Encapsulation feeding frame capable of effectively preventing chip frame from collapsing

Abstract

The utility model provides a packaging feeding frame capable of effectively preventing a chip frame from collapsing. The packaging feeding frame comprises a frame body and a plurality of material lifting frames, a plurality of hollow-out areas are uniformly arranged on the rack body, the hollow-out areas are of square structures, and the edge positions of the hollow-out areas are sunken downwards to form step frames; the material lifting frame is inserted into the step frame; a plurality of first supporting ribs are arranged on the inner walls of the two sides of the material lifting frame in an annular array mode. The root part of the first supporting rib is provided with a pin, and the position of the pin on the first supporting rib is matched with the jack on the chip frame. A plurality of second supporting ribs are arranged on the inner walls of the two ends of the material lifting frame in a rectangular array mode. The first supporting ribs are perpendicular to the inner wall of the lifting frame in the length direction. The second supporting ribs are perpendicular to the inner wall of the material lifting frame in the width direction. According to the utility model, the chip frame is placed on the feeding frame, so that no product collapses and deforms, and the product cannot be separated even if vibration is generated in the feeding process.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor chip processing, in particular to an encapsulation loading rack which can effectively prevent a chip frame from sagging. Background Art

[0002] Chip-on-frame encapsulation is a form of chip packaging. It involves placing, attaching, and connecting the chip to a frame, then encapsulating and securing it with a plastic insulating medium to create a three-dimensional structure. A chip package is a housing for semiconductor integrated circuit chips, designed to protect them for stable and reliable operation under various environmental and operating conditions. While various packaging methods exist, chip-on-frame encapsulation is a common type. In this packaging method, the chip is attached and fixed to a frame, then connected and encapsulated through a series of process steps to form a complete three-dimensional structure. This packaging method offers numerous advantages, such as good heat dissipation and ease of installation and removal, making it widely used in various electronic devices.

[0003] At present, chip frame encapsulation requires a loading rack. The original loading rack product carrier is short, the product load is poor, the product is prone to collapse and deformation, and the vibration during the loading process can easily cause one side of the product to detach from the loading frame carrier. The reset process requires manual contact to reset the product, which has the risk of causing product quality problems.

[0004] In view of the above-mentioned prior art, it is desired to provide a packaging loading rack that can effectively prevent the chip frame from sagging. Utility Model Content

[0005] The utility model aims to provide an encapsulation loading rack which can effectively prevent chip frames from sagging. When the chip frames are placed on the loading rack, there is no product sagging or deformation. Even if vibration occurs during the loading process, the products will not fall off.

[0006] A packaging loading rack that effectively prevents chip frames from sagging, comprising a rack body and a plurality of lifting frames;

[0007] The frame is evenly provided with a plurality of hollow areas, each of which is a square structure, and the edges of the hollow areas are concave downward to form a step frame;

[0008] The number of the material lifting frames is equal to the number of the hollow areas, the size of the material lifting frames is adapted to the step frames in the hollow areas, and the material lifting frames are inserted into the step frames;

[0009] A plurality of first supporting ribs are provided on both inner walls of the lifting frame in a circular array, and the distance between two adjacent first supporting ribs is equal to the distance between two longitudinally adjacent workstations on the chip frame;

[0010] A pin is provided at the root of the first supporting rib, and the position of the pin on the first supporting rib is adapted to the socket on the chip frame;

[0011] A plurality of second supporting ribs are provided on the inner walls of both ends of the material lifting frame in a rectangular array, and the spacing between two adjacent second supporting ribs is equal to the spacing between two adjacent stations on the chip frame;

[0012] The first supporting rib is perpendicular to the inner wall of the lifting frame in the longitudinal direction;

[0013] The second supporting rib is perpendicular to the inner wall of the lifting frame in the width direction;

[0014] Two first handles are provided at one end of the outer side of the frame.

[0015] Preferably, a plurality of inserting posts are provided at the bottom of the step frame, and the material lifting frame is inserted into the step frame through the inserting posts.

[0016] Preferably, the length of the first supporting rib is 1 / 4 of the chip frame, and the length of the second supporting rib is 1 / 8 of the chip frame.

[0017] Preferably, the frame is provided with a cover, and the cover is adapted to the frame;

[0018] Positioning pins are provided at the corners of the upper surface of the frame, and the cover is plugged into the positioning pins.

[0019] Furthermore, the cover body is provided with two second handles, and the frame body is provided with grooves at positions corresponding to the two handles, and the second handles are inserted into the grooves.

[0020] Compared with the prior art, the semiconductor chip mounting machine conveying device of the present invention has the following advantages:

[0021] (1) The chip frame has good bearing capacity, and there is no product collapse or deformation. Even if vibration occurs during the loading process, the product will not fall off. The product remains in the correct loading position and does not need to be reset, avoiding product quality risks caused by human contact;

[0022] (2) Simple structure and easy to use. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 Schematic diagram of the structure of the frame in this embodiment;

[0024] Figure 2 This is a schematic diagram of the structure of a packaging loading rack that effectively prevents the chip frame from sagging in this embodiment. Figure 1 ;

[0025] Figure 3 for Figure 2 A partial enlarged view of the middle A;

[0026] Figure 4 This is a schematic structural diagram of a packaging loading rack that effectively prevents chip frames from sagging, without a cover in this embodiment;

[0027] Figure 5 This is a schematic diagram of the structure of a packaging loading rack that effectively prevents the chip frame from sagging in this embodiment. Figure 2 . DETAILED DESCRIPTION

[0028] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0029] A packaging loading rack which effectively prevents a chip frame from sagging comprises a rack body 1 and a plurality of lifting frames 2.

[0030] like Figure 1 As shown, a plurality of hollow areas 3 are evenly arranged on the frame 1 . The hollow areas 3 are square structures, and the edges of the hollow areas 3 are recessed downward to form step frames 4 .

[0031] like Figure 2 As shown, the number of the material lifting frames 2 is equal to the number of the hollow areas 3 , the size of the material lifting frames 2 is adapted to the step frames 4 in the hollow areas 3 , and the material lifting frames 2 are inserted into the step frames 4 .

[0032] In this embodiment, a plurality of plug posts 5 are provided at the bottom of the step frame 4, and the material lifting frame 2 is inserted into the step frame 4 through the plug posts 5; such a setting plays a certain positioning role and prevents the material lifting frame 2 from moving in the step frame 4.

[0033] A plurality of first supporting ribs 6 are provided on both sides of the inner wall of the lifting frame 2 in a circular array, and the distance between two adjacent first supporting ribs 6 is equal to the distance between two adjacent longitudinal stations on the chip frame; Figure 3 As shown, a pin 7 is provided at the root of the first supporting rib 6 , and the position of the pin 7 on the first supporting rib 6 is adapted to the socket on the chip frame.

[0034] A plurality of second supporting ribs 8 are provided on the inner walls at both ends of the material lifting frame 2 in a rectangular array. The distance between two adjacent second supporting ribs 8 is equal to the distance between two adjacent stations on the chip frame.

[0035] The first supporting ribs 6 are perpendicular to the inner wall of the material lifting frame 2 in the length direction; the second supporting ribs 8 are perpendicular to the inner wall of the material lifting frame 2 in the width direction.

[0036] Two first handles 9 are provided at one end of the outer side of the frame 1 for easy grasping by staff.

[0037] In this embodiment, the length of the first supporting rib 6 is 1 / 4 of the chip frame, and the length of the second supporting rib 8 is 1 / 8 of the chip frame. On the one hand, the first supporting rib 6 and the second supporting rib 8 of the lifting frame assist the step frame 4 in supporting the chip frame, so that the product is well supported and there is no collapse or deformation of the product. On the other hand, it is also convenient for the encapsulated chip frame to be separated from the lifting frame.

[0038] In this embodiment, the frame 1 is provided with a cover 10, which fits snugly within the frame 1. Positioning pins 11 are located at the corners of the frame 1's top surface, and the cover 10 is inserted into these pins. This compresses the edges of the chip frame to prevent it from shaking during packaging. Even if vibrations occur during the loading process, the product will not fall off the carrier sheet and will remain in the correct loading position, eliminating the need for resetting and preventing potential product quality risks from human contact.

[0039] Furthermore, if Figure 4 and Figure 5 As shown, the cover body 10 is provided with two second handles 12, and the frame body 1 is provided with grooves 13 at the positions corresponding to the two second handles. The second handles 12 are inserted into the grooves 13, which makes it easier for staff to transport the loading rack later.

[0040] When encapsulating the chip frame, first insert the lifting frame 2 into the step frame 4, place the chip frame loaded with chips to be encapsulated on the lifting frame 2, and insert the pins 7 into the sockets on the chip frame, and finally cover the cover 10.

[0041] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are illustrative and cannot be understood as limitations on the present invention. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present invention.

Claims

1. A packaging loading rack that effectively prevents chip frames from sagging, characterized in that: It includes a frame and several lifting frames; The frame is evenly provided with a plurality of hollow areas, each of which is a square structure, and the edges of the hollow areas are concave downward to form a step frame; The number of the material lifting frames is equal to the number of the hollow areas, the size of the material lifting frames is adapted to the step frames in the hollow areas, and the material lifting frames are inserted into the step frames; A plurality of first supporting ribs are provided on both inner walls of the lifting frame in a circular array, and the distance between two adjacent first supporting ribs is equal to the distance between two longitudinally adjacent workstations on the chip frame; A pin is provided at the root of the first supporting rib, and the position of the pin on the first supporting rib is adapted to the socket on the chip frame; A plurality of second supporting ribs are provided on the inner walls of both ends of the material lifting frame in a rectangular array, and the spacing between two adjacent second supporting ribs is equal to the spacing between two adjacent stations on the chip frame; The first supporting rib is perpendicular to the inner wall of the lifting frame in the longitudinal direction; The second supporting rib is perpendicular to the inner wall of the lifting frame in the width direction; Two first handles are provided at one end of the outer side of the frame.

2. The encapsulation loading rack that effectively prevents chip frames from sagging as claimed in claim 1, characterized in that: A plurality of inserting posts are provided at the bottom of the step frame, and the material lifting frame is inserted into the step frame through the inserting posts.

3. The encapsulation loading rack that effectively prevents chip frames from sagging as claimed in claim 1, characterized in that: The length of the first supporting rib is 1 / 4 of the chip frame, and the length of the second supporting rib is 1 / 8 of the chip frame.

4. A packaging loading rack that effectively prevents chip frames from sagging as claimed in any one of claims 1 to 3, characterized in that: The frame is provided with a cover, and the cover is adapted to the frame; Positioning pins are provided at the corners of the upper surface of the frame, and the cover is plugged into the positioning pins.

5. The encapsulation loading rack that effectively prevents chip frames from sagging as claimed in claim 4, characterized in that: The cover body is provided with two second handles, and the frame body is provided with grooves at positions corresponding to the two handles, and the second handles are inserted into the grooves.

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