Insulated gate bipolar transistor (IGBT) insulation module heat dissipation structure

Abstract

The utility model discloses a heat radiation structure of an IGBT insulation module, and belongs to the technical field of heat radiation structures. The IGBT insulation module heat dissipation structure comprises a lower insulation frame, a bracket is installed at the bottom end of the inner side of the lower insulation frame, a ceramic plate is arranged at the top end of the bracket, IGBT modules are arranged on the two sides of the top end of the ceramic plate, an upper insulation frame is arranged on the outer sides of the IGBT modules, first positioning grooves are formed in the middles of the two sides of each IGBT module, and first positioning holes are formed in the bottom ends of the first positioning grooves. A first positioning groove is formed in the insulating frame, a positioning block is arranged on the inner side of the first positioning groove, a first positioning column is fixedly connected to one side of the bottom end of the positioning block, and the outer side of the first positioning column is connected with the inner side of the first positioning hole in an inserted mode. The whole mounting plane falls on the bracket of the lower insulating frame, so that the contact area is increased, the stress is more uniform, the screws are prevented from being broken, and the practical value is higher.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation structures, in particular to an IGBT insulation module heat dissipation structure. Background Art

[0002] In a 10kV all-in-one machine, the electrical clearance needs to be controlled at more than 100mm and the creepage distance needs to be controlled at more than 140mm. However, due to the limitations of the working environment, the all-in-one machine generally requires the size to be as small as possible. In the all-in-one machine frequency conversion, IGBT is the main power device and its number is relatively large. If it is designed in full accordance with the electrical clearance of 100mm and the creepage distance of 140, the size of the frequency conversion part will become very large. Therefore, the solution adopted is to make an insulating frame to wrap the IGBT. IGBT generates heat during operation. Conventional 1140V and 3300V IGBTs will be laid under water channels. While the 10KV product IGBT insulation module is wrapped, its bottom needs to be covered with alumina and aluminum nitride ceramic plates with relatively good heat dissipation performance, and then water channels are opened at the corresponding positions of the water cooling plate. This meets both insulation requirements and heat dissipation requirements. During the manufacturing process of the insulation module, the bottom ceramic has poor processing performance and is relatively brittle. The previous practice was to drill bolt holes in the ceramic plate and then fix it to the insulation module with non-metallic screws. However, due to the tight fit of the ceramic plate with the water-cooling plate and its limited thickness, the bolt head needs to be completely sunken into the ceramic plate, which limits the size of the bolt. In addition, non-metallic bolts are required. During actual use, the bolts connecting the ceramic plate and the insulation module at the bottom are prone to breakage.

[0003] Therefore, in view of this, the existing structure and defects are studied and improved, and an IGBT insulation module heat dissipation structure is provided to achieve a purpose with greater practical value. Utility Model Content

[0004] The purpose of the present utility model is to provide an IGBT insulation module heat dissipation structure to solve the problem that the existing IGBT insulation module heat dissipation structure proposed in the above background technology needs to be tightly fitted with a water-cooled plate during use, and the thickness is also limited. The bolt head needs to be completely sunken into the ceramic plate, the size of the bolt is restricted, and the bolt needs to be a non-metallic bolt. In actual use, the bolts connecting the ceramic plate and the insulation module at the bottom are prone to breakage.

[0005] In view of the above problems, the technical solution proposed by the present invention is:

[0006] A heat dissipation structure of an IGBT insulation module, comprising a lower insulation frame, a bracket is installed at the inner bottom end of the lower insulation frame, a ceramic plate is provided at the top of the bracket, IGBT modules are provided on both sides of the top of the ceramic plate, an upper insulation frame is provided on the outside of the IGBT module, a first positioning groove is provided in the middle of both sides of the IGBT module, a first positioning hole is provided at the bottom end of the first positioning groove, a positioning block is provided on the inside of the first positioning groove, a first positioning column is fixedly connected to one side of the bottom end of the positioning block, the outer side of the first positioning column and the inner side of the first positioning hole are plugged in, a pair of second positioning columns are fixedly connected to the other side of the bottom end of the positioning block, a pair of second positioning grooves are provided on both sides of the top end of the lower insulation frame, a pair of second positioning holes are provided at the bottom end of the second positioning groove, the outer side of the second positioning column and the inner side of the second positioning hole are plugged in.

[0007] Furthermore, a slot is provided on the outer side of the bottom end of the ceramic plate, and the inner side of the slot is engaged with the outer side of the bracket.

[0008] The beneficial effect of adopting the above further solution is that the inner side of the slot and the outer side of the bracket are snap-fitted together, which facilitates the installation and fixation of the ceramic board, and ensures that the ceramic board will not shift easily during use, providing stable support and good insulation performance for the IGBT module.

[0009] Furthermore, a plurality of connection seats are provided on both sides of the upper insulating frame, a first threaded hole is provided on the inner side of the connection seat, and a plurality of second threaded holes are provided on both sides of the top of the lower insulating frame, and the first threaded holes and the second threaded holes are connected by screws.

[0010] The beneficial effect of adopting the above further solution is that, through the setting of the first threaded hole and the second threaded hole, the upper insulation frame and the lower insulation frame can be firmly connected by screws, thereby enhancing the integrity and stability of the heat dissipation structure of the entire insulation module and facilitating installation and disassembly.

[0011] Furthermore, three threaded holes are provided at four corners of the IGBT module, and a fourth threaded hole corresponding to the third threaded hole is provided at the bottom end of the upper insulating frame. The third threaded hole and the fourth threaded hole are connected by a top screw.

[0012] The beneficial effect of adopting the above further solution is that, by providing the third threaded hole and the fourth threaded hole, the stable installation of the IGBT module is further ensured, and the loosening of the IGBT module due to vibration and other reasons during use is prevented, thereby affecting its normal working performance.

[0013] Furthermore, a boss is provided at the bottom end of the upper insulating frame, and the outer side of the boss is in contact with the inner side of the lower insulating frame.

[0014] The beneficial effect of adopting the above further solution is that by providing a boss at the bottom end of the upper insulating frame, the contact area between the upper insulating frame and the lower insulating frame can be increased, thereby improving the sealing and stability between the two, and also helping to better protect the internal IGBT module.

[0015] Furthermore, a plurality of epoxy resin grouting holes are opened on the top of the upper insulating frame.

[0016] The beneficial effect of adopting the above further solution is that a plurality of epoxy resin grouting holes are opened at the top of the upper insulating frame, which facilitates the pouring of epoxy resin, enhances the insulation performance, and improves the electrical safety and reliability of the entire structure.

[0017] Furthermore, a plurality of water cooling plate fixing holes are provided on the top of the lower insulating frame.

[0018] The beneficial effect of adopting the above further solution is that a number of water-cooling plate fixing holes are opened at the top of the lower insulating frame, which facilitates the installation of the water-cooling plate, provides an effective heat dissipation path for the IGBT module, ensures that the IGBT module will not be damaged due to excessive temperature during operation, and extends its service life.

[0019] Compared with the prior art, the beneficial effects of the present invention are as follows: the heat dissipation structure of the IGBT insulation module is provided with a ceramic plate at the top of the bracket, which realizes the change of the installation method of the ceramic plate, and no bolts are used to connect the ceramic plate and the insulation frame. The entire installation plane of the ceramic plate falls on the bracket of the lower insulation frame, the contact area is increased, the force is more uniform, and the screw breakage is avoided. Through the arrangement of the positioning block, the first positioning column, the second positioning column, the first positioning groove, the second positioning groove, the first positioning hole and the second positioning hole, the IGBT module can be accurately positioned in the lower insulation frame, ensuring the accuracy of the installation position and improving the stability and reliability of the overall structure. The inner side of the card slot and the outer side of the bracket are engaged with each other, which facilitates the installation and fixation of the ceramic plate and can ensure that the ceramic plate will not be easily displaced during use, providing stable support and good insulation performance for the IGBT module. Through the arrangement of the first threaded hole and the second threaded hole, the upper insulation frame and the lower insulation frame can be firmly connected by screws, thereby enhancing the integrity and stability of the heat dissipation structure of the entire insulation module and facilitating installation and disassembly. The setting of the threaded hole further ensures the stable installation of the IGBT module, prevents the IGBT module from loosening due to vibration and other reasons during use, affecting its normal working performance. The bottom end of the upper insulating frame is provided with a boss, which can increase the contact area between the upper insulating frame and the lower insulating frame, improve the sealing and stability between the two, and also help to better protect the internal IGBT module. A number of epoxy resin grouting holes are opened at the top of the upper insulating frame to facilitate the injection of epoxy resin, enhance the insulation performance, and improve the electrical safety and reliability of the entire structure. A number of water-cooling plate fixing holes are opened at the top of the lower insulating frame to facilitate the installation of the water-cooling plate, provide an effective heat dissipation path for the IGBT module, ensure that the IGBT module will not be damaged by excessive temperature during operation, and extend its service life. The utility model changes the installation method of the ceramic plate and no longer uses bolts to connect the ceramic plate and the insulating frame. Instead, it adopts the method of milling a mounting plane. The entire mounting plane falls on the bracket of the lower insulating frame, the contact area is increased, the force is more uniform, and the screw breakage is avoided, which has high practical value. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a schematic diagram of the disassembled three-dimensional structure disclosed in an embodiment of the present utility model;

[0021] Figure 2 This is a schematic diagram of the three-dimensional structure of the positioning block disclosed in the embodiment of the utility model;

[0022] Figure 3 A top view of the IGBT module disclosed in an embodiment of the present utility model;

[0023] Figure 4 A cross-sectional view of the upper insulating frame disclosed in an embodiment of the present utility model;

[0024] Figure 5 This is a schematic diagram of the three-dimensional structure of the lower insulating frame disclosed in an embodiment of the utility model.

[0025] In the figure: 100, lower insulation frame; 10001, water-cooling plate fixing hole; 10002, bracket; 10003, second positioning groove; 10004, second positioning hole; 10005, second threaded hole; 101, ceramic plate; 10101, slot; 102, upper insulation frame; 10201, epoxy resin grouting hole; 10202, fourth threaded hole; 10203, connecting seat; 10204, first threaded hole; 10205, boss; 103, IGBT module; 10301, first positioning groove; 10302, first positioning hole; 10303, third threaded hole; 104, positioning block; 10401, first positioning column; 10402, second positioning column. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0027] See also Figure 1-Figure 5The utility model provides a technical solution: an IGBT insulation module heat dissipation structure, comprising a lower insulation frame 100, a bracket 10002 is installed at the inner bottom end of the lower insulation frame 100, a ceramic plate 101 is provided at the top end of the bracket 10002, IGBT modules 103 are provided on both sides of the top end of the ceramic plate 101, an upper insulation frame 102 is provided on the outer side of the IGBT module 103, a first positioning groove 10301 is provided in the middle of both sides of the IGBT module 103, a first positioning hole 10302 is provided at the bottom end of the first positioning groove 10301, a positioning block 104 is provided on the inner side of the first positioning groove 10301, a first positioning column 10401 is fixedly connected to one side of the bottom end of the positioning block 104, the outer side of the first positioning column 10401 is plugged into the inner side of the first positioning hole 10302, a pair of second positioning columns 10402 are fixedly connected to the other side of the bottom end of the positioning block 104, and the lower insulation frame 100 is provided with a plurality of second positioning columns 10402. A pair of second positioning grooves 10003 are provided on both sides of the top, and a pair of second positioning holes 10004 are provided at the bottom end of the second positioning groove 10003. The outer side of the second positioning column 10402 and the inner side of the second positioning hole 10004 are plugged in. A ceramic plate 101 is provided on the top of the bracket 10002 to change the installation method of the ceramic plate. Bolts are no longer used to connect the ceramic plate and the insulating frame. The entire installation plane of the ceramic plate falls on the bracket of the lower insulating frame, the contact area is increased, the force is more uniform, and the screw breakage is avoided. Through the arrangement of the positioning block 104, the first positioning column 10401, the second positioning column 10402, the first positioning groove 10301, the second positioning groove 10003, the first positioning hole 10302 and the second positioning hole 10004, the IGBT module 103 can be accurately positioned in the lower insulating frame, ensuring the accuracy of the installation position and improving the stability and reliability of the overall structure.

[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0029] See also Figure 1-Figure 5A card slot 10101 is provided on the outer side of the bottom end of the ceramic plate 101, and the inner side of the card slot 10101 is engaged with the outer side of the bracket 10002. A plurality of connecting seats 10203 are provided on both sides of the upper insulating frame 102, and a first threaded hole 10204 is provided on the inner side of the connecting seat 10203. A plurality of second threaded holes 10005 are provided on both sides of the top of the lower insulating frame 100, and the first threaded holes 10204 and the second threaded holes 10005 are connected by screws. A third threaded hole 10303 is provided at the four corners of the IGBT module 103, and a fourth threaded hole 10202 corresponding to the third threaded hole 10303 is provided at the bottom end of the upper insulating frame 102. The third threaded hole 10303 and the fourth threaded hole 10202 are connected by a top screw, and the card slot 1010 is provided. 1 and the outer side of the bracket 10002 are snap-fitted and connected, which is convenient for the installation and fixation of the ceramic plate 101, and at the same time can ensure that the ceramic plate 101 will not be easily displaced during use, providing stable support and good insulation performance for the IGBT module 103. Through the setting of the first threaded hole 10204 and the second threaded hole 10005, the upper insulating frame 102 and the lower insulating frame 100 can be firmly connected by screws, thereby enhancing the integrity and stability of the heat dissipation structure of the entire insulating module and facilitating installation and disassembly. Through the setting of the third threaded hole 10303 and the fourth threaded hole 10202, the stable installation of the IGBT module 103 is further ensured, and the IGBT module 103 is prevented from loosening due to vibration and other reasons during use, thereby affecting its normal working performance.

[0030] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0031] See also Figure 1-Figure 5The bottom end of the upper insulating frame 102 is provided with a boss 10205, the outer side of the boss 10205 contacts the inner side of the lower insulating frame 100, the top of the upper insulating frame 102 is provided with a plurality of epoxy resin grouting holes 10201, and the top of the lower insulating frame 100 is provided with a plurality of water-cooling plate fixing holes 10001. The boss 10205 is provided at the bottom end of the upper insulating frame 102, which can increase the contact area between the upper insulating frame 102 and the lower insulating frame 100, improve the sealing and stability between the two, and also help to better To protect the internal IGBT module 103, a plurality of epoxy resin grouting holes 10201 are opened through the top of the upper insulating frame 102 to facilitate the injection of epoxy resin, enhance the insulation performance, and improve the electrical safety and reliability of the entire structure. A plurality of water-cooling plate fixing holes 10001 are opened through the top of the lower insulating frame 100 to facilitate the installation of the water-cooling plate, providing an effective heat dissipation path for the IGBT module 103, ensuring that the IGBT module 103 will not be damaged due to excessive temperature during operation, and extending its service life.

[0032] Specifically, the working principle of the heat dissipation structure of the IGBT insulation module is as follows: when in use, a ceramic plate 101 is provided on the top of the bracket 10002 to change the installation method of the ceramic plate. The ceramic plate and the insulation frame are no longer connected by bolts. The entire installation plane of the ceramic plate falls on the bracket of the lower insulation frame, the contact area is increased, the force is more uniform, and the screw breakage is avoided. Through the arrangement of the positioning block 104, the first positioning column 10401, the second positioning column 10402, the first positioning groove 10301, the second positioning groove 10003, the first positioning hole 10302 and the second positioning hole 10004, the IGBT module 103 can be placed at the bottom. The precise positioning in the insulating frame ensures accurate installation position and improves the stability and reliability of the overall structure. The inner side of the card slot 10101 and the outer side of the bracket 10002 are engaged and connected to facilitate the installation and fixation of the ceramic plate 101. At the same time, it can ensure that the ceramic plate 101 will not shift easily during use, providing stable support and good insulation performance for the IGBT module 103. The first threaded hole 10204 and the second threaded hole 10005 are set, so that the upper insulating frame 102 and the lower insulating frame 100 can be firmly connected by screws, thereby enhancing the integrity and stability of the heat dissipation structure of the entire insulating module and facilitating installation and disassembly. The arrangement of the third threaded hole 10303 and the fourth threaded hole 10202 further ensures the stable installation of the IGBT module 103, and prevents the IGBT module 103 from loosening due to vibration and other reasons during use, thereby affecting its normal working performance. The bottom end of the upper insulating frame 102 is provided with a boss 10205, which can increase the contact area between the upper insulating frame 102 and the lower insulating frame 100, improve the sealing and stability between the two, and also help to better protect the internal IGBT module 103. The top end of the upper insulating frame 102 is provided with a plurality of epoxy resin grouting holes 10201, which facilitates the injection of epoxy resin and increases Strong insulation performance improves the electrical safety and reliability of the entire structure. A number of water-cooling plate fixing holes 10001 are opened on the top of the lower insulating frame 100 to facilitate the installation of the water-cooling plate, providing an effective heat dissipation path for the IGBT module 103, ensuring that the IGBT module 103 will not be damaged due to excessive temperature during operation, thereby extending its service life. The utility model changes the installation method of the ceramic plate and no longer uses bolts to connect the ceramic plate and the insulating frame. Instead, a mounting plane is milled. The entire mounting plane falls on the bracket of the lower insulating frame, which increases the contact area, makes the force more uniform, and avoids screw breakage, thereby having high practical value.

Claims

1. An IGBT insulation module heat dissipation structure, characterized in that: The invention comprises a lower insulating frame (100), wherein a bracket (10002) is installed at the inner bottom end of the lower insulating frame (100), a ceramic plate (101) is provided at the top end of the bracket (10002), an IGBT module (103) is provided on both sides of the top end of the ceramic plate (101), an upper insulating frame (102) is provided on the outer side of the IGBT module (103), a first positioning groove (10301) is provided in the middle of both sides of the IGBT module (103), a first positioning hole (10302) is provided at the bottom end of the first positioning groove (10301), and a positioning block ( 104), a first positioning column (10401) is fixedly connected to one side of the bottom end of the positioning block (104), the outer side of the first positioning column (10401) is plugged into the inner side of the first positioning hole (10302), a pair of second positioning columns (10402) are fixedly connected to the other side of the bottom end of the positioning block (104), a pair of second positioning grooves (10003) are provided on both sides of the top end of the lower insulating frame (100), a pair of second positioning holes (10004) are provided at the bottom end of the second positioning grooves (10003), and the outer side of the second positioning column (10402) is plugged into the inner side of the second positioning hole (10004).

2. The IGBT insulation module heat dissipation structure according to claim 1, characterized in that: A slot (10101) is provided on the outer side of the bottom end of the ceramic plate (101), and the inner side of the slot (10101) is engaged with the outer side of the bracket (10002).

3. The IGBT insulation module heat dissipation structure according to claim 1, characterized in that: A plurality of connection seats (10203) are provided on both sides of the upper insulating frame (102), a first threaded hole (10204) is provided on the inner side of the connection seat (10203), and a plurality of second threaded holes (10005) are provided on both sides of the top of the lower insulating frame (100), and the first threaded holes (10204) and the second threaded holes (10005) are connected by screws.

4. The IGBT insulation module heat dissipation structure according to claim 1, characterized in that: The four corners of the IGBT module (103) are each provided with a third threaded hole (10303), the bottom end of the upper insulating frame (102) is provided with a fourth threaded hole (10202) corresponding to the third threaded hole (10303), and the third threaded hole (10303) and the fourth threaded hole (10202) are connected via a top screw.

5. The IGBT insulation module heat dissipation structure according to claim 1, characterized in that: A boss (10205) is provided at the bottom end of the upper insulating frame (102), and the outer side of the boss (10205) is in contact with the inner side of the lower insulating frame (100).

6. The IGBT insulation module heat dissipation structure according to claim 1, characterized in that: A plurality of epoxy resin grouting holes (10201) are provided at the top of the upper insulating frame (102).

7. The IGBT insulation module heat dissipation structure according to claim 1, characterized in that: A plurality of water cooling plate fixing holes (10001) are provided at the top of the lower insulating frame (100).

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