Wafer packaging device

Abstract

The utility model provides a wafer packaging device, which is used for pressing a packaging film on a wafer body and comprises a conveying device and a pressing device. The conveying equipment comprises a clamping piece, a conveying belt and a plurality of conveying wheels, the conveying belt is wound on the conveying wheels, a packaging film is assembled on the conveying belt and comprises a first film layer and a second film layer which are arranged in an overlapped mode, the clamping piece has the moving direction close to or away from the conveying belt, and the clamping piece is used for clamping the first film layer. Separating the first film layer from the second film layer; the pressing equipment comprises an upper cover plate and a lower cover plate, the upper cover plate has the moving direction close to or away from the lower cover plate, the lower cover plate is provided with a pressing station facing the upper cover plate, the pressing station is provided with a wafer body, the second film layer is movably assembled on the lower cover plate and arranged between the upper cover plate and the wafer body, and the upper cover plate is provided with a cutting piece facing the lower cover plate. Therefore, the exposure time of the second film layer is controlled, the pollution risk is reduced, the surface quality is prevented from being damaged, and the packaging effect of the wafer body is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of wafer packaging, and in particular relates to a wafer packaging device. Background Art

[0002] Wafer packaging is an important step in the wafer manufacturing process. Wafers are usually made of materials such as silicon, which are easily affected by oxidation. Wafers will be contaminated by dust, pollutants, chemical gases, etc. during the manufacturing process. The sealing film can effectively protect the wafer surface from external pollutants, ensure the cleanliness and flatness of the wafer surface, and facilitate subsequent process steps and device performance.

[0003] The wafer packaging device in the related technology will peel off the release film of the packaging film in advance and then transfer it to the wafer body. During the process, the sealing film layer of the peeled release film is always exposed to the outside, which poses a risk of contamination. At the same time, during the loading and unloading process of the wafer body, there is a loading and unloading gap. In the loading and unloading gap, the exposed sealing film layer also has a contamination risk, resulting in poor wafer packaging effect. Utility Model Content

[0004] The technical purpose of the present utility model is to provide a wafer packaging device, aiming to solve the problem that the sealing film layer of the packaging film is exposed for too long, resulting in poor wafer packaging effect.

[0005] In order to solve the above technical problems, the present invention is implemented as follows: a wafer packaging device for pressing a packaging film on a wafer body, comprising a conveying device and a pressing device; wherein,

[0006] The conveying device includes a clamping member, a conveyor belt, and a plurality of conveyor wheels. The conveyor belt is wound around each of the conveyor wheels. The packaging film is mounted on the conveyor belt. The packaging film includes a first film layer and a second film layer that are stacked. The clamping member has a movement direction of approaching or moving away from the conveyor belt. The clamping member is used to clamp the first film layer to separate the first film layer from the second film layer.

[0007] The pressing device includes an upper cover plate and a lower cover plate, the upper cover plate has a movement direction close to or away from the lower cover plate, the lower cover plate is provided with a pressing station arranged toward the upper cover plate, the pressing station is provided with the wafer body, the second film layer is movably assembled on the lower cover plate and is provided between the upper cover plate and the wafer body, and the upper cover plate is provided with a cutting piece toward the lower cover plate.

[0008] In some embodiments of the present invention, the clamping member includes a first clamp and a second clamp, the first clamp has a movement direction approaching or moving away from the second clamp, the surface area of the first clamp is larger than the surface area of the second clamp, when the first clamp is away from the second clamp, the first clamp abuts the first film layer, when the first clamp is close to the second clamp, the first clamp and the second clamp clamp the first film layer.

[0009] In some embodiments of the present invention, a plurality of ribs arranged at intervals are provided on a side of the second splint close to the first splint.

[0010] In some embodiments of the present invention, the conveying device also includes a mounting bracket and a recovery reel rotatably connected to the mounting bracket, the first film layer is doped with magnetic powder, and an elastic electromagnet is provided between the clamping member and the recovery reel, and the elastic electromagnet has a connected state and a bent state. When the elastic electromagnet is in the connected state, the two ends of the elastic electromagnet are respectively connected to the clamping member and the mounting bracket, and when the elastic electromagnet is in the bent state, the clamping member releases the first film layer, the elastic electromagnet turns on and attracts the first film layer, and the end of the elastic electromagnet connected to the clamping member is bent toward the recovery reel.

[0011] In some embodiments of the present invention, the first clamping plate is provided with a guide groove, and one end of the elastic electromagnet is disposed in the guide groove.

[0012] In some embodiments of the present invention, a card interface is provided on the recovery reel, and one end of the first film layer is plugged into and fitted with the card interface.

[0013] Compared with the prior art, the wafer packaging device in this utility model has the following beneficial effects:

[0014] The first film layer of the packaging film is a release film, and the second film layer is used to encapsulate the wafer body. Through the action of the clamping part, the device can accurately separate the first film layer and the second film layer of the packaging film, thereby controlling the exposure time of the second film layer, reducing the risk of contamination, and effectively protecting the wafer surface in the subsequent packaging process, avoiding damage to the surface quality, and improving the packaging effect of the wafer body. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a side view of the elastic electromagnet in the wafer packaging device in one embodiment of the present invention in a connected state;

[0016] Figure 2 for Figure 1 A side view of the elastic electromagnet in a mid-wafer packaging device in a bent state;

[0017] Figure 3 for Figure 1 A schematic diagram of part of the structure of the conveying equipment in the wafer packaging device;

[0018] Figure 4 for Figure 1 Schematic diagram of the structure of the pressing equipment in the wafer packaging device.

[0019] In the accompanying drawings, each reference numeral represents:

[0020] 100. Wafer packaging device; 11. Conveying equipment; 111. Mounting bracket; 112. Clamping member; 1121. First clamping plate; 1122. Second clamping plate; 113. Conveyor belt; 114. Conveying wheel; 115. Recovery reel; 1151. Card interface; 116. Elastic electromagnet; 1161. First end; 1162. Second end; 12. Pressing equipment; 121. Upper cover plate; 122. Lower cover plate; 1221. Pressing station. DETAILED DESCRIPTION

[0021] The following describes in detail embodiments of the present invention, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0022] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "circumferential", "radial", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0023] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of this utility model, "plurality" means two or more, unless otherwise specifically defined.

[0024] Please refer to Figures 1 to 4 The present invention proposes a wafer packaging device 100 for pressing a packaging film on a wafer body, comprising a conveying device 11 and a pressing device 12; wherein the conveying device 11 comprises a clamping member 112, a conveyor belt 113 and a plurality of conveyor wheels 114, the conveyor belt 113 is wound around each conveyor wheel 114, and a packaging film is mounted on the conveyor belt 113, the packaging film comprising a first film layer and a second film layer stacked together, the clamping member 112 has a movement direction of approaching or moving away from the conveyor belt 113, and the clamping member 112 has a movement direction of approaching or moving away from the conveyor belt 113. 2 is used to clamp the first film layer to separate the first film layer from the second film layer; the pressing device 12 includes an upper cover plate 121 and a lower cover plate 122, the upper cover plate 121 has a movement direction of approaching or moving away from the lower cover plate 122, the lower cover plate 122 is provided with a pressing station 1221 arranged toward the upper cover plate 121, and a wafer body is provided on the pressing station 1221, the second film layer is movably assembled on the lower cover plate 122 and is provided between the upper cover plate 121 and the wafer body, and the upper cover plate 121 is provided with a cutting piece facing the lower cover plate 122.

[0025] The first layer of the packaging film is a release film, and the second layer is used to encapsulate the wafer. The second layer can be made of materials such as epoxy resin, polyimide, and polyamide. The second layer has excellent mechanical properties and chemical resistance and is used to protect the wafer. Through the action of the clamping member 112, the device can accurately separate the first and second layers of the packaging film, thereby controlling the exposure time of the second layer, reducing the risk of contamination, and effectively protecting the wafer surface during the subsequent packaging process, preventing surface damage.

[0026] Please refer to Figure 4 , the clamping member 112 drives the packaging film to separate, and cooperates with the upper and lower cover plates 122 to press the wafer body and the second film layer, thereby improving the overall efficiency of the packaging process and reducing the need for manual intervention. Since the second film layer is directly assembled on the lower cover plate 122 and finally pressed with the wafer body, this helps to ensure good adhesion and sealing between the packaging film and the wafer body, thereby improving the overall quality of the packaged product. As an integrated device, the wafer packaging device 100 integrates multiple steps such as conveying, separation, pressing and cutting, which improves the degree of automation of the packaging process and provides a more efficient and reliable packaging solution for integrated circuit manufacturing.

[0027] Specifically, the clamping member 112 includes a first clamping plate 1121 and a second clamping plate 1122. The first clamping plate 1121 has a movement direction close to or away from the second clamping plate 1122. The surface area of the first clamping plate 1121 is greater than the surface area of the second clamping plate 1122. When the first clamping plate 1121 is away from the second clamping plate 1122, the first clamping plate 1121 abuts against the first film layer. When the first clamping plate 1121 is close to the second clamping plate 1122, the first clamping plate 1121 and the second clamping plate 1122 clamp the first film layer.

[0028] The first clamping plate 1121 has a larger surface area. The first clamping plate 1121 first contacts the first film layer on the conveyor belt 113. The first film layer is separated from the second film layer by the thrust. The first film layer is guided by the first clamping plate 1121 into the space enclosed by the first clamping plate 1121 and the second clamping plate 1122. The first clamping plate 1121 and the second clamping plate 1122 move close to each other, thereby clamping the first film layer and continuously pulling the first film layer and the second film layer to separate.

[0029] When first clamping plate 1121 moves away from second clamping plate 1122, its larger surface area allows it to quickly and accurately contact the first film layer and initiate separation, which helps improve the efficiency of the entire packaging process. Furthermore, the larger surface area of first clamping plate 1121 disperses pressure on the first film layer, reducing the risk of damage, which is particularly important when processing thin or fragile materials. The movement of first clamping plate 1121 and second clamping plate 1122 toward and away from each other can be achieved through a precision control system, making the clamping and release of the first film layer even more precise, thereby improving the accuracy of the packaging film separation process.

[0030] To enhance friction between the first and second plates 1121, 1122, the second plate 1122 is equipped with multiple, spaced ribs on its side, adjacent to the first plate 1121. These ribs increase the roughness and friction of the clamping surface, thereby enhancing the secure grip. When the first and second plates 1121, 1122 clamp the first film, the ribs provide better friction against the film surface, preventing it from slipping or loosening and strengthening the grip.

[0031] The spaced arrangement of the ribs helps evenly distribute the pressure from the clamping surface on the film. By providing multiple ribs on the side and arranging them at regular intervals, the clamping force can be evenly distributed across the film surface, preventing damage to the film from excessive local pressure. The rib design increases the contact area between the clamping surface and the film, improving suitability for packaging films of different materials and thicknesses. Whether for thin or thick films, the ribs effectively increase the clamping force and ensure stable and reliable clamping. The rib arrangement design takes into account potential damage and deformation of the film during the clamping process. The even distribution and appropriate rib shape can reduce damage to the film and prevent unnecessary deformation during the clamping process.

[0032] Furthermore, the first clamping plate 1121 is provided with grooves arranged at intervals at the overlapping position with the second clamping plate 1122, and each groove and each rib can be plugged into and matched with each other to further improve the fastening force between the first clamping plate 1121 and the second clamping plate 1122, and to strengthen the clamping force of the first film layer.

[0033] In this embodiment, the wafer packaging apparatus 100 may further include a laser cutting device (not shown), with an output port of the laser cutting device directed toward the first clamping plate 1121. When no wafer is assembled on the pressing station 1221, the first clamping plate 1121 and the second clamping plate 1122 are positioned close together to clamp the first film layer. The laser cutting device then emits a laser directed toward the first film layer and cuts it, allowing the first film layer to remain attached to the second film layer. This reduces the exposure time of the second film layer of the packaging film and reduces the risk of contamination.

[0034] Please refer to Figure 1 and Figure 2 In this embodiment, the conveying device 11 also includes a mounting bracket 111 and a recovery reel 115 rotatably connected to the mounting bracket 111. The first film layer is doped with magnetic powder. An elastic electromagnet 116 is provided between the clamping member 112 and the recovery reel 115. The elastic electromagnet 116 has a connected state and a bent state. When the elastic electromagnet 116 is in the connected state, the two ends of the elastic electromagnet 116 are respectively connected to the clamping member 112 and the mounting bracket 111. When the elastic electromagnet 116 is in the bent state, the clamping member 112 releases the first film layer, the elastic electromagnet 116 turns on and attracts the first film layer, and the end of the elastic electromagnet 116 connected to the clamping member 112 bends toward the recovery reel 115.

[0035] The elastic electromagnet 116 is magnetic when energized, and can generate attraction to the first film layer doped with magnetic powder. Moreover, the first film layer doped with magnetic powder can be used to shield electromagnetic interference, effectively reducing the interference of external electromagnetic fields on the equipment, and improving the performance and stability of the wafer packaging device 100.

[0036] The elastic electromagnet 116 bends, driving the first film layer from the clamping member 112 to the recovery reel 115. As the recovery reel 115 rotates, the first film layer is rolled up and recycled. The elastic electromagnet 116 has the characteristic of automatically returning to a connected state from a bent state, preparing for the next release. This design simplifies the connection and release process between the clamping member 112 and the recovery reel 115, improving operational efficiency. Operators can easily install and replace the clamping member 112, saving time and labor costs. At the same time, when the elastic electromagnet 116 is in the bent state, a certain tension and connection are formed between the clamping member 112 and the recovery reel 115, making the release action of the clamping member 112 more stable. This helps ensure that the packaging film remains stable during transportation, avoiding damage to the film layer or poor transportation caused by looseness between the clamping member 112 and the recovery reel 115.

[0037] Specifically, first clamping plate 1121 is provided with a guide groove, into which one end of elastic electromagnet 116 is disposed. The guide groove facilitates the transition of the first film layer from first clamping plate 1121 to elastic electromagnet 116, facilitating the elastic electromagnet 116 to drive the first film layer to the recovery reel 115, thereby improving the recovery efficiency of the first film layer.

[0038] When a wafer is assembled on the pressing station 1221, the first clamping plate 1121 of the clamping member 112 rotates away from the second clamping plate 1122, the first film layer of the packaging film abuts the first clamping plate 1121 and is separated from the second film layer, the first film layer enters between the first clamping plate 1121 and the second clamping plate 1122, the first clamping plate 1121 then rotates closer to the second clamping plate 1122, the first clamping plate 1121 and the second clamping plate 1122 clamp the first film layer and continuously tighten it, and the first film layer is accumulated.

[0039] The elastic electromagnet 116 includes a first end 1161 and a second end 1162. The first end 1161 is connected to the guide groove of the first clamping plate 1121, and the second end 1162 is mounted on the mounting bracket 111. As the first clamping plate 1121 rotates, the first end 1161 disengages from the guide groove and bends toward the recovery reel 115. To allow the accumulated first film layer to be wound around the recovery reel 115, the first clamping plate 1121 rotates away from the second clamping plate 1122, thereby releasing the first film layer. Simultaneously, the elastic electromagnet 116 is energized, attracting the accumulated first film layer to unfold into the guide groove and adhere to the side of the first end 1161 away from the bottom of the guide groove. As the first clamping plate 1121 continues to rotate, the first end 1161 moves along an arc-shaped trajectory, driving the first film layer to the recovery reel 115.

[0040] The first clamping plate 1121 and the elastic electromagnet 116 cooperate to guide the first film layer as it winds around the recovery reel 115, effectively preventing excessive accumulation of the first film layer and eliminating potential malfunctions. The mechanical structure is compact, and the elastic electromagnet 116 effectively guides the clamping member 112 and the recovery reel 115, eliminating the need for manual guidance of the first film layer for recovery and improving the efficiency and automation of the conveyor 11.

[0041] In this embodiment, the first clamping plate 1121 and the second clamping plate 1122 are cross-rotatingly connected. As the first clamping plate 1121 moves away from the second clamping plate 1122, the first clamping plate 1121 drives the elastic electromagnet 116 away from the second clamping plate 1122 and bends toward the recovery reel 115. When the clamping member 112 needs to clamp the first film layer, the elastic electromagnet 116 can also push the first clamping plate 1121 close to the second clamping plate 1122. The two cooperate with each other, simplifying the connection structure and improving the transmission efficiency of the device.

[0042] Furthermore, the conveying device 11 may be provided with a movable handle rotatably connected to the mounting bracket 111, and the first clamping plate 1121 of the clamping member 112 may be slidably assembled with the movable handle. As the movable handle rotates, the movable handle gradually drives the first clamping plate 1121 to rotate and slide with the first clamping plate 1121. The rotation of the first clamping plate 1121 drives the elastic electromagnet 116 from a connected state to a bent state. Under normal circumstances, the rotation of the first clamping plate 1121 can be achieved by a motor. In the event of a motor failure or manual intervention, the movable handle can be used to regulate the movement of the first clamping plate 1121, thereby improving the stability of the movement of the first clamping plate 1121 and the second clamping plate 1122, reducing the operating error of the clamping member 112 on the packaging film, and improving the packaging effect and stability of the wafer packaging device 100.

[0043] Please refer to Figure 3 In this embodiment, the recycling reel 115 is provided with a snap-in interface 1151, into which one end of the first film layer is plugged. The first film layer is plugged into the snap-in interface 1151 by the bending of the elastic electromagnet 116. As the recycling reel 115 rotates, the first film layer curls, preventing it from loosening or falling off due to movement, thus ensuring operational stability and reliability. The first film layer is flexible, creating an interference fit with the snap-in interface 1151, enhancing the connection strength between the first film layer and the recycling reel 115. The recycling reel 115 may also be provided with a retaining groove to prevent the first film layer from falling out.

[0044] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A wafer packaging device for pressing a packaging film onto a wafer body, characterized in that: Including conveying equipment and pressing equipment; wherein, The conveying device includes a clamping member, a conveyor belt, and a plurality of conveyor wheels. The conveyor belt is wound around each of the conveyor wheels. The packaging film is mounted on the conveyor belt. The packaging film includes a first film layer and a second film layer that are stacked. The clamping member has a movement direction of approaching or moving away from the conveyor belt. The clamping member is used to clamp the first film layer to separate the first film layer from the second film layer. The pressing device includes an upper cover plate and a lower cover plate, the upper cover plate has a movement direction close to or away from the lower cover plate, the lower cover plate is provided with a pressing station arranged toward the upper cover plate, the wafer body is provided on the pressing station, the second film layer is movably assembled on the lower cover plate and is provided between the upper cover plate and the wafer body, and the upper cover plate is provided with a cutting piece toward the lower cover plate.

2. The wafer packaging device according to claim 1, wherein: The clamping member includes a first clamping plate and a second clamping plate, the first clamping plate has a movement direction close to or away from the second clamping plate, the surface area of the first clamping plate is larger than the surface area of the second clamping plate, when the first clamping plate is away from the second clamping plate, the first clamping plate abuts the first film layer, and when the first clamping plate is close to the second clamping plate, the first clamping plate and the second clamping plate clamp the first film layer.

3. The wafer packaging device according to claim 2, wherein: A plurality of convex ribs arranged at intervals are provided on a side surface of the second splint close to the first splint.

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