Heat dissipation structure and laser pump
Through the combined structure of liquid-cooled parts and heat dissipation substrate, the efficient direct water-cooled heat dissipation of laser pump is achieved, solving the problem of poor traditional heat dissipation effect and improving the heat dissipation performance and reliability of the laser.
Patent Information
- Application Number
- CN202422382110.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-29
- Publication Date
- 2025-08-05
- Estimated Expiration
- 2034-09-29
AI Technical Summary
The heat dissipation effect of traditional laser pumps is poor, resulting in a high probability of failure of the power module when the laser runs for a long time, affecting the output performance and reliability.
Using a combined structure of liquid-cooled parts and heat dissipation substrate, direct water-cooled heat dissipation is achieved through liquid-cooled channels and liquid-cooled grooves. The heat dissipation column is partially immersed in the coolant, increasing the heat dissipation area and improving heat dissipation efficiency.
It improves the heat dissipation efficiency of the laser pump, reduces the failure probability of the power module, and improves the output performance and reliability of the laser.
Smart Images
Figure CN223194226U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of laser processing, in particular to a heat dissipation structure and laser pumping. Background Art
[0002] Long-term operation of a laser generates a significant amount of heat. As the temperature rises, the probability of failure of the laser pump power module also increases significantly, ultimately affecting the laser's output performance and reliability. Traditional laser pumps typically dissipate heat through copper-based heat conduction to a water-cooled aluminum plate. However, this method involves multiple media and results in poor heat dissipation. Utility Model Content
[0003] The embodiments of the present invention provide a heat dissipation structure and a laser pump, which can dissipate heat through direct water cooling and have high heat dissipation efficiency.
[0004] The heat dissipation structure proposed in the present utility model comprises: a liquid cooling element, wherein the liquid cooling element is provided with a liquid cooling channel and a liquid cooling groove, wherein the liquid cooling channel is connected to the liquid cooling groove, and the liquid cooling channel and the liquid cooling groove are used for flowing cooling liquid;
[0005] The heat dissipation substrate includes a substrate body and a plurality of heat dissipation columns. The plurality of heat dissipation columns are arranged on the substrate body. The substrate body covers the opening of the liquid cooling groove. The heat dissipation columns are accommodated in the liquid cooling groove, and at least part of the heat dissipation columns is located in the cooling liquid.
[0006] Optionally, the cross-section of the heat dissipation column is elliptical, and the long axis of the heat dissipation column is arranged along the flow direction of the coolant.
[0007] Optionally, the heat dissipation substrate includes several first heat dissipation groups and several second heat dissipation groups. Along the flow direction of the coolant, the first heat dissipation groups and the second heat dissipation groups are alternately and spaced apart. The first heat dissipation group includes n heat dissipation columns, and the second heat dissipation group includes n-1 heat dissipation columns, wherein n≥2. The n heat dissipation columns included in the first heat dissipation group are arranged in sequence along a direction perpendicular to the flow direction of the coolant, and the n-1 heat dissipation columns included in the second heat dissipation group are arranged along a direction perpendicular to the flow direction of the coolant. The heat dissipation columns of the second heat dissipation group are located between the two heat dissipation columns of the first heat dissipation group.
[0008] Optionally, the substrate body is provided with a plurality of connection protrusions, and the plurality of connection protrusions are provided with connection through holes along a direction approaching or away from the liquid cooling component, and the substrate body is bolted to the liquid cooling component via the connection through holes.
[0009] Optionally, a limiting groove is further provided on a side of the liquid cooling component close to the substrate body, the substrate body is located in the limiting groove, and the groove wall of the limiting groove limits the substrate body.
[0010] Optionally, the heat dissipation structure further includes a sealing ring, which is located between the heat dissipation substrate and the liquid cooling component, and is arranged around the liquid cooling groove.
[0011] Optionally, the liquid cooling component is provided with a sealing groove along the periphery of the liquid cooling groove, and the sealing ring is accommodated in the sealing groove.
[0012] Optionally, the liquid cooling component further includes a liquid inlet and a liquid outlet, the liquid inlet is communicated with the liquid cooling channel and the liquid cooling groove, and the liquid outlet is communicated with the liquid cooling channel and the liquid cooling groove.
[0013] Optionally, the heat dissipation structure further includes a power supply, which is disposed on the liquid cooling component and spaced apart from the heat dissipation substrate.
[0014] The present invention also provides a laser pump, comprising the heat dissipation structure described in any one of the above embodiments.
[0015] The heat dissipation structure and laser pumping provided by the embodiments of the present invention have multiple heat dissipation columns that effectively increase the surface area of the heat dissipation substrate and improve the heat dissipation efficiency. In addition, the substrate body is sealed on the opening of the liquid cooling groove, so that the substrate body and the liquid cooling groove form a cavity for the cooling liquid to pass through. The heat dissipation column is accommodated in the liquid cooling groove, so that at least a portion of the heat dissipation column can directly contact the cooling liquid to achieve heat dissipation, further improving the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.
[0017] Figure 1 This is a structural diagram of an embodiment of the heat dissipation structure of the utility model;
[0018] Figure 2 This is a structural diagram of an embodiment of a heat dissipation substrate of the present utility model;
[0019] Figure 3 This is a schematic structural diagram of another embodiment of the heat dissipation substrate of the present invention;
[0020] Figure 4 This is a cross-sectional view of an embodiment of the heat dissipation structure of the present utility model;
[0021] Figure 5 for Figure 4A partial enlarged view of point A in the middle;
[0022] Figure 6 This is a structural diagram of another embodiment of the heat dissipation structure of the utility model;
[0023] Figure 7 This is a structural diagram of another embodiment of the heat dissipation substrate of the present invention.
[0024] Description of Figure Numbers:
[0025] heat dissipation structure 100;
[0026] Liquid cooling element 10, liquid cooling channel 11, liquid cooling groove 13, limiting groove 15, sealing groove 17, liquid inlet 18, liquid outlet 19;
[0027] Heat dissipation substrate 20, substrate body 21, connection protrusion 211, connection through hole 2111, heat dissipation column 23, first heat dissipation group 25, second heat dissipation group 27;
[0028] Sealing ring 30;
[0029] Power supply 40.
[0030] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION
[0031] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0032] It should be noted that when an element is referred to as being “fixed on” or “disposed on” another element, it may be directly on the other element or indirectly on the other element. When an element is referred to as being “connected to” another element, it may be directly connected to the other element or indirectly connected to the other element.
[0033] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.
[0034] It should be understood that the term “and / or” used in the present specification and the appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes these combinations.
[0035] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of this utility model, "plurality" means two or more, unless otherwise specifically defined.
[0036] See also Figures 1 to 4 The present invention provides a heat dissipation structure 100, comprising a liquid cooling element 10 and a heat dissipation substrate 20. The liquid cooling element 10 is provided with a liquid cooling channel 11 and a liquid cooling groove 13. The liquid cooling channel 11 is connected to the liquid cooling groove 13, and the liquid cooling channel 11 and the liquid cooling groove 13 are used to flow the cooling liquid. The heat dissipation substrate 20 includes a substrate body 21 and a plurality of heat dissipation columns 23. The plurality of heat dissipation columns 23 are provided on the substrate body 21. The substrate body 21 covers the opening of the liquid cooling groove 13. The heat dissipation columns 23 are accommodated in the liquid cooling groove 13, and at least a portion of the heat dissipation columns 23 is located in the cooling liquid.
[0037] In the embodiment of the present invention, multiple heat dissipation columns 23 effectively increase the surface area of the heat dissipation substrate 20 and improve the heat dissipation efficiency. In addition, the substrate body 21 covers the opening of the liquid cooling groove 13, so that the substrate body 21 and the liquid cooling groove 13 form a cavity for the coolant to pass through. The heat dissipation column 23 is accommodated in the liquid cooling groove 13, so that at least a portion of the heat dissipation column 23 can directly contact the coolant to achieve heat dissipation, further improving the heat dissipation efficiency.
[0038] Specifically, the liquid cooling element 10 is used for passing the cooling liquid. It is understandable that the liquid cooling element 10 can be made of materials such as aluminum and copper with good thermal conductivity, and this application does not make any specific restrictions.
[0039] Liquid cooling channel 11 can have various configurations. It can be a hollow portion of liquid cooling element 10, forming liquid cooling channel 11. Alternatively, liquid cooling channel 11 can be a plurality of interconnected parallel channels within liquid cooling element 10 to guide the flow of coolant. Alternatively, liquid cooling channel 11 can be a plurality of curved channels within liquid cooling element 10, etc. This application does not impose any specific limitations on liquid cooling channel 11. It is understood that coolant can flow from liquid cooling channel 11 into liquid cooling groove 13, and coolant within liquid cooling groove 13 can also flow from liquid cooling groove 13 into liquid cooling channel 11. This application does not impose any specific limitations on this.
[0040] As can be understood, the heat dissipation substrate 20 is used to dissipate heat from the structure provided on the heat dissipation substrate 20. The substrate body 21 can cover the opening of the liquid cooling groove 13, so that the substrate body 21 and the liquid cooling groove 13 can together enclose a cavity for the flow of the coolant, thereby preventing the coolant from contacting the outside world, and facilitating the heat dissipation column 23 to be located in the cavity and to be in direct contact with the coolant to achieve heat dissipation. As can be understood, there are many ways to connect the heat dissipation substrate 20 to the liquid cooling component 10. The heat dissipation substrate 20 can be connected to the liquid cooling component 10 by clipping, bonding, welding, etc., which will not be listed one by one in this application.
[0041] It can be understood that the heat dissipation column 23 can be located entirely in the coolant, or partially in the coolant. The positional relationship between the heat dissipation column 23 and the coolant can be adjusted according to factors such as the height of the coolant and the shape of the heat dissipation substrate 20. This application does not impose any specific restrictions.
[0042] It can be understood that the shape of the heat dissipation substrate 20 can match the shape of the opening of the liquid cooling groove 13, and the shape of the heat dissipation substrate 20 can also be different from the shape of the opening of the liquid cooling groove 13. The heat dissipation substrate 20 can be sealed on the opening of the liquid cooling groove 13. This application does not impose any specific restrictions.
[0043] See also Figure 2 In the embodiment of the present invention, the cross section of the heat dissipation column 23 is elliptical, and the long axis of the heat dissipation column 23 is arranged along the flow direction of the coolant.
[0044] In this way, the resistance of the heat dissipation column 23 to the flow of the coolant can be reduced, and the coolant can flow through the heat dissipation column 23 more easily, thereby improving the heat dissipation efficiency.
[0045] It can be understood that the long axis of the heat dissipation column 23 is set along the flow direction of the coolant, which means that the long axis of the heat dissipation column 23 is basically consistent with the flow direction of the coolant. The long axis of the heat dissipation column 23 can be at an angle of 0°, 5°, 10°, 15°, 20°, 30°, 40°, etc. to the flow direction of the coolant. The long axis of the heat dissipation column 23 can generally be facing the flow direction of the coolant. This application does not impose any specific restrictions.
[0046] In this utility model embodiment, please refer to Figure 7The heat dissipation substrate 20 includes a plurality of first heat dissipation groups 25 and a plurality of second heat dissipation groups 27. Along the flow direction of the coolant, the first heat dissipation groups 25 and the second heat dissipation groups 27 are alternately and spaced apart. The first heat dissipation group 25 includes n heat dissipation columns 23, and the second heat dissipation group 27 includes n-1 heat dissipation columns 23, wherein n≥2. The n heat dissipation columns 23 included in the first heat dissipation group 25 are arranged in sequence perpendicular to the flow direction of the coolant, and the n-1 heat dissipation columns 23 included in the second heat dissipation group 27 are arranged perpendicular to the flow direction of the coolant. The heat dissipation columns 23 of the second heat dissipation group 27 are located between the two heat dissipation columns 23 of the first heat dissipation group 25.
[0047] In this way, after the coolant flows through the gap between the two heat dissipation columns 23 included in the first heat dissipation group 25, it can naturally flow through the heat dissipation columns 23 of the second heat dissipation group 27 located between the two heat dissipation columns 23, thereby reducing the situation where the front heat dissipation columns 23 block the coolant from flowing through the rear heat dissipation columns 23, ensuring good contact between the coolant and the heat dissipation columns 23 to take away the heat on the heat dissipation columns 23.
[0048] It can be understood that the heat dissipation substrate 20 may include 1, 2, 3, 4, 5, 10, 15 or other numbers of first heat dissipation groups 25, and each first heat dissipation group 25 may include 2, 3, 4, 5, 10, 20 or other numbers of heat dissipation columns 23. The heat dissipation substrate 20 may include 1, 2, 3, 4, 5, 10, 15 or other numbers of second heat dissipation groups 27, and each second heat dissipation group 27 may include 1, 2, 3, 4, 5, 10, 20 or other numbers of heat dissipation columns 23, which are not listed one by one in this application.
[0049] It can be understood that when the heat dissipation substrate 20 includes multiple first heat dissipation groups 25 and the second heat dissipation group 27 includes multiple heat dissipation columns 23, when the coolant flows between the two heat dissipation columns 23 included in the second heat dissipation group 27, it can also flow to the heat dissipation columns 23 of the first heat dissipation group 25, thereby continuously reducing the probability that the heat dissipation columns 23 included in the first heat dissipation group 25 block the coolant from flowing through the heat dissipation columns 23 included in the second heat dissipation group 27, and reducing the probability that the heat dissipation columns 23 included in the second heat dissipation group 27 block the coolant from flowing through the heat dissipation columns 23 included in the first heat dissipation group 25, thereby achieving better heat dissipation effect.
[0050] See also Figures 1 to 3 In the embodiment of the present invention, the substrate body 21 is provided with a plurality of connecting protrusions 211 , and the plurality of connecting protrusions 211 are provided with connecting through holes 2111 along the direction approaching or away from the liquid cooling part 10 , and the substrate body 21 is bolted to the liquid cooling part 10 through the connecting through holes 2111 .
[0051] In this way, the base plate body 21 can be connected to the liquid cooling element 10 by bolts, which has a simple structure, is easy to process, and has a relatively firm connection and is easy to disassemble.
[0052] It is understandable that the substrate body 21 can be provided with 2, 3, 4, 5, 6, 7, 8 or other numbers of connecting protrusions 211, as long as the substrate body 21 can well cover the opening of the liquid cooling groove 13, and this application does not make specific restrictions.
[0053] For further information, see Figure 1 and Figure 5 A limiting groove 15 is further provided on one side of the liquid cooling element 10 close to the substrate body 21 . The substrate body 21 is located in the limiting groove 15 , and the groove wall of the limiting groove 15 limits the substrate body 21 .
[0054] In this way, when the substrate body 21 and the liquid-cooling element 10 are installed, they can be aligned through the limiting groove 15 , which facilitates the bolt connection between the substrate body 21 and the liquid-cooling element 10 .
[0055] See also Figure 5 In the embodiment of the present invention, the heat dissipation structure 100 further includes a sealing ring 30 . The sealing ring 30 is located between the heat dissipation substrate 20 and the liquid cooling element 10 . The sealing ring 30 is disposed around the liquid cooling groove 13 .
[0056] In this way, the sealing between the heat dissipation substrate 20 and the liquid cooling element 10 can be enhanced, and the probability of the cooling liquid contacting the outside world can be reduced.
[0057] It is understandable that the sealing ring 30 can be made of elastic materials such as silicone, rubber, etc., and this application does not impose any specific restrictions.
[0058] For further information, see Figure 5 The liquid cooling element 10 is provided with a sealing groove 17 along the periphery of the liquid cooling groove 13 , and the sealing ring 30 is accommodated in the sealing groove 17 .
[0059] In this way, the sealing ring 30 can be limited to avoid displacement of the sealing ring 30 and ensure a good sealing effect of the sealing ring 30.
[0060] See also Figure 1 and Figure 6 In the embodiment of the present invention, the liquid cooling component 10 further includes a liquid inlet 18 and a liquid outlet 19 , the liquid inlet 18 is connected to the liquid cooling channel 11 and the liquid cooling groove 13 , and the liquid outlet 19 is connected to the liquid cooling channel 11 and the liquid cooling groove 13 .
[0061] In this way, it is convenient to input and output the coolant, and the coolant can be replaced in time to ensure the heat dissipation effect.
[0062] See also Figure 1 and Figure 6 In the embodiment of the present invention, the heat dissipation structure 100 further includes a power supply 40 . The power supply 40 is disposed on the liquid cooling element 10 , and the power supply 40 is spaced apart from the heat dissipation substrate 20 .
[0063] In this way, the liquid cooling element 10 can also cool the power supply 40 , thereby reducing the heat dissipation cost of the power supply 40 .
[0064] The embodiment of the present invention also provides a laser pump, which includes a heat dissipation structure 100. The specific structure of the heat dissipation structure 100 refers to the above embodiment. Since the laser pump adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought by the technical solutions of the above embodiments.
[0065] In the laser pumping of the embodiment of the present invention, the multiple heat dissipation columns 23 effectively increase the surface area of the heat dissipation substrate 20 and improve the heat dissipation efficiency. In addition, the substrate body 21 covers the opening of the liquid cooling groove 13, so that the substrate body 21 and the liquid cooling groove 13 form a cavity for the coolant to pass through. The heat dissipation columns 23 are accommodated in the liquid cooling groove 13, so that at least a portion of the heat dissipation columns 23 can directly contact the coolant to achieve heat dissipation, further improving the heat dissipation efficiency of the laser pumping.
[0066] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. All equivalent structural transformations made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or direct / indirect application in other related technical fields are included in the patent protection scope of the present invention.
Claims
1. A heat dissipation structure, characterized in that: include: A liquid cooling element, wherein the liquid cooling element is provided with a liquid cooling channel and a liquid cooling groove, wherein the liquid cooling channel is in communication with the liquid cooling groove, and the liquid cooling channel and the liquid cooling groove are used for flowing cooling liquid; The heat dissipation substrate includes a substrate body and a plurality of heat dissipation columns. The plurality of heat dissipation columns are arranged on the substrate body. The substrate body covers the opening of the liquid cooling groove. The heat dissipation columns are accommodated in the liquid cooling groove, and at least part of the heat dissipation columns is located in the cooling liquid.
2. The heat dissipation structure according to claim 1, wherein: The cross section of the heat dissipation column is elliptical, and the long axis of the heat dissipation column is arranged along the flow direction of the coolant.
3. The heat dissipation structure according to claim 1 or 2, characterized in that: The heat dissipation substrate includes a plurality of first heat dissipation groups and a plurality of second heat dissipation groups. Along the flow direction of the coolant, the first heat dissipation groups and the second heat dissipation groups are alternately and spaced apart. The first heat dissipation group includes n heat dissipation columns, and the second heat dissipation group includes n-1 heat dissipation columns, wherein n≥2. The n heat dissipation columns included in the first heat dissipation group are arranged in sequence perpendicular to the flow direction of the coolant, and the n-1 heat dissipation columns included in the second heat dissipation group are arranged perpendicular to the flow direction of the coolant. The heat dissipation columns of the second heat dissipation group are located between the two heat dissipation columns of the first heat dissipation group.
4. The heat dissipation structure according to claim 1, wherein: The base plate body is provided with a plurality of connection protrusions, and the plurality of connection protrusions are provided with connection through holes along a direction approaching or away from the liquid cooling component. The base plate body is bolted to the liquid cooling component via the connection through holes.
5. The heat dissipation structure according to claim 4, wherein: A limiting groove is further provided on a side of the liquid cooling component close to the substrate body. The substrate body is located in the limiting groove, and the groove wall of the limiting groove limits the substrate body.
6. The heat dissipation structure according to claim 1, wherein: The heat dissipation structure further includes a sealing ring, which is located between the heat dissipation substrate and the liquid cooling component, and is arranged around the liquid cooling groove.
7. The heat dissipation structure according to claim 6, wherein: The liquid cooling component is provided with a sealing groove along the periphery of the liquid cooling groove, and the sealing ring is accommodated in the sealing groove.
8. The heat dissipation structure according to claim 1, wherein: The liquid cooling component further includes a liquid inlet and a liquid outlet, the liquid inlet is communicated with the liquid cooling channel and the liquid cooling groove, and the liquid outlet is communicated with the liquid cooling channel and the liquid cooling groove.
9. The heat dissipation structure according to claim 1, wherein: The heat dissipation structure further includes a power supply, which is arranged on the liquid cooling component and is spaced apart from the heat dissipation substrate.
10. A laser pump, characterized in that: The heat dissipation structure comprises the heat dissipation structure according to any one of claims 1 to 9.