Circuit board structure with high heat dissipation performance

Abstract

The utility model discloses a circuit board structure with high heat dissipation performance, which comprises a plurality of layers of circuit board bodies which are arranged in parallel, every two circuit board bodies form a group, and the back sides of the two circuit board bodies in each group are opposite to each other; the phase change heat absorption plate is arranged between the back sides of the two adjacent circuit board bodies in a sliding manner and abuts against the back sides of the circuit board bodies; and the heat dissipation plate is arranged on the side wall of the circuit board body and is used for clamping the phase change heat absorption plate. Compared with the prior art, the circuit board has the following advantages and effects that through the arrangement of the phase change heat absorption plate in sliding connection, heat on the circuit board body can be adsorbed and stored through the phase change heat absorption plate, and when the phase change heat absorption plate moves to the position of the heat dissipation plate, the heat stored in the phase change heat absorption plate is guided to the heat dissipation plate, so that the heat dissipation efficiency is improved. The heat dissipation plate is used for dissipating heat, heat transfer in the phase change heat absorption plate is achieved, meanwhile, timely heat dissipation of the circuit board body is achieved, and the heat dissipation effect of the whole circuit board structure is improved.

Description

Technical Field

[0001] The utility model relates to the field of circuit boards, in particular to a circuit board structure with high heat dissipation. Background Art

[0002] Circuit boards are essential components used to assemble electronic components in electronic devices. They provide a platform for electrical connections between components and transmit electronic signals through pre-defined circuits and patterns. Circuit boards miniaturize and visualize circuits, playing a vital role in the mass production of fixed circuits and optimizing the layout of electrical appliances.

[0003] During the production process of traditional large components, two or even multiple layers of circuit boards need to be arranged side by side inside them. When the circuit boards are working, air cooling is achieved through fans inside the components. However, the cooling effect of air cooling is general and the heat on the circuit boards cannot be dissipated in time, which can easily cause the circuit boards to overheat and burn, affecting the normal use of the equipment. This needs to be improved. Utility Model Content

[0004] In view of the shortcomings of the prior art, the purpose of the present invention is to provide a high heat dissipation circuit board structure, which has the advantage of improving the heat dissipation effect.

[0005] The above technical objectives of the present invention are achieved through the following technical solutions: A high heat dissipation circuit board structure, comprising:

[0006] The multi-layer circuit board bodies are arranged parallel to each other, and the circuit board bodies are grouped in pairs, with the back sides of the two circuit board bodies in each group facing each other;

[0007] a phase-change heat-absorbing plate, slidably disposed between the back sides of two adjacent circuit board bodies and contacting the back sides of the circuit board bodies;

[0008] The heat dissipation plate is arranged on the side wall of the circuit board body and is used for clamping the phase change heat absorption plate.

[0009] In a preferred example, the present invention can be further configured as follows: two phase-change heat absorbing plates are provided, and two groups of heat dissipating plates are provided and distributed on both sides of the circuit board body.

[0010] In a preferred example, the present invention can be further configured as follows: guide rails are provided on the circuit board body and the heat dissipation plate, and track grooves for the guide rails to slide are provided on the phase change heat absorption plate.

[0011] In a preferred example, the present invention can be further configured as follows: a plurality of guide grooves are provided on the heat dissipation plate.

[0012] In a preferred example, the present invention can be further configured as follows: a metal heat conducting plate is provided on the back side of the circuit board body.

[0013] In a preferred example, the present invention can be further configured as follows: a plurality of heat dissipation fins are provided on the surface of the circuit board body.

[0014] In a preferred example, the present invention can be further configured as follows: a pair of support seats are provided on the back side of the heat sink, and the support seats are distributed on both sides of the heat sink, one of the support seats is provided with an insertion rod, and the other support seat is provided with a tube for the insertion rod to be inserted.

[0015] In summary, the present invention has the following beneficial effects:

[0016] 1. By providing a slidingly connected phase-change heat absorbing plate, the phase-change heat absorbing plate can be used to absorb and store heat on the circuit board body. When the phase-change heat absorbing plate moves to the heat sink position, the heat stored in the phase-change heat absorbing plate is transferred to the heat sink, and the heat sink is used to dissipate the heat, thereby achieving heat transfer within the phase-change heat absorbing plate and timely heat dissipation of the circuit board body, thereby improving the heat dissipation effect of the entire circuit board structure.

[0017] 2. By setting up guide grooves on the heat sink and coordinating with the fan cooling, the heat on the heat sink can be quickly taken away, thus improving the heat dissipation efficiency;

[0018] 3. By setting a support structure between adjacent heat sinks, the stability between the heat sinks is increased, the heat sinks are prevented from shaking, and the working stability of the entire circuit board is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a structural diagram of an embodiment;

[0020] Figure 2 Schematic diagram of the connection relationship of the embodiment.

[0021] Figure numerals: 1. circuit board body; 2. phase change heat absorption plate; 3. heat dissipation plate; 4. metal heat conduction plate; 5. guide rail; 6. track groove; 7. guide groove; 8. heat dissipation fin; 9. support seat; 91. insertion rod; 92. insertion tube. DETAILED DESCRIPTION

[0022] The present invention will be described in further detail below with reference to the accompanying drawings.

[0023] like Figure 1 、 Figure 2 As shown, a high heat dissipation circuit board structure includes a multi-layer circuit board body 1, a phase change heat absorption plate 2 and a heat dissipation plate 3.

[0024] like Figure 1 、 Figure 2 As shown, the multi-layer circuit board bodies 1 are arranged parallel to each other, with the circuit board bodies 1 forming a group of two, and the back sides of the two circuit board bodies 1 in each group facing each other. A metal heat conducting plate 4 is provided on the back side of the circuit board body 1 to quickly conduct heat from the circuit board body 1.

[0025] like Figure 1 、 Figure 2 As shown, two phase change heat absorbing plates 2 are arranged side by side, and the two phase change heat absorbing plates 2 are alternately slidably arranged between the back sides of two adjacent circuit board bodies 1 and contact the back sides of the circuit board bodies 1 to absorb and store the heat on the metal heat conducting plate 4.

[0026] like Figure 1 、 Figure 2 As shown, two groups of heat dissipation plates 3 are provided. The two groups of heat dissipation plates 3 are provided on both sides of the circuit board body 1 and are used to clamp the phase change heat absorption plate 2 .

[0027] When the circuit board structure is working, the driving mechanism in the component is used to control the reciprocating motion of the two phase change heat absorption plates 2. The driving mechanism in the component can be a cylinder, an electric cylinder or a gear rack structure to ensure stable sliding control of the phase change heat absorption plate 2.

[0028] When the phase-change heat absorbing plates 2 slide, one phase-change heat absorbing plate 2 is located between two adjacent circuit board bodies 1, and the other phase-change heat absorbing plate 2 is located between two heat dissipating plates 3 on one side. At this time, the phase-change heat absorbing plates 2 between the circuit board bodies 1 can absorb and store heat from the circuit board bodies 1.

[0029] After the phase change heat absorbing plate 2 slides, the phase change heat absorbing plate 2 carrying heat slides between another set of heat dissipating plates 3, and the heat stored in the phase change heat absorbing plate 2 is introduced into the heat dissipating plate 3, and the heat is dissipated by the heat dissipating plate 3, thereby realizing the heat transfer in the phase change heat absorbing plate 2.

[0030] Then the phase change heat absorbing plate 2 moves in the opposite direction, and the staggered movement of the two phase change heat absorbing plates 2 is used to transfer the heat on the circuit board body 1 to the heat dissipation plate 3 in a timely manner, and cooperate with the fan in the components to achieve rapid dissipation of heat on the heat dissipation plate 3. The circuit board body 1 can also be cooled by air cooling, thereby improving the heat dissipation effect of the entire circuit board structure.

[0031] like Figure 1 、 Figure 2 As shown, guide rails 5 are provided on the circuit board body 1 and the heat dissipation plate 3, and track grooves 6 for the guide rails 5 to slide are provided on the phase change heat absorption plate 2, so as to realize the movement guidance of the phase change heat absorption plate 2 and increase the stability of the phase change heat absorption plate 2 in the sliding structure.

[0032] like Figure 1 、 Figure 2 As shown, a plurality of guide grooves 7 are provided on the heat sink 3. Therefore, when the entire circuit board structure is working, the guide grooves 7 can be aligned with the fan, and the heat dissipation efficiency of the heat sink 3 can be accelerated by air cooling, which also indirectly improves the heat dissipation efficiency of the entire circuit board structure.

[0033] like Figure 1 、 Figure 2 As shown, a plurality of heat dissipation fins 8 are provided on the surface of the circuit board body 1 for dissipating heat from the circuit board body 1 by utilizing the principle of thermal radiation. The combination of multiple heat dissipation methods improves the heat dissipation effect and heat dissipation efficiency of the entire circuit board structure.

[0034] like Figure 1 、 Figure 2 As shown, a pair of support seats 9 are provided on the back side of the heat sink 3. The support seats 9 are distributed on both sides of the heat sink 3. One of the support seats 9 is provided with an insertion rod 91, and the other support seat 9 is provided with a plug 92 for the insertion rod 91 to be inserted.

[0035] Therefore, in the practical application of the circuit board structure, by setting a support structure between adjacent heat sinks 3, the connection and fixation between adjacent heat sinks 3 can be achieved, the stability between the heat sinks 3 can be increased, the shaking of the heat sinks 3 can be avoided, and the working stability of the entire circuit board can be improved.

[0036] The specific embodiments are merely explanations of the present invention and are not limitations of the present invention. After reading this specification, those skilled in the art may make non-creative modifications to the embodiments as needed. However, as long as they are within the scope of the claims of the present invention, they are protected by patent law.

Claims

1. A circuit board structure with high heat dissipation, characterized by: include: Multilayer circuit board bodies (1) are arranged parallel to each other, the circuit board bodies (1) are grouped in pairs, and the back sides of the two circuit board bodies (1) in each group face each other; A phase-change heat absorption plate (2) is slidably disposed between the back sides of two adjacent circuit board bodies (1) and contacts the back sides of the circuit board bodies (1); A heat dissipation plate (3) is arranged on the side wall of the circuit board body (1) and is used to clamp the phase change heat absorption plate (2).

2. The high heat dissipation circuit board structure according to claim 1, characterized in that: The phase-change heat absorption plates (2) are provided in two numbers, and the heat dissipation plates (3) are provided in two groups and are distributed on both sides of the circuit board body (1).

3. The high heat dissipation circuit board structure according to claim 2, characterized in that: Guide rails (5) are provided on the circuit board body (1) and the heat dissipation plate (3), and track grooves (6) for the guide rails (5) to slide are provided on the phase-change heat absorption plate (2).

4. The high heat dissipation circuit board structure according to claim 1, wherein: A plurality of guide grooves (7) are provided on the heat dissipation plate (3).

5. The high heat dissipation circuit board structure according to claim 1, characterized in that: A metal heat conducting plate (4) is provided on the back side of the circuit board body (1).

6. The high heat dissipation circuit board structure according to claim 5, characterized in that: A plurality of heat dissipation fins (8) are provided on the surface of the circuit board body (1).

7. The high heat dissipation circuit board structure according to claim 1, characterized in that: A pair of support seats (9) are provided on the back side of the heat dissipation plate (3), and the support seats (9) are distributed on both sides of the heat dissipation plate (3). One of the support seats (9) is provided with an insertion rod (91), and the other support seat (9) is provided with a plug (92) for the insertion rod (91) to be plugged in.

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