Printed circuit board

Abstract

The utility model discloses a printed circuit board. The printed circuit board comprises a metal plate; the second metal plate comprises an overlapping area and a dislocation area, and the dislocation area of the second metal plate is exposed relative to the first metal plate, so that a blind groove is formed between the first metal plate and the second metal plate; the dielectric partition plate comprises a first dielectric partition plate, a plurality of windows arranged at intervals are arranged on the portion, corresponding to the dislocation area, of the first dielectric partition plate, and the windows at least partially correspond to the circuit on the second metal plate, so that the circuit in the dislocation area is at least partially exposed. Therefore, a blind groove is formed between the first metal plate and the second metal plate through the arrangement of the dislocation area, and a circuit in the dislocation area is at least partially exposed through the arrangement of the plurality of windows arranged at intervals in the part, corresponding to the dislocation area, of the first dielectric partition plate, so that the problems of glue flowing and deviation of the blind groove can be avoided; and the circuit can be exposed to facilitate subsequent welding.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a printed circuit board. Background Art

[0002] With the continuous development of semiconductor technology, the manufacturing process of printed circuit boards is also constantly improving. Blind slots are provided on printed circuit boards to facilitate the circuit layout of the circuit board.

[0003] In related technologies, circuits matching various devices are generally designed in PCB blind slots. In order to prevent short circuits between circuits, ink needs to be printed in the blind slots to provide solder resistance and insulation. However, the ink usually needs to be pre-printed in the blind slots before the outer circuit board is laminated. This is equivalent to hiding the ink in the middle layer. After the outer circuit is realized, the excess material above the ink is milled off with a milling cutter in a controlled depth milling manner, thereby exposing the circuit and ink in the blind slots. In this way, when removing the glue by chemical reaction, the ink may dissolve in the glue removal solution, and when the circuit board is laminated, there is a risk of the ink at the outline position of the blind slot being displaced. Utility Model Content

[0004] The present invention aims to solve at least one of the technical problems in the prior art. To this end, one purpose of the present invention is to provide a printed circuit board that can not only solve the problem of glue flow in blind slots, but also avoid the problem of blind slot deviation.

[0005] According to the utility model, a printed circuit board includes: a metal plate, wherein the metal plates are multiple and include a first metal plate and a second metal plate, the first metal plates are multiple, and the multiple first metal plates are adjacent to each other and stacked, and the second metal plates are multiple and stacked on the lower side of the multiple first metal plates; the second metal plate includes an overlapping area and an offset area, the overlapping area overlaps with the projection of the first metal plate in the up-down direction, the offset area is offset with the projection of the first metal plate in the up-down direction, and the offset area of the second metal plate is exposed relative to the first metal plate so that a blind groove is formed between the first metal plate and the second metal plate; a dielectric partition, wherein the dielectric partition includes a first dielectric partition, the first dielectric partition is stacked between the first metal plate and the second metal plate, and the first dielectric partition is provided with a plurality of spaced windows in a portion corresponding to the offset area, and the windows at least partially correspond to the circuit on the second metal plate so that the circuit in the offset area is at least partially exposed.

[0006] Therefore, by setting the offset area, a blind groove is formed between the first metal plate and the second metal plate, and by setting a plurality of spaced windows in the portion corresponding to the first dielectric partition and the offset area, the circuit in the offset area is at least partially exposed. This not only avoids the problems of blind groove glue flow and blind groove deviation, but also exposes the circuit to facilitate subsequent welding. Further, it can reduce the process difficulty of the printed circuit board and enhance product competitiveness.

[0007] In some examples of the present invention, the area of the projection of the first metal plate in the up-down direction is smaller than the area of the projection of the second metal plate in the up-down direction, so that the dislocation area of the second metal plate is exposed relative to the first metal plate, and the blind groove is formed between the first metal plate and the second metal plate.

[0008] In some examples of the present invention, there are multiple windows, and the multiple windows are arranged at intervals.

[0009] In some examples of the present invention, a copper-clad laminate substrate is further included, wherein the copper-clad laminate substrate includes a first substrate, which is stacked between two adjacent first metal plates, and the projections of the first substrate and the first metal plates in the vertical direction overlap with each other.

[0010] In some examples of the present invention, the copper-clad laminate substrate further includes a second substrate, which is stacked between at least two adjacent second metal plates, and the dielectric separator further includes a second dielectric separator, which is disposed between at least two adjacent second metal plates.

[0011] In some examples of the present invention, the multiple metal plates include an upper boundary metal plate, a lower boundary metal plate and an intermediate metal plate, the upper boundary metal plate is located at the uppermost side of the multiple metal plates, the lower boundary metal plate is located at the lowermost side of the multiple metal plates, and the intermediate metal plate is arranged between the upper boundary metal plate and the lower boundary metal plate. There are multiple intermediate metal plates, and each intermediate metal plate is respectively provided with the dielectric partition and the copper clad laminate substrate on both sides in the upper and lower directions.

[0012] In some examples of the present invention, the plurality of intermediate metal plates include a first intermediate metal plate, a second intermediate metal plate, a third intermediate metal plate and a fourth intermediate metal plate, the upper boundary metal plate, the first intermediate metal plate, the second intermediate metal plate, the third intermediate metal plate, the fourth intermediate metal plate and the lower boundary metal plate are stacked in sequence in the upper and lower directions, the upper boundary metal plate and the first intermediate metal plate are both the first metal plates, the second intermediate metal plate, the third intermediate metal plate, the fourth intermediate metal plate and the lower boundary metal plate are all second metal plates; the first substrate is arranged between the upper boundary metal plate and the first intermediate metal plate, the second substrate is arranged between the second intermediate metal plate and the third intermediate metal plate, the third substrate is arranged between the fourth intermediate metal plate and the lower boundary metal plate, a first dielectric partition is arranged between the first intermediate metal plate and the second intermediate metal plate, and a second dielectric partition is arranged between the third intermediate metal plate and the fourth intermediate metal plate.

[0013] In some examples of the present invention, the area of the misaligned region is smaller than the area of the overlapped region.

[0014] In some examples of the present invention, the metal plate, the copper-clad laminate substrate, and the dielectric separator are all pressed together.

[0015] In some examples of the present invention, the dielectric separator is a prepreg.

[0016] Additional aspects and advantages of the present invention will be given in part in the following description and will become apparent from the following description or learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0018] Figure 1 is an exploded view of a printed circuit board according to an embodiment of the present utility model;

[0019] Figure 2 This is a schematic diagram of a printed circuit board manufacturing process according to an embodiment of the present utility model;

[0020] Figure 3 This is a schematic diagram of a printed circuit board manufacturing process according to an embodiment of the present utility model;

[0021] Figure 4 This is a schematic diagram of a printed circuit board manufacturing process according to an embodiment of the present utility model;

[0022] Figure 5is a schematic diagram of a printed circuit board according to an embodiment of the present utility model;

[0023] Figure 6 It is a flow chart of a method for manufacturing a printed circuit board according to an embodiment of the present utility model.

[0024] Reference numerals:

[0025] 100. Printed circuit board;

[0026] 10. Metal plate; 101. First metal plate; 102. Second metal plate; 1021. Overlapping area; 1022. Misaligned area;

[0027] 103, upper boundary metal plate; 104, lower boundary metal plate; 105, intermediate metal plate; 1051, first intermediate metal plate; 1052, second intermediate metal plate; 1053, third intermediate metal plate; 1054, fourth intermediate metal plate;

[0028] 20, dielectric separator; 201, first dielectric separator; 202, second dielectric separator;

[0029] 30. Copper clad laminate substrate; 301. First substrate; 302. Second substrate; 303. Third substrate;

[0030] 40. Open the window;

[0031] 50. Blind groove. DETAILED DESCRIPTION

[0032] The embodiments of the present invention are described in detail below. The embodiments described with reference to the accompanying drawings are exemplary. The embodiments of the present invention are described in detail below.

[0033] Reference below Figures 1-6 A printed circuit board 100 according to an embodiment of the present invention is described.

[0034] Combine Figures 1-6 As shown, the printed circuit board 100 according to the present invention can mainly include: a metal plate 10 and a dielectric separator 20. The metal plates 10 are multiple and include a first metal plate 101 and a second metal plate 102. The first metal plates 101 are multiple and are adjacent to each other and stacked. The second metal plates 102 are multiple and are stacked on the bottom side of the multiple first metal plates 101. This not only provides layout space for circuit construction of the printed circuit board 100, but also ensures the structural strength of the printed circuit board 100. In addition, metal has good thermal conductivity, which can effectively disperse and conduct the heat generated by the printed circuit board 100, thereby improving the stability and reliability of the printed circuit board 100.

[0035] The second metal plate 102 includes an overlapping area 1021 and an offset area 1022. The overlapping area 1021 overlaps with the projection of the first metal plate 101 in the up and down directions, and the offset area 1022 is offset with the projection of the first metal plate 101 in the up and down directions. The offset area 1022 of the second metal plate 102 is exposed relative to the first metal plate 101, so that a blind groove 50 is formed between the first metal plate 101 and the second metal plate 102. In this way, the offset area 1022 of the second metal plate 102 is exposed relative to the first metal plate 101, which can provide sufficient space for the setting of the blind groove 50 and reduce the processing difficulty of the blind groove 50.

[0036] The dielectric separator 20 includes a first dielectric separator 201, which is stacked between the first metal plate 101 and the second metal plate 102. The portion of the first dielectric separator 201 corresponding to the offset region 1022 is provided with a plurality of spaced-apart windows 40. The windows 40 at least partially correspond to the circuitry on the second metal plate 102, thereby at least partially exposing the circuitry in the offset region 1022. Specifically, the dielectric separator 20 has an insulating function. The first dielectric separator 201 and the second metal plate 102 have the same area. By stacking the first dielectric separator 201 between the first metal plate 101 and the second metal plate 102, the first metal plate 101 and the second metal plate 102 are not only electrically isolated, allowing the circuitry in each portion of the first metal plate 101 and the second metal plate 102 to operate independently without interfering with each other, but also preventing short circuits between the first metal plate 101 and the second metal plate 102, which could cause circuit malfunction.

[0037] Furthermore, the circuit of the dislocated area 1022 is at least partially exposed through the window 40. This not only facilitates subsequent soldering operations so that part of the circuit of the dislocated area 1022 can be connected to other layers or other circuits and reduces the difficulty of wiring, but also allows the printed circuit board 100 to be tested and debugged through the circuit exposed in the dislocated area 1022, and to perform signal measurement, analysis or troubleshooting, thereby improving the stability and reliability of the printed circuit board 100.

[0038] In this way, a blind groove 50 is formed in the exposed area of the first dielectric partition 201 relative to the first metal plate 101. The blind groove 50 formed in this way itself has the functions of insulation and solder resistance, so that no printing ink is required in the blind groove 50. Furthermore, this can not only avoid the problem of glue flow in the blind groove 50, but also avoid the problem of the blind groove 50 being offset relative to the first metal plate 101. In addition, it can also facilitate the design of circuits matching various devices in the blind groove 50.

[0039] Therefore, by setting the offset area 1022, a blind groove 50 is formed between the first metal plate 101 and the second metal plate 102. By setting a plurality of spaced windows 40 in the corresponding parts of the first dielectric partition 201 and the offset area 1022, the circuit of the offset area 1022 is at least partially exposed. This not only avoids the problems of glue flow and deviation of the blind groove 50, but also exposes the circuit to facilitate subsequent welding. Further, it can reduce the process difficulty of the printed circuit board 100 and enhance the competitiveness of the product.

[0040] In some examples of the present invention, both the copper clad laminate substrate 30 and the dielectric separator 20 have an insulating function.

[0041] Combine Figure 3 、 Figure 4 and Figure 5 As shown, the area of the projection of the first metal plate 101 in the vertical direction is smaller than the area of the projection of the second metal plate 102 in the vertical direction, so that the offset region 1022 of the second metal plate 102 is exposed relative to the first metal plate 101, and a blind groove 50 is formed between the first metal plate 101 and the second metal plate 102. Specifically, the area of the projection of the first metal plate 101 in the vertical direction is smaller than the area of the projection of the second metal plate 102 in the vertical direction. This allows the area of the second metal plate 102 to be larger than the areas of the first metal plate 101 and the first substrate 301, ensuring that the second metal plate 102 has an exposed area relative to the first metal plate 101, namely the offset region 1022. This reserves a certain amount of space for the arrangement of the blind groove 50, thereby preventing damage to the metal plate 10 caused by subsequent processing of the blind groove 50. Furthermore, the rationality of the structural arrangement of the printed circuit board 100 is ensured, thereby improving the reliability of the printed circuit board 100.

[0042] Combine Figure 4 and Figure 5 As shown, there are multiple windows 40, which are spaced apart. This arrangement not only allows electrical connections to be made at multiple locations in the offset region 1022, thereby reducing the difficulty of wiring the circuit, but also facilitates electrical connection operations such as welding at the circuit connection points within the windows 40, thereby reducing the difficulty of welding and improving the quality and efficiency of welding.

[0043] In addition, the spaced arrangement of the multiple windows 40 is also beneficial to ensuring the structural strength of the printed circuit board 100 and optimizing the heat dissipation performance of the printed circuit board 100. It can not only avoid breakage or deformation at the position of the windows 40, but also increase the heat dissipation area of the printed circuit board 100.

[0044] Furthermore, the spacing of the plurality of windows 40 can improve the stability and reliability of the printed circuit board 100 .

[0045] Combine Figure 1、 Figure 3 and Figure 5 As shown, the printed circuit board 100 also includes a copper-clad laminate substrate 30, which includes a first substrate 301. The first substrate 301 is stacked between two adjacent first metal plates 101, and the projections of the first substrate 301 and the first metal plates 101 in the vertical direction overlap. Specifically, the copper-clad laminate substrate 30 has a certain insulating effect. Stacking the first substrate 301 between the two adjacent first metal plates 101 not only isolates the structures of the two first metal plates 101, allowing the circuits of the two first metal plates 101 to operate independently without interfering with each other, but also prevents circuit malfunction caused by accidental contact between the two first metal plates 101. Furthermore, the first substrate 301 and the two first metal plates 101 have the same area, and their projections in the vertical direction overlap. This ensures the rationality of the basic structure of the printed circuit board 100 and improves the stability and reliability of the printed circuit board 100.

[0046] Combine Figure 1 、 Figure 2 and Figure 4 As shown, the copper-clad laminate substrate 30 further includes a second substrate 302, which is stacked and disposed between at least two adjacent second metal plates 102. The dielectric separator 20 further includes a second dielectric separator 202, which is disposed between at least two adjacent second metal plates 102. Specifically, both the copper-clad laminate substrate 30 and the dielectric separator 20 have a certain insulating effect. This arrangement not only isolates the two adjacent second metal plates 102, allowing circuits on different layers of the second metal plates 102 to operate independently without interfering with each other, but also prevents circuit malfunctions caused by accidental contact between the two adjacent second metal plates 102, thereby ensuring the stability and reliability of the printed circuit board 100.

[0047] Combine Figure 1 、 Figure 2 and Figure 4As shown, the multiple metal plates 10 include an upper boundary metal plate 103, a lower boundary metal plate 104 and an intermediate metal plate 105. The upper boundary metal plate 103 is located at the uppermost side of the multiple metal plates 10, the lower boundary metal plate 104 is located at the lowermost side of the multiple metal plates 10, and the intermediate metal plate 105 is arranged between the upper boundary metal plate 103 and the lower boundary metal plate 104. There are multiple intermediate metal plates 105, and each intermediate metal plate 105 is respectively provided with a dielectric partition 20 and a copper clad laminate substrate 30 on both sides in the upper and lower directions. With this arrangement, the structure of the printed circuit board 100 realizes a stacked arrangement of metal plates 10 and insulating layers, isolating the metal plates 10 from each other. This not only allows signal lines, power layers, and ground planes to be arranged on different metal plates 10, but also allows the printed circuit board 100 to accommodate more circuit elements and more complex line connections. It also reduces loss and interference during circuit signal transmission, ensuring signal integrity and quality. Furthermore, it can ensure the stability and reliability of the circuit on the printed circuit board 100 and improve the circuit performance of the printed circuit board 100.

[0048] Combine Figure 1 、 Figure 2 and Figure 4 As shown, the plurality of intermediate metal plates 105 include a first intermediate metal plate 1051, a second intermediate metal plate 1052, a third intermediate metal plate 1053, and a fourth intermediate metal plate 1054. The upper boundary metal plate 103, the first intermediate metal plate 1051, the second intermediate metal plate 1052, the third intermediate metal plate 1053, the fourth intermediate metal plate 1054, and the lower boundary metal plate 104 are stacked in sequence in the vertical direction. The upper boundary metal plate 103 and the first intermediate metal plate 1051 are both the first metal plate 101, and the second intermediate metal plate 1052, the third intermediate metal plate 1053, the fourth intermediate metal plate 1054, and the lower boundary metal plate 104 are all the second metal plate 102.

[0049] A first substrate 301 is arranged between the upper boundary metal plate 103 and the first intermediate metal plate 1051, a second substrate 302 is arranged between the second intermediate metal plate 1052 and the third intermediate metal plate 1053, a third substrate 303 is arranged between the fourth intermediate metal plate 1054 and the lower boundary metal plate 104, a first dielectric separator 201 is arranged between the first intermediate metal plate 1051 and the second intermediate metal plate 1052, and a second dielectric separator 202 is arranged between the third intermediate metal plate 1053 and the fourth intermediate metal plate 1054.

[0050] Among them, the dielectric separator 20 and the copper clad laminate substrate 30 can not only provide an insulating layer to prevent short circuit and leakage between the lines of different metal plates 10 and ensure the normal operation of the circuit, but also play a supporting and fixing role to ensure the structural strength of the printed circuit board 100.

[0051] Furthermore, the dielectric separator 20 and the copper clad laminate substrate 30 can be tightly bonded to the metal plate 10 to form a strong laminate structure, thereby ensuring the overall performance of the circuit board.

[0052] Furthermore, the dielectric separator 20 generally has good processing performance, such as being easy to cut and drill, which makes it easy to process the prepreg during the manufacturing process of the printed circuit board 100 to meet the design requirements of different circuits.

[0053] Such a configuration not only can achieve mutual isolation between the metal plates 10 and prevent short circuit or leakage between the circuits of the metal plates 10 , but also can ensure the stability and reliability of the printed circuit board 100 and simplify the processing process of the printed circuit board 100 .

[0054] Combine Figure 3 、 Figure 4 and Figure 5 As shown, the area of the dislocation region 1022 is smaller than the area of the overlap region 1021, wherein the dislocation region 1022 is mainly used to set the blind groove 50 and the window 40, and the first metal plate 101 needs to be stacked on the upper layer of the overlap region 1021. By making the area of the dislocation region 1022 smaller than the area of the overlap region 1021, the overlap region 1021 can be prevented from being broken or deformed due to stress concentration, thereby improving the stability and reliability of the printed circuit board 100.

[0055] Combine Figure 1 、 Figure 2 and Figure 5 As shown, the metal plate 10, the copper-clad laminate substrate 30 and the dielectric separator 20 are all pressed together. By placing the copper-clad laminate or the dielectric separator 20 between the metal plates 10 for stacking, and pressing the arranged metal plates 10, the copper-clad laminate substrate 30 and the dielectric separator 20 together, not only can the structural strength and deformation resistance of the printed circuit board 100 be improved, but also the electronic components and circuits inside the printed circuit board 100 can be protected, which is conducive to ensuring the integrity and stability of the printed circuit board 100.

[0056] Combine Figure 1 、 Figure 2 and Figure 4 As shown, the dielectric partition 20 is a semi-cured sheet. Specifically, the semi-cured sheet is mainly composed of resin and reinforcing material, and the semi-cured sheet has reliable insulation properties. By using the semi-cured sheet as the dielectric partition 20, not only can the two layers of metal plates 10 on the upper and lower sides of the dielectric partition 20 be electrically isolated and the normal operation of the circuits on the two layers of metal plates 10 on the upper and lower sides of the dielectric partition 20 be ensured, but also the structural strength and deformation resistance of the printed circuit board 100 can be ensured, thereby improving the stability and reliability of the printed circuit board 100.

[0057] Furthermore, the prepreg has good thermal stability. Using the prepreg as the dielectric separator 20 can optimize the heat distribution of the printed circuit board 100 and improve the heat dissipation performance of the printed circuit board 100 .

[0058] In addition, the prepreg also has a certain adhesive effect, which can further improve the stability and flatness of the printed circuit board 100.

[0059] Combine Figures 1-6 As shown, the manufacturing method of the printed circuit board 100 according to the present invention includes the following steps: performing circuit etching on the first intermediate metal plate 1051, the second intermediate metal plate 1052, the third intermediate metal plate 1053, and the fourth intermediate metal plate 1054, and stacking the upper boundary metal plate 103, the first intermediate metal plate 1051, the second intermediate metal plate 1052, the third intermediate metal plate 1053, the fourth intermediate metal plate 1054, and the lower boundary metal plate 104 in sequence from top to bottom; arranging a first dielectric separator 201 between the first intermediate metal plate 1051 and the second intermediate metal plate 1052, and a second dielectric separator 202 between the third intermediate metal plate 1053 and the fourth intermediate metal plate 1054; arranging a first substrate 301 between the upper boundary metal plate 103 and the first intermediate metal plate 1051, and a second substrate 302 between the second intermediate metal plate 1052 and the third intermediate metal plate 1053; and arranging a second dielectric separator 202 between the fourth intermediate metal plate 1054 and the lower boundary metal plate. The third substrate 303 is set between the metal plates 104 and pressed; the upper boundary metal plate 103, the first intermediate metal plate 1051, the second intermediate metal plate 1052, the third intermediate metal plate 1053, the fourth intermediate metal plate 1054 and the lower boundary metal plate 104 are drilled and electroplated; the upper boundary metal plate 103 and the lower boundary metal plate 104 are subjected to circuit corrosion; the upper boundary metal plate 103, the first substrate 301 and the first intermediate metal plate 1051 are partially milled in sequence, and the first dielectric The partition 201 is exposed relative to the upper boundary metal plate 103, the first substrate 301, and the first intermediate metal plate 1051 to form a blind groove 50. A window 40 is formed in the portion of the first dielectric partition 201 exposed relative to the upper boundary metal plate 103, the first substrate 301, and the first intermediate metal plate 1051, wherein the window 40 corresponds to at least a portion of the graphic circuit on the second intermediate metal plate 1052. The processed surface is processed and the final shape processing is performed to complete the production of the printed circuit board 100.

[0060] Specifically, the intermediate metal plate 105 is first subjected to circuit etching, and unnecessary portions of the intermediate metal plate 105 are corroded away through a chemical reaction, thereby forming a circuit pattern and wire connections. Next, the upper boundary metal plate 103, the first intermediate metal plate 1051, the second intermediate metal plate 1052, the third intermediate metal plate 1053, the fourth intermediate metal plate 1054, and the lower boundary metal plate 104 are stacked in sequence from top to bottom, and dielectric separators 20 or copper-clad laminate substrates 30 are placed correspondingly between the metal plates 10, and then pressed together to form the basic structural framework of the printed circuit board 100.

[0061] Furthermore, drilling and electroplating processes are performed on the laminated printed circuit board 100, which not only provides locations for inserting and soldering the pins of the electronic components, so that the electronic components can be accurately installed on the circuit board, but also helps to achieve electrical connection between different metal plates 10, improve the performance of the printed circuit board 100, and at the same time reduce the weight of the printed circuit board 100. In addition, the electroplating layer can also effectively prevent the surface of the printed circuit board 100 from oxidation or corrosion, thereby extending the service life of the printed circuit board 100.

[0062] Furthermore, circuit etching is performed on the upper boundary metal plate 103 and the lower boundary metal plate 104 to etch away unnecessary portions of the upper boundary metal plate 103 and the lower boundary metal plate 104 , thereby forming circuit patterns and wire connections on the upper boundary metal plate 103 and the lower boundary metal plate 104 .

[0063] Furthermore, after calculating the milling depth, a milling cutter is used to mill the corresponding portion of the first dielectric spacer 201 of the printed circuit board 100 using a controlled depth milling method, thereby forming a blind groove 50 and providing a window 40 within the blind groove 50. The blind groove 50 thus formed achieves insulation through the dielectric spacer 20, eliminating the need for printing ink and preventing glue flow through the blind groove 50. Furthermore, the blind groove 50 is formed by milling the first dielectric spacer 201 after the various layers of the printed circuit board 100 are laminated, thus preventing the blind groove 50 from shifting due to lamination misalignment.

[0064] Furthermore, the processed surface is processed, and finally the outer shape is processed according to the requirements of the printed circuit board 100 to complete the production of the printed circuit board 100.

[0065] Such an arrangement can ensure the stability and reliability of the printed circuit board 100 and can ensure the normal operation and good working performance of the circuit of the printed circuit board 100.

[0066] Combine Figure 6As shown, a window 40 is formed in the portion of the first dielectric partition 201 exposed relative to the upper boundary metal plate 103, the first substrate 301 and the first intermediate metal plate 1051, wherein the step of the window 40 corresponding to at least a portion of the graphic circuit on the second intermediate metal plate 1052 also includes: using a laser device to laser burn the window 40 in the portion of the first dielectric partition 201 exposed relative to the upper boundary metal plate 103, the first substrate 301 and the first intermediate metal plate 1051, thereby removing a portion of the dielectric partition above the soldering pad of the second intermediate metal plate 1052, so that the graphic circuit on the second intermediate metal plate 1052 is exposed, which can help to achieve electrical connection between the circuit on the second metal plate 102 and other circuits, and can facilitate subsequent tinning and welding operations on the circuit of the exposed portion of the second metal plate 102.

[0067] In addition, the first dielectric plate insulates and isolates the second metal plate 102 from the first intermediate metal plate 1051 above it. This arrangement can also avoid or reduce signal interference between the two metal plates 10.

[0068] Combine Figure 6 As shown, according to the manufacturing method of the printed circuit board 100 of the present invention, the step of processing the processing surface further includes: performing chemical nickel-gold treatment on the processing surface; and / or performing hot air soldering leveling on the processing surface.

[0069] Such a configuration not only allows the surface of the printed circuit board 100 to have good solderability, but also allows the printed circuit board 100 to have good corrosion resistance and oxidation resistance. In addition, it can also make the surface of the printed circuit board 100 smoother, facilitating the installation of electronic components and electrical contact. Furthermore, it can improve the stability and reliability of the printed circuit board 100 and extend the service life of the printed circuit board 100.

[0070] Since the structure of the printed circuit board 100 achieves insulation in the blind slot 50 through the dielectric partition 20 and the manufacturing method of the printed circuit board 100 is also more perfect, applying the manufacturing method of the printed circuit board 100 to the manufacture of the printed circuit board 100 can not only make the printed circuit board 100 have good working performance, but also improve the stability and reliability of the printed circuit board 100.

[0071] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation to the present invention.

[0072] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "example," "specific example," or "some examples" means that a specific feature, structure, material, or characteristic described in conjunction with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example.

[0073] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and purpose of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A printed circuit board, characterized in that: include: A plurality of metal plates, the metal plates including a first metal plate and a second metal plate, wherein the first metal plates are multiple and are adjacent to each other and stacked, and the second metal plates are multiple and are stacked on the lower side of the multiple first metal plates; The second metal plate includes an overlapping area and an offset area, the overlapping area overlaps with the projection of the first metal plate in the vertical direction, the offset area is offset with the projection of the first metal plate in the vertical direction, and the offset area of the second metal plate is exposed relative to the first metal plate, so that a blind groove is formed between the first metal plate and the second metal plate; A dielectric partition, the dielectric partition includes a first dielectric partition, the first dielectric partition is stacked between the first metal plate and the second metal plate, the first dielectric partition is provided with a plurality of spaced windows in a portion corresponding to the dislocation area, the windows at least partially corresponding to the circuit on the second metal plate, so that the circuit in the dislocation area is at least partially exposed.

2. The printed circuit board according to claim 1, wherein: The area of the projection of the first metal plate in the up-down direction is smaller than the area of the projection of the second metal plate in the up-down direction, so that the dislocation area of the second metal plate is exposed relative to the first metal plate, and the blind groove is formed between the first metal plate and the second metal plate.

3. The printed circuit board according to claim 1, wherein: There are multiple windows, and the multiple windows are arranged at intervals.

4. The printed circuit board according to claim 1, wherein: It also includes a copper-clad laminate substrate, which includes a first substrate. The first substrate is stacked between two adjacent first metal plates, and the projections of the first substrate and the first metal plates in the vertical direction overlap with each other.

5. The printed circuit board according to claim 4, wherein: The copper clad laminate substrate further includes a second substrate, which is stacked between at least two adjacent second metal plates. The dielectric separator further includes a second dielectric separator, which is disposed between at least two adjacent second metal plates.

6. The printed circuit board according to claim 5, wherein: The multiple metal plates include an upper boundary metal plate, a lower boundary metal plate and an intermediate metal plate. The upper boundary metal plate is located at the uppermost side of the multiple metal plates, the lower boundary metal plate is located at the lowermost side of the multiple metal plates, and the intermediate metal plate is arranged between the upper boundary metal plate and the lower boundary metal plate. There are multiple intermediate metal plates, and each intermediate metal plate is respectively provided with the dielectric partition and the copper clad laminate substrate on both sides in the upper and lower directions.

7. The printed circuit board according to claim 6, wherein: The plurality of intermediate metal plates include a first intermediate metal plate, a second intermediate metal plate, a third intermediate metal plate, and a fourth intermediate metal plate, the upper boundary metal plate, the first intermediate metal plate, the second intermediate metal plate, the third intermediate metal plate, the fourth intermediate metal plate, and the lower boundary metal plate are stacked in sequence in the vertical direction, the upper boundary metal plate and the first intermediate metal plate are both the first metal plate, and the second intermediate metal plate, the third intermediate metal plate, the fourth intermediate metal plate, and the lower boundary metal plate are all the second metal plate; The first substrate is arranged between the upper boundary metal plate and the first intermediate metal plate, the second substrate is arranged between the second intermediate metal plate and the third intermediate metal plate, the third substrate is arranged between the fourth intermediate metal plate and the lower boundary metal plate, a first dielectric separator is arranged between the first intermediate metal plate and the second intermediate metal plate, and a second dielectric separator is arranged between the third intermediate metal plate and the fourth intermediate metal plate.

8. The printed circuit board according to claim 4, wherein: The area of the dislocation region is smaller than the area of the overlap region.

9. The printed circuit board according to claim 4, wherein: The metal plate, the copper-clad laminate substrate and the dielectric separator are all pressed together.

10. The printed circuit board according to claim 1, wherein: The dielectric separator is a prepreg.

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