Charging device

Abstract

The charging device disclosed by the embodiment of the utility model comprises the components of a housing which is provided with a mounting part; the charging module is arranged on the mounting part; the heat dissipation module is arranged on the mounting part; the heat dissipation module comprises a heat dissipation assembly and a liquid cooling piece, and the liquid cooling piece is in heat conduction connection with the charging module; a liquid flow channel is arranged in the liquid cooling piece, and the heat dissipation assembly is communicated with the liquid flow channel. According to the charging device provided by the embodiment of the invention, the liquid cooling piece is communicated with the heat dissipation assembly, so that the heat dissipation liquid can perform heat exchange through the heat dissipation assembly, thereby reducing the heat exchange loss caused by attaching the heat dissipation assembly to the liquid cooling piece, and further improving the heat dissipation efficiency.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic equipment accessories, in particular to a charging device. Background Art

[0002] With the development of electronic devices (such as mobile phones), electronic devices have become essential devices for people's daily lives and travel, and basically cover all kinds of daily application scenarios of people. Charging devices can charge electronic devices to improve the battery life of electronic devices. The charging device is provided with a charging module, which can charge electronic devices. However, during the charging process, the charging module generates heat, which may cause the charging device to heat up severely, and may even cause the electronic device to heat up, which seriously affects the charging efficiency between the charging device and the electronic device, and may also shorten the service life of the charging device and the electronic device.

[0003] Existing charging equipment typically features a liquid cooling system to dissipate heat from the charging module. This system, for example, includes a liquid cooling element and a radiator attached to the element. The liquid cooling element is thermally connected to the charging module, absorbing heat from the module via the liquid within the element. This heat is then transferred to the radiator, where it is dissipated. The heat from the liquid must pass through the liquid cooling element's housing and the connecting medium between the element and the radiator to reach the radiator. This results in low heat transfer efficiency between the liquid and the radiator, which in turn affects the cooling efficiency of the charging equipment. Utility Model Content

[0004] In response to at least some of the problems and defects in the prior art, an embodiment of the present invention discloses a charging device to solve the problem of low heat dissipation efficiency caused by attaching a radiator to a diaphragm for heat dissipation in the prior art.

[0005] Specifically, an embodiment of the present invention provides a charging device, including: a shell, provided with a mounting portion; a charging module, arranged on the mounting portion; a heat dissipation module, arranged on the mounting portion; the heat dissipation module includes a heat dissipation component and a liquid cooling component, and the liquid cooling component is thermally connected to the charging module; a liquid flow channel is provided in the liquid cooling component, and the heat dissipation component is connected to the liquid flow channel.

[0006] The charging device provided in this embodiment is connected between the liquid cooling element and the heat dissipation component so that the heat dissipation liquid flowing in the liquid flow channel can flow through the heat dissipation component for heat exchange, thereby reducing the heat exchange loss caused by attaching the heat dissipation component to the liquid cooling element and improving the heat dissipation efficiency.

[0007] In one embodiment of the present invention, the heat dissipation module includes a flow channel assembly, which is respectively connected to the heat dissipation assembly and the liquid cooling component, the flow channel assembly is connected to the liquid flow channel, and the liquid cooling component, the flow channel assembly and the heat dissipation assembly together form a closed liquid channel.

[0008] In one embodiment of the present invention, the heat dissipation assembly includes a radiator and a connection cover, the radiator and the connection cover are connected to form a heat exchange space, and the flow channel assembly is in communication with the heat exchange space.

[0009] In one embodiment of the present invention, the radiator includes a radiator substrate and heat dissipation fins arranged on the heat dissipation substrate, the connection cover is arranged on the side of the radiator substrate away from the heat dissipation fins, and the flow channel assembly is connected to the connection cover.

[0010] In one embodiment of the present invention, the heat dissipation assembly further includes a heat conducting member, which is provided on the heat sink substrate and located in the heat exchange space.

[0011] In one embodiment of the present invention, a plurality of heat-conducting columns are provided on a side of the heat-conducting member away from the heat sink. The plurality of heat-conducting columns extend in a direction away from the heat sink and are arranged at intervals.

[0012] In one embodiment of the present invention, a barrier column is further provided on a side of the heat conducting member away from the heat sink, and the barrier column is provided between the plurality of heat conducting columns.

[0013] In one embodiment of the present invention, the flow channel assembly includes two flow channel pipes, one of which connects the output port of the liquid cooling component and the input port of the heat exchange space; the other of which connects the input port of the liquid cooling component and the output port of the heat exchange space.

[0014] In one embodiment of the present invention, the heat dissipation assembly further comprises a heat conductor, which is arranged on the radiator substrate and away from the heat dissipation fins; at least two barrier columns are provided on the side of the heat conductor away from the radiator, and at least two of the barrier columns are provided between the input port and the output port of the two heat exchange spaces, and are staggered and spaced on the flow path between the input port and the output port of the heat exchange space.

[0015] In one embodiment of the present invention, the heat dissipation module further includes a power component, and the power component is connected to the flow channel assembly.

[0016] In one embodiment of the present invention, the charging module includes a coil assembly and a circuit board assembly electrically connected to the coil assembly, and the liquid cooling component is connected to the coil assembly.

[0017] In one embodiment of the present utility model, the shell includes an upper shell and a lower shell, the mounting portion includes a mounting cavity and a receiving groove, the lower shell is connected to the upper shell to form a mounting cavity, and a receiving groove is provided on the side of the upper shell away from the lower shell; the coil assembly is provided in the receiving groove, and the circuit board assembly is provided in the mounting cavity; the liquid cooling component cover is provided on the side of the coil assembly away from the upper shell.

[0018] In one embodiment of the present utility model, the heat dissipation module also includes a cooling fan and a radiator, the cooling fan is arranged in the installation cavity, and the shell is provided with an air inlet connected to the radiator and an air outlet connected to the cooling fan; the cooling fan and the radiator are arranged along a first direction, the circuit board assembly is arranged along a second direction, and is spaced apart from the radiator and the cooling fan, and the first direction is perpendicular to the second direction; and / or the radiator includes cooling fins, the channel between the air inlet and the cooling fins, and the gap between the radiator and the circuit board assembly together form an air inlet channel, the air inlet channel is connected to the inlet of the cooling fan, and the outlet of the cooling fan and the air outlet form an air outlet channel.

[0019] In one embodiment of the present invention, part of the liquid cooling element cover is provided on the coil assembly, and part of the liquid cooling element cover is provided on the upper shell; or, the liquid cooling element completely covers the coil assembly and the upper shell.

[0020] From the above, it can be seen that the above-mentioned technical features of the present invention can have one or more of the following beneficial effects: the charging device provided in this embodiment is connected to the liquid cooling part and the heat dissipation component so that the heat dissipation liquid flowing in the liquid flow channel can flow through the heat dissipation component for heat exchange, thereby reducing the heat exchange loss caused by attaching the heat dissipation component to the liquid cooling part, and thus improving the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0022] Figure 1 This is a schematic diagram of the exploded structure of the charging device provided in an embodiment of the present utility model.

[0023] Figure 2 for Figure 1 Schematic diagram of the exploded structure of the charging device from another angle.

[0024] Figure 3 for Figure 1 Schematic diagram of the decomposed structure of the heat dissipation module.

[0025] Figure 4 Schematic diagram of the positions of the heat-conducting columns and the barrier columns on the heat-conducting component.

[0026] Description of reference numerals:

[0027] 10- Charging device;

[0028] 100-shell; 101-heat dissipation outlet; 102-shell air inlet; 103-installation part; 110-upper shell; 111-accommodation groove; 112-through hole; 120-lower shell; 130-installation cavity; 131-first installation cavity; 132-second installation cavity; 140-blocking plate; 200-charging module; 210-coil assembly; 220-circuit board assembly; 300-heat dissipation module; 310-liquid cooling component; 320-flow channel assembly; 321-flow channel pipe; 322-connecting cover; 330-heat dissipation assembly; 331-heat conducting component; 3311-heat conducting column; 3312-blocking column; 332-radiator; 340-cooling fan; 350-power component; 400-circuit board; 500-battery. DETAILED DESCRIPTION

[0029] To make the purpose, technical solutions, and advantages of the present invention more clear, the following will provide a clear and complete description of the technical solutions of the present invention in conjunction with specific embodiments of the present invention and the corresponding drawings. Obviously, the embodiments described are only some of the embodiments of the present invention, not all of them. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without inventive effort are also within the scope of protection of the present invention.

[0030] It should be noted that directional terms such as "upper," "lower," "front," "back," "left," "right," "inner," "outer," and "side" mentioned in the embodiments of the present invention refer only to directions in the accompanying drawings. Therefore, the directional terms used are intended to illustrate and facilitate understanding of the present invention and are not intended to limit the present invention. For ease of understanding and description, the dimensions and thicknesses of each component shown in the drawings are arbitrarily illustrated, but the present invention is not limited thereto.

[0031] It will be understood that when a component such as a layer, film, region, or substrate is referred to as being "on" another component, the component may be directly on the other component or intervening components may be present. In addition, in the specification, unless explicitly described to the contrary, the word "comprising" will be understood to mean including the components described, but not excluding any other components. Furthermore, in the specification, "on..." means being above or below the target component, and does not necessarily mean being on top based on gravity.

[0032] The following embodiments of the present invention are described in detail with reference to the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments may be combined with each other.

[0033] like Figure 1 and Figure 2 As shown, an embodiment of the present invention provides a charging device 10. The charging device 10 provided in the embodiment of the present invention is used, for example, to charge electronic devices. The electronic devices mentioned here are, for example, mobile phones, tablet computers, etc. The charging device 10 can, for example, charge the electronic device in a wired or wireless manner. For example, the charging device 10 can charge the electronic device through a data cable, or the charging device 10 can charge the electronic device in a wireless manner such as magnetic attraction. The charging device 10 can, for example, be a power bank, or the charging device 10 can be a charging plug that can charge the electronic device. The present application does not limit the specific production product of the charging device 10. The specific structure of the charging device 10 is described below by taking the charging device 10 as, for example, a power bank.

[0034] See also Figure 1 and Figure 2 The charging device 10, for example, includes a housing 100, a charging module 200, and a heat dissipation module 300. Specifically, the housing 100, for example, is provided with a mounting portion 103, the charging module 200, for example, is provided on the mounting portion 103 and is used to charge an external device, and the heat dissipation module 300, for example, is provided on the mounting portion 103 and is used to dissipate heat for the charging module 200. The heat dissipation module 300, for example, includes a liquid cooling element 310 and a heat dissipation assembly 330, and the liquid cooling element 310 is thermally connected to the charging module 200. The liquid cooling element 310 is connected to the charging module 200, and a liquid flow channel is provided in the liquid cooling element 310, and the heat dissipation assembly 330 is connected to the liquid flow channel; so that the heat dissipation liquid flowing in the liquid flow channel can flow through the heat dissipation assembly 330 for heat exchange, thereby reducing the heat exchange loss caused by attaching the heat dissipation assembly to the liquid cooling element, thereby improving the heat dissipation efficiency of the charging module 200. It should be noted that the heat dissipation component 330 is connected to the liquid flow channel, which means that the heat dissipation liquid flowing in the liquid flow channel can flow through the surface or interior of the heat dissipation component 330.

[0035] Furthermore, the heat dissipation module 300 may include, for example, a flow channel assembly 320, which is connected to the liquid cooling element 310 and communicates with the liquid flow channel therein. A heat dissipation assembly 330 may also be connected to the flow channel assembly 320, with the liquid cooling element 310, the flow channel assembly 320, and the heat dissipation assembly 330 collectively forming a closed liquid channel. The liquid cooling element 310 is connected to the charging module 200, transferring heat from the charging module 200 to the heat dissipation liquid. The cooling liquid flows through the heat dissipation assembly 330, cooling the liquid. Heat is dissipated from the heat dissipation assembly 330, and the cooled liquid is then directed back to the liquid cooling element 310 from the flow channel assembly 320, thereby circulating and cooling the charging module 200. In other embodiments, the heat dissipation assembly 330 may be directly placed over the liquid cooling element 310, connected to the liquid flow channel of the liquid cooling element 310, to achieve more efficient heat transfer. The connection method between the liquid cooling element 310 and the heat dissipation assembly 330 is not limited to a single method.

[0036] For example, the liquid channel may contain a circulating heat dissipation liquid, which flows through the liquid flow channel within the liquid cooling element 310 to dissipate heat from the charging module 200. The heat dissipation liquid also flows through the heat dissipation assembly 330. The liquid cooling element 310 may include, for example, a cold plate (typically a closed cavity made of a heat-conducting metal such as copper or aluminum). The liquid cooling element 310 is thermally connected to the charging module 200, thereby indirectly transferring heat generated by the charging module 200 to the heat dissipation liquid enclosed in the liquid flow channel to dissipate heat from the charging module 200.

[0037] The charging device 10 provided in this application connects the flow channel assembly 320 with the liquid flow channel in the liquid cooling unit 310, and the flow channel assembly 320 is also connected to the heat dissipation assembly 330, so that the heat dissipation liquid circulates in a closed loop formed by the liquid cooling unit 310, the flow channel assembly 320 and the heat dissipation assembly 330. The heat dissipation liquid is, for example, water or coolant. Of course, the heat dissipation liquid can also be other liquids with high specific heat capacity, and this application does not impose specific restrictions on this. The high specific heat capacity of the heat dissipation liquid can be used to absorb heat from the charging module, thereby dissipating heat from the charging module.

[0038] The charging device 10 provided in this embodiment provides a flow channel component between the liquid cooling element and the heat dissipation component so that the heat dissipation liquid can enter the heat dissipation component for heat exchange, thereby reducing the heat exchange loss caused by attaching the heat dissipation component to the liquid cooling element and improving the heat dissipation efficiency.

[0039] Further, see Figure 1 and Figure 2, the shell 100 is provided with a mounting portion 103, and the mounting portion 103 includes a mounting cavity 130 and a receiving groove 111. For example, the shell 100 includes an upper shell 110 and a lower shell 120, and the lower shell 120 is connected to the upper shell 110 to form the mounting cavity 130. Among them, the receiving groove 111 is provided on the side of the upper shell 110 away from the lower shell 120. In one embodiment, the charging device 10 has a wireless charging function, and the charging module 200 includes a coil assembly 210 and a circuit board assembly 220. The circuit board assembly 220 is arranged in the mounting cavity 130, and the coil assembly 210 is arranged in the receiving groove 111. The liquid cooling component 310, for example, covers the side of the coil assembly 210 away from the upper shell 110 and is thermally conductively connected to the coil assembly 210. The liquid cooling element 310 is partially covered on the coil assembly 210 and partially covered on the upper shell 110. In order to better transfer the heat from the coil assembly 210 to the liquid cooling element 310, the coil assembly 210 needs to be completely covered. In one embodiment, the liquid cooling element 310 not only completely covers the coil assembly, but also completely covers the upper shell. The liquid cooling element 310 not only conducts the heat of the coil assembly, but also transfers the heat from the electronic equipment in contact with the liquid cooling element 310. The larger the area of contact between the liquid cooling element 310 and the electronic equipment, the better the heat transfer effect of the electronic equipment. The upper shell 110 is also provided with a through hole 112, for example. The flow channel assembly 320 is connected to the liquid cooling element 310 through the through hole 112. For example, see Figure 3 The housing 100 is provided with a blocking plate 140, for example, which divides the mounting cavity 130 into a first mounting cavity 131 and a second mounting cavity 132. The heat dissipation assembly 330 is located in the second mounting cavity 132. The charging device 10 is provided with a battery 500, for example, which is electrically connected to the coil assembly 200 and is located in the first mounting cavity 131.

[0040] Further, see Figure 3 The heat dissipation component 330 includes, for example, a connecting cover 322, a heat conductor 331 and a radiator 332. The radiator 332 and the connecting cover 322 form a relatively closed heat exchange space, and the heat dissipation liquid conducts heat in the heat exchange space and conducts heat to the radiator 332. The flow channel component 320 is in communication with the heat exchange space to introduce or export the heat dissipation liquid into or out of the heat exchange space. Specifically, the radiator 332 includes, for example, a radiator substrate 3321 and heat dissipation fins on the radiator substrate 3321 facing away from the radiator substrate 3321. The flow channel component 320 includes, for example, a flow channel pipe 321, the flow channel pipe 321 is connected to the connecting cover 322, the flow channel pipe 321 is connected to the liquid flow channel in the liquid cooling component 310, and the connecting cover 322 is connected to the flow channel pipe 321. Among them, the connecting cover 322 is covered on the radiator substrate 3321 to form a heat exchange space.

[0041] As described above, the heat conductor 331 is, for example, disposed on the heat sink substrate 3321 and located within the heat exchange space, and the heat dissipating liquid flows through the heat conductor 331. For example, the heat conductor 331 is a metal structure, preferably aluminum; the heat sink 332 includes, for example, heat dissipating fins connected to the heat sink substrate 3321, and the heat conductor 331 is disposed on a side of the heat sink substrate 3321 away from the heat dissipating fins. Preferably, the heat sink substrate 3321 and the heat conductor 331 are, for example, fixedly connected or integrally connected. For example, the heat conductor 331 and the heat sink substrate 3321 can be welded to improve the stability of the connection between the two.

[0042] As mentioned above, see Figure 3 and Figure 4 A plurality of heat-conducting columns 3311 are provided on the side of the heat-conducting member 331 away from the radiator 332. The plurality of heat-conducting columns 3311 extend in a direction away from the radiator 332 and are spaced apart on the heat-conducting member 331. The heat-dissipating liquid flows through the plurality of heat-conducting columns 3311. By providing a plurality of heat-conducting columns 3311, the heat conduction area is increased, so that the heat-dissipating liquid can fully exchange heat with the radiator 332 on the heat-conducting member 331, thereby improving the heat dissipation efficiency. The heat-conducting columns 3311 are made of metal, for example, the heat-conducting columns 3311 can be copper columns. Of course, the heat-conducting columns 3311 can also be aluminum columns. This is not specifically limited in this application. After the heat-dissipating liquid dissipates heat from the coil assembly 200 via the liquid cooling member 310, it flows to the heat-conducting member 331 through the flow channel assembly 320 and exchanges heat with the radiator 332, so that the radiator 332 can cool the heat-dissipating liquid.

[0043] In a specific embodiment, see Figure 4 The heat conducting member 331 is further provided with a barrier column 3312 on the side away from the heat sink 332. The barrier column 3312 is provided between the plurality of heat conducting columns 3311 to guide the heat dissipation liquid. The number of the barrier columns 3312 is at least two, and the two adjacent barrier columns 3312 are staggered. For example, the barrier columns 3312 are as follows: Figure 4 The heat conducting member 331 is provided with a water channel so as to form a water channel inside the heat conducting member 331, so that the heat dissipation liquid can fully contact with the plurality of heat dissipation columns 3311, thereby preventing the heat dissipation liquid from taking a straight path and causing some heat conducting columns 3311 to not contact the heat dissipation liquid, thereby increasing the contact area between the heat dissipation liquid and the heat conducting columns 3311, that is, increasing the heat dissipation area, thereby improving the heat dissipation efficiency.

[0044] In a specific embodiment, there are two flow channel pipes 321 , one end of each of the two flow channel pipes 321 is connected to the liquid cooling element 310 , and the other end of each of the two flow channel pipes 321 is connected to the connection cover 322 . The two ends of one flow channel pipe 321 are respectively connected to the output port of the liquid cooling component 310 and the input port of the heat exchange space, and the two ends of the other flow channel pipe 321 are respectively connected to the input port of the liquid cooling component 310 and the output port of the heat exchange space; the radiator base plate 332 is connected to the connection cover 322 to form a box-shaped heat exchange space, and the two flow channel pipes 321 are respectively connected to the output port and the input port of the connection cover 322. The heat-carrying heat-dissipating liquid output from the output port of the liquid cooling component 310 enters the heat exchange space through one of the flow channel pipes 321 and contacts the heat conductor 331 in the heat exchange space. The heat-carrying heat-dissipating liquid conducts the heat to the heat conductor 331, and the heat of the heat conductor 331 is then conducted to the radiator 332 and contacts the external air for heat dissipation; the temperature of the heat-dissipating liquid after heat dissipation decreases, and it will be discharged from the output port of the heat exchange space, enter the other flow channel pipe 321, and then flow into the input port of the liquid cooling component 310. The heat conducting member 331 is disposed on the heat sink base plate 3321 and is close to the connection cover 322. At least two barrier columns 3312 are disposed on the side of the heat conducting member 331 away from the heat sink 332. The at least two barrier columns 3312 are disposed between the output port and the input port of the heat exchange space. The flow passage between the input port and the output port of the heat exchange space is staggered and spaced apart so that the heat dissipating liquid fully contacts the heat conducting columns 3311 along the path from the output port of the liquid cooling member 310 to the input port of the liquid cooling member 310. The barrier columns 3312 are disposed along the path from the output port of the liquid cooling member 310 to the input port of the liquid cooling member 310 and are staggered and spaced apart. This allows the heat dissipating liquid to pass through more heat conducting columns 3311, thereby increasing the contact area and the length of the path. This increases the heat conduction time of the heat dissipating liquid on the heat conducting member 331, resulting in better heat conduction and higher heat dissipation efficiency.

[0045] In accordance with the above, see Figure 3 The heat dissipation module 300 also includes a power part 350, which is connected to the flow channel assembly 320, and the heat dissipation liquid flows through the power part 350. The power part 350 is used to provide power for the heat dissipation liquid so that the heat dissipation liquid can circulate in the flow channel assembly 320 and flow through the heat dissipation assembly 310, the liquid cooling part 330 and the power part 350. The power part 350 is, for example, a water pump or other power device that can provide heat dissipation liquid circulation, and this application does not impose specific restrictions on this. Specifically, the power part 350, the heat dissipation assembly 330, the liquid cooling part 310 and the flow channel assembly 320 together form a closed heat dissipation circuit. It should be noted that the flow channel assembly 320 is, for example, provided with a multi-way connector, so that it can, for example, have multiple ports to respectively connect the heat dissipation assembly 330, the liquid cooling part 310, and the power part 350.

[0046] In addition, see Figure 1 and Figure 2The heat dissipation module 300 further includes, for example, a heat dissipation fan 340. The housing 100 is provided with, for example, an air outlet 101, which is, for example, connected to the air outlet of the heat dissipation fan 340. The heat dissipation fan 340 is used to remove heat from the heat dissipation component 330 and discharge it from the heat dissipation outlet 101. The heat dissipation fan 340 is used to remove heat from the radiator 332, for example, to cool the radiator 332. The radiator 332 can then continue to exchange heat with the heat dissipation liquid in the heat conducting member 331 to cool the heat dissipation liquid. Specifically, the heat dissipation fan 340 is, for example, a centrifugal fan. Figure 2 The housing 100 is provided with an air inlet 102, for example, which is connected to the radiator 332. External airflow, for example, enters the housing 100 through the housing air inlet 102 and becomes internal airflow. The internal airflow passes through the radiator 332 and enters the cooling fan 340 through the air inlet of the cooling fan 340. The cooling fan 340 rotates and is discharged through the cooling air outlet 101.

[0047] For example, the cooling fan 340 and the heat sink 332 are arranged in a first direction, and the circuit board assembly 220 is arranged in a second direction and spaced apart from the heat sink 332 and the cooling fan 340, wherein the first direction is perpendicular to the second direction. Figure 2 In the X direction, the second direction is as follows Figure 2 Y direction. And / or, the heat sink 332 includes, for example, heat sink fins, and the channel between the air inlet 102 and the heat sink fins, and the gap between the heat sink 332 and the circuit board assembly 220 together form an air inlet channel. The air inlet channel is also connected to the inlet of the heat dissipation fan 340, and the outlet of the heat dissipation fan 340 and the air outlet 101 form an air outlet channel.

[0048] The cooling fan 340 mentioned above is, for example, a centrifugal fan. Compared with an axial flow fan, the use of a centrifugal fan as a cooling fan can, on the one hand, avoid the fan being placed vertically, which would cause the thickness of the charging device 10 to be too thick. On the other hand, the axial flow fan can only blow air toward the radiator or circuit board, and a special air duct needs to be set for it. Otherwise, the air flow will be chaotic, resulting in poor cooling efficiency of the fan. The centrifugal fan draws the internal air flow into the fan, and the internal air flow can be sucked into the centrifugal fan after passing through the radiator and circuit board, thereby taking away the heat on the radiator and circuit board.

[0049] In summary, the charging device provided by the embodiment of the present invention, by arranging a flow channel component between the liquid cooling component and the heat dissipation component, allows the heat dissipation liquid to enter the heat dissipation component for heat exchange, thereby reducing the heat exchange loss caused by attaching the heat dissipation component to the liquid cooling component, and thus improving the heat dissipation efficiency.

[0050] It can be understood that the aforementioned embodiments are merely illustrative of the present invention. The technical solutions of the various embodiments can be arbitrarily combined and used in conjunction with each other, provided that the technical features do not conflict, the structures do not contradict, and the purpose of the invention of the present invention is not violated.

[0051] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims

1. A charging device, characterized in that: include: The housing is provided with a mounting portion; A charging module is arranged on the mounting portion; A heat dissipation module is arranged on the mounting portion; the heat dissipation module includes a heat dissipation component and a liquid cooling component, and the liquid cooling component is thermally connected to the charging module; a liquid flow channel is provided in the liquid cooling component, and the heat dissipation component is connected to the liquid flow channel.

2. The charging device according to claim 1, wherein The heat dissipation module includes a flow channel component, which is respectively connected to the heat dissipation component and the liquid cooling component. The flow channel component is connected to the liquid flow channel, and the liquid cooling component, the flow channel component and the heat dissipation component together form a closed liquid channel.

3. The charging device according to claim 2, characterized in that The heat dissipation assembly includes a radiator and a connection cover. The radiator and the connection cover are connected to form a heat exchange space. The flow channel assembly is in communication with the heat exchange space.

4. The charging device according to claim 3, wherein The radiator comprises a radiator substrate and heat dissipation fins arranged on the radiator substrate. The connection cover is arranged on a side of the radiator substrate away from the heat dissipation fins. The flow channel assembly is connected to the connection cover.

5. The charging device according to claim 4, characterized in that The heat dissipation assembly further includes a heat conducting member, which is arranged on the radiator substrate and located in the heat exchange space.

6. The charging device according to claim 5, characterized in that A plurality of heat-conducting columns are provided on a side of the heat-conducting member away from the heat sink. The plurality of heat-conducting columns extend in a direction away from the heat sink and are arranged at intervals.

7. The charging device according to claim 6, wherein: A barrier column is further provided on a side of the heat conducting member away from the radiator, and the barrier column is provided between the plurality of heat conducting columns.

8. The charging device as claimed in claim 3, characterized in that The flow channel assembly includes two flow channel pipes, one of which connects the output port of the liquid cooling component and the input port of the heat exchange space; the other of which connects the input port of the liquid cooling component and the output port of the heat exchange space.

9. The charging device according to claim 8, characterized in that The heat dissipation assembly also includes a heat conductor, which is arranged on the radiator substrate and away from the heat dissipation fins; at least two barrier columns are provided on the side of the heat conductor away from the radiator, and at least two of the barrier columns are provided between the input port and the output port of the two heat exchange spaces, and are staggered and spaced on the flow path between the input port and the output port of the heat exchange space.

10. The charging device according to claim 2, wherein: The heat dissipation module further includes a power component, and the power component is connected to the flow channel component.

11. The charging device according to any one of claims 1 to 10, characterized in that: The charging module includes a coil assembly and a circuit board assembly electrically connected to the coil assembly, and the liquid cooling component is connected to the coil assembly.

12. The charging device according to claim 11, wherein: The shell includes an upper shell and a lower shell, the mounting portion includes a mounting cavity and a receiving groove, the lower shell is connected to the upper shell to form a mounting cavity, and a receiving groove is provided on the side of the upper shell away from the lower shell; the coil assembly is provided in the receiving groove, and the circuit board assembly is provided in the mounting cavity; the liquid cooling component cover is provided on the side of the coil assembly away from the upper shell.

13. The charging device according to claim 12, wherein: The heat dissipation module further includes a heat dissipation fan and a radiator, wherein the heat dissipation fan is arranged in the installation cavity, and the housing is provided with an air inlet connected to the radiator and an air outlet connected to the heat dissipation fan; The cooling fan and the radiator are arranged along a first direction, the circuit board assembly is arranged along a second direction and spaced apart from the radiator and the cooling fan, and the first direction is perpendicular to the second direction; and / or The radiator includes cooling fins, and the channel between the air inlet and the cooling fins and the gap between the radiator and the circuit board assembly together form an air inlet channel, the air inlet channel is connected to the inlet of the cooling fan, and the outlet of the cooling fan and the air outlet form an air outlet channel.

14. The charging device according to claim 12, wherein: Part of the liquid cooling element cover is arranged on the coil assembly, and part of the liquid cooling element cover is arranged on the upper shell; or, the liquid cooling element completely covers the coil assembly and the upper shell.

Images