Control device and electronic equipment

Abstract

The embodiment of the utility model provides a control device and electronic equipment, and the control device comprises a circuit board, a supporting part, and a plurality of electronic elements. The circuit board is provided with a first plate surface and a second plate surface which are oppositely arranged along a preset direction, the supporting piece is mounted between the second plate surface and an inner cavity surface of the shell, and at least part of the second plate surface is exposed outside the supporting piece and forms a first accommodating space with the inner cavity surface of the shell; one part of the plurality of electronic elements is arranged on the first board, and the other part of the plurality of electronic elements is arranged in the first accommodating space. The control device and the electronic equipment provided by the embodiment of the utility model have the advantage of small size.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of computer technology, and in particular to a control device and an electronic device. Background Art

[0002] Computer calculations and operations are primarily performed by the CPU (Central Processing Unit). However, as CPU processing performance increases, the heat generated by the CPU is increasing.

[0003] Related electronic devices often use fans to dissipate heat from the CPU. For example, the electronic device includes a housing and a control device disposed within the housing's inner cavity. The control device includes a circuit board, a CPU, a fan, and a fixed backplate. The lower side of the fixed backplate is connected to the housing, and the upper side of the fixed backplate is connected to the circuit board. The CPU is mounted on the upper surface of the circuit board, and the fan is positioned above the CPU. The fan directs air through the CPU, removing heat from the CPU.

[0004] In the aforementioned heat dissipation solutions, one side of the circuit board often contacts the fixed backplane, forcing the electronic components to be concentrated on the other side of the circuit board. When there are a large number of electronic components, the circuit board surface area must be large enough to accommodate them. However, this approach results in a larger space and bulkier circuit board, which in turn increases the size of the electronic device. Summary of the Invention

[0005] The purpose of the embodiments of the present application is to provide a control device and an electronic device, which can solve the problem of large size of electronic devices.

[0006] To achieve the above-mentioned purpose, one aspect of an embodiment of the present application provides a control device for an electronic device, the electronic device including a shell, the control device being arranged in the inner cavity of the shell, the control device including: a circuit board, a support member and a plurality of electronic components; the circuit board has a first board surface and a second board surface arranged opposite to each other along a preset direction, the support member is configured to be installed between the second board surface and the inner cavity surface of the shell, and at least part of the second board surface is exposed on the outside of the support member and a first accommodating space is formed between the second board surface and the inner cavity surface of the shell; a part of the plurality of electronic components is arranged on the first board surface, and the other part is arranged in the first accommodating space.

[0007] The control device provided by the embodiment of the present application arranges multiple electronic components on the first board surface and the second board surface of the circuit board respectively, so as to reduce the area of the board surface of the circuit board, thereby reducing the space occupied by the circuit board, and further reducing the volume of the electronic device. In addition, by providing a support member and using the support member to fix the circuit board to the housing of the electronic device, the support member is also used to form a first accommodation space between the second board surface of the circuit board and the inner cavity surface of the housing, which can accommodate the electronic components arranged on the second board surface, so as to facilitate the placement of the electronic components arranged on the second board surface of the circuit board.

[0008] Optionally, the multiple electronic components include a processor, and the processor is arranged on the first board surface; the control device further includes a first fastener and a fan assembly for cooling the processor. The fan assembly is located on one side of the first board surface of the circuit board, and the first fastener sequentially passes through the fan assembly, the circuit board and the support member and is firmly connected.

[0009] Through the above solution, the fan assembly is used to cool the processor, and the first fastener is used to connect the fan assembly, the circuit board and the support member.

[0010] Optionally, the support member is made of a metal material; the control device further includes an insulating board, and the insulating board is arranged between the second board surface and the support member; the first fastener sequentially passes through the fan assembly, the circuit board, the insulating board and is firmly connected to the support member.

[0011] Through the above solution, the support member made of a metal material is used to meet the rigidity requirements of the support member, and the insulating board is used to prevent electric leakage.

[0012] Optionally, the support member includes a body portion and multiple support portions. The body portion has a top surface and a bottom surface arranged oppositely along a preset direction, and the top surface of the body portion is connected to the second board surface; the multiple support portions are supported between the body portion and the inner cavity surface of the housing; the first fasteners are multiple, and the multiple first fasteners sequentially pass through the fan assembly, the circuit board, the insulating board and are firmly connected to the multiple support portions in one-to-one correspondence.

[0013] Through the above solution, the top surface of the body portion is in surface contact with the second board surface of the circuit board, so as to increase the contact area between the support member and the second board surface and avoid stress concentration.

[0014] Optionally, the multiple support portions are connected to the outer periphery of the body portion; the support portion is folded relative to the body portion, so that the support portion has a first connection surface and a second connection surface arranged oppositely along a preset direction, and the first connection surface is configured to be connected to the inner cavity surface of the housing.

[0015] Through the above solution, the first connection surface of the body portion is in surface contact with the second inner cavity surface, so as to increase the connection area between the two and improve the connection stability.

[0016] Optionally, the second connection surface is flush with the top surface of the body portion and contacts the insulating plate.

[0017] Through the above solution, it is possible to prevent the insulating plate from being suspended above the second connection surface, thereby avoiding bending of the insulating plate when connecting the insulating plate to the support portion through the first fastener.

[0018] Optionally, the support member further includes a first connection portion. The first connection portion is connected to the second connection surface and passes through the insulating plate and the circuit board. The first connection portion has a threaded hole for threaded connection with the first fastener.

[0019] Through the above solution, it is convenient to position and install the support member and the circuit board, improving the assembly efficiency.

[0020] Optionally, the support member further includes a second connection portion. The second connection portion is connected to the bottom surface of the body portion; the control device includes a second fastener and a fixing base. The fixing base wraps around the outside of the processor and is located on one side of the first board surface of the circuit board; the second fastener sequentially passes through the fixing base, the circuit board, the insulating plate, the body portion and is threadedly connected to the second connection portion.

[0021] Through the above solution, the processor is assembled on the first board surface of the circuit board by means of the fixing base, and the fixing between the fixing base, the circuit board and the support member is achieved by using the second fastener.

[0022] Optionally, the air inlet end of the fan assembly faces the processor, and the axis of the air outlet end of the fan assembly is perpendicular to the axis of the air inlet end of the fan.

[0023] Through the above solution, the height of the fan assembly in the preset direction is reduced.

[0024] To achieve the above object, another aspect of the embodiments of the present application further provides an electronic device, including a housing and the control device as described above.

[0025] The electronic device provided by the embodiments of the present application has the advantage of small volume. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0027] Figure 1 It is a partial schematic diagram of an electronic device provided by an embodiment of the present application;

[0028] Figure 2 For Figure 1Exploded view of the shown control device;

[0029] Figure 3 is Figure 1 Partial cross-sectional view of the shown electronic device;

[0030] Figure 4 is Figure 1 A partial cross-sectional view of the shown electronic device;

[0031] Figure 5 is Figure 1 Another partial cross-sectional view of the shown electronic device.

[0032] Description of reference numerals:

[0033] 1000, control device;

[0034] 100, circuit board; 101, first board surface; 102, second board surface;

[0035] 200, electronic component; 201, processor;

[0036] 300, support member; 310, body portion; 320, support portion; 321, first connection surface; 322, second connection surface; 330, first connection portion; 340, second connection portion;

[0037] 400, fan assembly; 401, fan; 402, bracket;

[0038] 500, insulating board;

[0039] 601, first accommodation space; 602, second accommodation space;

[0040] 701, first fastener; 702, second fastener;

[0041] 800, fixing base;

[0042] 2000, housing; 2001, second inner cavity surface. Detailed implementation manners

[0043] As described in the background art, the related electronic devices have the problem of large volume. After research by the inventor, it is found that the reason for this problem is that the back side of the circuit board of the related electronic device is fixed to the housing through a fixed back plate, and the electronic components are concentrated on the front side board surface of the circuit board. When the number of electronic components is large, the area of the front side board surface of the circuit board needs to be large enough to carry these electronic components. The large front side board surface of the circuit board will cause the large volume of the circuit board, and further cause the large space occupied by the circuit board, and further cause the large volume of the electronic device, which does not meet the user's demand for miniaturization of the electronic device.

[0044] In view of the above technical problems, the inventors of the present application came up with the idea of arranging multiple electronic components separately on the front and back side surfaces of the circuit board to reduce the area of the circuit board surface. In order to provide a placement space for the electronic components arranged on the back side of the circuit board, the embodiments of the present application replace the fixed backplane in the related art with a higher support member.

[0045] In order to make the objectives, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are some, but not all, of the embodiments of the present application.

[0046] All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without making creative efforts shall fall within the scope of protection of the present application. Without conflict, the following embodiments and the features in the embodiments may be combined with each other.

[0047] Figure 1 Partial schematic diagram of an electronic device provided by an embodiment of the present application. Refer to Figure 1 , the electronic device provided by the embodiments of the present application may be a terminal device with computing functions, such as, intelligent interactive flat panel, tablet computer (pad), computer, virtual reality (VR) terminal device, augmented reality (AR) terminal device, wireless terminal in industrial control, wireless terminal in self-driving, wireless terminal in remote medical surgery, wireless terminal in smart grid, wireless terminal in transportation safety, wireless terminal in smart city, wireless terminal in smart home, personal digital assistant (PDA), vehicle-mounted device, etc.

[0048] The electronic device includes a housing 2000 and multiple devices arranged in the inner cavity of the housing 2000. These devices include a control device 1000 and other devices (such as a storage device, an input device, an output device, etc.). Optionally, the devices of the electronic device can communicate with each other to complete user instructions.

[0049] Figure 2 For Figure 1 exploded view of the control device shown. Refer to Figure 2, the control device 1000 includes a circuit board 100, a support member 300, and multiple electronic components 200. Among them, the shape of the circuit board 100 can be plate-shaped, and the circuit board 100 has a first board surface 101 and a second board surface 102 oppositely arranged in its thickness direction.

[0050] Figure 3 For Figure 1 a partial cross-sectional view of the illustrated electronic device. Refer to Figure 2 With Figure 3 , in order to reduce the area of the board surface (the first board surface 101, the second board surface 102) of the circuit board 100, the multiple electronic components 200 are respectively arranged on the first board surface 101 and the second board surface 102 of the circuit board 100. That is to say, among the multiple electronic components 200, a part of the electronic components 200 are arranged on the first board surface 101, and another part of the electronic components 200 are arranged on the second board surface 102. For the sake of simplicity of description, the thickness direction of the circuit board 100 is hereinafter referred to as the preset direction.

[0051] In order to provide a placement space for the electronic components 200 arranged on the first board surface 101 and the second board surface 102 of the circuit board 100, the board surface of the circuit board 100 is suspended with respect to the inner cavity surface of the housing 2000.

[0052] Specifically, the inner cavity surface of the housing 2000 has a first inner cavity surface (not shown in the figure) and a second inner cavity surface 2001 oppositely arranged in the preset direction. The first board surface 101 of the circuit board 100 faces the first inner cavity surface of the housing 2000, and there is a distance between the first board surface 101 of the circuit board 100 and the first inner cavity surface, so that the inner cavity surface of the housing 2000 on one side of the first board surface 101 of the circuit board 100 forms a space capable of accommodating the electronic components 200. The second board surface 102 of the circuit board 100 faces the second inner cavity surface 2001 of the housing 2000, and there is a distance between the second board surface 102 of the circuit board 100 and the second inner cavity surface 2001, so that the inner cavity surface of the housing 2000 on one side of the second board surface 102 of the circuit board 100 forms a space capable of accommodating the electronic components 200.

[0053] It is worth noting that the circuit board 100 can be suspended with respect to the inner cavity surface of the housing 2000 through the support member 300. Specifically, the support member 300 is fixed between the second board surface 102 of the circuit board 100 and the second inner cavity surface 2001 of the housing 2000. That is to say, one end of the support member 300 in the preset direction can be connected to the second inner cavity surface 2001 of the housing 2000, and the other end of the support member 300 in the preset direction can be connected to the second board surface 102 of the circuit board 100.

[0054] As mentioned above, some of the electronic components 200 are disposed on the second board surface 102 of the circuit board 100. To avoid interference between the support member 300 and these electronic components 200 disposed on the second board surface 102 of the circuit board 100, the support member 300 and the second board surface 102 of the circuit board 100 may be arranged as follows:

[0055] At least a part of the second board surface 102 may be exposed outside the support member 300 (wherein, with the outer edge of the support member 300 as the boundary, the area enclosed by the outer edge of the support member 300 is the inner side of the support member 300, and vice versa is the outer side of the support member 300), and a first accommodation space 601 may be formed between the exposed second board surface 102 and the inner cavity surface of the housing 2000, and the first accommodation space 601 can accommodate the electronic components 200 disposed on the second board surface 102 of the circuit board 100. That is to say, the vertical projection of the support member 300 on the second board surface 102 may be located inside the second board surface 102 (with the outer edge of the second board surface 102 as the boundary, the area enclosed by the outer edge of the second board surface 102 is the inner side of the second board surface 102, and vice versa is the outer side of the second board surface 102), and the electronic components 200 disposed on the second board surface 102 can surround the outer periphery of the support member 300.

[0056] Continue to refer to Figure 2 With Figure 3 , a plurality of electronic components 200 include a processor 201 (such as a CPU, etc.), and the processor 201 may be disposed on the first board surface 101 of the circuit board 100. To fix the processor 201 to the circuit board 100, the control device 1000 provided by the embodiment of the present application further includes a fixing base 800, and the fixing base 800 can wrap around the outside of the processor 201, and the fixing base 800 can be located on one side of the first board surface 101 of the circuit board 100.

[0057] Figure 4 For Figure 1 a partial cross-sectional view of the illustrated electronic device. Refer to Figure 3 With Figure 4 , to achieve the fixation between the fixing base 800 and the circuit board 100, the control device 1000 provided by the embodiment of the present application further includes a second fastener 702. The second fastener 702 can sequentially pass through the fixing base 800, the circuit board 100 and be tightly connected to the support member 300.

[0058] Exemplarily, when the support member 300 includes a main body portion 310 and a plurality of support portions 320 as described below, the second fastener 702 can be fixedly connected to the main body portion 310. Since the distance between the bottom surface of the main body portion 310 and the second inner cavity surface 2001 of the housing 2000 is small (i.e., the height of the second accommodation space 602 in the preset direction is small), it is not convenient for the nut to extend in, so the support member 300 provided in the embodiment of the present application can be arranged as follows: The support member 300 includes a second connecting portion 340, which can be connected to the bottom surface of the main body portion 310, and the second connecting portion 340 can be provided with a threaded hole, and the main body portion 310 can be provided with a through hole corresponding to the threaded hole and penetrating through the main body portion 310. The second fastener 702 can sequentially pass through the fixing base 800, the circuit board 100, the insulating board 500, the through hole of the main body portion 310 and be threadedly connected to the threaded hole of the second connecting portion 340.

[0059] Reference Figure 1 And Figure 2 , optionally, in order to dissipate heat from the processor 201, the control device 1000 provided in the embodiment of the present application further includes a fan assembly 400, which can be located on one side of the first board surface 101 of the circuit board 100, and the fan assembly 400 can guide the relatively cold air from the outside to blow towards the processor 201 or suck the relatively hot air near the processor 201 to the outside.

[0060] The fan assembly 400 can include a fan 401 and a bracket 402 for fixing the fan 401. The fan 401 can be arranged on the side of the processor 201 and can guide the air to flow through the processor 201 from the side. Alternatively, the fan 401 can cover the side of the processor 201 facing away from the first board surface 101 and can guide the air to flow through the processor 201 along the thickness direction of the circuit board 100.

[0061] Here, the side of the processor 201 refers to one or more sides of the processor 201 in a direction perpendicular to the thickness direction of the circuit board 100. For example, if the thickness direction of the circuit board 100 is the up-down direction, the side of the processor 201 can refer to the left side, right side, front side, rear side, etc. of the processor 201.

[0062] In order to reduce the height of the fan assembly 400 in the preset direction, further, the fan 401 can be a centrifugal fan. Exemplarily, the air inlet end of the fan 401 can cover the side of the processor 201 facing away from the first board surface 101, and the air inlet end of the fan 401 can face the processor 201. The axis of the air outlet end of the fan 4 and the axis of the air inlet end of the fan 401 can be perpendicular to each other, so as to reduce the height of the fan assembly 400 in the preset direction, and further reduce the height of the electronic device in the preset direction.

[0063] As mentioned above, the circuit board 100 is fixed to the housing 2000 through the support member 300. The fan assembly 400 can be fixed to the housing 2000 through the support member 300 or other mounting members. When both the fan assembly 400 and the circuit board 100 are fixed to the housing 2000 through the support member 300, the control device 1000 has the advantages of fewer assembly parts and high assembly efficiency.

[0064] Figure 5 For Figure 1 another partial cross-sectional view of the illustrated electronic device. Refer to Figure 5 , the fan assembly 400 includes a fan 401 and a bracket 402. Among them, the bracket 402 can be arranged on the side of the fan 401 facing the circuit board 100. The control device 1000 includes a first fastener 701, and the first fastener 701 can sequentially pass through the bracket 402 of the fan assembly 400, the circuit board 100, and be fixedly connected to the support member 300. In this way, the assembly among the fan assembly 400, the circuit board 100, and the support member 300 is realized through the first fastener 701, which has the advantages of reducing the parts required for assembly and improving the assembly efficiency.

[0065] Among them, there are several possibilities for the fixed connection between the first fastener 701 and the support member 300:

[0066] In one possibility, refer to Figure 5 , the side of the support member 300 away from the circuit board 100 can be fixed to the second inner cavity surface 2001 of the housing 2000 by welding or other means, and the support member 300 can be provided with an internal threaded hole. The first fastener 701 can sequentially pass through the bracket 402 of the fan assembly 400, the circuit board 100 and be threadedly connected to the internal threaded hole to achieve a fixed connection. By adopting this method, it is possible to avoid opening holes on the housing 2000, so as to reduce the amount of holes on the appearance of the electronic device and meet the user's demand for a hole-free appearance.

[0067] In another possibility, the first fastener 701 can sequentially pass through the bracket 402 of the fan assembly 400, the circuit board 100, the support member 300, and the housing 2000, and be threadedly connected to a nut located outside the housing 2000 to achieve a fixed connection.

[0068] It should be noted that the fan assembly 400 generates vibrations during operation. If the rigidity of the support member 300 is small, the vibrations generated by the fan assembly 400 may damage the support member 300. In order to extend the service life of the support member 300 and thus extend the service life of the electronic device, the support member 300 can be made of a metal material with a relatively large rigidity and not easily bent, such as steel.

[0069] It is understandable that metal materials are prone to conducting electricity. To avoid electric leakage, the control device 1000 provided in the embodiments of the present application further includes an insulating plate 500. The insulating plate 500 can be disposed between the circuit board 100 and the support member 300. In this way, the first fastener 701 can sequentially pass through the fan assembly 400, the circuit board 100, the insulating plate 500 and be firmly connected to the support member 300.

[0070] The insulating plate 500 can be made of insulating materials such as rubber, plastic, glass, etc.

[0071] Furthermore, to reduce the thickness of the control device 1000 in a preset direction, the thickness of the insulating plate 500 can be less than a preset thickness. Among them, the preset thickness can be 1 mm to 2 mm. Exemplarily, the insulating plate 500 can be in a film shape. For example, the insulating plate 500 can be a polyester film (such as Mylar).

[0072] Reference Figures 3 - 5 , the support member 300 includes a body portion 310 and a plurality of support portions 320. Among them, the body portion 310 can have a top surface and a bottom surface disposed opposite to each other along a preset direction. The top surface of the body portion 310 can contact the second board surface 102 of the circuit board 100. In this way, the top surface of the body portion 310 and the second board surface 102 of the circuit board 100 can be in surface-to-surface contact to increase the contact area between the support member 300 and the second board surface 102 and avoid stress concentration.

[0073] In addition, the plurality of support portions 320 can be supported between the body portion 310 and the inner cavity surface of the housing 2000. The first fastener 701 can be plural, and the plural first fasteners 701 and the plural support portions 320 can be firmly connected in a one-to-one correspondence. Specifically, the first fastener 701 can sequentially pass through the fan assembly 400, the circuit board 100, the insulating plate 500 and be firmly connected to the corresponding support portion 320. In this way, the first fastener 701 is used to fix the fan assembly 400, the circuit board 100 and the support portion 320. In addition, a second accommodation space 602 can be formed between the bottom surface of the body portion 310 and the second inner cavity surface 2001 of the housing 2000, and the second accommodation space 602 can accommodate the second connecting portion 340 mentioned above.

[0074] Furthermore, the plurality of support portions 320 can be connected to the outer periphery of the body portion 310, and the support portion 320 can be folded relative to the body portion 310 so that the support portion 320 can have a first connecting surface 321 and a second connecting surface 322 disposed opposite to each other along a preset direction. Among them, the first connecting surface 321 can be connected to the second inner cavity surface 2001 of the housing 2000. In this way, the first connecting surface 321 of the body portion 310 and the second inner cavity surface 2001 can be in surface-to-surface contact to increase the connection area between the two and improve the connection stability.

[0075] The folding mentioned above can be explained as follows: The support part 320 includes a first section and a second section. Among them, the first section can be connected to the main body part 310 and can be bent relative to the main body part 310 towards the second inner cavity surface 2001 of the housing 2000. The second section can be connected to the first section and can be bent relative to the first section towards the first accommodation space 601. In this way, the second section can form a first connection surface 321 and a second connection surface 322 along a preset direction.

[0076] Furthermore, the second connection surface 322 can be flush with the top surface of the main body part 310, and the second connection surface 322 can be in contact with the insulating plate 500 to prevent the insulating plate 500 from hanging above the second connection surface 322, thereby avoiding bending of the insulating plate 500 when connecting the insulating plate 500 to the support part 320 through the first fastener 701. In this way, the service life of the insulating plate 500 can be improved.

[0077] Furthermore, in order to position and install the support 300 and the circuit board 100, the circuit board 100 can be provided with a first through hole penetrating the circuit board 100, and the insulating plate 500 can also be provided with a second through hole penetrating the insulating plate 500. The axis of the second through hole and the axis of the first through hole can be collinear. In addition, the support 300 further includes a first connection part 330. The first connection part 330 can be connected to the second connection surface 322, and the first connection part 330 can sequentially pass through the second through hole and the first through hole. Among them, in order to achieve a holeless housing 2000 for the electronic device, the support part 320 can be welded to the housing 2000, and the first connection part 330 can be provided with a threaded hole threadedly connected to the first fastener 701.

[0078] In addition, in this application, unless otherwise clearly specified and limited, terms such as "installation", "connection", "connection", "fixation", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be directly connected, or indirectly connected through an intermediate medium, and can be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific situations.

[0079] In the description of this specification, the description referring to terms such as "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present disclosure. In this specification, the schematic descriptions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0080] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some or all of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A control device for an electronic device, wherein the electronic device comprises a housing (2000), characterized in that: The control device (1000) is arranged in the inner cavity of the housing (2000), and the control device (1000) comprises: a circuit board (100), a support member (300), and a plurality of electronic components (200); The circuit board (100) has a first board surface (101) and a second board surface (102) arranged opposite to each other along a preset direction; the support member (300) is configured to be installed between the second board surface (102) and the inner cavity surface of the housing (2000), so that at least a portion of the second board surface (102) is exposed outside the support member (300) and a first accommodating space (601) is formed between the second board surface and the inner cavity surface of the housing (2000); A portion of the plurality of electronic components (200) is arranged on the first board surface (101), and another portion is arranged in the first accommodating space (601).

2. The control device according to claim 1, characterized in that The plurality of electronic components (200) include a processor (201), and the processor (201) is disposed on the first board (101); The control device (1000) further comprises a first fastener (701) and a fan assembly (400) for dissipating heat from the processor (201); the fan assembly (400) is located on one side of the first board surface (101) of the circuit board (100); the first fastener (701) passes through the fan assembly (400), the circuit board (100), and the support member (300) in sequence to be fastened together.

3. The control device according to claim 2, characterized in that The support member (300) is made of metal material; The control device (1000) further includes an insulating plate (500), wherein the insulating plate (500) is arranged between the second plate surface (102) and the support member (300); The first fastener (701) passes through the fan assembly (400), the circuit board (100), and the insulating plate (500) in sequence and is fastened to the support member (300).

4. The control device according to claim 3, characterized in that The support member (300) comprises a main body (310) and a plurality of support portions (320); the main body (310) has a top surface and a bottom surface that are arranged opposite to each other along the preset direction; the top surface of the main body (310) is connected to the second plate surface (102); the plurality of support portions (320) are supported between the main body (310) and the inner cavity surface of the shell (2000); There are multiple first fasteners (701), and the multiple first fasteners (701) sequentially pass through the fan assembly (400), the circuit board (100), and the insulating plate (500) and are fastened and connected to the multiple support parts (320) in a one-to-one correspondence.

5. The control device according to claim 4, characterized in that The plurality of support portions (320) are connected to the outer periphery of the main body portion (310); the support portion (320) is folded relative to the main body portion (310) so that the support portion (320) has a first connecting surface (321) and a second connecting surface (322) that are relatively arranged along the preset direction, and the first connecting surface (321) is configured to be connected to the inner cavity surface of the shell (2000).

6. The control device according to claim 5, characterized in that The second connecting surface (322) is flush with the top surface of the main body (310), and the second connecting surface (322) is in contact with the insulating plate (500).

7. The control device according to claim 5, characterized in that The support member (300) further includes a first connecting portion (330), the first connecting portion (330) being connected to the second connecting surface (322), and the first connecting portion (330) being passed through the insulating plate (500) and the circuit board (100), and the first connecting portion (330) having a threaded hole threadedly connected to the first fastener (701).

8. The control device according to any one of claims 4 to 7, characterized in that: The support member (300) further includes a second connecting portion (340), wherein the second connecting portion (340) is connected to the bottom surface of the main body (310); The control device (1000) includes a second fastener (702) and a fixing seat (800), wherein the fixing seat (800) is wrapped around the outside of the processor (201), and the fixing seat (800) is located on one side of the first board surface (101) of the circuit board (100); the second fastener (702) passes through the fixing seat (800), the circuit board (100), the insulating plate (500), the main body (310) in sequence and is threadedly connected to the second connecting portion (340).

9. The control device according to any one of claims 2 to 7, characterized in that: The air inlet end of the fan assembly (400) faces the processor (201), and the axis of the air outlet end of the fan assembly (400) is perpendicular to the axis of the air inlet end of the fan assembly (400).

10. An electronic device comprising a housing (2000) and the control device (1000) according to any one of claims 1 to 9.

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