafer inspection device according to an embodiment of the present application;

[0018] Figure 2 A schematic diagram of a partially exploded structure of a wafer inspection device according to the first embodiment of the present application;

[0019] Figure 3 A schematic diagram of a partially exploded structure of a wafer inspection device according to a second embodiment of the present application;

[0020] Figure 4 A schematic diagram of a partially exploded structure of a wafer inspection device according to a third embodiment of the present application;

[0021] Figure 5 A schematic diagram of a partially exploded structure of a wafer inspection device according to a fourth embodiment of the present application;

[0022] Figure 6 for Figure 4 A magnified image of the dotted box in center A;

[0023] Figure 7 This is a partial structural diagram of a wafer inspection device according to the first embodiment of the present application;

[0024] Figure 8 A schematic diagram of a portion of the structure of a wafer inspection device according to a second embodiment of the present application;

[0025] Figure 9 This is a schematic diagram of a partial exploded structure of a wafer inspection device according to the fifth embodiment of the present application.

[0026] Description of reference numerals:

[0027] 100-wafer detection device, 110-sample rack, 111-first sub-rack, 112-second sub-rack, 113-connecting rack, 114-setting space, 115-light-transmitting portion, 120-mounting seat, 130-heating mechanism, 131-heating component, 132-heat pipe, 140-microscope component, 150-temperature sensor, 160-movable rack, 161-moving portion, 1611-first moving sub-unit, 1612-second Moving sub-unit, 1613-third moving sub-unit, 162-connecting part, 163-mounting part, 164-first mounting assembly, 1641-first mounting member, 1642-second mounting member, 1643-third mounting member, 165-second mounting assembly, 1651-fourth mounting member, 1652-fifth mounting member, 1653-sixth mounting member, 1654-seventh mounting member, 170-first moving assembly, 171-first track Parts, 172-second track member, 180-second moving assembly, 181-third track member, 182-fourth track member, 190-third moving assembly, 191-fifth track member, 192-sixth track member, 210-first sliding assembly, 211-first sliding member, 212-second sliding member, 213-first rolling member, 220-second sliding assembly, 221-third sliding member, 222-fourth sliding member, 223-second rolling member, 230-third sliding assembly, 231-fifth sliding member, 232-sixth sliding member, 240-fourth sliding assembly, 241-seventh sliding member, 242-eighth sliding member, 250-backlight assembly, 260-probe assembly, 270-moving mechanism, 280-first driving assembly, 281-first cylinder, 282-first piston, 290-second driving assembly, 291-second cylinder, 292-second piston. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0029] The terms "first," "second," and the like in the specification and claims of this application and the accompanying drawings are used to distinguish between different objects, not to describe a particular order. Furthermore, the terms "including," "having," and any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or apparatus comprising a series of steps or elements is not limited to the listed steps or elements but may optionally include steps or elements not listed, or may optionally include other steps or elements inherent to the process, method, product, or apparatus.

[0030] References herein to "embodiments" or "implementations" mean that a particular feature, structure, or characteristic described in connection with the embodiments or implementations may be included in at least one embodiment of the present application. The appearance of such phrases in various places in the specification does not necessarily refer to the same embodiment, nor do they constitute independent or alternative embodiments that are mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0031] Some wafers need to be tested for their performance in a high-temperature environment. Commonly, the metal sample stage is heated to increase the temperature of the metal sample stage. The metal sample stage transfers heat to the wafer and increases the temperature of the wafer, thereby providing a high-temperature environment for wafer testing.

[0032] With the continuous advancement of wafer technology, customer testing requirements are becoming increasingly diverse. When customers need to place a light source below the sample stage, a metal sample stage cannot achieve light transmission, so a glass sample stage is required. However, glass has poor thermal uniformity. Directly heating the glass sample stage will result in uneven temperature distribution on the surface of the glass sample stage, making it difficult to achieve the required specific temperature through heat transfer when the wafer is placed on the glass sample stage.

[0033] See Figure 1 An embodiment of the present application provides a heatable wafer detection device 100, which includes: a sample rack 110, a mounting seat 120 and a heating mechanism 130. The sample rack 110 is used to set the sample to be detected; the mounting seat 120 is used to install the sample rack 110; the heating mechanism 130 includes a heating component 131 and a heat pipe 132. The heating component 131 is used to generate heat flow and transport the heat flow to the heat pipe 132. The heat pipe 132 is located on the side of the sample rack 110 away from the mounting seat 120 to heat the sample to be detected.

[0034] In this embodiment, the heating mechanism 130 is arranged adjacent to the mounting seat 120, and the heating component 131 of the heating mechanism 130 heats the air inside the heating component 131 to generate a heat flow, and further transmits the heat flow to the heat pipe 132. The heat pipe 132 is located on the side of the sample holder 110 away from the mounting seat 120. When the sample to be detected is set on the sample holder 110, the heat flow emitted by the heat pipe 132 heats the sample to be detected to quickly increase the temperature of the sample to be detected, providing high temperature conditions for the detection of the sample to be detected. When the sample to be detected needs to be tested for its high temperature performance under the condition of a light source, the component providing the light source and the heat pipe 132 can be arranged on opposite sides of the sample holder 110 to take into account the test conditions of the sample to be detected. The wafer detection device 100 of this embodiment provides a new heating method for the sample to be detected, so that other test conditions of the sample to be detected can be taken into account, thereby improving the detection performance of the wafer detection device 100 on the sample to be detected. In addition, the heating mechanism 130 has high heating efficiency for the sample to be detected, which facilitates rapid temperature increase of the sample to be detected and improves the efficiency of the wafer detection device 100 in detecting the sample to be detected.

[0035] Optionally, in some embodiments, the heating mechanism 130 is a high-temperature impingement airflow meter.

[0036] Optionally, the heating temperature range of the heating mechanism 130 is 20° C. to 225° C., and the heating rate of the heating mechanism 130 is 8° C. / s to 11° C. / s.

[0037] Optionally, the sample to be tested is a wafer, a circuit board, etc.

[0038] See Figure 2 In some embodiments, the sample rack 110 includes a first sub-rack 111, a second sub-rack 112 and a connecting rack 113. The first sub-rack 111 and the second sub-rack 112 are spaced apart, and the first sub-rack 111 is closer to the heat pipe 132 than the second sub-rack 112. The connecting rack 113 is arranged between the first sub-rack 111 and the second sub-rack 112 and connects the first sub-rack 111 and the second sub-rack 112 respectively. The first sub-rack 111, the connecting rack 113 and the second sub-rack 112 form a setting space 114. The first sub-rack 111 has a light-transmitting portion 115, and the light-transmitting portion 115 is used to set the sample to be tested. The wafer inspection device 100 also includes a backlight assembly 250. The backlight assembly 250 is located in the setting space 114 and is arranged corresponding to the light-transmitting portion 115.

[0039] In this embodiment, the wafer inspection device 100 includes a backlight assembly 250. When the backlight assembly 250 is positioned adjacent to the sample to be inspected, the backlight assembly 250 can provide light for the sample to be inspected, so that the wafer inspection device 100 can inspect the performance of the wafer to be inspected under the light source. The sample rack 110 is a double-layer structure. Along the arrangement direction of the heat pipe 132 and the sample rack 110, the opposite ends of the connecting frame 113 are respectively connected to the first sub-rack 111 and the second sub-rack 112. The setting space 114 enclosed by the first sub-rack 111, the connecting frame 113 and the second sub-rack 112 is used to set the backlight assembly 250, and the light-transmitting portion 115 of the first sub-rack 111 is used to set the sample to be inspected. The backlight assembly 250 is arranged corresponding to the light-transmitting portion 115 to provide light for the sample to be inspected. In this embodiment, the light-transmitting portion 115 can, on the one hand, ensure that the light source emitted by the backlight assembly 250 passes through and illuminates the sample to be detected, and on the other hand, can provide support for the sample to be detected to prevent the sample to be detected from collapsing due to gravity during the detection process, thereby affecting the contact between the probe assembly 260 and the sample to be detected, thereby improving the detection performance of the wafer detection device 100 for detecting the sample to be detected. Furthermore, in this embodiment, the backlight assembly 250 and the heat pipe 132 are arranged on opposite sides of the first sub-frame 111, solving the problem of poor thermal conductivity of the light-transmitting portion 115 and difficulty in heat transfer, so that the wafer detection device 100 can take into account the test conditions of high temperature of the sample to be detected and the setting of the light source, thereby improving the detection performance of the wafer detection device 100.

[0040] Optionally, the light-transmitting portion 115 is a light-transmitting glass member.

[0041] See Figure 3 In some embodiments, the wafer inspection device 100 further includes a probe assembly 260 and a moving mechanism 270. The probe assembly 260 and the sample holder 110 are spaced apart on the mounting base 120, and the probe assembly 260 is used to inspect the sample to be inspected; the moving mechanism 270 is disposed on a side of the sample holder 110 away from the probe assembly 260 and is connected to the sample holder 110 to adjust the relative position of the sample holder 110 and the probe assembly 260.

[0042] In this embodiment, the probe assembly 260 is spaced apart from the sample holder 110 on the mounting base 120. When the sample to be tested is placed on the first sub-rack 111 of the sample holder 110, the probe assembly 260 is placed adjacent to the sample holder 110 and the tip of the probe assembly 260 contacts the sample to be tested to test the sample to be tested. The movable structure is disposed on a side of the sample holder 110 away from the probe assembly 260 and is connected to the sample holder 110. The movable mechanism 270 can drive the sample holder 110 to move horizontally and vertically to adjust the relative positions of the sample holder 110 and the probe assembly 260, thereby ensuring that the probe assembly 260 contacts the sample holder 110. This prevents the tip of the probe assembly 260 from failing to contact the sample to be tested or from piercing the sample to be tested, thereby improving the detection performance of the wafer inspection device 100.

[0043] In some embodiments, the wafer inspection device 100 further includes a microscope assembly 140 and a temperature sensor 150. The microscope assembly 140, the temperature sensor 150 and the heat pipe 132 are spaced apart on the same side of the sample holder 110, and the temperature sensor 150 is arranged adjacent to the microscope assembly 140. The microscope assembly 140 is used to observe the sample to be inspected, and the temperature sensor 150 is used to detect the temperature of the sample to be inspected.

[0044] In this embodiment, the microscope assembly 140, the temperature sensor 150, and the heat pipe 132 are spaced apart and arranged on the same side of the sample holder 110. When the sample to be tested is placed on the sample holder 110, the heat pipe 132 is first moved above the sample holder 110 so that the heat flux emitted by the heat pipe 132 heats the sample to be tested and raises the temperature of the sample to be tested to a first temperature greater than the detection temperature of the sample to be tested. Furthermore, when the microscope assembly 140 is moved above the sample to be tested, if the temperature of the sample to be tested drops during this process, the temperature sensor 150 is positioned adjacent to the microscope assembly 140 and can detect the temperature of the sample to be tested. When it is detected that the first temperature of the sample to be tested has dropped to the detection temperature of the sample to be tested, the user can observe the sample to be tested through the microscope assembly 140 to observe the contact between the tip of the probe assembly 260 and the sample to be tested, thereby achieving detection of the sample to be tested.

[0045] In some embodiments, the wafer inspection device 100 further includes a moving frame 160 and a first moving assembly 170. The moving frame 160 and the sample holder 110 are disposed on the same side of the mounting base 120. The moving frame 160 is used to mount the heat pipe 132, the microscope assembly 140, and the temperature sensor 150. The first moving assembly 170 is disposed between the mounting base 120 and the moving frame 160 so that the moving frame 160 can move relative to the mounting base 120 along a first direction (e.g., Figure 3 The first movable assembly 170 includes a first track member 171 and a second track member 172, wherein the first track member 171 is disposed on the mounting base 120 and extends along the first direction, and the second track member 172 is disposed on the movable frame 160 and can be slidably connected to the first track member 171 along the first direction to drive the heat pipe 132 and the microscope assembly 140 to move relative to the mounting base 120 along the first direction, so that one of the heat pipe 132 and the microscope assembly 140 moves to above the sample to be detected.

[0046] It can be understood that both the first track member 171 and the second track member 172 extend along the first direction.

[0047] It can be understood that the first direction is the direction in which the heat pipe 132 and the microscope assembly 140 are arranged in sequence.

[0048] In this embodiment, the movable frame 160 is used to install the heat pipe 132, the microscope assembly 140 and the temperature sensor 150, and the first movable assembly 170 is provided between the movable frame 160 and the mounting seat 120. The first movable assembly 170 is used to realize the relative sliding of the movable frame 160 and the mounting seat 120 in the first direction, and then realize the adjustment of the relative position of the movable frame 160 and the mounting seat 120 in the first direction. When the relative positions of the heat pipe 132 and the microscope assembly 140 and the movable frame 160 are fixed, After being determined, by changing the relative positions of the movable frame 160 and the mounting seat 120 in the first direction, the relative positions of the heat pipe 132 and the mounting seat 120 in the first direction, and the relative positions of the microscope assembly 140 and the mounting seat 120 in the first direction are changed, so that one of the heat pipe 132 and the microscope assembly 140 is moved above the sample to be detected, so that the heat pipe 132 heats the sample to be detected, or the microscope assembly 140 is located above the sample to be detected for the convenience of observation by the user. Specifically, the first moving assembly 170 includes a first track member 171 and a second track member 172. The first track member 171 is disposed on a side of the mounting base 120 facing the movable frame 160 and extends along a first direction. The second track member 172 is disposed on a side of the movable frame 160 facing the mounting base 120 and is slidably connected to the first track member 171 along the first direction. When the second track member 172 moves relative to the first track member 171, it drives the movable frame 160 to move along the first direction, thereby driving the heat pipe 132 and the microscope assembly 140 to move along the first direction relative to the mounting base 120. The first track member 171 and the second track member 172 provide guidance for the movement of the movable frame 160 relative to the mounting base 120 in the first direction and reduce the movement resistance of the movable frame 160 relative to the mounting base 120, thereby facilitating the movement of one of the heat pipe 132 and the microscope assembly 140 above the sample to be inspected, thereby improving the performance of the wafer inspection apparatus 100.

[0049] See Figure 4 and Figure 5In some embodiments, the movable frame 160 includes a movable portion 161, a connecting portion 162, and a mounting portion 163 connected in sequence, and the movable portion 161 is provided with a second track member 172 on a side facing the mounting seat 120; the mounting portion 163 includes a first mounting component 164 and a second mounting component 165 arranged at intervals, and the first mounting component 164 and the second mounting component 165 are respectively arranged on a side of the connecting portion 162 away from the movable portion 161, the first mounting component 164 is used to install the heat pipe 132, and the second mounting component 165 is used to install the microscope assembly 140; the wafer inspection device 100 also includes a second movable component 180, and the second movable component 180 includes a third track member 181 and a fourth track member 182, and the third track member 181 is arranged on the connecting portion 162 and along the second direction (such as Figure 4 The fourth track member 182 is connected to the first mounting assembly 164 and can be slidably connected to the third track member 181 along the second direction to drive the heat pipe 132 to move relative to the mounting base 120 along the second direction to adjust the distance between the heat pipe 132 and the sample to be tested in the second direction; wherein the second direction intersects with the first direction.

[0050] It can be understood that the third rail member 181 and the fourth rail member 182 both extend along the second direction.

[0051] Optionally, in some embodiments, the first direction is perpendicular to the second direction.

[0052] Optionally, the second direction is a direction in which the sample holder 110 and the heat pipe 132 are arranged in sequence.

[0053] In this embodiment, the moving part 161, the connecting part 162 and the mounting part 163 are connected in sequence, and the second track member 172 is provided on the side of the moving part 161 facing the mounting seat 120, the connecting part 162 is used to connect the moving part 161 and the mounting part 163, the first mounting component 164 of the mounting part 163 is used to install the heat pipe 132, and the second mounting component 165 of the mounting part 163 is used to install the microscope assembly 140. When the second track member 172 of the moving part 161 slides along the first direction to connect to the first track member 171, it drives the connecting part 162, the first mounting component 164 and the second mounting component 165 to move relative to the mounting seat 120 along the first direction, thereby causing the first heat pipe 132 and the microscope assembly 140 to move relative to the mounting seat 120 along the first direction, so as to facilitate moving one of the heat pipe 132 and the microscope assembly 140 to be above the sample to be inspected, thereby improving the performance of the wafer inspection device 100. In this embodiment, the first mounting assembly 164 and the second mounting assembly 165 are independently arranged to facilitate independent adjustment of the relative position of the heat pipe 132 and the mounting base 120, and the relative position of the microscope assembly 140 and the mounting base 120, so as to enhance the flexibility of the wafer detection device 100.

[0054] Furthermore, in this embodiment, the second moving assembly 180 includes a third track member 181 and a fourth track member 182. The third track member 181 is disposed on a side of the connecting portion 162 facing the first mounting assembly 164 and extends along the second direction. The fourth track member 182 is disposed on a side of the first mounting assembly 164 facing the connecting portion 162 and is slidably connected to the third track member 181 along the second direction. Specifically, when the third track member 181 moves relative to the fourth track member 182 in a direction away from the sample to be tested, the distance between the heat pipe 132 and the sample to be tested in the second direction increases; when the third track member 181 moves relative to the fourth track member 182 in a direction toward the sample to be tested, the distance between the heat pipe 132 and the sample to be tested in the second direction decreases, thereby facilitating a user's control over the heating efficiency of the heat pipe 132 on the sample to be tested.

[0055] Optionally, the wafer detection device 100 also includes a first drive component 280, which includes a first cylinder 281 and a first piston 282. The first cylinder 281 is fixedly arranged on the surface of the connecting portion 162 facing the first mounting component 164, and the surface of the first cylinder 281 away from the connecting portion 162 is provided with the third track member 181. The first piston 282 is partially arranged in the first cylinder 281 and can be moved relative to the first cylinder 281 along the second direction. The first piston 282 is partially protruded from the first cylinder 281 and the side of the first piston 282 away from the first cylinder 281 supports the end of the first mounting component 164 close to the connecting portion 162.

[0056] It can be understood that along the arrangement direction of the moving part 161, the connecting part 162 and the mounting part 163, the connecting part 162, the first cylinder 281, the third rail member 181, the fourth rail member 182 and the first mounting assembly 164 are arranged in sequence.

[0057] In this embodiment, when the first piston 282 moves relative to the first cylinder 281 along the second direction toward away from the sample to be detected, the side of the first piston 282 away from the first cylinder 281 supports the end of the first mounting component 164 close to the connecting portion 162 to drive the first mounting component 164 to move along the second direction toward away from the sample to be detected. During this process, the fourth track member 182 on the first mounting component 164 slides along the second direction relative to the third track member 181 on the first cylinder 281 toward away from the sample to be detected, so as to provide guidance for the relative sliding of the first mounting component 164 and the connecting portion 162, thereby improving the performance of the wafer detection device 100. Accordingly, when the first piston 282 moves relative to the first cylinder 281 in the second direction toward the sample to be tested, the first mounting assembly 164 is driven to move in the second direction toward the sample to be tested. During this process, the fourth track member 182 on the first mounting assembly 164 slides in the second direction relative to the third track member 181 on the first cylinder 281 toward the sample to be tested. In this embodiment, the first driving assembly 280 provides a stable driving force for the first mounting assembly 164 to move in the second direction relative to the connecting portion 162, thereby improving the stability of the movement of the first mounting assembly 164 relative to the connecting portion 162.

[0058] Optionally, the first driving assembly 280 further includes a first solenoid valve (not shown) to control air intake and exhaust of the first cylinder 281 , thereby controlling the movement direction of the first piston 282 relative to the first cylinder 281 .

[0059] In some embodiments, the wafer inspection device 100 also includes a third moving component 190, the third moving component 190 includes a fifth rail component 191 and a sixth rail component 192, the fifth rail component 191 is arranged on the connecting portion 162 and extends along the second direction, the fifth rail component 191 and the third rail component 181 are spaced apart along the first direction, the sixth rail component 192 is connected to the second mounting component 165 and can be slidably connected to the fifth rail component 191 along the second direction to drive the microscope component 140 to move relative to the mounting base 120 along the second direction to adjust the distance between the microscope component 140 and the sample to be inspected in the second direction.

[0060] It can be understood that the fifth rail member 191 and the sixth rail member 192 both extend along the second direction.

[0061] In this embodiment, the third moving assembly 190 includes a fifth rail member 191 and a sixth rail member 192. The fifth rail member 191 is disposed on a side of the connecting portion 162 facing the second mounting assembly 165 and extends along the second direction. The sixth rail member 192 is disposed on a side of the second mounting assembly 165 facing the connecting portion 162 and is slidably connected to the fifth rail member 191 along the second direction. Specifically, when the fifth rail member 191 moves relative to the sixth rail member 192 in a direction away from the sample to be inspected, the distance between the microscope assembly 140 and the sample to be inspected in the second direction increases. When the fifth rail member 191 moves relative to the sixth rail member 192 in a direction toward the sample to be inspected, the distance between the microscope assembly 140 and the sample to be inspected in the second direction decreases, thereby facilitating observation of the sample to be inspected by the microscope assembly 140.

[0062] Optionally, the wafer detection device 100 also includes a second drive assembly 290, the second drive assembly 290 includes a second cylinder 291 and a second piston 292, the second cylinder 291 is fixedly arranged on the surface of the connecting portion 162 facing the second mounting assembly 165, the surface of the second cylinder 291 away from the connecting portion 162 is provided with the fifth rail member 191, the second piston 292 is partially arranged in the second cylinder 291 and can be moved relative to the second cylinder 291 along the second direction, the second piston 292 is partially protruded from the second cylinder 291 and the side of the second piston 292 away from the second cylinder 291 supports the end of the second mounting assembly 165 close to the connecting portion 162.

[0063] It can be understood that along the arrangement direction of the moving part 161, the connecting part 162 and the mounting part 163, the connecting part 162, the second cylinder 291, the fifth rail member 191, the sixth rail member 192 and the second mounting assembly 165 are arranged in sequence.

[0064] In this embodiment, when the second piston 292 moves relative to the second cylinder 291 along the second direction toward away from the sample to be detected, the side of the second piston 292 away from the second cylinder 291 supports the end of the second mounting assembly 165 close to the connecting portion 162 to drive the second mounting assembly 165 to move along the second direction toward away from the sample to be detected. During this process, the sixth track member 192 on the second mounting assembly 165 slides relative to the fifth track member 191 on the second cylinder 291 along the second direction toward away from the sample to be detected, so as to provide guidance for the relative sliding of the second mounting assembly 165 and the connecting portion 162, thereby improving the performance of the wafer detection device 100. Accordingly, when the second piston 292 moves relative to the second cylinder 291 in the second direction toward the sample to be tested, the second mounting assembly 165 is driven to move in the second direction toward the sample to be tested. During this process, the sixth track member 192 on the second mounting assembly 165 slides in the second direction relative to the fifth track member 191 on the second cylinder 291 toward the sample to be tested. In this embodiment, the second drive assembly 290 provides a stable driving force for the second mounting assembly 165 to move in the second direction relative to the connecting portion 162, thereby improving the stability of the movement of the second mounting assembly 165 relative to the connecting portion 162.

[0065] Optionally, the second driving assembly 290 further includes a second solenoid valve (not shown) to control the air intake and exhaust of the second cylinder 291 , thereby controlling the movement direction of the second piston 292 relative to the second cylinder 291 .

[0066] See Figure 6 In some embodiments, the wafer inspection device 100 further includes a first sliding assembly 210, which is disposed between the first mounting assembly 164 and the fourth rail member 182 to adjust the first mounting assembly 164 and the fourth rail member 182 along a third direction (such as Figure 6 The wafer inspection device 100 further includes a second sliding assembly 220, which is disposed between the second mounting assembly 165 and the sixth rail member 192 to adjust the distance between the second mounting assembly 165 and the sixth rail member 192 along a third direction; wherein the third direction intersects with the first direction and the second direction in pairs.

[0067] It can be understood that the third direction is the arrangement direction of the heat pipe 132 and the sample rack 110 .

[0068] Optionally, in some embodiments, the first direction, the second direction and the third direction are perpendicular to each other.

[0069] In this embodiment, the first sliding assembly 210 is disposed between the first mounting assembly 164 and the fourth track member 182 to adjust the distance between the first mounting assembly 164 and the fourth track member 182 along the third direction, thereby adjusting the relative position of the heat pipe 132 and the mounting base 120 in the third direction. The second sliding assembly 220 is disposed between the second mounting assembly 165 and the sixth track member 192 to adjust the distance between the second mounting assembly 165 and the sixth track member 192 along the third direction, thereby adjusting the relative position of the microscope assembly 140 and the mounting base 120 in the third direction. The first sliding assembly 210 and the second sliding assembly 220 are independently disposed and cooperate with each other, facilitating the user to adjust the relative position of the heat pipe 132 and the mounting base 120 in the third direction, as well as the relative position of the microscope assembly 140 and the mounting base 120 in the third direction, so that the center of the heat pipe 132 and the center of the microscope assembly 140 are collinear along the third direction. When the user pushes the movable frame 160 so that it slides along the first direction to connect with the mounting base 120, the heat pipe 132 and the microscope assembly 140 can be quickly moved to above the inspection area of the sample to be inspected, which is beneficial to improving the inspection efficiency of the wafer inspection apparatus 100 for the sample to be inspected. If the center of the heat pipe 132 and the center of the microscope assembly 140 are not aligned in a straight line along the third direction, then after the heat pipe 132 heats the inspection area of the sample to be inspected, the user pushes the movable frame 160 along the first direction relative to the mounting base 120 to position the microscope assembly 140 above the sample to be inspected. At this time, the microscope assembly 140 is not necessarily aligned with the inspection area of the sample to be inspected, and the position of the microscope assembly 140 and the sample to be inspected needs to be further adjusted. On the one hand, this reduces the efficiency of the inspection of the sample to be inspected, and on the other hand, as time goes by, the temperature of the sample to be inspected drops below the detection temperature, thereby reducing the accuracy of the wafer inspection apparatus 100 in inspecting the sample to be inspected.

[0070] Optionally, the first sliding assembly 210 includes a first sliding member 211 and a second sliding member 212, wherein the first sliding member 211 is disposed on the fourth track member 182 and extends along the third direction, and the second sliding member 212 is disposed on the first mounting assembly 164 and slidably connected to the first sliding member 211 along the third direction;

[0071] In this embodiment, the first sliding member 211 is disposed on a side of the fourth track member 182 facing the first mounting assembly 164 and extends along the third direction. The second sliding member 212 is disposed on a side of the first mounting assembly 164 facing the fourth track member 182 and is slidable along the third direction relative to the first sliding member 211. Specifically, when the second sliding member 212 slides along the third direction relative to the first sliding member 211, it drives the first mounting assembly 164 to move along the third direction relative to the mounting base 120. In other words, it drives the heat pipe 132 to move along the third direction relative to the sample to be tested, so that the heat pipe 132 moves above the to-be-tested area of the sample to be tested, thereby facilitating the heat pipe 132 to heat the sample to be tested.

[0072] Optionally, the first sliding assembly 210 further includes a first rolling member 213, which is located between the first sliding member 211 and the second sliding member 212. The first rolling member 213 can be respectively connected to the first sliding member 211 and the second sliding member 212 in a rolling manner to improve the accuracy of the movement of the second sliding member 212 relative to the first sliding member 211.

[0073] Optionally, the second sliding assembly 220 includes a third sliding member 221 and a fourth sliding member 222, the third sliding member 221 is arranged on the sixth track member 192 and extends along the third direction, and the fourth sliding member 222 is arranged on the second mounting assembly 165 and slidably connected to the third sliding member 221 along the third direction.

[0074] In this embodiment, the third sliding member 221 is provided on a side of the sixth rail member 192 facing the second mounting assembly 165 and extends along the third direction, and the fourth sliding member 222 is provided on a side of the second mounting assembly 165 facing the sixth rail member 192 and can slide along the third direction relative to the third sliding member 221. Specifically, when the fourth sliding member 222 slides along the third direction relative to the third sliding member 221, it will drive the second mounting assembly 165 to move along the third direction relative to the mounting base 120. In other words, it will drive the microscope assembly 140 to move along the third direction relative to the sample to be inspected, so that the microscope assembly 140 moves above the area to be inspected of the sample to be inspected, so that the user can detect and observe the contact between the sample to be inspected and the probe assembly 260 through the microscope assembly 140, which is beneficial to improving the performance of the wafer inspection device 100 in inspecting the sample to be inspected.

[0075] Optionally, the second sliding assembly 220 further includes a second rolling member 223, which is located between the third sliding member 221 and the fourth sliding member 222. The second rolling member 223 can be respectively connected to the third sliding member 221 and the fourth sliding member 222 in a rolling manner to improve the accuracy of the movement of the fourth sliding member 222 relative to the third sliding member 221.

[0076] See Figure 7 In some embodiments, the first mounting assembly 164 includes a first mounting member 1641, a second mounting member 1642, and a third mounting member 1643. One end of the first mounting member 1641 is used to mount the heat pipe 132. The end of the first mounting member 1641 facing away from the heat pipe 132 is sleeved on the outer periphery of the second mounting member 1642. The second mounting member 1642 extends along the second direction. The position of the first mounting member 1641 in the second direction is adjustable compared to the second mounting member 1642. One end of the third mounting member 1643 is connected to the second mounting member 1642. The end of the third mounting member 1643 facing away from the second mounting member 1642 can be slidably connected to the fourth track member 182 along the third direction.

[0077] In this embodiment, one end of the first mounting member 1641 is used to mount the heat pipe 132. The end of the first mounting member 1641 facing away from the heat pipe 132 is sleeved on the outer periphery of the second mounting member 1642. The position of the first mounting member 1641 relative to the second mounting member 1642 in the second direction is adjustable. In other words, the first mounting member 1641 can be moved relative to the second mounting member 1642 to adjust the relative position of the heat pipe 132 and the sample to be tested in the second direction. After the first mounting member 1641 has adjusted the relative position of the second mounting member 1642, the first mounting member 1641 can be fixed to the second mounting member 1642 to secure the heat pipe 132 to the first mounting assembly 164. In addition, the end of the third mounting member 1643 facing away from the second mounting member 1642 can be slidably connected to the fourth track member 182 along the third direction. In other words, the end of the third mounting member 1643 facing away from the second mounting member 1642 is provided with the first sliding member 211, which can achieve relative sliding along the third direction with the second sliding member 212 on the fourth track member 182, thereby adjusting the relative position of the heat pipe 132 and the sample to be tested along the third direction.

[0078] See Figure 8In some embodiments, the second mounting assembly 165 includes a fourth mounting member 1651, a fifth mounting member 1652 and a sixth mounting member 1653, one end of the fourth mounting member 1651 is used to mount the microscope assembly 140, and the end of the fourth mounting member 1651 away from the microscope assembly 140 is sleeved on the outer periphery of the fifth mounting member 1652, and the fifth mounting member 1652 extends along the second direction. The position of the fourth mounting member 1651 in the second direction is adjustable compared to the fifth mounting member 1652, one end of the sixth mounting member 1653 is connected to the fifth mounting member 1652, and the end of the sixth mounting member 1653 away from the fifth mounting member 1652 can be slidably connected to the sixth track member 192 along the third direction.

[0079] In this embodiment, one end of the fourth mounting member 1651 is used to mount the microscope assembly 140, and the end of the fourth mounting member 1651 facing away from the microscope assembly 140 is sleeved on the outer periphery of the fifth mounting member 1652. The position of the fourth mounting member 1651 in the second direction is adjustable relative to the fifth mounting member 1652. In other words, the fourth mounting member 1651 can be moved relative to the fifth mounting member 1652 to adjust the relative position of the microscope assembly 140 and the sample to be inspected in the second direction. After the fourth mounting member 1651 has adjusted the relative position of the fifth mounting member 1652, the fourth mounting member 1651 can be fixed to the fifth mounting member 1652 to secure the microscope assembly 140 to the second mounting assembly 165. In addition, the end of the sixth mounting member 1653 facing away from the fifth mounting member 1652 can be slidably connected to the sixth rail member 192 along the third direction. In other words, the end of the sixth mounting member 1653 facing away from the fifth mounting member 1652 is provided with the third sliding member 221, which can achieve relative sliding along the third direction with the fourth sliding member 222 on the sixth rail member 192, thereby adjusting the relative position of the microscope assembly 140 and the sample to be detected along the third direction.

[0080] Optionally, the second mounting assembly 165 further includes a seventh mounting member 1654 . The seventh mounting member 1654 is fixedly disposed on the fourth mounting member 1651 . The seventh mounting member 1654 is used to mount the temperature sensor 150 .

[0081] In some embodiments, the wafer inspection device 100 further includes a third sliding assembly 230 and a fourth sliding assembly 240; the moving portion 161 includes a first moving sub-portion 1611, a second moving sub-portion 1612, and a third moving sub-portion 1613 arranged in sequence along the second direction, the first moving sub-portion 1611 is provided with a second track member 172 on the side away from the second moving sub-portion 1612, the third sliding assembly 230 is provided between the first moving sub-portion 1611 and the second moving sub-portion 1612 and extends along the third direction for guiding The second movable sub-section 1612 and the third movable sub-section 1613 move along the third direction relative to the first movable sub-section 1611; the fourth sliding component 240 is arranged between the second movable sub-section 1612 and the third movable sub-section 1613 and extends along the first direction, and the end of the third movable sub-section 1613 away from the second movable sub-section 1612 is connected to the connecting part 162, and the fourth sliding component 240 is used to guide the third movable sub-section 1613 and the connecting part 162 to move along the first direction relative to the second movable sub-section 1612.

[0082] See Figure 9 It can be understood that along the second direction, the mounting seat 120, the first moving component 170, the first moving sub-part 1611, the third sliding component 230, the second moving sub-part 1612, the fourth sliding component 240 and the third moving sub-part 1613 are arranged in sequence.

[0083] In this embodiment, a second track member 172 is provided on a side of the first movable sub-section 1611 facing away from the second movable sub-section 1612 to facilitate relative movement of the first movable sub-section 1611 and the mounting base 120 along a first direction. When the first movable sub-section 1611 slides along the first direction to connect with the mounting base 120, it drives the second movable sub-section 1612, the third movable sub-section 1613, the connecting portion 162, and the mounting portion 163 to move relative to the mounting base 120 along the first direction, thereby positioning one of the heat pipe 132 and the microscope assembly 140 above the inspection area of the sample to be inspected. Furthermore, the third sliding assembly 230 is disposed between the first movable sub-section 1611 and the second movable sub-section 1612 and extends along the third direction. The third sliding assembly 230 provides a guide for the movement of the second movable sub-section 1612 and the third movable sub-section 1613 relative to the first movable sub-section 1611, thereby achieving synchronous movement of the heat pipe 132 and the microscope assembly 140 in the third direction. Furthermore, the fourth sliding assembly 240 is disposed between the second movable sub-section 1612 and the third movable sub-section 1613 and extends along the first direction. The fourth sliding assembly 240 provides a guide for the movement of the third movable sub-section 1613 relative to the second movable sub-section 1612 and the first movable sub-section 1611, thereby achieving synchronous movement of the heat pipe 132 and the microscope assembly 140 in the first direction.

[0084] In some embodiments, the third sliding assembly 230 includes a fifth sliding member 231 and a sixth sliding member 232, the fifth sliding member 231 is arranged on the side of the first moving sub-section 1611 facing the second moving sub-section 1612 and extends along the third direction, and the sixth sliding member 232 is arranged on the side of the second moving sub-section 1612 facing the first moving sub-section 1611 and can slide relative to the fifth sliding member 231 along the third direction.

[0085] In this embodiment, the fifth sliding member 231 is disposed on a side of the first moving sub-section 1611 facing the second moving sub-section 1612 and extends along the third direction. The sixth sliding member 232 is disposed on a side of the second moving sub-section 1612 facing the first moving sub-section 1611 and is slidable along the third direction relative to the fifth sliding member 231. Specifically, when the sixth sliding member 232 slides along the third direction relative to the fifth sliding member 231, it drives the second moving sub-section 1612 and the third moving sub-section 1613 to move relative to the first moving sub-section 1611, thereby achieving synchronous movement of the heat pipe 132 and the microscope assembly 140 in the third direction.

[0086] Optionally, the third sliding assembly 230 also includes a third rolling member (not shown), which is located between the fifth sliding member 231 and the sixth sliding member 232. The third rolling member can be respectively connected to the fifth sliding member 231 and the sixth sliding member 232 in a rolling manner to improve the accuracy of the movement of the sixth sliding member 232 relative to the fifth sliding member 231.

[0087] In some embodiments, the fourth sliding assembly 240 includes a seventh sliding member 241 and an eighth sliding member 242, the seventh sliding member 241 is arranged on the side of the second moving sub-section 1612 facing the third moving sub-section 1613 and extends along the first direction, and the eighth sliding member 242 is arranged on the side of the third moving sub-section 1613 facing the second moving sub-section 1612 and can slide relative to the seventh sliding member 241 along the first direction.

[0088] In this embodiment, the seventh sliding member 241 is disposed on a side of the second moving sub-section 1612 facing the third moving sub-section 1613 and extends along the first direction. The eighth sliding member 242 is disposed on a side of the third moving sub-section 1613 facing the second moving sub-section 1612 and is slidable along the first direction relative to the seventh sliding member 241. Specifically, when the eighth sliding member 242 slides along the first direction relative to the seventh sliding member 241, it drives the third moving sub-section 1613 to move relative to the first moving sub-section 1611 and the second moving sub-section 1612, thereby causing the heat conducting pipe 132 and the microscope assembly 140 to move synchronously in the first direction. In addition, compared with the first moving component 170, the fourth sliding component 240 has higher precision in the relative adjustment of the second moving sub-section 1612 and the third moving sub-section 1613 along the first direction. The first moving component 170 can be used to coarsely adjust the relative positions of the heat pipe 132 and the microscope component 140 and the mounting seat 120 in the first direction, and the fourth sliding component 240 can be used to fine-tune the relative positions of the heat pipe 132 and the microscope component 140 and the mounting seat 120 in the first direction, thereby improving the flexibility of adjusting the heat pipe 132 and the microscope component 140, and improving the performance of the wafer detection device 100 in detecting the sample to be detected.

[0089] Optionally, the fourth sliding assembly 240 also includes a fourth rolling member (not shown), which is located between the seventh sliding member 241 and the eighth sliding member 242. The fourth rolling member can be respectively connected to the seventh sliding member 241 and the eighth sliding member 242 in a rolling manner to improve the accuracy of the movement of the eighth sliding member 242 relative to the seventh sliding member 241.

[0090] Mentioning "embodiments" and "implementation methods" in this application means that the specific features, structures or characteristics described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrases in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described in this application can be combined with other embodiments. In addition, it should be understood that the features, structures or characteristics described in the various embodiments of the present application can be arbitrarily combined to form another embodiment that does not deviate from the spirit and scope of the technical solution of the present application, unless there is a contradiction between them.

[0091] Finally, it should be noted that the above implementation modes are only used to illustrate the technical solutions of the present application and are not limiting. Although the present application has been described in detail with reference to the above preferred implementation modes, ordinary technicians in this field should understand that the technical solutions of the present application can be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present application.

Claims

1. A heatable wafer detection device, characterized in that: The wafer detection device comprises: A sample rack, wherein the sample rack is used to place samples to be tested; A mounting base, the mounting base is used to mount the sample holder; and The heating mechanism includes a heating component and a heat pipe. The heating component is used to generate heat flow and transport the heat flow to the heat pipe. The heat pipe is located on the side of the sample holder away from the mounting seat to heat the sample to be tested.

2. The wafer inspection device according to claim 1, wherein: The wafer inspection device also includes a microscope assembly and a temperature sensor. The microscope assembly, the temperature sensor and the heat pipe are arranged at intervals on the same side of the sample holder, and the temperature sensor is arranged adjacent to the microscope assembly. The microscope assembly is used to observe the sample to be inspected, and the temperature sensor is used to detect the temperature of the sample to be inspected.

3. The wafer inspection device according to claim 2, wherein: The wafer detection device also includes a movable frame and a first movable component, the movable frame and the sample frame are arranged on the same side of the mounting seat, the movable frame is used to install the heat pipe, the microscope assembly and the temperature sensor, and the first movable component is arranged between the mounting seat and the movable frame so that the movable frame can move relative to the mounting seat along a first direction; the first movable component includes a first track member and a second track member, the first track member is arranged on the mounting seat and extends along the first direction, the second track member is arranged on the movable frame and can be slidably connected to the first track member along the first direction to drive the heat pipe and the microscope assembly to move relative to the mounting seat along the first direction, so that one of the heat pipe and the microscope assembly moves to above the sample to be detected.

4. The wafer inspection device according to claim 3, wherein: The movable frame includes a movable portion, a connecting portion, and a mounting portion connected in sequence, wherein the second track member is provided on a side of the movable portion facing the mounting seat; the mounting portion includes a first mounting assembly and a second mounting assembly spaced apart from each other, the first mounting assembly and the second mounting assembly being respectively provided on a side of the connecting portion facing away from the movable portion, the first mounting assembly being used to mount the heat pipe, and the second mounting assembly being used to mount the microscope assembly; The wafer inspection device further includes a second moving assembly, the second moving assembly including a third track member and a fourth track member, the third track member being disposed on the connecting portion and extending along the second direction, the fourth track member being connected to the first mounting assembly and slidably connected to the third track member along the second direction to drive the heat conducting pipe to move relative to the mounting seat along the second direction to adjust the distance between the heat conducting pipe and the sample to be inspected in the second direction; and The wafer inspection device also includes a third moving component, which includes a fifth rail member and a sixth rail member. The fifth rail member is arranged on the connecting portion and extends along the second direction. The fifth rail member and the third rail member are spaced apart along the first direction. The sixth rail member is connected to the second mounting component and can be slidably connected to the fifth rail member along the second direction to drive the microscope component to move relative to the mounting seat along the second direction to adjust the distance between the microscope component and the sample to be inspected in the second direction; wherein, the second direction intersects with the first direction.

5. The wafer inspection device according to claim 4, wherein: The wafer inspection device further includes a first sliding assembly, the first sliding assembly being arranged between the first mounting assembly and the fourth rail member to adjust the distance between the first mounting assembly and the fourth rail member along the third direction; the first sliding assembly includes a first sliding member and a second sliding member, the first sliding member being arranged on the fourth rail member and extending along the third direction, the second sliding member being arranged on the first mounting assembly and slidably connected to the first sliding member along the third direction; The wafer inspection device further includes a second sliding assembly, the second sliding assembly being arranged between the second mounting assembly and the sixth rail member to adjust the distance between the second mounting assembly and the sixth rail member along the third direction; the second sliding assembly includes a third sliding member and a fourth sliding member, the third sliding member being arranged on the sixth rail member and extending along the third direction, the fourth sliding member being arranged on the second mounting assembly and slidably connected to the third sliding member along the third direction; The third direction intersects with the first direction and the second direction in pairs.

6. The wafer inspection device according to claim 5, characterized in that: The first mounting assembly includes a first mounting member, a second mounting member, and a third mounting member. One end of the first mounting member is used to mount the heat pipe. An end of the first mounting member facing away from the heat pipe is sleeved on the outer periphery of the second mounting member. The second mounting member extends along the second direction. The position of the first mounting member relative to the second mounting member in the second direction is adjustable. One end of the third mounting member is connected to the second mounting member. An end of the third mounting member facing away from the second mounting member can be slidably connected to the fourth track member along the third direction. The second mounting assembly includes a fourth mounting member, a fifth mounting member and a sixth mounting member, one end of the fourth mounting member is used to mount the microscope assembly, an end of the fourth mounting member facing away from the microscope assembly is sleeved on the outer periphery of the fifth mounting member, the fifth mounting member extends along the second direction, the position of the fourth mounting member in the second direction is adjustable compared to the fifth mounting member, one end of the sixth mounting member is connected to the fifth mounting member, and an end of the sixth mounting member facing away from the fifth mounting member can be slidably connected to the sixth track member along the third direction.

7. The wafer inspection device according to claim 4, wherein: The wafer detection device also includes a third sliding assembly and a fourth sliding assembly; the moving part includes a first moving sub-section, a second moving sub-section and a third moving sub-section arranged in sequence along the second direction, and the second track member is provided on the side of the first moving sub-section away from the second moving sub-section, and the third sliding assembly is arranged between the first moving sub-section and the second moving sub-section and extends along the third direction, and is used to guide the second moving sub-section and the third moving sub-section to move relative to the first moving sub-section along the third direction; the fourth sliding assembly is arranged between the second moving sub-section and the third moving sub-section and extends along the first direction, and the end of the third moving sub-section away from the second moving sub-section is connected to the connecting part, and the fourth sliding assembly is used to guide the third moving sub-section and the connecting part to move relative to the second moving sub-section along the first direction.

8. The wafer inspection device according to claim 7, wherein: The third sliding assembly includes a fifth sliding member and a sixth sliding member, wherein the fifth sliding member is disposed on a side of the first moving sub-section facing the second moving sub-section and extends along a third direction, and the sixth sliding member is disposed on a side of the second moving sub-section facing the first moving sub-section and is slidable relative to the fifth sliding member along the third direction; The fourth sliding assembly includes a seventh sliding member and an eighth sliding member. The seventh sliding member is arranged on a side of the second moving sub-part facing the third moving sub-part and extends along the first direction. The eighth sliding member is arranged on a side of the third moving sub-part facing the second moving sub-part and can slide relative to the seventh sliding member along the first direction.

9. The wafer inspection device according to any one of claims 1 to 8, characterized in that: The sample rack includes a first sub-rack, a second sub-rack and a connecting rack. The first sub-rack and the second sub-rack are arranged at intervals, and the first sub-rack is arranged closer to the heat pipe than the second sub-rack. The connecting rack is arranged between the first sub-rack and the second sub-rack and connects the first sub-rack and the second sub-rack respectively. The first sub-rack, the connecting rack and the second sub-rack form a setting space. The first sub-rack has a light-transmitting portion, and the light-transmitting portion is used to set the sample to be tested. The wafer detection device also includes a backlight assembly, and the backlight assembly is located in the setting space and is arranged corresponding to the light-transmitting portion.

10. The wafer inspection device according to any one of claims 1 to 8, characterized in that: The wafer inspection device also includes a probe assembly and a moving mechanism. The probe assembly and the sample holder are arranged on the mounting seat with a gap therebetween. The probe assembly is used to detect the sample to be inspected. The moving mechanism is arranged on a side of the sample holder away from the probe assembly and is connected to the sample holder to adjust the relative position of the sample holder and the probe assembly.

Images