Server case and server with same
By combining the heat dissipation method of liquid-cooled module and air-cooled module, the direct contact liquid-cooled plate and the central processor optimizes the airflow distribution, solving the complexity and cost of traditional liquid-cooled systems, achieving efficient and low-cost heat dissipation effects, and improving the performance and reliability of the server.
Patent Information
- Application Number
- CN202521328675.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-26
- Publication Date
- 2025-08-05
- Estimated Expiration
- 2035-06-26
AI Technical Summary
Traditional liquid-cooled cooling systems have complex structures, high cost, difficult system integration and unchanged maintenance, making it difficult to resolve the contradiction between heat dissipation efficiency and cost efficiency.
The heat dissipation method of combining liquid-cooled modules and air-cooled modules is adopted. The liquid-cooled module directly contacts the central processor through the liquid-cooled plate, combines the fan and flow guide components to optimize the airflow distribution, simplify the pipeline network, and reduces the difficulty of installation and maintenance.
It realizes efficient cooling of the central processor, improves server performance and stability, reduces manufacturing and maintenance costs, and improves system flexibility and reliability.
Smart Images

Figure CN223193328U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of servers, and in particular to a server chassis and a server having the same. Background Art
[0002] With the rapid development of information technology, server processing power and data throughput continue to increase, leading to a significant increase in the power consumption of central processing units (CPUs) and other electronic components. To address the resulting heat dissipation challenges, the industry has long relied on liquid cooling technology, leveraging the efficient heat conduction properties of liquid media to maintain normal server operating temperatures.
[0003] However, traditional liquid cooling solutions involve complex liquid circulation systems and piping networks. Not only do they require extensive consideration of details during the design phase to ensure effective distribution of the coolant, but they also significantly increase the difficulty of installation and maintenance during actual server deployment. Furthermore, the cost is much higher than other cooling technologies, making this a major obstacle to the widespread adoption of liquid cooling in the cost-sensitive general-purpose server market. Utility Model Content
[0004] The present application provides a server chassis and a server having the same, so as to at least solve the problem in the related art of the contradiction between heat dissipation efficiency and cost-effectiveness caused by the complex structure, high cost, difficulty in system integration and constant maintenance of the liquid cooling system.
[0005] The present application provides a server chassis, comprising: a chassis for accommodating a central processing unit, the server chassis also comprising: a liquid cooling module, the liquid cooling module comprising a liquid cooling plate, a liquid inlet pipe and a liquid outlet pipe, the liquid cooling plate being in contact with the central processing unit, a cooling liquid flow channel being provided in the liquid cooling plate, the inlet of the cooling liquid flow channel being connected to the liquid inlet pipe, and the outlet of the cooling liquid flow channel being connected to the liquid outlet pipe, so that the cooling liquid flowing through the cooling liquid flow channel can cool the central processing unit.
[0006] Furthermore, the server chassis also includes an air cooling module, including a fan. The chassis is provided with an air inlet and an air outlet. The fan is arranged in the chassis to introduce the air outside the chassis into the chassis and flow it out through the air outlet.
[0007] Furthermore, the server chassis also includes a power board arranged in the chassis, and the air cooling module also includes a fan wall for carrying fans, there are multiple fans, and the fan wall is located in the chassis. The air cooling module also includes: a guide component, which is arranged at a position corresponding to the fan wall and the power board, and is arranged in sequence with the multiple fans along the length direction of the fan wall; wherein, the guide component has a guide air inlet, and the guide air inlet is arranged away from the power board to guide the airflow introduced by the multiple fans from the air inlets to the air inlets of other fans and into the chassis.
[0008] Furthermore, the inlet of the liquid inlet pipe and / or the outlet of the liquid outlet pipe are provided with a plug component.
[0009] Furthermore, the server chassis also includes an air guide component arranged in the chassis, and the air guide component is arranged between the fan wall and the power board to guide at least part of the airflow introduced into the chassis from the air cooling module to the central processing unit.
[0010] Furthermore, the air guide component includes a first air guide portion and a second air guide portion, the extension direction of the first air guide portion is parallel to the extension direction of the fan wall, and a set angle is formed between the extension direction of the second air guide portion and the extension direction of the first air guide portion, the set angle is an obtuse angle, and the opening of the set angle is set away from the fan wall.
[0011] Furthermore, a protruding mounting portion is provided on the side of the second air guide portion away from the air cooling module, and a locking hole is provided on the mounting portion. The server chassis also includes a locking piece used in conjunction with the locking hole, and the locking piece can be inserted into the locking hole to fix the air guide component in the box body through the cooperation of the locking piece and the locking hole.
[0012] Furthermore, the guide component includes: a first guide plate, on which a mounting component for mounting with a fan wall is provided;
[0013] The second guide plate is arranged on one side of the first guide plate, and a guide angle is formed between the second guide plate and the first guide plate; the guide side plate is arranged between the first guide plate and the second guide plate to form a guide space with a guide air inlet together with the first guide plate and the second guide plate.
[0014] Furthermore, the number of the guide side plates is at least two, the two guide side plates are arranged oppositely on both sides of the first guide plate, and each guide side plate is triangular in shape.
[0015] Furthermore, the installation component is protruding from the first guide plate, and a mounting channel is provided at a position of the fan wall corresponding to the installation component. The installation component enters from an inlet of the mounting channel to install the guide component on the fan wall.
[0016] Furthermore, there are multiple mounting components, and the multiple mounting components are arranged at intervals along the arrangement direction of the two guide side plates.
[0017] Furthermore, the mounting component includes a mounting column, the extension direction of the mounting column is perpendicular to the surface of the first guide plate, and the mounting component also includes a mounting block arranged at one end of the mounting column away from the first guide plate, and the mounting block is used to limit the displacement of the mounting column in the mounting channel along the extension direction of the mounting column.
[0018] Furthermore, the mounting block is annular, the mounting post is cylindrical, and the diameter of the mounting block is greater than the diameter of the mounting post.
[0019] Furthermore, the liquid cooling module also includes a limiting component arranged in the box body, the limiting component includes a bearing part and a locking part, the bearing part has a first clamping end, the locking part has a first locking end, the first clamping end and the first locking end are engaged with each other to form a fixed space for fixing the liquid inlet pipe and the liquid outlet pipe.
[0020] Furthermore, the liquid cooling module also includes: an avoidance component, which is arranged in the box body and located between the liquid cooling plate and the limiting component. The avoidance component has an avoidance groove. After being limited by the limiting component, the liquid inlet pipe and the liquid outlet pipe pass through the avoidance groove and are connected to the liquid cooling plate.
[0021] The present application also provides a server, including: a server chassis, which is the above-mentioned server chassis.
[0022] Through the present application, since a liquid cooling module is integrated into the server chassis, including a liquid cooling plate in contact with the central processing unit, a liquid inlet pipe, and a liquid outlet pipe, and a coolant flow channel is provided inside the liquid cooling plate and is connected to the liquid inlet pipe and the liquid outlet pipe, the technical problem of poor heat dissipation of a high-power central processing unit can be solved, and the technical effect of efficiently cooling the central processing unit and improving the performance and stability of the server can be achieved. When facing a high-power central processing unit, the traditional liquid cooling heat dissipation method often arranges intricate pipes in the box, which is costly. In the present application, the liquid cooling plate is in direct contact with the central processing unit, saving space inside the server. At the same time, since the liquid cooling module can directly cool the central processing unit to prevent it from overheating, it can significantly alleviate the thermal stress inside the server and protect other electronic components from high temperatures, thereby extending the service life of the server. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] In order to more clearly illustrate the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.
[0024] Figure 1 A schematic diagram of the overall structure of a server chassis and a server having the same provided in an embodiment of the present application;
[0025] Figure 2 for Figure 1 Schematic diagram of the specific structure of the middle guide component;
[0026] Figure 3 It is a structural diagram of the liquid cooling module;
[0027] Figure 4 for Figure 3 Exploded view in .
[0028] The above drawings include the following reference numerals:
[0029] 1. Box body; 2. Air-cooling module; 3. Air guide component; 301. First air guide plate; 302. Mounting component; 3021. Mounting column; 3022. Mounting block; 303. Second air guide plate; 304. Air guide side plate; 4. Air guide component; 401. First air guide part; 402. Second air guide part; 403. Mounting part; 6. Central processing unit; 7. Liquid cooling module; 701. Liquid cooling plate; 702. Liquid inlet pipe; 703. Liquid outlet pipe; 704. Plug component; 705. Limit component; 7051. Load-bearing part; 7052. Locking part; 8. Power board. DETAILED DESCRIPTION
[0030] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.
[0031] It should be noted that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like, indicating positions or relationships, are based on the positions or relationships shown in the accompanying drawings and are intended solely for ease of description and simplification of the present application. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limiting the present application. The terms "mounted," "connected," and "connected" should be interpreted broadly, and may include, for example, fixed, removable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediary; and internal communication between two components. The terms "parallel," "perpendicular," and "equal" encompass the described conditions and conditions similar to the described conditions, provided that the range of the similar conditions is within an acceptable range of deviation, as determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes both absolute parallelism and approximate parallelism, where the acceptable deviation range for approximate parallelism may be, for example, within 5°; "perpendicular" includes both absolute perpendicularity and approximate perpendicularity, where the acceptable deviation range for approximate perpendicularity may also be, for example, within 5°. "Equal" includes both absolute equality and approximate equality, where the acceptable deviation range for approximate equality may be, for example, that the difference between the two is less than or equal to 5% of either. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.
[0032] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below with reference to the accompanying drawings and specific implementation methods.
[0033] With the rapid development of information technology, server processing power and data throughput continue to increase, leading to a significant increase in the power consumption of central processing units (CPUs) and other electronic components. To address the resulting heat dissipation challenges, the industry has long relied on liquid cooling technology, leveraging the efficient heat conduction properties of liquid media to maintain normal server operating temperatures.
[0034] However, traditional liquid cooling solutions involve complex liquid circulation systems and piping networks. Not only do they require extensive consideration of details during the design phase to ensure effective distribution of the coolant, but they also significantly increase the difficulty of installation and maintenance during actual server deployment. Furthermore, the cost is much higher than other cooling technologies, making this a major obstacle to the widespread adoption of liquid cooling in the cost-sensitive general-purpose server market.
[0035] like Figures 1 to 4 As shown, the embodiments of the present application provide a server chassis and a server having the same to address the above problems.
[0036] First, an embodiment of the present application provides a server chassis, which includes a box body 1 for accommodating a central processing unit 6. The server chassis also includes: a liquid cooling module 7, the liquid cooling module 7 includes a liquid cooling plate 701, a liquid inlet pipe 702 and a liquid outlet pipe 703, the liquid cooling plate 701 is in contact with the central processing unit 6, and a cooling liquid flow channel is provided in the liquid cooling plate 701, the inlet of the cooling liquid flow channel is connected to the liquid inlet pipe 702, and the outlet of the cooling liquid flow channel is connected to the liquid outlet pipe 703, so that the central processing unit 6 is cooled by the cooling liquid flowing through the cooling liquid flow channel.
[0037] Specifically, if Figure 1 As shown, the server chassis provided by the present application includes a box body 1, a central processing unit 6 is arranged in the box body 1, a liquid cooling module 7 is also arranged in the box body 1, the liquid cooling module 7 includes a liquid cooling plate 701, the liquid cooling module 7 also includes a liquid inlet pipe 702 and a liquid outlet pipe 703 connected to the liquid cooling plate 701, wherein the liquid cooling plate 701 is arranged on the central processing unit 6 and contacts the central processing unit 6, four first threaded holes are arranged on the central processing unit 6, and four second threaded holes are arranged at positions corresponding to the four first threaded holes of the liquid cooling plate 701 (the arrangement of the four second threaded holes does not cause The four first threaded holes and the four second threaded holes correspond to each other one by one, and the first locking screws are used to lock the first threaded holes with the corresponding second threaded holes to achieve the installation of the liquid cooling plate 701. A cooling liquid flow channel is provided in the liquid cooling plate 701, and the inlet of the cooling liquid flow channel is connected to the liquid inlet pipe 702, and the outlet of the cooling liquid flow channel is connected to the liquid outlet pipe 703. By supplying cooling liquid to the liquid inlet pipe 702, the cooling liquid is transported from the liquid inlet pipe 702 to the liquid cooling plate 701, cools the central processing unit 6, and then flows out from the liquid outlet pipe 703.
[0038] like Figure 1 As shown, the liquid cooling plate 701 is directly mounted on the CPU 6 and tightly connected to the four first threaded holes on the CPU 6 and the four second threaded holes on the liquid cooling plate 701 via four first locking screws, thereby achieving direct contact between the liquid cooling plate 701 and the surface of the CPU 6. This direct contact significantly reduces thermal resistance and improves heat conduction efficiency, thereby more effectively transferring the heat generated by the CPU 6 during operation to the coolant. Since the thermal conductivity of the liquid medium is much higher than that of air, the provision of the coolant flow channel further accelerates heat transfer, ensuring that the CPU 6 can remain within a safe temperature range during high-load operation.
[0039] Liquid cooling plate 701 is internally provided with a coolant flow channel, which is connected to the external cooling system via an inlet pipe 702 and an outlet pipe 703. The inlet of the coolant flow channel is connected to the inlet pipe 702, and the outlet is connected to the outlet pipe 703. This design ensures that the coolant can flow through the surface of the CPU 6 in an optimal path, increasing the heat exchange area with the CPU 6 and improving heat exchange efficiency. After the coolant flows through the CPU 6, the heat carried by the coolant is quickly transferred, preventing the CPU 6 from continuously increasing in temperature, thereby improving server stability and extending the life of the hardware.
[0040] The installation method in which the liquid cooling plate 701 directly contacts the central processing unit 6 eliminates the need for the complex piping network and circulation device in traditional liquid cooling systems, greatly simplifies the internal structure of the server chassis, and reduces manufacturing costs. The direct locking between the liquid cooling plate 701 and the central processing unit 6 not only reduces the number of installation steps, but also avoids the risk of leakage that may increase due to excessive piping in traditional liquid cooling systems, further reducing maintenance costs. The matching design of the four threaded holes ensures the stability of the liquid cooling plate 701. At the same time, due to the special design of the second threaded hole, the liquid cooling plate 701 will not leak, thereby simplifying the structure while ensuring the safety and reliability of the liquid cooling system.
[0041] The first locking screw makes assembly and disassembly of the liquid cooling plate 701 extremely convenient, allowing replacement or inspection without complex tools or specialized skills, significantly improving the server's maintainability. Furthermore, this design allows the server to be flexibly adjusted to meet varying cooling requirements. For example, when CPU 6 power consumption is low, lower-cost air cooling can be considered. However, when CPU 6 power consumption increases, a quick switch to liquid cooling can be made to accommodate varying server operation phases.
[0042] Furthermore, the server chassis also includes an air cooling module 2, including a fan. The chassis 1 is provided with an air inlet and an air outlet. The fan is arranged inside the chassis 1 to introduce the air flow outside the chassis 1 into the chassis 1 and flow out from the air outlet.
[0043] like Figure 1 As shown, the server chassis also includes an air cooling module 2 arranged in the box body 1. The air cooling module 2 includes a fan. An air inlet and an air outlet are provided on the box body 1. The fan in the air cooling module 2 introduces the air flow outside the box body 1 into the inside of the box body 1 to cool down other components arranged inside the box body 1. The air flow after cooling flows out from the air outlet. In this embodiment, after setting the liquid cooling module 7, the air cooling module 2 is further introduced. The two methods are combined to dissipate heat from the box body 1, which greatly increases the heat dissipation efficiency.
[0044] As previously mentioned, liquid cooling module 7 directly targets the high-heat density area of CPU 6. Through liquid cooling plate 701, close contact with the surface of CPU 6 effectively transfers the large amount of heat generated by CPU 6 during operation to the coolant. The configuration of the coolant flow channel ensures even distribution and effective cooling of the coolant, greatly improving the heat dissipation efficiency of CPU 6.
[0045] On the basis of the liquid cooling module 7, the server chassis is also equipped with an air cooling module 2, which introduces external cold air through the air inlet located in the box 1. The efficient operation of the fan sends the cold air to the inside of the box 1 to dissipate heat to the parts set in the box 1. At the same time, due to the setting of the liquid cooling module 7, the central processing unit 6 can be cooled by air and liquid at the same time, thereby extending the service life of the central processing unit 6.
[0046] By combining liquid cooling and air cooling, this application can fully utilize the advantages of both cooling methods: the high efficiency of liquid cooling and the wide coverage of air cooling. Liquid cooling module 7 focuses on the high-power heat source of CPU 6, while air cooling module 2 is responsible for dissipating heat from other electronic components and CPU 6. The two complement each other and work together to enable the heat within the server chassis to be transferred out in a timely and effective manner, avoiding local overheating. This improves the overall heat dissipation capacity of the server.
[0047] The combination of air cooling and liquid cooling achieves high heat dissipation efficiency while also taking cost control into consideration. Air cooling module 2, as a supplement to liquid cooling module 7, is relatively low-cost and can effectively distribute the pressure on the server's heat dissipation budget. Furthermore, this design provides system cooling flexibility, allowing for dynamic adjustment of the cooling strategy based on the server's actual operating conditions. For example, relying more on air cooling under low load conditions and enhancing the role of liquid cooling under high load conditions can achieve ideal heat dissipation in different scenarios, extending the server's service life.
[0048] Furthermore, the server also includes a power board 8 arranged in the box body 1, and the air cooling module 2 also includes a fan wall for carrying fans, there are multiple fans, and the fan wall is located in the box body 1. The air cooling module 2 also includes: a guide component 3, which is arranged at a position corresponding to the fan wall and the power board 8, and is arranged in sequence along the length direction of the fan wall with multiple fans; wherein, the guide component 3 has a guide air inlet, and the guide air inlet is arranged away from the power board 8 to guide the airflow introduced by the multiple fans from the air inlets to the air inlets of other fans and enter the box body 1.
[0049] Specifically, the server chassis also includes a power board 8 arranged in the box body 1, and the air cooling module 2 also includes a fan wall arranged in the box body 1. A plurality of fans are arranged on the fan wall, and the plurality of fans are arranged in sequence along the extension direction of the fan wall. A guide component 3 is provided at a position corresponding to the power board 8 on the fan wall, such as Figure 1 As shown, the guide component 3 is arranged between two adjacent fans, and the guide component 3 has an air inlet, as shown in FIG. Figure 2 As shown, it is a schematic diagram of the specific structure of the guide component 3. The guide component 3 has an air inlet. After the air flow introduced by the air-cooling module 2 enters the box body 1, part of the air flow will pass through the air inlet of the guide component 3 and enter the interior of the guide component 3. The setting of the guide component 3 can guide the air flow entering it to the air inlets of other fans set on the fan wall, thereby introducing more air flow into the box body 1.
[0050] The fan wall within the server chassis serves as the core of the air cooling module 2. Multiple fans arranged along the fan wall create a continuous and powerful airflow. This design ensures timely cooling of internal heat sources within the server, especially for high-power electronic components, as the fan wall provides sufficient airflow for effective heat dissipation.
[0051] A guide component 3 is installed on the fan wall at a location corresponding to the power board 8. This component also has an air inlet. This component captures and redirects some of the airflow drawn in by the fan, precisely directing it to other fan inlets on the fan wall. This increases the total amount of airflow entering the enclosure 1 for heat dissipation and optimizes its distribution, ensuring more direct and efficient cooling for other components within the enclosure 1.
[0052] The presence of the air guide component 3 allows for the reuse and optimal distribution of the fan-generated airflow, preventing it from dissipating aimlessly within the chassis 1 and ensuring that it flows more concentratedly to the areas requiring cooling. This precise airflow guidance not only improves heat dissipation efficiency but also reduces energy waste caused by wasted airflow, ultimately enhancing the overall energy efficiency of the server chassis.
[0053] Furthermore, a plug component 704 is provided at the inlet of the liquid inlet pipe 702 and / or the outlet of the liquid outlet pipe 703 .
[0054] like Figure 3 and Figure 4 As shown, a plug component 704 is provided at the outlet of the liquid inlet pipe 702 and / or the liquid outlet pipe 703, which can quickly connect the liquid inlet pipe 702 and the liquid outlet pipe 703 to the external coolant supply system.
[0055] The design of plug assembly 704 allows the liquid inlet pipe 702 and liquid outlet pipe 703 to be quickly and accurately connected to the external coolant supply system. This configuration simplifies the installation and removal of the server liquid cooling system, allowing maintenance personnel to connect and disconnect pipes without complex tools or time-consuming operations, significantly reducing server maintenance time and improving server maintainability.
[0056] The addition of the plug component 704 not only facilitates quick plugging, but more importantly, it takes into account the sealing and stability of the connection parts in its design, effectively preventing the leakage of coolant during the plugging and unplugging process, and reducing the possibility of failure of the liquid cooling system.
[0057] The dual benefits of quick plug-in and enhanced connection security make server maintenance more efficient and safer. Maintenance personnel can quickly inspect and repair the liquid cooling system, reducing server downtime due to maintenance. This is particularly important for server applications that require 24 / 7 uninterrupted operation. Furthermore, because plug assembly 704 reduces the risk of leakage during maintenance work, it also reduces long-term server maintenance costs.
[0058] The design of plug assembly 704 also provides greater flexibility for on-site server deployment and subsequent upgrades. During initial server installation, connecting the coolant supply system is simplified, eliminating the need to worry about complex piping connections. Furthermore, as server performance upgrades or cooling requirements change, the quick-plug and unplug feature of plug assembly 704 makes adjusting the liquid cooling system incredibly easy, allowing for rapid adaptation to changing cooling requirements and ensuring optimal server operation.
[0059] Furthermore, the server chassis also includes an air guide component 4 arranged in the chassis 1, and the air guide component 4 is arranged between the fan wall and the power board 8 to guide at least part of the airflow introduced into the chassis 1 from the air cooling module 2 to the central processing unit 6.
[0060] Specifically, if Figure 1 As shown, an air guide component 4 is also provided in the box body 1, and the air guide component 4 is arranged between the fan wall and the power board 8. The existence of the air guide component 4 is used to introduce at least part of the airflow introduced by the air cooling module 2 into the box body 1 to the central processing unit 6 to dissipate the heat of the central processing unit 6 again.
[0061] Figure 1In the internal structure of the server chassis shown, the air guide component 4 is set between the fan wall and the power board 8. The airflow generated by the fan wall is used to direct at least a portion of it to the location of the central processing unit 6. Since the central processing unit 6 is one of the largest heat sources inside the server, the liquid cooling module 7 alone may not be enough to cope with sudden high load conditions. In this case, the addition of air cooling becomes an effective auxiliary heat dissipation method. The air guide component 4 redistributes part of the airflow originally used to cool the power board 8 or other components to the central processing unit 6 area, which not only improves the utilization rate of heat dissipation resources, but also ensures heat dissipation redundancy in extreme situations, providing additional protection for the stable operation of the server.
[0062] The provision of air guide component 4 helps to establish a more balanced heat load distribution within the server. Heat generated by CPU 6 under high load can be efficiently dissipated by liquid cooling module 7. At the same time, the air cooling provided by air guide component 4 can alleviate performance bottlenecks that may arise from excessive use of the liquid cooling system, such as rapid temperature rise of the coolant. This combined liquid and air cooling design ensures that even when the power consumption of CPU 6 increases dramatically, the server can maintain a relatively stable temperature range, improving the overall reliability and durability of the system.
[0063] Furthermore, the air guide component 4 includes a first air guide portion 401 and a second air guide portion 402. The extension direction of the first air guide portion 401 is parallel to the extension direction of the fan wall. A set angle is formed between the extension direction of the second air guide portion 402 and the extension direction of the first air guide portion 401. The set angle is an obtuse angle, and the opening of the set angle is set away from the fan wall.
[0064] Specifically, the air guide component 4 includes a first air guide portion 401 and a second air guide portion 402. The first air guide portion 401 and the second air guide portion 402 are both air guide plates, and the first air guide portion 401 and the second air guide portion 402 are both vertically arranged in the box body 1. The extension direction of the first air guide portion 401 is arranged parallel to the extension direction of the fan wall. A set angle is formed between the extension direction of the second air guide portion 402 and the extension direction of the first air guide portion 401. The set angle is an obtuse angle, and the opening of the set angle is arranged away from the fan wall.
[0065] The first air guide 401 is arranged parallel to the fan wall. Its primary function is to guide the linear airflow generated by the fan, ensuring that the airflow effectively reaches the power board 8 and other important electronic components. Simultaneously, the second air guide 402 forms an obtuse angle with the first air guide 401, and its opening faces away from the fan wall. This design causes the airflow to deflect upon contact with the second air guide 402, allowing the majority of the airflow to be directed to the CPU 6. This further enhances the air cooling effect of the CPU 6 on top of liquid cooling. This air duct design optimizes the airflow path, improves the cooling efficiency of the air cooling system, and ensures uniform cooling of the heat source within the server.
[0066] The obtuse angle between the first and second air guides 401, 402, and the orientation of the second air guide 402's opening away from the fan wall provide a physical basis for dynamic airflow control. Under varying operating conditions, such as light or heavy server loads, the relative position or angle of the first and second air guides 401, 402 can be adjusted to flexibly control airflow distribution, ensuring that airflow effectively covers all heat sources, thereby enhancing the adaptability and flexibility of the server cooling system.
[0067] The first air guide portion 401 and the second air guide portion 402 arranged perpendicular to the box body 1 are more efficient in space utilization, reduce interference with other components inside the server, make the internal structure of the server chassis more compact, and improve space utilization.
[0068] By precisely controlling the airflow path, unnecessary energy consumption is avoided, reducing the overall power consumption of the server during operation. Furthermore, since air cooling systems are relatively inexpensive, optimizing the cooling effect by using the air guide component 4 can improve the server's heat dissipation performance without significantly increasing the server's manufacturing cost, achieving an effective balance between performance and cost.
[0069] Furthermore, a protruding mounting portion 403 is provided on the side of the second air guide portion 402 away from the air cooling module 2, and a locking hole is provided on the mounting portion 403. The server chassis also includes a locking piece used in conjunction with the locking hole, and the locking piece can be inserted into the locking hole to fix the air guide component 4 in the box body 1 through the cooperation of the locking piece and the locking hole.
[0070] Specifically, a mounting portion 403 is provided at the bottom of the second air guide portion 402 on the side away from the air cooling module 2. The mounting portion 403 protrudes from the second air guide portion 402. A locking hole is provided on the mounting portion 403. The locking hole is a threaded hole. The server chassis also includes a locking member used in conjunction with the locking hole. In this embodiment, the locking member can be a locking bolt, which can be inserted into the locking hole. The air guide component 4 is fixed in the box body 1 by the use of the locking bolt and the locking hole.
[0071] The mounting portion 403 is designed to protrude from the bottom of the second air guide portion 402 on the side away from the air cooling module 2. It is provided with a threaded locking hole that mates with a locking member (e.g., a locking bolt) within the server chassis. This design ensures that the air guide component 4 is securely fixed within the chassis 1, enhancing its positioning accuracy and structural stability.
[0072] The locking member adopts a locking bolt, which not only facilitates the installation of the air guide component 4, but also simplifies the removal process of the air guide component 4. Without the need for any special tools, maintenance personnel can adjust or replace the air guide component 4 by tightening or loosening the locking bolt, which significantly improves maintenance efficiency.
[0073] Furthermore, the guide component 3 includes: a first guide plate 301, on which a mounting component 302 for mounting on a fan wall is provided; a second guide plate 303, which is arranged on one side of the first guide plate 301, and a guide angle is formed between the second guide plate 303 and the first guide plate 301; a guide side plate 304, which is arranged between the first guide plate 301 and the second guide plate 303, so as to form a guide space with a guide air inlet together with the first guide plate 301 and the second guide plate 303.
[0074] like Figure 2 As shown, the guide component 3 includes a first guide plate 301, and a mounting component 302 for mounting with a fan wall is provided on the first guide plate 301. A second guide plate 303 is provided on one side of the first guide plate 301. The plane formed by the second guide plate 303 is perpendicular to the plane formed by the first guide plate 301, and the angle formed is the guide angle. The guide component 3 also includes a guide side plate 304, which is provided between the first guide plate 301 and the second guide plate 303, and together with the first guide plate 301 and the second guide plate 303, forms a guide space with a guide air inlet to guide the air flow introduced into the box body 1 by the air-cooling module 2.
[0075] like Figure 2 As shown, the guide component 3 forms a guide space with a specific guide air inlet. When the air cooling module 2 introduces cold air into the interior of the box 1, the first guide plate 301 and the second guide plate 303 work together to guide this part of the airflow to the air inlet of other fans.
[0076] The airflow redirection mechanism of air guide component 3 ensures more uniform airflow distribution within the server, avoiding excess airflow in some areas and insufficient airflow in others. This uniform airflow distribution helps improve heat dissipation efficiency, ensuring that all components within the server are in a well-cooled environment, thereby improving server operational stability and hardware lifespan.
[0077] Compared to adding more fans or fan wall area, the air guide component 3 improves cooling efficiency by optimizing the airflow path, reducing the need for additional heat dissipation resources, and lowering system complexity and cost. Especially in space-constrained server chassis, this design can fully utilize existing air cooling modules to achieve efficient heat dissipation, avoiding the additional cost and space occupied by additional heat dissipation equipment.
[0078] Furthermore, the number of the guide side plates 304 is at least two, the two guide side plates 304 are oppositely arranged on both sides of the first guide plate 301, and each guide side plate 304 is triangular in shape.
[0079] Specifically, in this embodiment, Figure 2 As shown, there are two guide side plates 304, which are respectively arranged on both sides of the first guide plate 301, and each guide side plate 304 is triangular in shape, and the two right-angled sides of the guide side plate 304 are respectively used to connect with the first guide plate 301 and the second guide plate 303.
[0080] The modular design of the air guide component 3 makes its installation and removal simple, and facilitates the adjustment of the airflow path during server maintenance and upgrades.
[0081] The arrangement of the two triangular guide side plates 304 and the first guide plate 301 and the second guide plate 303 enables the airflow introduced by the air-cooling module 2 to enter the guide component 3 when passing through the guide component 3, and to introduce the airflow entering the guide component 3 to the air inlets of other fans on the fan wall, thereby increasing the airflow entering areas with high heat dissipation requirements, such as the power board 8 and the central processing unit 6, thereby improving the heat dissipation efficiency and effect.
[0082] The triangular shape of the guide plates 304 helps enhance the directionality of the airflow and reduce turbulence generated when the airflow passes through the guide member 3. The right-angled sides of the triangle, combined with the first and second guide plates 301 and 303, provide a smoother transition path for the airflow, reducing airflow resistance and avoiding energy waste and reduced heat dissipation efficiency caused by turbulence, allowing the airflow to reach the target heat dissipation area in a more linear and stable manner.
[0083] The triangular design of each guide plate 304 not only helps guide airflow but also increases the structural stability of the guide component 3, reducing the risk of loosening or damage due to mechanical vibration. Furthermore, the arrangement of the two guide plates 304 fully utilizes the space within the server chassis, avoiding interference with other components and providing structural support for the compact design of the server.
[0084] Furthermore, the installation component 302 is protruding from the first guide plate 301, and a mounting channel is provided at a position of the fan wall corresponding to the installation component 302. The installation component 302 enters from the entrance of the mounting channel to install the guide component 3 on the fan wall.
[0085] Specifically, the mounting component 302 is arranged to protrude from the first guide plate 301, and the protruding direction of the mounting component 302 is away from the air inlet of the guide component 3. An mounting channel is provided at a position corresponding to the mounting component 302 on the fan wall. The mounting component 302 can enter through the inlet of the mounting channel and install the guide component 3 on the fan wall.
[0086] Mounting member 302 protrudes from first deflector plate 301, extending away from the air inlet of deflector member 3. This design allows deflector member 3 to be quickly aligned with the mounting channel on the fan wall during installation. The protruding mounting member 302 naturally guides deflector member 3 into the correct position when entering the mounting channel, eliminating the need for additional alignment. This greatly simplifies the installation process, improving productivity and accuracy.
[0087] The protruding mounting member 302 not only facilitates installation but also strengthens the connection between the air guide member 3 and the fan wall. During server operation, especially under high load and vibration conditions, this secure mounting prevents displacement of the air guide member 3, ensuring a consistent airflow path and thus maintaining effective cooling.
[0088] By designing the protruding mounting component 302 and the mounting channel on the fan wall, the installation of the guide component 3 is achieved without the need for additional fixing materials such as screws or clips. This not only reduces manufacturing costs but also reduces space occupancy. This design is particularly important when the internal space of the server chassis is extremely limited.
[0089] The mounting member 302, in conjunction with the mounting channel on the fan wall, simplifies the removal and maintenance of the air guide member 3. When maintenance or replacement of the air guide member 3 is required, maintenance personnel can easily remove the air guide member 3 through the inlet of the mounting channel, without the need for complex tools or a lengthy disassembly or installation process.
[0090] Furthermore, there are multiple mounting components 302 , and the multiple mounting components 302 are arranged at intervals along the arrangement direction of the two guide side plates 304 .
[0091] Furthermore, the mounting component 302 includes a mounting column 3021, the extension direction of the mounting column 3021 is perpendicular to the surface of the first guide plate 301, and the mounting component 302 also includes a mounting block 3022 arranged at one end of the mounting column 3021 away from the first guide plate 301, and the mounting block 3022 is used to limit the displacement of the mounting column 3021 in the mounting channel along the extension direction of the mounting column 3021.
[0092] Furthermore, the mounting block 3022 is annular, the mounting post 3021 is cylindrical, and the diameter of the mounting block 3022 is greater than the diameter of the mounting post 3021 .
[0093] Specifically, there are multiple mounting components 302, and the multiple mounting components are arranged at intervals along the arrangement direction of the two guide side plates 304. In this embodiment, there are two mounting components 302, and the two mounting components 302 are respectively arranged on the top of the first guide plate 301 and close to the two guide side plates 304. The mounting component 302 includes a mounting column 3021 extending away from the air guide port direction of the guide component 3, and the extension direction of the mounting column 3021 is perpendicular to the surface of the first guide plate 301. The mounting component 302 also includes a mounting block 3022 arranged at the end of the mounting column 3021. The mounting block 3022 is used to limit the displacement of the mounting column 3021 in the mounting channel along the extension direction of the mounting column 3021, that is, to limit the displacement of the guide component 3 along the extension direction of the mounting column 3021 in this application, wherein the mounting block 3022 is annular, the mounting column 3021 is cylindrical, and the diameter of the mounting block 3022 is set larger than the diameter of the mounting column 3021.
[0094] There are two mounting components 302, spaced apart along the arrangement of the guide side panels 304. By placing mounting components 302 atop the first guide panel 301, the guide panel 3 is securely mounted on the fan wall, preventing loosening or displacement caused by vibration. The mounting posts 3021 extend away from the air outlet of the guide panel 3, perpendicular to the surface of the first guide panel 301. This design minimizes direct obstruction to airflow and reduces resistance, ensuring smooth flow of cool air into the guide space and effectively improving heat dissipation efficiency.
[0095] Mounting block 3022 is located at the end of mounting post 3021. Its annular design matches the cylindrical structure of mounting post 3021, but its diameter is larger. This size difference allows mounting block 3022 to function as a displacement limiter within the mounting channel. Mounting block 3022 effectively prevents movement of mounting post 3021 along its extension direction, indirectly limiting the displacement of air guide component 3 and ensuring the stability of the airflow guidance path.
[0096] The mounting assembly 302, consisting of the mounting block 3022 and mounting post 3021, features a streamlined design that eliminates the need for additional fixings (such as screws and clips). This not only simplifies the installation process and reduces manufacturing costs, but also improves maintenance convenience. Maintenance personnel can easily remove or reinstall the flow guide assembly 3 through the mounting channel without the need for complex tools or lengthy maintenance.
[0097] The material selection and dimensional design of mounting post 3021 and mounting block 3022 ensure that mounting component 302 maintains its structural integrity despite the high temperatures and vibrations found in the server's internal environment. The combination of cylindrical and annular shapes not only creates a clean visual appearance but also provides a stable connection and displacement restriction, thereby increasing the durability and reliability of the system.
[0098] The design of mounting components 302 takes into account the compactness of the server's internal space and the flexibility of component layout. The combination of mounting posts 3021 and mounting blocks 3022 is compatible with current server architectures while also ensuring compatibility for future system upgrades or thermal management solution adjustments. The two mounting components 302 also ensure the accuracy of the installation direction and position of the flow guide component 3, allowing for rapid adaptation even when server structure or requirements change, enhancing the system's scalability and adaptability. Logical analysis shows that this design leaves ample room and support for the continued evolution of thermal management technology in the server field.
[0099] Furthermore, the liquid cooling module 7 also includes a limiting component 705 arranged in the box body 1, and the limiting component 705 includes a bearing portion 7051 and a locking portion 7052. The bearing portion 7051 has a first clamping end, and the locking portion 7052 has a first locking end. The first clamping end and the first locking end are engaged with each other to form a fixed space for fixing the liquid inlet pipe 702 and the liquid outlet pipe 703.
[0100] Specifically, the liquid cooling module 7 also includes a limiting component 705 arranged inside the box body 1, which is used to fix the liquid inlet pipe 702 and the liquid outlet pipe 703. The limiting component 705 includes a bearing part 7051 arranged in the box body 1, and the bearing part 7051 is fixed in the box body 1 by screws. It also includes a locking part 7052 used in conjunction with the bearing part 7051. One end of the locking part 7052 can be rotated relative to the bearing part 7051, and the free end of the locking part 7052 is provided with a snap-fitting protrusion. The bearing part 7051 is provided with a snap-fitting groove at a position corresponding to the snap-fitting protrusion. Through the cooperation of the bearing part 7051 and the locking part 7052, the liquid inlet pipe 702 and the liquid outlet pipe 703 can be limited.
[0101] The load-bearing portion 7051 of the limiting component 705 is fixed to the housing 1 via screws, while one end of the locking portion 7052 is rotatable relative to the load-bearing portion and has a snap-fitting protrusion at its free end that engages with a snap-fitting groove in the load-bearing portion 7051. This design ensures that the liquid inlet and outlet pipes 702 and 703 remain stable during server operation, preventing displacement or loosening of the pipes due to vibration, thereby reducing the risk of pipe leakage and ensuring the reliability of the liquid cooling system and the continuous operation of the server.
[0102] The mating design of the locking protrusion and the locking groove enables locking portion 7052 to easily secure and release the inlet and outlet pipes 702 and 703. During server maintenance or upgrades, maintenance personnel can quickly lock and unlock the pipes without complicated tools or time-consuming operations, simplifying the maintenance process and improving efficiency.
[0103] The integrated design of the retaining member 705, through its simple and effective structure, eliminates the need for additional fixing devices, reducing the manufacturing cost of the liquid cooling module 7. Furthermore, the coordinated use of the bearing portion 7051 and the locking portion 7052 simplifies the integration of the liquid cooling module 7 with other server components, reduces installation errors, and improves the overall cost-effectiveness of the system.
[0104] An embodiment of the present application further provides a server, including a server chassis, wherein the server chassis is the above-mentioned server chassis.
[0105] The above is a detailed introduction to a server provided by the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only intended to help understand the method and core ideas of the present application. It should be noted that, for those skilled in the art, without departing from the principles of the present application, several improvements and modifications may be made to the present application, and such improvements and modifications also fall within the scope of protection of the claims of the present application.
Claims
1. A server chassis, comprising: A box (1) for accommodating a central processing unit (6), characterized in that the server chassis further comprises: A liquid cooling module (7), the liquid cooling module (7) comprising a liquid cooling plate (701), a liquid inlet pipe (702) and a liquid outlet pipe (703), the liquid cooling plate (701) being in contact with the central processing unit (6), a cooling liquid flow channel being provided in the liquid cooling plate (701), the inlet of the cooling liquid flow channel being in communication with the liquid inlet pipe (702), and the outlet of the cooling liquid flow channel being in communication with the liquid outlet pipe (703), so as to cool the central processing unit (6) by the cooling liquid flowing through the cooling liquid flow channel.
2. The server chassis according to claim 1, wherein: The server chassis further comprises an air cooling module (2) comprising a fan. An air inlet and an air outlet are provided on the chassis (1). The fan is arranged inside the chassis (1) to introduce airflow outside the chassis (1) into the chassis (1) and to flow out through the air outlet.
3. The server chassis according to claim 2, wherein: The server chassis further comprises a power supply board (8) arranged in the box body (1); the air cooling module (2) further comprises a fan wall for carrying the fan; there are multiple fans; the fan wall is located in the box body (1); the air cooling module (2) further comprises: A flow guide component (3) is arranged at a position corresponding to the fan wall and the power supply board (8), and is arranged in sequence with the plurality of fans along the length direction of the fan wall; The guide component (3) has a guide air inlet, which is arranged away from the power board (8) to guide the air flow introduced from the air inlet by the multiple fans to the air inlets of other fans and then into the box (1).
4. The server chassis according to claim 1, wherein: The inlet of the liquid inlet pipe (702) and / or the outlet of the liquid outlet pipe (703) are provided with a plug component (704).
5. The server chassis according to claim 3, wherein: The server chassis further comprises an air guide component (4) disposed in the chassis (1), wherein the air guide component (4) is disposed between the fan wall and the power board (8) to guide at least part of the airflow introduced from the air cooling module (2) into the chassis (1) to the central processing unit (6).
6. The server chassis according to claim 5, wherein: The air guide component (4) comprises a first air guide portion (401) and a second air guide portion (402), the extension direction of the first air guide portion (401) is parallel to the extension direction of the fan wall, the extension direction of the second air guide portion (402) forms a set angle with the extension direction of the first air guide portion (401), the set angle is an obtuse angle, and the opening of the set angle is arranged away from the fan wall.
7. The server chassis according to claim 6, wherein: A protruding mounting portion (403) is provided on a side of the second air guide portion (402) away from the air cooling module (2), and a locking hole is provided on the mounting portion (403). The server chassis also includes a locking member used in conjunction with the locking hole, and the locking member can be inserted into the locking hole to fix the air guide component (4) in the box body (1) through the use of the locking member and the locking hole.
8. The server chassis according to claim 3, wherein: The flow guide component (3) comprises: a first guide plate (301), the first guide plate (301) being provided with a mounting component (302) for mounting on the fan wall; A second guide plate (303) is provided on one side of the first guide plate (301), and a guide angle is formed between the second guide plate (303) and the first guide plate (301); The guide side plate (304) is arranged between the first guide plate (301) and the second guide plate (303), so as to form a guide space having the guide air inlet together with the first guide plate (301) and the second guide plate (303).
9. The server chassis according to claim 8, wherein: The number of the guide side plates (304) is at least two, the two guide side plates (304) are relatively arranged on both sides of the first guide plate (301), and each of the guide side plates (304) is triangular in shape.
10. The server chassis according to claim 8, wherein: The mounting component (302) is arranged to protrude from the first guide plate (301), and a mounting channel is provided at a position of the fan wall corresponding to the mounting component (302). The mounting component (302) enters from the inlet of the mounting channel to mount the guide component (3) on the fan wall.
11. The server chassis according to claim 8, wherein: There are multiple mounting components (302), and the multiple mounting components (302) are arranged at intervals along the arrangement direction of the two guide side plates (304).
12. The server chassis according to claim 10, wherein: The mounting component (302) comprises a mounting column (3021), the extension direction of the mounting column (3021) being perpendicular to the surface of the first guide plate (301), and the mounting component (302) further comprises a mounting block (3022) arranged at an end of the mounting column (3021) away from the first guide plate (301), the mounting block (3022) being used to limit the displacement of the mounting column (3021) in the mounting channel along the extension direction of the mounting column (3021).
13. The server chassis according to claim 12, wherein: The mounting block (3022) is annular, the mounting column (3021) is cylindrical, and the diameter of the mounting block (3022) is greater than the diameter of the mounting column (3021).
14. The server chassis according to claim 1, wherein: The liquid cooling module (7) further includes a limiting component (705) arranged in the box body (1), the limiting component (705) including a bearing portion (7051) and a locking portion (7052), the bearing portion (7051) having a first clamping end, the locking portion (7052) having a first locking end, the first clamping end and the first locking end being engaged with each other to form a fixed space for fixing the liquid inlet pipe (702) and the liquid outlet pipe (703).
15. A server, comprising a server chassis, characterized in that: The server chassis is the server chassis according to any one of claims 1 to 14.