Modular LED test instrument

Abstract

The utility model discloses a modular LED test instrument, which comprises a main body, the main body is provided with a plurality of expansion interfaces, each expansion interface can be connected with an expansion module, and each expansion module is internally provided with a plurality of optical fiber channels; an independent optical sensor is configured in any optical fiber channel; the main body is internally provided with an embedded microcontroller, the embedded microcontroller is responsible for identifying and managing the accessed extension module, automatically configuring and initializing the accessed extension module after being electrified, and analyzing and processing optical sensor data transmitted by the accessed extension module. The modular LED testing instrument is provided with a plurality of expansion interfaces, each expansion interface can be connected with an expansion module, and a plurality of optical fiber channels are arranged in the expansion modules, so that simultaneous testing of large-scale LED products is supported. The modular LED test instrument provided by the utility model has high flexibility and expansibility, and can meet the requirements of different test scenes.

Description

Technical Field

[0001] The utility model relates to the technical field of LED testing, in particular to a modular LED testing instrument. Background Art

[0002] With the continuous development of LED technology, LED products are increasingly being used in display, lighting and other fields. However, the testing and verification of large-scale LED products has become a challenge. Traditional test equipment often suffers from problems such as limited number of interfaces, poor scalability, and low test efficiency.

[0003] Although there are some modular testing equipment on the current market, most of them have defects such as interface incompatibility, single expansion module function, and inability to support large-scale concurrent testing.

[0004] Conventional LED testers have a single-piece housing with a USB or RS232 communication port 11 and typically 2-20 fixed fiber optic ports 12 for connecting optical fiber cables, the other ends of which face the LED's light-emitting surface. The LED tester also has a dedicated embedded microprocessor that processes data from the optical sensor and receives commands from the USB or RS232 port. Traditional LED testers have fixed channels and cannot flexibly expand fiber optic channels.

[0005] In view of this, it is necessary to improve the existing LED testing instruments. Utility Model Content

[0006] In view of the deficiencies in the prior art, the technical problem to be solved by the present invention is to provide a modular LED testing instrument. The purpose of designing the modular LED testing instrument is to support simultaneous testing of large-scale LED products and improve testing efficiency and accuracy.

[0007] To solve the above technical problems, the present invention is implemented through the following solutions: A modular LED test instrument of the present invention includes a main body, the main body is provided with multiple expansion interfaces, each expansion interface can be connected to an expansion module, and each expansion module has multiple fiber optic channels built in;

[0008] An independent optical sensor is configured in any optical fiber channel;

[0009] The main body has an embedded microcontroller built in, which is responsible for identifying and managing the connected expansion modules. After power-on, the embedded microcontroller automatically configures and initializes the connected expansion modules, and analyzes and processes the optical sensor data transmitted by the connected expansion modules.

[0010] Furthermore, the expansion interface is a TYPE-C expansion interface, of which 8 to 16 are provided, and each expansion interface supports forward and reverse insertion.

[0011] Furthermore, each expansion module has 16 built-in fiber channels.

[0012] Furthermore, the main body is provided with at least one HDMI interface.

[0013] Furthermore, the embedded microcontroller is provided with an MCU and peripheral circuits connected to the MCU.

[0014] Furthermore, the MCU is a single chip microcomputer of the STM32F103RET6 model.

[0015] Furthermore, the peripheral circuit includes:

[0016] The crystal oscillator circuit includes a crystal oscillator Y2, a resistor R12, a capacitor C13, and a capacitor C10. The first end of the crystal oscillator Y2 is connected to the OSC_IN port of the MCU; the resistor R12 is connected in parallel with the crystal oscillator Y2; the first end of the capacitor C13 is connected to the first end of the crystal oscillator Y2, and the second end thereof is grounded; the first end of the capacitor C10 is connected to the second end of the crystal oscillator Y2, and the second end thereof is grounded;

[0017] Capacitor C3, a first end of which is connected to pin 1 VBAT of the MCU, and a second end thereof is grounded;

[0018] Four capacitors connected in parallel, with first ends of the four capacitors connected to pin 1 VBAT of the MCU, pin 32 VDD1 of the MCU, pin 48 VDD2 of the MCU, pin 64 VDD3 of the MCU, and pin 19 VDD4 of the MCU, and second ends of the four capacitors connected in parallel being grounded;

[0019] Capacitor C12, a first end of the capacitor C12 is connected to pin 13 VDDA of the MCU, and a second end thereof is grounded;

[0020] The chip inductor FB1 is provided in the circuit between the 13th pin VDDA of the MCU and the 19th pin VDD4 of the MCU;

[0021] Resistor R1, the first end of the resistor R1 is connected to pin 7 NRST of the MCU and the first end of the capacitor C2, the second end of the capacitor C2 is grounded, and the second end of the resistor R1 is connected to pin 1 VBAT of the MCU;

[0022] Memory U1, pin 1 AO of the memory U1, pin 2 A1 of the memory U1, and pin 3 A2 of the memory U1 are interconnected and connected to pin 1 VBAT of the MCU, pin 4 GND of the memory U1 is grounded, pin 5 SDA of the memory U1 is connected to pin 59 PB7 / I2C1_SDA / TIM4_CH2 / FSMC_NADV / USART1_RX of the MCU, pin 6 SCL of the memory U1 is connected to pin 58 PB6 / I2C1_SCL / TIM4_CH1 / USART1_TX of the MCU, pin 7 NC of the memory U1 is grounded, pin 8 VDD of the memory U1 is connected to pin 1 VBAT of the MCU and the first end of capacitor C5, and the second end of capacitor C5 is grounded.

[0023] Furthermore, the peripheral circuit also includes an anti-static circuit including an anti-surge chip, and the anti-surge chip is connected to the MCU.

[0024] Compared with the prior art, the beneficial effects of the present invention are:

[0025] 1. The modular LED test instrument of this utility model is provided with multiple expansion interfaces, each of which can be connected to an expansion module. The expansion module has multiple fiber optic channels built in, which supports the simultaneous testing of large-scale LED products.

[0026] 2. This modular LED tester is highly flexible and scalable, meeting the needs of different testing scenarios. Its built-in intelligent control system simplifies the testing process, improving test efficiency and accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 This is a port structure diagram of an LED test instrument in the prior art.

[0028] Figure 2 This is a block diagram of the working principle of the LED testing instrument of this utility model.

[0029] Figure 3 This is a diagram of the MCU of the utility model and the peripheral circuits connected to the MCU.

[0030] Figure 4 for Figure 3 A magnified diagram of the left circuit.

[0031] Figure 5 for Figure 3 The enlarged diagram of the circuit on the right.

[0032] Figure 6 This is a diagram of one of the peripheral circuits connected to the MCU.

[0033] Figure 7 This is a memory circuit diagram of the present utility model.

[0034] Figure 8 This is the circuit diagram of the TYPE-C expansion interface of the utility model.

[0035] Figure 9 This is the anti-static circuit diagram of the utility model.

[0036] Markings in the accompanying drawings: USB or RS232 communication interface 11, optical fiber interface 12, main body 21, expansion module 22. DETAILED DESCRIPTION

[0037] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more specific definition of the scope of protection of the present invention. Obviously, the embodiments described in the present invention are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0038] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0039] Example 1: The specific structure of the utility model is as follows:

[0040] Please refer to the attached Figure 2-9 The modular LED test instrument of the present invention includes a main body 21, which is made of metal material. The main body 21 is provided with multiple expansion interfaces, each of which can be connected to an expansion module 22, and each expansion module 22 has multiple fiber optic channels built in. Figure 2 As shown, the main body 21 is also provided with a serial interface and a USB interface. The USB interface is connected to the MCU through a communication chip. The main body 21 supports communication with the host computer through the serial interface or the USB interface. The main body 21 also supports a maximum of 28V DC power supply.

[0041] An independent optical sensor is configured in any fiber channel. The main body has an embedded microcontroller. The optical sensor is used to sense the light emitted by the LED and generate an optical signal. The optical signal passes through the communication chip, module port, serial communication, and expansion port in sequence, and is ultimately received by the embedded microcontroller.

[0042] The embedded microcontroller is responsible for identifying and managing connected expansion modules. Upon power-up, it automatically configures and initializes the connected expansion modules and analyzes and processes the optical sensor data transmitted by the connected expansion modules. Users send commands to the embedded microcontroller through a communication interface. Upon receiving the commands, the embedded microcontroller executes the corresponding instructions and actions, and then transmits the processed data back to the host computer.

[0043] The expansion interface is a TYPE-C expansion interface, which is provided with 8-16, and each expansion interface supports forward and reverse insertion, such as Figure 8 As shown, Figure 8 This is a circuit diagram of the TYPE-C expansion interface of the utility model. The TYPE-C expansion interface is used to connect a TYPE-C plug. A first fuse is provided in the 5V power supply circuit of the TYPE-C expansion interface, and a second fuse is provided in the 3.3V power supply circuit of the TYPE-C expansion interface.

[0044] Each expansion module has 16 built-in fiber channels, meaning each expansion module can measure 16 groups of LED lights. When 16 expansion interfaces are provided, this LED tester can support simultaneous testing of up to 16 x 16 = 256 LEDs, increasing testing efficiency compared to traditional LED testers.

[0045] The main body is also equipped with at least one HDMI interface. In addition to 8 to 16 TYPE-C expansion interfaces, the main body 21 also integrates an HDMI interface, allowing external modules to connect the expansion modules in the test equipment to the main body 21 via an HDMI cable. The HDMI cable also transmits test data back to the MCU of the main body 21 for data processing and analysis.

[0046] Example 2:

[0047] The following is a specific circuit of the LED test instrument of the present invention: The embedded microcontroller includes an MCU and peripheral circuits connected to the MCU.

[0048] The MCU is a single chip microcomputer of the STM32F103RET6 model.

[0049] The peripheral circuit includes:

[0050] The crystal oscillator circuit includes a crystal oscillator Y2, a resistor R12, a capacitor C13, and a capacitor C10. The first end of the crystal oscillator Y2 is connected to the OSC_IN port of the MCU; the resistor R12 is connected in parallel with the crystal oscillator Y2; the first end of the capacitor C13 is connected to the first end of the crystal oscillator Y2, and the second end thereof is grounded; the first end of the capacitor C10 is connected to the second end of the crystal oscillator Y2, and the second end thereof is grounded;

[0051] Capacitor C3, a first end of which is connected to pin 1 VBAT of the MCU, and a second end thereof is grounded;

[0052] Four capacitors connected in parallel, with first ends of the four capacitors connected to pin 1 VBAT of the MCU, pin 32 VDD1 of the MCU, pin 48 VDD2 of the MCU, pin 64 VDD3 of the MCU, and pin 19 VDD4 of the MCU, and second ends of the four capacitors connected in parallel being grounded;

[0053] Capacitor C12, a first end of the capacitor C12 is connected to pin 13 VDDA of the MCU, and a second end thereof is grounded;

[0054] The chip inductor FB1 is provided in the circuit between the 13th pin VDDA of the MCU and the 19th pin VDD4 of the MCU;

[0055] Resistor R1, the first end of the resistor R1 is connected to pin 7 NRST of the MCU and the first end of the capacitor C2, the second end of the capacitor C2 is grounded, and the second end of the resistor R1 is connected to pin 1 VBAT of the MCU;

[0056] Memory U1, pin 1 AO of the memory U1, pin 2 A1 of the memory U1, and pin 3 A2 of the memory U1 are interconnected and connected to pin 1 VBAT of the MCU, pin 4 GND of the memory U1 is grounded, pin 5 SDA of the memory U1 is connected to pin 59 PB7 / I2C1_SDA / TIM4_CH2 / FSMC_NADV / USART1_RX of the MCU, pin 6 SCL of the memory U1 is connected to pin 58 PB6 / I2C1_SCL / TIM4_CH1 / USART1_TX of the MCU, pin 7 NC of the memory U1 is grounded, pin 8 VDD of the memory U1 is connected to pin 1 VBAT of the MCU and the first end of capacitor C5, and the second end of capacitor C5 is grounded.

[0057] Example 3:

[0058] like Figure 9As shown, the peripheral circuit also includes an anti-static circuit including an anti-surge chip, which is connected to the MCU. The model of the anti-surge chip is SRV05-4. Taking one of the anti-surge chips U8 as an example, the 5-pin VCC of the anti-surge chip U8 is connected to the power supply circuit of VCC5, the 6-pin IO4 of the anti-surge chip U8 is connected to the 29-pin PB10 / I2C2_SCL / USART3_TX / TIM2_CH3 of the MCU, and the 4-pin IO3 of the anti-surge chip U8 is connected to the 30-pin PB11 / I2C2_SDA / USART3_RX / TIM2_CH4 of the MCU. Pin 1 IO1 of the surge protection chip U8 is connected to pin 59 PB7 / I2C1_SDA / TIM4_CH2 / FSMC_NADV / USART1_RX of the MCU, pin 2 GND of the surge protection chip U8 is grounded, and pin 3 IO2 of the surge protection chip U8 is connected to pin 58 PB6 / I2C1_SCL / TIM4_CH1 / USART1_TX of the MCU.

[0059] In summary, the main body 21 of the present invention is made of metal material, and 8 to 16 TYPE-C expansion interfaces are provided on the surface. Each interface supports forward and reverse insertion, and each TYPE-C expansion interface is provided with an electrostatic protection design to ensure the fast and stable connection of the expansion module. The main body 21 supports the access of 8 to 16 expansion modules, and can be arbitrarily configured within a number of 1 to 16. The main body 21 supports communication with the host computer through a serial port or USB, and supports a maximum DC power supply of 28V. The main body 21 has a built-in embedded microcontroller, which is responsible for identifying and managing the connected expansion modules. After the microcontroller is powered on, it will automatically configure and initialize the expansion module, and analyze and process the optical sensor data transmitted from the expansion module. The user sends instructions to the microcontroller of the main body 21 through the interface of the communication expansion module. After receiving the instructions, the microcontroller performs the corresponding action of the instructions and transmits the processed data back to the host computer. In addition to integrating 8 to 16 TYPE-C interfaces, the main body 21 also integrates an HDMI interface, which makes it convenient for external modules to connect the cabinet device expansion module in the test equipment to the main body 21 via an HDMI cable, and transmit the test data back to the microcontroller of the main body 21 via the HDMI cable for data processing and analysis.

[0060] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A modular LED testing instrument, comprising a main body (21), characterized in that: The main body (21) is provided with a plurality of expansion interfaces, each of which is capable of connecting to an expansion module (22), and each expansion module (22) has a plurality of built-in optical fiber channels; An independent optical sensor is configured in any optical fiber channel; The main body has an embedded microcontroller built in, which is responsible for identifying and managing the connected expansion modules. After power-on, the embedded microcontroller automatically configures and initializes the connected expansion modules, and analyzes and processes the optical sensor data transmitted by the connected expansion modules.

2. A modular LED testing instrument according to claim 1, characterized in that: The expansion interface is a TYPE-C expansion interface, which is provided with 8-16 TYPE-C expansion interfaces, and each TYPE-C expansion interface supports forward and reverse insertion.

3. The modular LED testing instrument according to claim 2, characterized in that: Each expansion module has multiple Fibre Channel channels built into it.

4. The modular LED testing instrument according to claim 1, characterized in that: The main body is also provided with at least one HDMI interface.

5. The modular LED testing instrument according to claim 1, characterized in that: The embedded microcontroller is provided with an MCU and peripheral circuits connected with the MCU.

6. The modular LED testing instrument according to claim 5, characterized in that: The MCU is a single chip microcomputer of the STM32F103RET6 model.

7. The modular LED testing instrument according to claim 6, characterized in that: The peripheral circuit includes: The crystal oscillator circuit includes a crystal oscillator Y2, a resistor R12, a capacitor C13, and a capacitor C10. The first end of the crystal oscillator Y2 is connected to the OSC_IN port of the MCU; the resistor R12 is connected in parallel with the crystal oscillator Y2; the first end of the capacitor C13 is connected to the first end of the crystal oscillator Y2, and the second end thereof is grounded; the first end of the capacitor C10 is connected to the second end of the crystal oscillator Y2, and the second end thereof is grounded; Capacitor C3, a first end of which is connected to pin 1 VBAT of the MCU, and a second end thereof is grounded; Four capacitors connected in parallel, with first ends of the four capacitors connected to pin 1 VBAT of the MCU, pin 32 VDD1 of the MCU, pin 48 VDD2 of the MCU, pin 64 VDD3 of the MCU, and pin 19 VDD4 of the MCU, and second ends of the four capacitors connected in parallel being grounded; Capacitor C12, a first end of the capacitor C12 is connected to pin 13 VDDA of the MCU, and a second end thereof is grounded; The chip inductor FB1 is provided in the circuit between the 13th pin VDDA of the MCU and the 19th pin VDD4 of the MCU; Resistor R1, the first end of the resistor R1 is connected to pin 7 NRST of the MCU and the first end of the capacitor C2, the second end of the capacitor C2 is grounded, and the second end of the resistor R1 is connected to pin 1 VBAT of the MCU; Memory U1, pin 1 AO of the memory U1, pin 2 A1 of the memory U1, and pin 3 A2 of the memory U1 are interconnected and connected to pin 1 VBAT of the MCU, pin 4 GND of the memory U1 is grounded, pin 5 SDA of the memory U1 is connected to pin 59 PB7 / I2C1_SDA / TIM4_CH2 / FSMC_NADV / USART1_RX of the MCU, pin 6 SCL of the memory U1 is connected to pin 58 PB6 / I2C1_SCL / TIM4_CH1 / USART1_TX of the MCU, pin 7 NC of the memory U1 is grounded, pin 8 VDD of the memory U1 is connected to pin 1 VBAT of the MCU and the first end of capacitor C5, and the second end of capacitor C5 is grounded.

8. The modular LED testing instrument according to claim 6, characterized in that: The peripheral circuit also includes an anti-static circuit including an anti-surge chip, and the anti-surge chip is connected to the MCU.

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